A circuit board laminating equipment

Abstract

This invention relates to a circuit board laminating device, comprising a machine base with a housing on top, a base on top of the machine base, a pressure plate above the base, a buffer mechanism connected to the top of the pressure plate inside the housing, a separation mechanism on the pressure plate, and multiple lifting mechanisms on top of the buffer mechanism, with a drive mechanism connecting the lifting mechanisms. The drive mechanism includes a gear I driven by a motor; the lifting mechanism includes a screw fixed to the top wall of the housing via bearings, a gear II meshing with gear I on the screw, and a helical tube on the screw below gear II; the buffer mechanism includes a fixing plate fixed to the helical tube, the fixing plate being connected to the pressure plate via an elastic element I; the separation mechanism includes a protrusion penetrating the fixing plate, a groove at the bottom of the protrusion for accommodating a protrusion, and an elastic element II connected to the protrusion on the top wall of the groove. This invention has a simple structure and is easy to use.

Description

Technical Field

[0001] This invention relates to the field of circuit board lamination, and particularly to a circuit board lamination device. Background Technology

[0002] High-end electronic products, due to space constraints, can have multiple layers of circuitry stacked inside in addition to surface wiring. During the production process, after each layer of circuitry is fabricated, it is positioned and pressed together using optical equipment, so that the multiple layers of circuitry are stacked on a single circuit board, commonly known as a multilayer circuit board. Circuit boards with two or more layers are also called multilayer circuit boards. In the process of processing multilayer circuit boards, it is necessary to press the inner layers with the prepreg and copper foil, so a pressing device is required.

[0003] In existing lamination devices, such as the multilayer circuit board lamination device in CN222954197U, the pressure plate may come into contact with the top surface of the circuit board during lamination and cause some adhesion. When the pressure plate moves upward, it may lift the circuit board. After it is lifted to a certain height, the circuit board separates from the pressure plate under the influence of gravity and falls onto the base, which in turn affects the safety of the circuit board. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board laminating device.

[0005] The technical problem of this invention is mainly solved by the following technical solution:

[0006] A circuit board laminating device includes a machine base with a box on top, a base on top of the machine base inside the box, a pressure plate that can move up and down above the base, a buffer mechanism connected to the top of the pressure plate inside the box, a separation mechanism penetrating the buffer mechanism on the pressure plate, and multiple sets of lifting mechanisms on top of the buffer mechanism, wherein a drive mechanism is provided on the inner top between the multiple sets of lifting mechanisms.

[0007] The drive mechanism includes a gear I driven by a motor;

[0008] The lifting mechanism includes a screw fixed to the top wall of the housing by a bearing, a gear II that meshes with gear I on the screw, and a spiral tube on the screw below gear II;

[0009] The buffer mechanism includes a fixed plate fixed to the solenoid tube, and the fixed plate is connected to the pressure plate through an elastic element I;

[0010] The separation mechanism includes a boss that penetrates the fixed plate, and the bottom of the boss is provided with a groove to accommodate the protrusion. The top wall of the groove is provided with an elastic element II that is connected to the protrusion.

[0011] Preferably, both elastic element I and elastic element II are made of spring material.

[0012] Preferably, a groove is vertically provided on the side wall of the groove, a slider located in the groove is provided on the top of the side wall of the protrusion, and the bottom end of the protrusion extends to the outside of the bottom of the groove.

[0013] Preferably, the top edge of the pressure plate is provided with a rim that surrounds the fixing plate, and the top of the inner side wall of the rim is provided with a limiting part located above the fixing plate.

[0014] Preferably, the number of lifting mechanisms is at least four sets, wherein multiple sets of lifting mechanisms are evenly arranged at the top edge of the fixed plate, and the gears II in the multiple sets of lifting mechanisms form a circular structure coaxial with gear I.

[0015] Preferably, the inner wall of the spiral tube is provided with a thread for screwing the screw, the outer wall of the spiral tube is a smooth structure, the bottom of the spiral tube is covered with a sleeve, and an L-shaped bracket for fixing the sleeve is provided on the top wall of the inner box.

