Heat dissipation device and electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2026-08-11
AI Technical Summary
然而，散热风扇工作时，也会因自身功耗而产生一定热量，因而电子设备的降温效果并不明显
[0015]采用本申请的技术方案，利用第一盖板和第二盖板扣合形成容纳腔，使散热装置的组成结构较为简单。通过在第一盖板和/或第二盖板上设置第一凸起部，能够增加第一盖板和/或第二盖板与侧向组件之间的间隙尺寸，从而更大的间隙尺寸内可以容纳更多的空气，进而提高散热效果。同时，第一凸起部上设置的第二凸起部可以与目标器件等产生热量的热源相对，由于第二凸起部能减小散热装置与第二凸起部对应侧的热源之间的距离，因此可以实现更高效地导热，提高对热源的散热效果。
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Figure CN224627002U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic technology, and in particular to a heat dissipation device and electronic device. Background Technology
[0002] With the popularization of 5G technology and the development of mobile games, the functions of electronic devices such as smartphones and tablets are becoming increasingly diversified, and the power consumption of these devices is also increasing. However, due to the limited internal stacking space of these electronic devices, the heat generated cannot be quickly dissipated, which can easily lead to a continuous rise in the internal temperature of the devices. This not only reduces the user's feel but also affects the functionality of the electronic devices and poses certain safety hazards.
[0003] In related technologies, a small cooling fan is typically installed inside electronic devices to reduce their temperature, thereby accelerating airflow. However, the cooling fan itself generates heat due to its own power consumption, thus the cooling effect on the electronic device is not significant. Utility Model Content
[0004] In view of this, embodiments of this application provide a heat dissipation device and electronic device that can improve heat dissipation effect.
[0005] On the one hand, embodiments of this application provide a heat dissipation device having a receiving cavity for containing a heat dissipation working fluid;
[0006] The cavity wall on at least one side has a first protrusion that protrudes away from the cavity, and the first protrusion has at least one second protrusion that protrudes away from the cavity along the protrusion direction.
[0007] The heat dissipation device provided in this application embodiment has a receiving cavity, the sidewall of which has a first protrusion, and the first protrusion has a second protrusion. This two-stage protrusion structure increases the heat dissipation space within the receiving cavity, thereby increasing the heat dissipation rate. Simultaneously, the two-stage protrusion structure reduces the distance to the heat source, thus improving thermal conductivity. When the second protrusion is positioned opposite the target device, it can rapidly transfer the heat generated by the target device, thereby improving the heat dissipation effect.
[0008] In some possible implementations, both the first protrusion and the second protrusion are stamped structures.
[0009] By adopting the technical solution of this application, since both the first protrusion and the second protrusion are stamped structures, the first protrusion, the second protrusion, and the cavity wall of the receiving cavity are integrally formed. Compared with the structure of welding the protrusion structure to the cavity wall, the heat transfer resistance of the heat dissipation device can be reduced, thereby increasing the heat dissipation rate and thus improving the heat dissipation effect.
[0010] In some possible implementations, the surface of the second protrusion intersecting the protrusion direction has a third protrusion that is opposite to the protrusion of the receiving cavity.
[0011] By adopting the technical solution of this application, the first protrusion, the second protrusion and the third protrusion form a three-level stepped protrusion, which can further increase the heat dissipation space in the cavity, thereby improving the heat dissipation effect of the heat dissipation device.
[0012] In some possible implementations, the surface of the first protrusion intersecting the protrusion direction and / or the surface of the second protrusion intersecting the protrusion direction have a recessed portion that is recessed toward the receiving cavity.
[0013] By adopting the technical solution of this application, the recessed portion can avoid the target device opposite to the second protrusion, thereby ensuring a better heat dissipation effect and preventing the target device that generates heat from being damaged by interference or compression from the second protrusion, thus ensuring the normal use of the target device.
[0014] In some possible implementations, the heat dissipation device includes a first cover plate and a second cover plate that interlock with each other, the first cover plate and the second cover plate forming the receiving cavity, and the first cover plate and / or the second cover plate having the first protrusion.
