An electronic device

Abstract

This disclosure relates to an electronic device, including a first target component and a second target component. The electronic device further includes an adhesive layer disposed between the first target component and the second target component for connecting the first target component and the second target component. The adhesive layer includes at least a first adhesive portion and a second adhesive portion with different adhesive morphologies. An adhesive region exists between the first target component and the second target component, including at least a first adhesive region and a second adhesive region. The size parameter of the first adhesive region is larger than that of the second adhesive region. The first adhesive portion is disposed in the first adhesive region, and the second adhesive portion is disposed in the second adhesive region. In the electronic device of this disclosure, adhesive portions with different adhesive morphologies are used according to the different sizes of the adhesive regions, avoiding the problem that a single adhesive method cannot be applied to adhesive regions of different sizes, thereby improving the adhesive effect and enhancing the reliability of the connection between the first target component and the second target component.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the development of electronic device technology, the functions of electronic devices are becoming increasingly diversified, leading to more complex structures. Different structures require connection during assembly. In related technologies, adhesive bonding is often used to connect these different structures. Utility Model Content

[0003] To overcome the problems existing in the related technologies, this disclosure provides an electronic device.

[0004] According to a first aspect of the present disclosure, an electronic device is provided, comprising:

[0005] First target component and second target component;

[0006] An adhesive layer is disposed between the first target component and the second target component to connect the first target component and the second target component;

[0007] The adhesive layer includes at least a first adhesive portion and a second adhesive portion, the first adhesive portion and the second adhesive portion have different adhesive forms, there is an adhesive area between the first target part and the second target part, the adhesive area includes at least a first adhesive area and a second adhesive area, the size parameter of the first adhesive area is larger than the size parameter of the second adhesive area, the first adhesive portion is disposed in the first adhesive area, and the second adhesive portion is disposed in the second adhesive area.

[0008] In this embodiment of the present disclosure, the first target component and the second target component are connected by an adhesive layer. The adhesive layer adopts different adhesive forms according to the size parameters of the adhesive area, which avoids the problem that a single adhesive method cannot be applied to adhesive areas of different sizes, thereby improving the adhesive effect and the reliability of the connection between the first target component and the second target component.

[0009] In one possible implementation, the adhesive layer is distributed along the circumferential edge of either the first target member or the second target member, and the adhesive layer at least covers a portion of the circumferential edge.

[0010] In this embodiment of the present disclosure, by setting the adhesive layer to at least cover a portion of the circumferential edge of either the first target component or the second target component, the adhesive layer is bonded around the edge of the target component being bonded, thereby improving the bonding effect and the reliability of the bonded connection.

[0011] In one possible implementation, the first adhesive portion and the second adhesive portion are spaced apart along the circumferential edge, and the first adhesive portion and the second adhesive portion are connected.

[0012] In this embodiment, the first adhesive portion and the second adhesive portion are connected to improve the waterproofness and airtightness between the first target component and the second target component. The first adhesive portion and the second adhesive portion are spaced apart. The first adhesive portion and the second adhesive portion are set according to different areas of the edge. The splicing method is used for bonding, which improves the bonding effect while reducing the processing cost.

[0013] In one possible implementation, the adhesive layer is in the shape of a square ring, which is formed by four sides connected in sequence. Any two adjacent sides are connected by a vertices. The vertices of the square ring are set as second adhesive portions, and the four sides of the square ring are set as first adhesive portions.

[0014] In this embodiment of the present disclosure, by providing a second adhesive part at the top corner where the adhesive area is smaller and a first adhesive part at the four sides where the adhesive area is larger, the adhesive can be applied according to the size parameters of the adhesive area, thereby improving the flexibility and reliability of the adhesive application.

[0015] In one possible implementation, the adhesive layer is in the shape of a square ring, the square ring including a top edge, a bottom edge and two side edges, the top edge, the bottom edge and the two side edges enclosing the square ring, wherein the side edges are provided with the second adhesive portion, and the top edge and the bottom edge are provided with the first adhesive portion.