[0016] The beneficial effects of this invention are as follows: This invention drives multiple sets of locking mechanisms to move simultaneously through a driving mechanism, and drives the pressure plate and protrusions to press the circuit board together. The multiple sets of locking mechanisms and buffering mechanisms achieve the purpose of multi-point compression and fixation of the pressure plate, thereby improving its pressing effect and efficiency on the circuit board. At the same time, the buffering mechanism also plays a certain role in buffering and shock absorption. When the pressure plate separates from the circuit board, the separation mechanism prevents the circuit board from being lifted by the pressure plate and falling, thereby improving its safety. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the present invention;

[0018] Figure 2 This is a cross-sectional view of the present invention;

[0019] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0020] In the diagram: 1. Machine base, 2. Housing, 3. Base, 4. Pressure plate, 5. Buffer mechanism, 51. Fixed plate, 52. Elastic element I, 6. Separation mechanism, 61. Thrust, 62. Groove, 63. Protrusion, 64. Elastic element II, 7. Lifting mechanism, 71. Screw, 72. Bearing, 73. Gear II, 74. Screw tube, 8. Drive mechanism, 81. Motor, 82. Gear I, 9. Slide groove, 10. Slider, 11. Edge, 12. Limiting part, 13. Sleeve, 14. L-shaped frame. Detailed Implementation

[0021] The technical solution of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings.

[0022] A circuit board laminating device includes a machine base 1 with a housing 2 on top, a base 3 on top of the machine base 1 inside the housing 2, a pressure plate 4 that can move up and down above the base 3, a buffer mechanism 5 connected to the top of the pressure plate 4 inside the housing 2, a separation mechanism 6 penetrating the buffer mechanism 5 on the pressure plate 4, and multiple sets of lifting mechanisms 7 on top of the buffer mechanism 5, wherein a drive mechanism 8 is provided on the inner top between the multiple sets of lifting mechanisms 7.

[0023] The drive mechanism 8 includes a gear I82 driven by a motor 81.

[0024] The lifting mechanism 7 includes a screw 71 fixed to the top wall of the housing 2 via a bearing 72. A gear II 73 that meshes with a gear I 82 is provided on the screw 71. A screw tube 74 is provided on the screw 71 below the gear II 73.

[0025] The buffer mechanism 5 includes a fixed plate 51 fixed to the solenoid 74. The fixed plate 51 is connected to the pressure plate 4 through an elastic element I52. The number of lifting mechanisms 7 is at least four sets, with multiple sets of lifting mechanisms 7 evenly arranged at the top edge of the fixed plate 51. The gears II73 in the multiple sets of lifting mechanisms 7 form a circular structure coaxial with the gear I82. The top edge of the pressure plate 4 is provided with a rim 11 that is wrapped around the fixed plate 51. The top of the inner side wall of the rim 11 is provided with a limiting part 12 located above the fixed plate 51. When the elastic element I52 contracts and expands to move the pressure plate 4, the pressure plate 4 will drive the rim 11 to slide up and down on the outside of the fixed plate 51. The fixed plate 51 abuts against the inner side wall of the rim 11 to prevent the pressure plate 4 from moving horizontally. When the pressure plate 4 moves down to a certain position, the fixed plate 51 abuts against the limiting part 12 and pulls the pressure plate 4 through the rim 11 to limit its downward movement.

[0026] The separation mechanism 6 includes a boss 61 that penetrates the fixed plate 51. The bottom of the boss 61 is provided with a groove 62 that accommodates the protrusion 63. The top wall of the groove 62 is provided with an elastic element II 64 that is connected to the protrusion 63.

[0027] In this embodiment, both elastic element I52 and elastic element II64 are made of spring material.

[0028] like Figure 3As shown, a vertical groove 9 is provided on the side wall of the groove 62, and a slider 10 located in the groove is provided on the top of the side wall of the protrusion 63. The bottom end of the protrusion 63 extends to the outer side of the bottom of the groove 62. When the elastic element II 64 moves the protrusion 63 in the groove 62 during the contraction and expansion process, it will move the slider 10 in the groove 9. The groove 9 locks the slider 10, indirectly preventing the protrusion 63 from rotating in the groove 62. It can also limit the vertical displacement of the protrusion 63, preventing the protrusion 63 from sliding completely out of the groove 62.

[0029] In this embodiment, the inner wall of the solenoid 74 is provided with threads for screwing the screw 71, the outer wall of the solenoid 74 is a smooth structure, and the bottom of the solenoid 74 is fitted with a sleeve 13. An L-shaped bracket 14 for fixing the sleeve 13 is provided on the inner top wall of the housing 2. When the lifting mechanism 7 is working, it drives the solenoid 74 to move up and down within the sleeve 13. The L-shaped bracket 14 and the sleeve 13 not only limit and fix the body of the solenoid 74, but also position and fix the bottom end of the screw 71 through the corresponding body of the solenoid 74.