[0015] The technical solution of this application utilizes a first cover plate and a second cover plate to form a receiving cavity, simplifying the structure of the heat dissipation device. By providing a first protrusion on the first cover plate and / or the second cover plate, the gap between the first cover plate and / or the second cover plate and the lateral components can be increased, allowing more air to be accommodated within the larger gap, thereby improving the heat dissipation effect. Simultaneously, a second protrusion on the first protrusion can be positioned opposite a heat source such as a target device. Since the second protrusion reduces the distance between the heat dissipation device and the heat source on the corresponding side of the second protrusion, more efficient heat conduction can be achieved, improving the heat dissipation effect on the heat source.
[0016] In some possible implementations, the first cover plate and the second cover plate are respectively provided with the first protrusion, and the second protrusion on the first cover plate is disposed opposite to the second protrusion on the second cover plate.
[0017] By adopting the technical solution of this application, when the second protrusions on the first cover plate and the second cover plate are arranged opposite to each other, the second protrusion on the cover plate closer to the heat source can reduce the distance between itself and the heat source, thereby rapidly dissipating the heat generated by the heat source and improving the heat dissipation effect. The second protrusion on the cover plate farther from the heat source can increase the gap between the heat dissipation device and that side, thereby increasing the air volume on that side and achieving a better heat insulation effect.
[0018] In some possible implementations, the heat dissipation device further includes a heat-conducting layer, the two sides of which abut against the surface of the second protrusion away from the receiving cavity and the surface of the target device, respectively.
[0019] By adopting the technical solution of this application, the second protrusion can directly contact the heat source through the heat-conducting layer, thereby enhancing the heat conduction effect and rapidly transferring the heat generated by the heat source, thereby improving the heat dissipation effect.
[0020] In some possible implementations, the first protrusion has a plurality of second protrusions, each of which corresponds to a target device.
[0021] By adopting the technical solution of this application, by setting a second protrusion that corresponds one-to-one with the target device, the distance between the corresponding target devices can be reduced and the volume in the cavity can be increased, thereby enabling the heat generated by the target device to be transferred out more quickly, thus improving the heat dissipation effect.
[0022] In some possible implementations, the heat dissipation device further includes a graphite layer located on the surface of the first cover plate opposite to the second cover plate and / or on the surface of the second cover plate opposite to the first cover plate, wherein the orthographic projection of the first protrusion on the graphite layer is located within the graphite layer.
[0023] By employing the technical solution of this application, the graphite layer stacked on the first cover plate and / or the second cover plate in the heat dissipation device can more effectively transfer heat away, thereby improving the heat dissipation rate and further improving the heat dissipation effect.
[0024] In some possible implementations, the heat dissipation device further includes a plurality of support members located within the receiving cavity, with both ends of the support members abutting against the first cover plate and the second cover plate, respectively.
[0025] By adopting the technical solution of this application, the support member can support the first cover plate and the second cover plate, thereby increasing the strength of the first cover plate and the second cover plate and preventing deformation of the first cover plate and the second cover plate.
[0026] In some possible implementations, the receiving cavity includes opposing first and second regions, and the cavity wall of the receiving cavity located in the first region is provided with the second protrusion;
[0027] The heat dissipation device further includes a heat insulation element that extends from the first region to the second region and divides the receiving cavity into a first cavity and a second cavity side by side.
[0028] The first cavity is connected to the first region at one end and the second cavity is connected to the first region at one end. The first cavity is connected to the second region at one end and the second cavity is connected to the second region at one end. The heat dissipation medium is heated and flows through the first region, the first cavity and the second region to the second cavity, and then flows back from the second cavity to the first region.
[0029] By adopting the technical solution of this application and setting up a heat insulation component, the high-heat vapor in the first cavity and the low-temperature liquid in the second cavity can be prevented from moving between each other, ensuring that the liquid in the second cavity remains at a low temperature, thereby improving the effectiveness of heat dissipation and thus improving the heat dissipation effect.