[0016] In this embodiment of the present disclosure, by providing a second adhesive portion at the side with a smaller adhesive area and a first adhesive portion at the top and bottom edges with a larger adhesive area, the adhesive can be applied according to the size parameters of the adhesive area, thereby improving the flexibility and reliability of the adhesive application.

[0017] In one possible implementation, the first adhesive portion includes a backing adhesive layer, and the second adhesive portion includes a dispensing adhesive layer.

[0018] In this embodiment of the present disclosure, by providing a backing adhesive layer in a larger first bonding area and a dotting adhesive layer in a smaller second bonding area, the adhesive layer can simultaneously meet the needs of large-area bonding and local bonding, ensuring the overall bonding effect and avoiding poor local bonding or adhesive overflow.

[0019] In one possible implementation, the dimensional parameters include at least one of the length, width, and area of ​​the bonding region.

[0020] In this embodiment of the present disclosure, different bonding areas are divided according to size parameters, and different bonding parts are set for different bonding areas, thereby improving bonding flexibility and connection reliability.

[0021] In one possible implementation, the size parameter includes a width, wherein the width of the first adhesive region is greater than or equal to a preset width, and the width of the second adhesive region is less than the preset width.

[0022] In this embodiment of the disclosure, the bonding area is divided into a second bonding area and a first bonding area according to whether it is less than a preset width. Different bonding parts are set for bonding areas of different widths so that bonding areas of different widths can achieve better bonding effects.

[0023] In one possible implementation, the preset width is in the range of 0.6mm to 0.8mm.

[0024] In this embodiment, setting the preset width to 0.6mm~0.8mm can ensure the bonding effect. When the width of the bonding area is greater than or equal to the preset width, the backing adhesive layer is used for bonding. When the width of the bonding area is less than the preset width, the dot adhesive layer is used for bonding. This can also reduce the requirements for the processing accuracy of the backing adhesive layer.

[0025] In one possible implementation, the first target component includes a mid-frame, and the second target component includes a screen module and / or a battery cover.

[0026] The adhesive layer is used to connect the mid-frame and the screen module; and / or

[0027] The adhesive layer is used to connect the middle frame and the battery cover.

[0028] In this embodiment of the disclosure, the screen module and / or battery cover are bonded to the middle frame by an adhesive layer, which improves the bonding effect between the middle frame and the screen module and / or battery cover and enhances the structural stability of the electronic device.

[0029] In one possible implementation, there is an adhesive region between the mid-frame and the screen module. The adhesive region includes at least a first adhesive region and a second adhesive region. The first adhesive region is disposed on the top edge and / or bottom edge of the screen module, and the second adhesive region is disposed on the side edge of the screen module. The adhesive layer includes at least a backing adhesive layer and a dispensing adhesive layer. The backing adhesive layer is disposed on the first adhesive region, and the dispensing adhesive layer is disposed on the second adhesive region.

[0030] In this embodiment of the disclosure, the screen module is bonded to the middle frame through an adhesive layer, which improves the bonding effect between the middle frame and the screen module.

[0031] In one possible implementation, the adhesive layer is used to connect the middle frame and the battery cover, and there is an adhesive area between the middle frame and the battery cover. The adhesive area includes at least a first adhesive area and a second adhesive area. The first adhesive area is disposed on the four sides of the battery cover, and the second adhesive area is disposed on the top corner of the battery cover. The adhesive layer includes at least a backing adhesive layer and a dispensing adhesive layer. The backing adhesive layer is disposed on the first adhesive area, and the dispensing adhesive layer is disposed on the second adhesive area.

[0032] In this embodiment of the present disclosure, the battery cover is bonded to the middle frame by an adhesive layer, which improves the bonding effect between the middle frame and the battery cover and enhances the structural stability of the electronic device.

[0033] In one possible implementation, the electronic device further includes a front housing disposed on a first side of the mid-frame, and the screen module is connected to the front housing via the adhesive layer.