[0030] In use, the circuit board is placed on the base 3. The motor 81 drives the gear I82 to rotate, and the gear I82 simultaneously drives multiple sets of gears II73 to rotate in the same direction and at the same speed. This causes the gear II73 to drive the top of the screw 71 to rotate in the bearing 72, while also driving the screw 71 to rotate in the solenoid 74. This simultaneously drives multiple sets of solenoids 74 to move downward in the same direction and at the same speed. At this time, while the solenoid 74 slides downward in the sleeve 13, it also drives the fixing plate 51 to move downward. The fixing plate 51 then drives the pressure plate 4 to move downward through the elastic element I52. The pressure plate 4 drives the protrusion 63 to move downward through components such as the protrusion 61.

[0031] The protrusion 63 first contacts the circuit board to lock and position it. At this time, the buffer mechanism 5, the pressure plate 4 and the separation mechanism 6 continue to move down. The protrusion 63 will compress the elastic element II 64 and slide it in the groove 62, so that the protrusion 63 slides completely into the groove 62. The pressure plate 4 moves down to contact the top surface of the circuit board and also compresses the elastic element I 52 to make it contract, thereby playing a certain role in buffering and shock absorption. Finally, the bottom surface of the pressure plate 4 and the protrusion 63 form a flat end surface to press the top of the circuit board.

[0032] When the pressure plate 4 moves upward to reset after pressing, the stretching force of the elastic element II 64 will push the protrusion 63 to press against the top surface of the circuit board, preventing the circuit board from being lifted by the upward-moving pressure plate 4. When the pressure plate 4 moves upward to a certain position, it will drive the separation mechanism 6 to move upward and separate from the circuit board. At this time, since the contact area between the protrusion 63 and the circuit board is limited, it will not lift the circuit board, thus effectively improving its safety.

[0033] This invention uses a driving mechanism 8 to simultaneously drive multiple sets of locking mechanisms 7 to move, which in turn causes the pressure plate 4 and protrusions 63 to press the circuit board together. The multiple sets of locking mechanisms 7 and buffering mechanisms 5 achieve multi-point compression and fixation of the pressure plate 4, thereby improving its pressing effect and efficiency on the circuit board. At the same time, the buffering mechanism 5 also provides a certain degree of buffering and shock absorption. When the pressure plate 4 separates from the circuit board, the separation mechanism 6 prevents the circuit board from being lifted up by the pressure plate 4 and falling, thereby improving the safety of the circuit board.

[0034] The present invention has been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A circuit board laminating device, comprising a machine base with a housing on top, a base on top of the machine base inside the housing, and a vertically movable pressure plate above the base, characterized in that: The box is equipped with a buffer mechanism connected to the top of the pressure plate. The pressure plate is also equipped with a separation mechanism that passes through the buffer mechanism. The top of the buffer mechanism is equipped with multiple sets of lifting mechanisms, and the inner top between the multiple sets of lifting mechanisms is equipped with a drive mechanism. The drive mechanism includes a gear I driven by a motor; The lifting mechanism includes a screw fixed to the top wall of the housing by a bearing, a gear II that meshes with gear I on the screw, and a spiral tube on the screw below gear II; The buffer mechanism includes a fixing plate fixed to the solenoid tube, and the fixing plate is connected to the pressure plate through an elastic element I; The separation mechanism includes a boss that penetrates the fixed plate, and the bottom of the boss is provided with a groove to accommodate the protrusion. The top wall of the groove is provided with an elastic element II that is connected to the protrusion.

2. The circuit board laminating equipment according to claim 1, characterized in that: Both elastic element I and elastic element II are made of spring material.

3. The circuit board laminating equipment according to claim 1, characterized in that: A sliding groove is vertically provided on the side wall of the groove, and a slider located in the sliding groove is provided on the top of the side wall of the protrusion. The bottom end of the protrusion extends to the outside of the bottom of the groove.

4. The circuit board laminating equipment according to claim 1, characterized in that: The top edge of the pressure plate is provided with a rim that is wrapped around the fixing plate, and the top of the inner side wall of the rim is provided with a limiting part located above the fixing plate.

5. The circuit board laminating equipment according to claim 1, characterized in that: The minimum number of lifting mechanisms is four sets, with multiple sets of lifting mechanisms evenly arranged at the top edge of the fixed plate, and the gears II in the multiple sets of lifting mechanisms forming a circular structure coaxial with gear I.

6. The circuit board laminating equipment according to claim 1, characterized in that: The inner wall of the spiral tube is provided with threads for screwing the screw rod, the outer wall of the spiral tube is a smooth structure, the bottom of the spiral tube is covered with a sleeve, and an L-shaped bracket for fixing the sleeve is provided on the top wall of the box.

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