[0030] On the other hand, embodiments of this application also provide an electronic device, which includes a heat source component, a screen component, and a heat dissipation device as described in any of the embodiments of this application above. The heat dissipation device is located between the heat source component and the screen component, and the second protrusion is disposed opposite to the target device in the heat source component.
[0031] The electronic device provided in this application has a heat dissipation device in the heat source component and the screen component, and the second protrusion is disposed opposite to the target device in the heat source component. Therefore, the heat generated by the target device can be quickly dissipated, thereby improving the heat dissipation effect of the heat source component and preventing the screen component from overheating, thus improving the user experience. Attached Figure Description
[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0033] Figure 1 This is a schematic diagram and a partial enlarged view of a heat dissipation device provided in an embodiment of this application;
[0034] Figure 2 yes Figure 1The figure shown is a cross-sectional view of a heat dissipation device provided in this application embodiment at section AA;
[0035] Figure 3 This is a schematic diagram and a partial enlarged view of another heat dissipation device provided in the embodiments of this application;
[0036] Figure 4 This is a schematic diagram and a partial enlarged view of another heat dissipation device provided in the embodiments of this application;
[0037] Figure 5 This is an exploded view of another heat dissipation device provided in an embodiment of this application;
[0038] Figure 6 This is a schematic diagram and a partial enlarged view of another heat dissipation device provided in the embodiments of this application;
[0039] Figure 7 This is a schematic diagram of the structure of the second cover plate in a heat dissipation device provided in an embodiment of this application;
[0040] Figure 8 yes Figure 1 The figure shown is a cross-sectional view of a heat dissipation device provided in this application embodiment at section BB;
[0041] Figure 9 This is an exploded view of an electronic device provided in an embodiment of this application;
[0042] Figure 10 This is a power consumption diagram of two electronic devices when conducting a temperature rise comparison test on an electronic device equipped with the heat dissipation device provided in the embodiments of this application and an electronic device in the related technology equipped with a common heat sink.
[0043] Figure 11 This is a temperature rise diagram of two electronic devices when a temperature rise comparison test is conducted on an electronic device equipped with the heat dissipation device provided in the embodiments of this application and an electronic device in the related art equipped with a common heat sink.
[0044] The labels in the attached diagram are as follows:
[0045] 100. Receiving cavity; 110. First protrusion; 120. Second protrusion; 130. Third protrusion; 140. Recess; 150. First region; 160. Second region; 101. First cavity; 102. Second cavity; 1011. First channel; 1012. Second channel;
[0046] 200. First cover plate;
[0047] 300. Second cover plate;
[0048] 400, Thermal conductive layer;
[0049] 500, graphite layer;
[0050] 600. Support components;
[0051] 700. Thermal insulation components;
[0052] 800. Separator;
[0053] 900. Heat source assembly; 910. Target device;
[0054] 1000, Screen components.
[0055] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0057] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by those skilled in the art.
[0058] To make the technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0059] Combination Figure 1 , Figure 2 and Figure 9As shown in the figure, this application embodiment provides a heat dissipation device with a receiving cavity 100 for containing a heat dissipation medium. At least one side wall of the receiving cavity 100 has a first protrusion 110 protruding away from the receiving cavity 100, and the first protrusion 110 has at least one second protrusion 120 protruding away from the receiving cavity 100 along the protrusion direction. The heat dissipation device provided in this application embodiment has a receiving cavity 100, a first protrusion 110 on the side wall of the receiving cavity 100, and a second protrusion 120 on the first protrusion 110. The two-stage protrusion structure increases the heat dissipation space within the receiving cavity 100, increasing the heat dissipation rate. Simultaneously, the two-stage protrusion structure reduces the distance to the heat source, thereby improving thermal conductivity. When the second protrusion 120 is positioned opposite to the target device 910, it can quickly transfer the heat generated by the target device 910, thereby improving the heat dissipation effect. It should be noted that the accompanying drawings of this application are illustrated using the protrusion direction as the thickness direction of the heat dissipation device as an example.