[0034] In this embodiment, the screen module is connected to the front shell of the electronic device through an adhesive layer, which improves the bonding effect between the screen module and the front shell and enhances the connection stability of the screen module. A dotted adhesive layer can be set in the bonding area with smaller size parameters to replace the complete back adhesive layer, which helps to reduce the black border width of the screen module and improve the screen display effect.

[0035] In one possible implementation, the electronic device further includes a rear cover disposed on a second side of the mid-frame, the second side being opposite to the first side, and the battery cover being connected to the rear cover via the adhesive layer.

[0036] In this embodiment of the disclosure, the battery cover is connected to the back cover of the electronic device through an adhesive layer, which helps to improve the bonding effect and ensure that the battery cover and the back cover still have good bonding reliability even when the bonding area is small.

[0037] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0038] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0039] Figure 1 This is a schematic cross-sectional view of an electronic device according to an exemplary embodiment.

[0040] Figure 2 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment.

[0041] Figure 3 This is a schematic diagram of the adhesive layer structure according to an exemplary embodiment.

[0042] Figure 4 This is a schematic diagram of the adhesive layer structure according to another exemplary embodiment. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0044] With the development of electronic device technology, the functions of electronic devices are becoming increasingly diversified, leading to more complex structures. Different structures require connection during assembly. In related technologies, bonding is often used to connect these different structures. When bonding two target parts, either dispensing or adhesive backing is typically employed. Dispensing is prone to breakage when the bonding area is large, making it difficult to guarantee a good bond; while adhesive backing is difficult to process when the bonding area is small. Therefore, the bonding methods in these technologies generally have poor bonding effects and fail to meet bonding requirements.

[0045] To address the aforementioned technical problems, this disclosure provides an electronic device. In this electronic device, a first target component and a second target component are connected by an adhesive layer. The adhesive layer employs different adhesive portions depending on the size parameters of the adhesive area, thus avoiding the problem that a single adhesive method cannot be applied to adhesive areas of different sizes. This improves the adhesive effect and enhances the reliability of the connection between the first target component and the second target component.

[0046] According to an exemplary embodiment, such as Figures 1-4As shown, this disclosure provides an electronic device, such as a mobile terminal, tablet computer, laptop computer, smartwatch, smart bracelet, etc. The electronic device includes a first target component 10 and a second target component 20. An adhesive layer 30 is disposed between the first target component 10 and the second target component 20. The adhesive layer 30 is used to connect the first target component 10 and the second target component 20, for example, to adhesively bond the first target component 10 to the second target component 20, or to adhesively bond the second target component 20 to the first target component 10. The first target component 10 and the second target component 20 can be any structure requiring adhesive connection, such as a frame, shell, circuit board, electronic component, decorative part, screen module, battery cover, etc. The first target component 10 and the second target component 20 can be the same or different. This disclosure does not impose excessive restrictions on the specific types of the first target component 10 and the second target component 20.

[0047] The adhesive layer 30 includes at least two different adhesive portions, namely, at least a first adhesive portion 31 and a second adhesive portion 32. The different adhesive portions have different bonding forms; that is, different adhesive portions can be processed using different techniques, such as dispensing, injection, or backing adhesive, to form adhesive portions of different shapes. The specific materials of the different adhesive portions can be the same or different, and this embodiment does not impose excessive restrictions on this. A bonding region 40 is provided between the first target part 10 and the second target part 20. The bonding region 40 includes at least a first bonding region 41 and a second bonding region 42, wherein the size parameter of the first bonding region 41 is larger than the size parameter of the second bonding region 42. The first adhesive portion 31 is disposed in the first bonding region 41, and the second adhesive portion 32 is disposed in the second bonding region 42. That is, adhesive portions with different bonding forms are provided in the first bonding region 41 and the second bonding region 42 according to their different sizes.

[0048] Of course, it is understandable that when the bonding area 40 includes more areas of different sizes and the bonding layer includes more bonding parts with different bonding forms, those skilled in the art can also adaptably set different bonding parts on areas of different sizes according to the content disclosed in the embodiments of this disclosure, so as to improve the bonding effect and reduce the bonding difficulty. The embodiments of this disclosure do not impose too many restrictions on this.

