A pad for automatic mounting of computer motherboards

Abstract

This application belongs to the field of computer pad manufacturing technology, specifically a pad for automatic mounting of computer motherboards. It includes a single-sided copper foil tape and a main release film. Silicone is applied to the upper part of the back side of the single-sided copper foil tape. The side of the silicone facing away from the single-sided copper foil tape is attached to the main release film. MYLAR single-sided tape is applied to the center of the front side of the single-sided copper foil tape, and foam is applied to the lower part of the front side of the single-sided copper foil tape. This application uses a combination of single-sided copper foil tape, silicone, and MYLAR single-sided tape to design a pad for automatic mounting of computer motherboards, solving the problem of how to integrate the functions of conductivity, heat dissipation, buffering, and shielding of computer motherboards into a single pad.

Description

Technical Field

[0001] This application belongs to the field of computer gasket manufacturing technology, specifically a gasket for automatic mounting of computer motherboards. Background Technology

[0002] The spacers are attached to the computer motherboard, mainly for conductivity, heat dissipation, buffering and shielding. However, the current spacer is just a simple piece of paper. When it is necessary to conduct electricity on the computer motherboard, it is necessary to combine conductive materials with the spacer. Moreover, functions such as heat dissipation, buffering and shielding cannot be achieved on a single spacer, so it is quite complicated. Utility Model Content

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a pad for automatic mounting of computer motherboards using single-sided copper foil tape in combination with silicone and MYLAR single-sided tape. This solves the problem of how to integrate the functions of conductivity, heat dissipation, buffering, and shielding of computer motherboards into a single pad.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] A pad for automatic mounting of computer motherboards includes a single-sided copper foil tape and a main release film. Silicone is disposed on the upper part of the back side of the single-sided copper foil tape. The side of the silicone facing away from the single-sided copper foil tape is attached to the main release film. MYLAR single-sided tape is disposed in the middle of the front side of the single-sided copper foil tape. Foam is disposed on the lower part of the front side of the single-sided copper foil tape.

[0006] Preferably, the width of the lower part of the single-sided copper foil tape is greater than the width of the upper part and the width of the lower part.

[0007] Preferably, the hardness of the silicone is 70°.

[0008] Preferably, the MYLAR single-sided tape has an insulating function.

[0009] Preferably, the end of the main release film away from the silicone is located outside the single-sided copper foil tape.

[0010] Preferably, the lower back of the single-sided copper foil tape is attached to the secondary release film.

[0011] Preferably, the end of the secondary release film away from the single-sided copper foil tape is located outside the single-sided copper foil tape.

[0012] This application has the following beneficial effects:

[0013] This application uses single-sided copper foil tape in combination with silicone and MYLAR single-sided tape to design a pad for automatic mounting of computer motherboards, solving the problem of how to integrate the functions of conductivity, heat dissipation, buffering and shielding of computer motherboards into a single pad. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this application;

[0015] Figure 2 for Figure 1 Exploded view.

[0016] Among them, 1. Single-sided copper foil tape; 2. Main release film; 3. Silicone; 4. MYLAR unidirectional tape; 5. Foam; 6. Secondary release film. Detailed Implementation

[0017] like Figure 1-2 As shown, a pad for automatic mounting of computer motherboards includes a single-sided copper foil tape 1 and a main release film 2. Silicone 3 is provided on the upper part of the back side of the single-sided copper foil tape 1. The side of the silicone 3 facing away from the single-sided copper foil tape 1 is attached to the main release film 2. MYLAR single-sided tape 4 is provided in the middle of the front side of the single-sided copper foil tape 1. Foam 5 is provided on the lower part of the front side of the single-sided copper foil tape 1.

[0018] In this embodiment, the single-sided copper foil tape 1 is model WieldTESA 60238, with one side black and the other side copper-colored, T=0.045mm, adhesion: ≥4.5N / cm, surface resistance: <0.7Ω / sq, and vertical resistance: <0.1Ω / in. 2 The silicone side of the single-sided copper foil tape 1 can be directly bonded to silicone YH-BK70542U without requiring a pretreatment agent, simplifying the process. The single-sided copper foil tape 1 provides conductivity in both the XY and Z directions, shielding, and heat dissipation. The main release film 2 protects the silicone 3 from contamination that could affect its adhesiveness. The foam 6 provides good cushioning, protecting the product.

[0019] As a preferred embodiment, the lower width of the single-sided copper foil tape 1 is greater than both the upper and lower widths. This arrangement allows the MYLAR single-sided tape 4 to have a larger surface area, making it easier to apply to the computer motherboard.

[0020] As a preferred option, the silicone 3 has a hardness of 70°. Using silicone material with a hardness of 70° provides a stronger cushioning effect and more effectively protects the components.

[0021] As a preferred embodiment, the MYLAR single-sided tape 4 has an insulating function.

[0022] As a preferred embodiment, the end of the main release film 2 furthest from the silicone is located outside the single-sided copper foil tape 1. This facilitates the removal of the main release film 2 during use.

[0023] As a preferred embodiment, the lower back of the single-sided copper foil tape 1 is attached to the secondary release film 6. This is to protect the adhesiveness of the lower back of the single-sided copper foil tape 1.

[0024] As a preferred embodiment, the end of the secondary release film 6 furthest from the single-sided copper foil tape 1 is located outside the single-sided copper foil tape 1. This facilitates the removal of the secondary release film 6 during use.

Claims

1. A gasket for automatic mounting of computer motherboards, characterized in that, The product includes a single-sided copper foil tape (1) and a main release film (2). Silicone (3) is provided on the upper part of the back side of the single-sided copper foil tape (1). The side of the silicone (3) facing away from the single-sided copper foil tape (1) is attached to the main release film (2). MYLAR single-sided tape (4) is provided in the middle of the front side of the single-sided copper foil tape (1). Foam (5) is provided on the lower part of the front side of the single-sided copper foil tape (1).

2. The gasket for automatic mounting of computer motherboards according to claim 1, characterized in that, The width of the lower part of the single-sided copper foil tape (1) is greater than the width of the upper part and the width of the lower part.

3. A gasket for automatic mounting of computer motherboards according to claim 1, characterized in that, The hardness of the silicone (3) is 70°.

4. A gasket for automatic mounting of computer motherboards according to claim 1, characterized in that, The MYLAR single-sided tape (4) has an insulating function.

5. A gasket for automatic mounting of computer motherboards according to claim 1, characterized in that, The end of the main release film (2) away from the silicone is located outside the single-sided copper foil tape (1).

6. A gasket for automatic mounting of computer motherboards according to claim 1, characterized in that, The back of the lower part of the single-sided copper foil tape (1) is attached to the secondary release film (6).

7. A gasket for automatic mounting of computer motherboards according to claim 6, characterized in that, The end of the secondary release film (6) away from the single-sided copper foil tape (1) is located outside the single-sided copper foil tape (1).

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