[0060] It should be noted that the electronic device may include, for example, a heat source component 900 and a screen component 1000. The heat dissipation device provided in this embodiment may be located between the screen component 1000 and the heat source component 900. The heat source component 900 may include a motherboard and multiple devices mounted on the motherboard, wherein the motherboard may be a PCB (Printed Circuit Board). The target device 910 in this embodiment may be, for example, a System-on-Chip (SOC) or DDR (Double Data Rate SDRAM) or other devices that generate high heat in the electronic device. The target device 910 may be disposed opposite to the second protrusion 120. It should be understood that when both the first protrusion 110 and the second protrusion 120 protrude towards the motherboard, the first protrusion 110 can reduce the distance between the outer surface of the heat dissipation device and the motherboard, and the second protrusion 120 can further reduce the distance between the outer surface of the heat dissipation device relative to the target device 910 and the target device 910. This can improve the heat conduction effect on the heat generated by the various devices on the motherboard, especially the high heat of the target device 910 can be quickly dissipated, improving the heat dissipation effect of the heat dissipation device, and thus better meeting the heat dissipation requirements of the SOC in high-heat scenarios such as benchmarking. When both the first protrusion 110 and the second protrusion 120 protrude towards the screen assembly 1000, the protrusion height of the first protrusion 110 and the second protrusion 120 can increase the gap thickness between the outer surface of the heat dissipation device without the first protrusion 110 and the second protrusion 120 and the screen assembly 1000, thereby increasing the amount of air in the thicker gap. This not only improves the heat dissipation effect but also provides effective heat insulation to prevent the screen assembly 1000 from overheating, thus improving the user's touch feel when touching the screen and satisfying the user's touch feel in high-heat scenarios such as playing games on the mobile phone.
[0061] The following is in conjunction with the appendix Figures 1 to 11 The various components and functions of the heat dissipation device provided in the embodiments of this application will be described in more detail.
[0062] like Figure 1As shown, in some possible embodiments, both the first protrusion 110 and the second protrusion 120 are stamped structures. It should be noted that in this embodiment, "stamped structure" refers to the fact that both the first protrusion 110 and the second protrusion 120 are processed by a stamping process. It should be understood that since both the first protrusion 110 and the second protrusion 120 are stamped structures, the first protrusion 110, the second protrusion 120, and the cavity wall of the receiving cavity 100 are integrally formed. Compared to welding the protrusion structure to the cavity wall of the receiving cavity 100, since the first protrusion 110 and the second protrusion 120 in this embodiment do not require soldering, the thermal resistance of the heat dissipation device can be effectively reduced, thereby enabling more efficient heat conduction and further improving the heat dissipation rate and effect.
[0063] like Figure 3 As shown, in some possible embodiments, the surface of the second protrusion 120 intersecting the protrusion direction has a third protrusion 130 that protrudes away from the receiving cavity 100. For example, the surface of the second protrusion 120 perpendicular to the protrusion direction has a third protrusion 130. It should be noted that by using the first protrusion 110, the second protrusion 120, and the third protrusion 130 to form a three-stage stepped protrusion, the heat dissipation space within the receiving cavity 100 can be further increased, thereby improving the heat dissipation effect of the heat dissipation device. Furthermore, the third protrusion 130 further reduces the distance between itself and the target device 910, thereby further improving the thermal conductivity of the heat dissipation device to the target device 910, and thus improving the heat dissipation effect.