[0049] In related technologies, when connecting the first target component 10 and the second target component 20, the adhesive layer 30 typically employs a single bonding method. For example, the adhesive layer 30 may be formed entirely by dispensing or by using adhesive backing. Dispensing is generally used for small-area bonding, but when the bonding area 40 is large, adhesive breakage is likely to occur, making it difficult to guarantee a good bonding effect. Adhesive backing, on the other hand, involves applying a pre-processed adhesive layer between the two target components, typically used for large-area bonding. However, due to limitations in processing precision, the size of the adhesive backing layer has processing limits and cannot be further reduced. When the bonding area 40 is too small, adhesive overflow can occur due to the large area of ​​the adhesive backing. In particular, when adhesive backing is used... Figure 1 When the screen module is 21, it will also result in a wider black border on the screen, affecting the visual effect.

[0050] In this embodiment of the present disclosure, different adhesive parts are provided in different adhesive areas 40 according to the different size parameters of different adhesive areas 40. Therefore, adhesive parts can be formed in larger adhesive areas 40 using an adhesive method suitable for large-area bonding, and adhesive parts can be formed in smaller adhesive areas 40 using an adhesive method suitable for small-area bonding. Compared with related technologies, this can better meet different bonding needs and improve the bonding effect.

[0051] In this embodiment of the present disclosure, the first target component 10 and the second target component 20 are connected by an adhesive layer 30. The adhesive layer 30 adopts different adhesive forms according to the size parameters of the adhesive area 40, which avoids the problem that a single adhesive method cannot be applied to adhesive areas 40 of different sizes, thereby improving the adhesive effect and the reliability of the connection between the first target component 10 and the second target component 20.

[0052] In some embodiments, the adhesive layer 30 is distributed along the circumferential edge of either the first target member 10 or the second target member 20, and the adhesive layer 30 at least covers a portion of the circumferential edge. That is, the adhesive layer 30 may be provided intermittently along the circumferential edge or continuously along the circumferential edge.

[0053] In one example, the adhesive layer 30 is intermittently arranged along the circumferential edge. When the sealing requirement between the first target 10 and the second target 20 is low, the adhesive layer 30 can be intermittently arranged along the circumferential edge to reduce the amount of adhesive used and lower material costs.

[0054] In another example, the adhesive layer 30 is continuously disposed along the circumferential edge. When a high level of sealing is required between the first target component 10 and the second target component 20, the adhesive layer 30 can be continuously disposed along the circumferential edge to form a continuous sealant layer, thereby improving waterproofness and airtightness.

[0055] In this embodiment of the present disclosure, by setting the adhesive layer 30 to at least cover a portion of the circumferential edge of either the first target member 10 or the second target member 20, the adhesive layer 30 is used to bond around the edge of the target member being bonded, thereby improving the bonding effect and the reliability of the bonded connection.

[0056] Additionally, the adhesive layer 30 can be used to bond the first target component 10 to the second target component 20, or it can be used to bond the second target component 20 to the first target component 10. In one example, the adhesive layer 30 is used to bond the first target component 10 to the second target component 20, and the adhesive layer 30 is distributed along the circumferential edge of the first target component 10. In another example, the adhesive layer 30 is used to bond the second target component 20 to the first target component 10, and the adhesive layer 30 is distributed along the circumferential edge of the second target component 20. That is, the adhesive layer 30 is used to bond one of the first target component 10 and the second target component 20 to the other, and the adhesive layer 30 is distributed along the circumferential edge of the target component to which it is bonded. Those skilled in the art can select the target component to be bonded according to the bonding requirements and set the position of the adhesive layer 30 accordingly; the embodiments disclosed herein do not impose excessive limitations in this regard.

[0057] In some embodiments, the adhesive layer 30 includes a first adhesive portion 31 and a second adhesive portion 32. For example... Figure 2 As shown, the bonding area 40 includes a first bonding area 41 and a second bonding area 42, wherein the dimensional parameters of the first bonding area 41 are larger than the dimensional parameters of the second bonding area 42. A first bonding portion 31 is disposed in the first bonding area 41, and a second bonding portion 32 is disposed in the second bonding area 42.