[0064] like Figure 4 As shown, in some possible embodiments, the surface of the first protrusion 110 intersecting the protrusion direction and / or the surface of the second protrusion 120 intersecting the protrusion direction have recesses 140 that are recessed toward the receiving cavity 100. For example, the surface of the first protrusion 110 perpendicular to the protrusion direction and / or the surface of the second protrusion 120 perpendicular to the protrusion direction have recesses 140. It should be noted that the recesses 140 can be used to avoid the target device 910 opposite to the first protrusion 110 and / or the second protrusion 120, preventing the target device 910, which generates heat, from being damaged by interference or compression from the first protrusion 110 or the second protrusion 120, thus ensuring the normal use of the target device 910. It should be understood that the shape of the recess 140 can match the target device 910, so that the recess 140 and the corresponding target device 910 can fit better to further improve the heat conduction effect and thus improve the heat dissipation effect of the heat dissipation device. It can also make better avoidance of the target device 910 by the recess 140 to ensure that the target device 910 works normally.
[0065] like Figure 5As shown, in some possible embodiments, the heat dissipation device includes a first cover plate 200 and a second cover plate 300 that interlock with each other, forming a receiving cavity 100. The first cover plate 200 and / or the second cover plate 300 are provided with a first protrusion 110. It should be understood that in the embodiments of this application, the cavity wall of the receiving cavity 100 with the first protrusion 110 is the first cover plate 200 and / or the second cover plate 300. It should be noted that using the first cover plate 200 and the second cover plate 300 to interlock to form the receiving cavity 100 simplifies the composition structure of the heat dissipation device. By providing the first protrusion 110 on the first cover plate 200 and / or the second cover plate 300, the gap size between the first cover plate 200 and / or the second cover plate 300 and the lateral components can be increased, thereby accommodating more air within the larger gap size and improving the heat dissipation effect. Meanwhile, the second protrusion 120 provided on the first protrusion 110 can protrude towards heat sources such as the target device 910 that generate heat. Since the second protrusion 120 can reduce the distance between the heat dissipation device and the heat source on the corresponding side of the second protrusion 120, more efficient heat conduction can be achieved, improving the heat dissipation effect on the heat source. In addition, when the second protrusion 120 provided on the first protrusion 110 protrudes towards the screen assembly 1000, the gap distance between the outer surface of the heat dissipation device and the screen assembly 1000 can be increased, thereby increasing the amount of air in the gap, which can improve the heat dissipation effect, quickly dissipate heat, and also play a heat insulation role, preventing the screen assembly 1000 from overheating. It should be noted that, in the embodiments of this application, the first cover plate 200 can be, for example, the side closer to the heat source assembly 900, and the second cover plate 300 can be, for example, the side closer to the screen assembly 1000. The accompanying drawings of this application are illustrated with the example of the first protrusion 110 and the second protrusion 120 provided on the first cover plate 200.
[0066] In some possible embodiments, the first cover plate 200 and the second cover plate 300 are each provided with a first protrusion 110, and the second protrusion 120 on the first cover plate 200 and the second protrusion 120 on the second cover plate 300 are disposed opposite to each other. It should be noted that when the second protrusions 120 on the first cover plate 200 and the second cover plate 300 are disposed opposite to each other, the second protrusion 120 on the cover plate closer to the heat source can reduce the distance between itself and the heat source, thereby rapidly dissipating the heat generated by the heat source and improving the heat dissipation effect. The second protrusion 120 on the cover plate farther from the heat source can increase the gap between the heat dissipation device and that side, thereby increasing the air volume on that side and achieving a better heat insulation effect.
[0067] like Figure 5As shown, in some possible embodiments, the heat dissipation device further includes a thermally conductive layer 400, the two sides of which abut against the surface of the second protrusion 120 away from the receiving cavity 100 and the surface of the target device 910, respectively. It should be understood that the second protrusion 120 protrudes towards the target device 910. It should be noted that the thermally conductive layer 400 can be made of thermally conductive gel. The second protrusion 120 can directly contact the heat source through the thermally conductive layer 400, thereby enhancing the thermal conductivity and rapidly transferring the heat generated by the heat source, thus improving the heat dissipation effect. Furthermore, since the second protrusion 120 protrudes towards the target device 910, the distance between the second protrusion 120 and the target device 910 is small. Therefore, the thickness of the thermally conductive layer 400 located between the target device 910 and the second protrusion 120 will also be small, thus the thinner thermally conductive layer 400 can further improve the thermal conductivity rate, thereby improving the heat dissipation rate.
[0068] Combination Figure 6 and Figure 9 As shown, in some possible embodiments, the first protrusion 110 has a plurality of second protrusions 120, each corresponding to a target device 910. By providing second protrusions 120 corresponding to target devices 910, the distance between corresponding target devices 910 can be reduced and the volume within the receiving cavity 100 can be increased, thereby enabling faster heat transfer from the target devices 910 and improving heat dissipation.
[0069] like Figure 5As shown, in some possible embodiments, the heat dissipation device further includes a graphite layer 500, which is located on the surface of the first cover plate 200 opposite to the second cover plate 300 and / or on the surface of the second cover plate 300 opposite to the first cover plate 200. The orthographic projection of the first protrusion 110 on the graphite layer 500 is located within the graphite layer 500. It should be understood that both the first protrusion 110 and the second protrusion 120 are formed by stamping on the first cover plate 200 and / or the second cover plate 300. It should be noted that by using the graphite layer 500 stacked on the first cover plate 200 and / or the second cover plate 300 in the heat dissipation device, heat can be transferred away more effectively, thereby increasing the heat dissipation rate and further improving the heat dissipation effect. It should be understood that the graphite layer 500 can cover not only the outer surface of the first protrusion 110, but also other outer surfaces of the first cover plate 200 or the second cover plate 300. Taking the first protrusion 110 protruding towards the heat source component 900 in the electronic device as an example, the heat dissipation principle of the heat dissipation device provided in this application embodiment will be explained: The heat generated by the target device 910 can be sequentially conducted to the outside of the middle frame of the electronic device through the thermally conductive layer 400, the receiving cavity 100, and the graphite layer 500, thereby achieving heat dissipation. It should be understood that the heat dissipation working fluid can achieve two-phase heat exchange within the receiving cavity 100 and horizontally and uniformly diffuse the heat to various areas within the receiving cavity 100.
[0070] Combination Figure 5 and Figure 7 As shown, in some possible embodiments, the heat dissipation device further includes a plurality of support members 600 located within the receiving cavity 100, with both ends of the support members 600 abutting against the first cover plate 200 and the second cover plate 300, respectively. It should be noted that the support members 600 provide support for the first cover plate 200 and the second cover plate 300, increasing their strength and preventing deformation. The shape of the support member 600 can be, for example, a cylinder, a sphere, a hemisphere, a frustum, etc. The accompanying drawings illustrate an example of a cylindrical support member 600 disposed on the surface of the second cover plate facing the first cover plate 200.
[0071] Combination Figure 7 and Figure 8As shown, in some possible embodiments, the receiving cavity 100 includes opposing first regions 150 and second regions 160, and the cavity wall of the receiving cavity 100 located in the first region 150 is provided with a second protrusion 120. The heat dissipation device also includes a heat insulation member 700, which extends from the first region 150 to the second region 160, and divides the receiving cavity 100 into a first cavity 101 and a second cavity 102 side by side. One end of the first cavity 101 near the first region 150 and one end of the second cavity 102 near the first region 150 are connected, and one end of the first cavity 101 near the second region 160 and one end of the second cavity 102 near the second region 160 are also connected, wherein the heat dissipation working fluid, when heated, flows through the first region 150, the first cavity 101 and the second region 160 to the second cavity 102, and then flows back from the second cavity 102 to the first region 150. It should be noted that, in this embodiment, the first region 150 may be, for example, the region corresponding to the motherboard in the electronic device, and the second region 160 may be, for example, the region corresponding to the sub-board in the electronic device. By providing the heat insulation component 700, the high-heat vapor in the first cavity 101 and the low-temperature liquid in the second cavity 102 can be prevented from moving between each other, ensuring that the liquid in the second cavity 102 remains at a lower temperature, thereby improving the effectiveness of heat dissipation and thus improving the heat dissipation effect. It should be understood that after the target device 910 corresponding to the second protrusion 120 generates heat, the liquid heat dissipation medium located in the first region 150 is heated and converted into high-temperature vapor. The vapor flows sequentially through the first cavity 101 and the second region 160 to achieve cooling. The cooled liquid heat dissipation medium can flow back from the second cavity 102 to the first region 150 for the next heat dissipation cycle, thus achieving efficient heat dissipation for the devices at the positions opposite to the first protrusion 110. It should be noted that the accompanying drawings of this application are illustrated by taking as an example a heat insulation element 700 with a raised strip shape protruding toward the first cover plate 200 provided on the second cover plate 300.