[0058] For example, the first adhesive portion 31 includes a backing adhesive layer, and the second adhesive portion 32 includes a dispensing adhesive layer.

[0059] In current related technologies, the minimum size of the back adhesive layer can be processed to 0.8mm, while the minimum size of the dispensing layer can reach 0.4mm. Therefore, when bonding in a smaller area of ​​the bonding area 40, such as the edge of the display area of ​​the screen module 21, using the dispensing layer can reduce the width of the black border of the screen by 50% compared to the back adhesive layer. This is beneficial to improving the screen ratio, achieving better display effects, and enhancing the user's visual experience.

[0060] In this embodiment, by providing a backing adhesive layer in a larger first bonding area 41 and a dotted adhesive layer in a smaller second bonding area 42, the adhesive layer 30 can simultaneously meet the needs of large-area bonding and local bonding, ensuring the overall bonding effect and avoiding poor local bonding or adhesive overflow. When applied to the bonding of the screen module 21, it can also reduce the black border of the screen while ensuring the bonding effect and improving the visual display effect.

[0061] In some embodiments, the first adhesive portion 31 and the second adhesive portion 32 are spaced apart along the circumferential edge, and the first adhesive portion 31 and the second adhesive portion 32 are connected. For example... Figure 2 As shown, the first adhesive portion 31 and the second adhesive portion 32 are spaced apart along the circumferential edge and are connected. The first adhesive portion 31 and the second adhesive portion 32 are connected to form an adhesive layer 30, thereby ensuring that the adhesive areas 40 of different sizes have a better bonding effect, and making the adhesive layer 30 continuously arranged along the circumferential edge, improving the sealing between the first target part 10 and the second target part 20. At the same time, waterproofing can be achieved without processing a complete U-shaped adhesive layer, reducing processing costs.

[0062] In this embodiment, the first adhesive portion 31 and the second adhesive portion 32 are connected to improve the waterproofness and airtightness between the first target part 10 and the second target part 20. The first adhesive portion 31 and the second adhesive portion 32 are spaced apart. The first adhesive portion 31 and the second adhesive portion 32 are set according to different areas of the edge. The splicing method is used for bonding, which improves the bonding effect while reducing the processing cost.

[0063] In some embodiments, the adhesive layer 30 is shaped as a square ring. That is, the overall shape of the adhesive layer 30 is square. In this embodiment of the present disclosure, the adhesive layer 30 is configured as a square ring to be suitable for bonding square target parts such as the screen module 21 and the battery cover 22.

[0064] In one example, such as Figure 3 As shown, the square ring is formed by four sides—first side 301, second side 302, third side 303, and fourth side 304—connected and enclosed sequentially. The square ring also has four vertices 305, and any two adjacent sides are connected through the vertices 305. The adhesive layer 30 of the square ring can be used, for example, to bond the battery cover 22. Since the bonding area of ​​the four sides of the battery cover 22 is large, and the bonding area of ​​the vertices is small, the size parameters of the bonding areas 40 corresponding to the four sides of the square ring are correspondingly large, while the size parameters of the bonding areas 40 corresponding to the vertices 305 of the square ring are small. The four vertices 305 of the square ring are designated as second adhesive portions 32, and the four sides of the square ring are designated as first adhesive portions 31.

[0065] In this embodiment of the present disclosure, by providing a second adhesive portion 32 at the top corner 305 where the adhesive area is smaller, and providing a first adhesive portion 31 at the four sides where the adhesive area is larger, the adhesive can be applied according to the size parameters of the adhesive area 40, thereby improving the flexibility and reliability of the adhesive.