[0072] Combination Figure 7 and Figure 8As shown, in some possible embodiments, the heat dissipation device further includes a separator 800 extending from the first region 150 to the second region 160. The separator 800 divides the first cavity 101 into two parallel channels, a first channel 1011 and a second channel 1012. The end of the first channel 1011 near the first region 150 and the end of the second channel 1012 near the first region 150 are connected, as are the ends of the first channel 1011 and the second channel 1012 near the second region 160. It should be noted that the separator 800 can separate the steam formed in the first region 150, thereby reducing the resistance to steam movement and facilitating the rapid flow of steam from the first region 150 into the first channel 1011 and the second channel 1012. After being cooled by the first channel 1011 and the second channel 1012, the steam can converge in the second region 160. The converged liquid heat dissipation medium then flows back from the second cavity 102 into the first region 150, thus achieving a heat dissipation cycle.
[0073] Combination Figure 10 and Figure 11 As shown, it should be noted that by installing the heat dissipation device provided in the embodiments of this application (i.e., the electronic device attached to this application), Figure 10 and attached Figure 11 Electronic devices 1) and related technologies that have a common heat spreader installed (i.e., the electronic devices attached to this application) Figure 10 and attached Figure 11 2) A temperature rise comparison test was conducted on the electronic equipment. The temperature at the SOC (State of Charge) of the electronic equipment, as well as the temperatures at the test points on the front and back of the electronic equipment, were measured. The following test results were obtained: Figure 10 Under the condition that both electronic devices have a power consumption of 3.5W, the overall temperature of the electronic device equipped with the heat dissipation device provided in this embodiment is significantly lower than that of the electronic device with a conventional heat sink. Specifically, the temperature at the SOC can be reduced by 3-5°C, the temperature on the front of the electronic device can be reduced by 3.3°C, and the temperature on the back of the electronic device can be reduced by 2.7°C, with a heat dissipation capacity increase of 2mA / °C. In other words, the heat dissipation device provided in this embodiment has a better heat dissipation effect, which can improve the heat dissipation effect on the SOC and effectively reduce the temperature rise on both sides of the electronic device.
[0074] As can be seen from the above, the heat dissipation device provided in this application embodiment has a relatively simple structure, which can save costs. At the same time, by setting two or more levels of protrusions, the heat dissipation device can improve its thermal conductivity and heat dissipation effect. Since the protrusions are all formed by stamping, the contact thermal resistance of the heat dissipation device is reduced, thereby further improving the heat dissipation efficiency and effect. In addition, the heat dissipation device provided in this application embodiment can conduct heat from the heat source location through the thermally conductive layer 400, the receiving cavity 100, and the graphite layer 500, thus improving the thermal conductivity rate. This not only improves the heat dissipation performance of the heat dissipation device but also provides a certain degree of heat insulation, which is beneficial for dissipating heat from electronic devices equipped with the heat dissipation device, improving the heat dissipation effect, and preventing the temperature from becoming too high when the user touches the electronic device, thus improving the user's feel.
[0075] Combination Figures 1 to 11 As shown, on the other hand, this application embodiment also provides an electronic device, which includes a heat source component 900, a screen component 1000, and a heat dissipation device as described in any one of the above embodiments of this application. The heat dissipation device is located between the heat source component 900 and the screen component 1000, and the second protrusion 120 is disposed opposite to the target device 910 in the heat source component 900. It should be noted that the heat dissipation device in the electronic device provided in this application embodiment has the same composition and function as the heat dissipation device as described in any one of the above embodiments of this application, so it will not be described again here. Since a heat dissipation device is provided in the heat source component 900 and the screen component 1000, and the second protrusion 120 is disposed opposite to the target device 910 in the heat source component 900, the heat generated by the target device 910 can be quickly dissipated, thereby improving the heat dissipation effect of the heat source component 900 and preventing the screen component 1000 from overheating, thus improving the user experience.
[0076] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multi-layered" refers to two or more layers unless otherwise expressly defined.
[0077] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.
[0078] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A heat dissipation device, characterized in that, The heat dissipation device has a receiving cavity (100) for containing a heat dissipation working fluid; At least one side of the cavity wall of the receiving cavity (100) has a first protrusion (110) that protrudes away from the receiving cavity (100), and the first protrusion (110) has at least one second protrusion (120) that protrudes away from the receiving cavity (100) along the protrusion direction.
2. The heat dissipation device according to claim 1, characterized in that, Both the first protrusion (110) and the second protrusion (120) are stamped structures.
3. The heat dissipation device according to claim 1, characterized in that, The surface of the second protrusion (120) intersecting the protrusion direction has a third protrusion (130) that protrudes away from the receiving cavity (100).
4. The heat dissipation device according to claim 1, characterized in that, The surface of the first protrusion (110) intersecting the protrusion direction and / or the surface of the second protrusion (120) intersecting the protrusion direction have a recess (140) that is recessed toward the receiving cavity (100).
5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device includes a first cover plate (200) and a second cover plate (300) that are interlocked with each other. The first cover plate (200) and the second cover plate (300) form the receiving cavity (100). The first cover plate (200) and / or the second cover plate (300) are provided with the first protrusion (110).
6. The heat dissipation device according to claim 5, characterized in that, The first cover plate (200) and the second cover plate (300) are respectively provided with the first protrusion (110), and the second protrusion (120) on the first cover plate (200) is disposed opposite to the second protrusion (120) on the second cover plate (300).
7. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device further includes a heat-conducting layer (400), the two sides of which abut against the surface of the second protrusion (120) away from the receiving cavity (100) and the surface of the target device (910), respectively.
8. The heat dissipation device according to claim 1, characterized in that, The first protrusion (110) has a plurality of second protrusions (120), and the second protrusions (120) correspond one-to-one with the target device (910).
9. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device further includes a graphite layer (500), which is located on the surface of the first cover plate (200) opposite to the second cover plate (300) and / or on the surface of the second cover plate (300) opposite to the first cover plate (200), and the orthographic projection of the first protrusion (110) on the graphite layer (500) is located within the graphite layer (500).
10. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device also includes a plurality of support members (600) located in the receiving cavity (100), the two ends of which abut against the first cover plate (200) and the second cover plate (300) respectively.
11. The heat dissipation device according to claim 1, characterized in that, The receiving cavity (100) includes a first region (150) and a second region (160) opposite to each other, and the cavity wall of the receiving cavity (100) located in the first region (150) is provided with a second protrusion (120); The heat dissipation device further includes a heat insulation element (700) that extends from the first region (150) to the second region (160) and divides the receiving cavity (100) into a first cavity (101) and a second cavity (102) side by side. The first cavity (101) is connected to the end of the first region (150) and the second cavity (102) is connected to the end of the second region (150). The first cavity (101) is connected to the end of the second region (160) and the second cavity (102) is connected to the end of the second region (160). The heat dissipation medium is heated and flows through the first region (150), the first cavity (101) and the second region (160) to the second cavity (102), and then flows back from the second cavity (102) to the first region (150).
12. An electronic device, characterized in that, The electronic device includes a heat source assembly (900), a screen assembly (1000), and a heat dissipation device as claimed in any one of claims 1 to 11, the heat dissipation device being located between the heat source assembly (900) and the screen assembly (1000), and the second protrusion (120) being disposed opposite to the target device (910) in the heat source assembly (900).