[0066] In another example, the adhesive layer is shaped like a square ring, such as... Figure 4As shown, the square ring includes a top edge 306, a bottom edge 307, and two side edges 308, which together form the square ring. The adhesive layer 30 of the square ring can be used, for example, for bonding the screen module 21. The position of the square ring corresponds to the circumferential edge of the screen module 21. The top edge 306 and bottom edge 307 of the square ring correspond to the top and bottom edges of the screen module (not shown in the figure), respectively, and the side edges of the square ring correspond to the side edges of the screen module 21. It is worth noting that in this embodiment, the top and bottom edges of the screen module 21 refer to the two edges located at the top and bottom of the screen module 21, respectively, in the user's commonly used posture when using the electronic device. Since the black borders of the top and bottom edges of the screen module 21 are usually wider, i.e., the bonding area is larger, while the black borders of the side edges of the screen module 21 are usually narrower, i.e., the bonding area is smaller. Therefore, the bonding areas 40 corresponding to the top edge 306 and bottom edge 307 of the square ring have larger dimensions, while the bonding areas 40 corresponding to the side edge 308 of the square ring have smaller dimensions. The side edge 308 is provided with a second bonding portion 32, and the top edge 306 and bottom edge 307 are provided with a first bonding portion 31.

[0067] Of course, it is understandable that the above two embodiments of adhesive layer 30 being a square ring can also be combined. For example, when the adhesive areas 40 on the sides and top corners of the square ring are both small, a second adhesive part 32 can be provided in the adhesive areas 40 corresponding to the sides and top corners. This disclosure does not impose too many restrictions on this.

[0068] In this embodiment of the present disclosure, by providing a second adhesive portion 32 at the side 308 with a smaller adhesive area and a first adhesive portion 31 at the top 306 and bottom 307 with a larger adhesive area, the adhesive can be applied according to the size parameters of the adhesive area 40, thereby improving the flexibility and reliability of the adhesive application.

[0069] In some embodiments, the dimensional parameters include at least one of the length, width, and area of ​​the bonding region 40. In one example, the dimensional parameter includes length. In another example, the dimensional parameter includes width and area. In yet another example, the dimensional parameter includes length, width, and area. It is understood that the embodiments of this disclosure do not impose excessive restrictions on the specific selection of the dimensional parameters. For example, when the length of the bonding region 40 has a greater impact on the bonding effect than the width, the dimensional parameter may only include length; when both the length and width of the bonding region 40 have a certain impact on the bonding effect, the dimensional parameter may be set as a combination of several parameters including length, width, and area.

[0070] In this embodiment of the disclosure, different bonding areas 40 are divided according to size parameters, and different bonding parts are provided for different bonding areas 40, thereby improving bonding flexibility and connection reliability.

[0071] In some embodiments, the dimensional parameters include width, wherein the width of the first adhesive region 41 is greater than or equal to a preset width, and the width of the second adhesive region 42 is less than the preset width. The region with a width greater than or equal to the preset width is the first adhesive region 41, which is provided with a first adhesive portion 31; the region with a width less than the preset width is the second adhesive region 42, which is provided with a second adhesive portion 32.

[0072] In this embodiment of the present disclosure, the bonding area 40 is divided into a second bonding area 42 and a first bonding area 41 according to whether it is less than a preset width. Different bonding parts are provided for bonding areas 40 of different widths so that bonding areas 40 of different widths can achieve better bonding effect.

[0073] In one example, the preset width ranges from 0.6mm to 0.8mm. For instance, the preset width is 0.7mm. This preset width is also the processing limit width of the adhesive layer in related technologies. Therefore, when the width of the bonding area 40 is greater than or equal to the preset width, the adhesive layer can be used for bonding; when the width of the bonding area 40 is less than the preset width, a dispensing layer is required for bonding. It is understood that the preset width in this embodiment is determined based on the processing limit width of the adhesive layer in current related technologies. When the processing limit width of the adhesive layer is further reduced, the preset width can also be adaptively adjusted. In this embodiment, setting the preset width to 0.6mm to 0.8mm ensures bonding effectiveness. Using the adhesive layer when the width of the bonding area 40 is greater than or equal to the preset width and using a dispensing layer when the width of the bonding area 40 is less than the preset width also reduces the requirement for the processing precision of the adhesive layer.

[0074] In some embodiments, the first target component 10 includes a mid-frame 101, and the second target component 20 includes a screen module 21 and / or a battery cover 22. An adhesive layer 30 is used to connect the mid-frame 101 and the screen module 21; and / or, the adhesive layer 30 is used to connect the mid-frame 101 and the battery cover 22.

[0075] In one example, the first target component 10 includes a mid-frame 101, the second target component 20 includes a screen module 21, and an adhesive layer 30 is used to bond the screen module 21 to the mid-frame 101. An adhesive region 40 is provided between the mid-frame 101 and the screen module 21, the adhesive region 40 including at least a first adhesive region 41 and a second adhesive region 42, and the adhesive layer 30 including at least a first adhesive portion 31 and a second adhesive portion 32. The screen module 21 is square in shape, the first adhesive region 41 is located on the top edge and / or bottom edge of the screen module 21, the second adhesive region 42 is located on the side edge of the screen module 21, the first adhesive portion 31 is located in the first adhesive region 41, and the second adhesive portion 32 is located in the second adhesive region 42.

[0076] In another example, the first target component 10 includes a middle frame 101, the second target component 20 includes a battery cover 22, and an adhesive layer 30 is used to bond the battery cover 22 to the middle frame 101. An adhesive region 40 is provided between the middle frame 101 and the battery cover 22, the adhesive region 40 including at least a first adhesive region 41 and a second adhesive region 42, and the adhesive layer 30 including at least a first adhesive portion 31 and a second adhesive portion 32. The battery cover 22 is square in shape, the first adhesive region 41 is located on the four sides of the battery cover 22, the second adhesive region 42 is located at the top corner of the battery cover 22, the first adhesive portion 31 is located in the first adhesive region 41, and the second adhesive portion 32 is located in the second adhesive region 42.

[0077] In another example, the first target component 10 includes a mid-frame 101, the second target component 20 includes a screen module 21 and a battery cover 22, and the adhesive layer 30 may include a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is used to bond the screen module 21 to the mid-frame 101, and the second adhesive layer is used to bond the battery cover 22 to the mid-frame 101. Furthermore, when the second target component 20 includes the screen module 21 and the battery cover 22, the screen module 21 and the battery cover 22 are typically located on different sides of the mid-frame 101.

[0078] In this embodiment, the screen module 21 and / or battery cover 22 are bonded to the middle frame 101 by the adhesive layer 30, which improves the bonding effect between the middle frame 101 and the screen module 21 and / or battery cover 22 and enhances the structural stability of the electronic device.

[0079] In some embodiments, the electronic device further includes a front housing 11. For example... Figures 1-4 As shown, the front shell 11 is located on the first side of the middle frame 101 (i.e., Figure 1As shown above, the screen module 21 is connected to the front shell 11 via an adhesive layer 30. The front shell 11 can be fixedly connected to the middle frame 101, or it can be an integral structure with the middle frame 101. The material of the front shell 11 can be the same as or different from that of the middle frame 101, for example, it can be metal, resin, plastic, ceramic, etc. This embodiment does not impose too many restrictions on this.

[0080] In this embodiment, the screen module 21 is connected to the front shell 11 of the electronic device through the adhesive layer 30, which improves the bonding effect between the screen module 21 and the front shell 11 and enhances the connection stability of the screen module 21. The adhesive layer can be set in the adhesive area 40 with smaller size parameters to replace the complete back adhesive layer, which helps to reduce the black border width of the screen module 21 and improve the screen display effect.

[0081] In some embodiments, the electronic device further includes a rear housing (not shown in the figure), which is disposed on the second side of the middle frame 101 (i.e., Figure 1 As shown below, the second side is opposite to the first side, and the battery cover 22 is connected to the rear shell through an adhesive layer 30. The rear shell can be fixedly connected to the middle frame 101, or it can be an integral structure with the middle frame 101. The material of the rear shell can be the same as or different from that of the front shell 11 and the middle frame 101. For example, it can be made of metal, resin, plastic, ceramic, etc. This disclosure does not impose too many restrictions on this embodiment.

[0082] In this embodiment of the disclosure, the battery cover 22 is connected to the back cover of the electronic device by the adhesive layer 30, which helps to improve the bonding effect and ensure that the battery cover 22 and the back cover still have good bonding reliability even when the bonding area 40 is small.

[0083] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0084] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, include: First target component and second target component; An adhesive layer is disposed between the first target component and the second target component to connect the first target component and the second target component; The adhesive layer includes at least a first adhesive portion and a second adhesive portion, the first adhesive portion and the second adhesive portion have different adhesive forms, there is an adhesive area between the first target part and the second target part, the adhesive area includes at least a first adhesive area and a second adhesive area, the size parameter of the first adhesive area is larger than the size parameter of the second adhesive area, the first adhesive portion is disposed in the first adhesive area, and the second adhesive portion is disposed in the second adhesive area.

2. The electronic device according to claim 1, characterized in that, The adhesive layer is distributed along the circumferential edge of either the first target component or the second target component, and the adhesive layer at least covers a portion of the circumferential edge.

3. The electronic device according to claim 2, characterized in that, The first adhesive portion and the second adhesive portion are spaced apart along the circumferential edge, and the first adhesive portion and the second adhesive portion are connected.

4. The electronic device according to claim 3, characterized in that, The adhesive layer is in the shape of a square ring, which is formed by four consecutively connected sides. Any two adjacent sides are connected by their apex. The apex of the square ring is set as the second adhesive part, and the four sides of the square ring are set as the first adhesive part.

5. The electronic device according to claim 3, characterized in that, The adhesive layer is in the shape of a square ring, which includes a top edge, a bottom edge, and two side edges. The top edge, the bottom edge, and the two side edges enclose the square ring. The side edges are provided with the second adhesive portion, and the top edge and the bottom edge are provided with the first adhesive portion.

6. The electronic device according to claim 1, characterized in that, The first adhesive portion includes a backing adhesive layer, and the second adhesive portion includes a dispensing adhesive layer.

7. The electronic device according to any one of claims 3 to 6, characterized in that, The dimensional parameters include at least one of the length, width, and area of ​​the bonding region.

8. The electronic device according to claim 7, characterized in that, The size parameters include width, wherein the width of the first adhesive area is greater than or equal to a preset width, and the width of the second adhesive area is less than the preset width.

9. The electronic device according to claim 8, characterized in that, The preset width ranges from 0.6mm to 0.8mm.

10. The electronic device according to any one of claims 1 to 6, characterized in that, The first target component includes a mid-frame, and the second target component includes a screen module and / or a battery cover; The adhesive layer is used to connect the middle frame and the screen module; And / or, The adhesive layer is used to connect the middle frame and the battery cover.

11. The electronic device according to claim 10, characterized in that, There is an adhesive area between the mid-frame and the screen module. The adhesive area includes at least a first adhesive area and a second adhesive area. The first adhesive area is disposed on the top edge and / or bottom edge of the screen module, and the second adhesive area is disposed on the side edge of the screen module. The adhesive layer includes at least a backing adhesive layer and a dispensing adhesive layer. The backing adhesive layer is disposed on the first adhesive area, and the dispensing adhesive layer is disposed on the second adhesive area.

12. The electronic device according to claim 10, characterized in that, The adhesive layer is used to connect the middle frame and the battery cover. There is an adhesive area between the middle frame and the battery cover. The adhesive area includes at least a first adhesive area and a second adhesive area. The first adhesive area is disposed on the four sides of the battery cover, and the second adhesive area is disposed on the top corner of the battery cover. The adhesive layer includes at least a backing adhesive layer and a dispensing adhesive layer. The backing adhesive layer is disposed in the first adhesive area, and the dispensing adhesive layer is disposed in the second adhesive area.

13. The electronic device according to claim 10, characterized in that, The electronic device also includes a front shell, which is disposed on the first side of the mid-frame, and the screen module is connected to the front shell through the adhesive layer.

14. The electronic device according to claim 13, characterized in that, The electronic device also includes a rear cover disposed on a second side of the mid-frame, the second side being opposite to the first side, and the battery cover being connected to the rear cover via the adhesive layer.

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