An inverter IGBT heat dissipation structure based on single-sided copper-clad ceramic sheet

Abstract

This utility model discloses a heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet, including a ceramic sheet structure and a side copper-clad layer. A snap-fit ​​connecting block is provided at the end of a telescopic threaded post, and a side telescopic moving block is provided at the end of an insert-connecting telescopic inner layer. A high-temperature resistant rubber pad layer is connected to the side telescopic moving block and the snap-fit ​​connecting block via adhesive. A toggle adjustment knob moves the telescopic threaded post through the threaded action. The ceramic sheet structure can be pressed and installed to a designated position via the side telescopic moving blocks and snap-fit ​​connecting blocks on both sides. This utility model improves the ease of installation, connection, and disassembly of the inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet, effectively increasing the efficiency of installation and disassembly for workers.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic and energy storage technology, specifically relating to a heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet. Background Technology

[0002] An inverter converts direct current (DC) to alternating current (AC) via an inverter bridge. Its core components include the inverter bridge, control logic, and filtering circuitry. Inverters are typically powered by a 12V or 24V DC supply, and convert this DC voltage to AC voltage using a PWM controller and switching elements such as MOSFETs or IGBTs. The PWM controller is responsible for regulating the output voltage and frequency to ensure that the output AC power meets the equipment's requirements.

[0003] Inverters are widely used in various devices that require AC power, including air conditioners, home theaters, power tools, sewing machines, computers, and televisions. They are particularly important in mobile devices, as they convert low-voltage DC power supplied by batteries into high-voltage AC power to meet the power supply needs of various electrical appliances.

[0004] The main function of an inverter heat sink is to help dissipate heat, ensuring that the internal components of the inverter operate at normal operating temperatures, thereby extending the service life of the equipment and improving its efficiency.

[0005] However, when installing an inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet to assist in heat dissipation, screws or welding are usually used for connection. This connection method is relatively troublesome and not conducive to installation and disassembly.

[0006] This invention addresses the aforementioned problems by providing a heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet, which is easy to install and disassemble. Utility Model Content

[0007] The purpose of this utility model is to provide a heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet, so as to solve the problem that the heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet mentioned in the background art is usually connected by screws or welding when installing it with the inverter heat sink to assist in heat dissipation. The connection method is relatively troublesome and not conducive to installation and disassembly.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation structure for an inverter IGBT based on a single-sided copper-clad ceramic sheet, comprising a ceramic sheet structure and a side copper-clad layer disposed on the side of the ceramic sheet structure.

[0009] A toggle adjustment knob is located on the side of the ceramic sheet structure. A telescopic threaded post is located in the middle of the toggle adjustment knob. A snap-fit ​​connecting block is located at the end of the telescopic threaded post. An insert-fit telescopic inner layer is located in the middle of the snap-fit ​​connecting block. A side telescopic moving block is located at the end of the insert-fit telescopic inner layer. A bottom contact high-temperature resistant rubber pad is located on the side of the side telescopic moving block and the snap-fit ​​connecting block. The bottom contact high-temperature resistant rubber pad is connected to the side telescopic moving block and the snap-fit ​​connecting block by adhesive. Turning the toggle adjustment knob moves the telescopic threaded post through the thread action. The ceramic sheet structure can be pressed and installed to a designated position through the side telescopic moving blocks and snap-fit ​​connecting blocks on both sides.

[0010] Preferably, a second movable limiting block is provided on the side of the telescopic threaded column, and the second movable limiting block and the telescopic threaded column are an integral structure.

[0011] Preferably, a limiting groove is provided on the outer side of the second movable limiting block, the second limiting groove being a groove formed by a ceramic sheet structure, and the length of the second limiting groove being the movement range of the second movable limiting block.

[0012] Preferably, a movable limiting block is provided on the side of the plug-in telescopic inner layer, and the movable limiting block and the plug-in telescopic inner layer are an integral structure.

[0013] Preferably, a limiting groove is provided at the outer position of the first moving limiting block, and the length of the first limiting groove is the moving range of the first moving limiting block.

[0014] Preferably, an active copper brazing layer is provided between the ceramic sheet structure and the side copper cladding layer, and the ceramic sheet structure and the side copper cladding layer are connected together by the active copper brazing layer.

[0015] Preferably, the ceramic plate structure is provided with heat sink side fins on its side, and the heat sink side fins are composed of a series of thin plates arranged at equal intervals.

[0016] Preferably, a radiator shell is provided on the side of the radiator side fins, and the radiator shell and the radiator side fins are an integral structure.

[0017] Compared with the prior art, this utility model provides a heat dissipation structure for inverter IGBTs based on a single-sided copper-clad ceramic sheet, which has the following advantages:

[0018] In the IGBT heat dissipation structure of an inverter based on a single-sided copper-clad ceramic sheet, a toggle adjustment knob is located on the side of the ceramic sheet structure. A telescopic threaded post is located in the middle of the toggle adjustment knob. A snap-fit ​​connecting block is located at the end of the telescopic threaded post. A plug-in telescopic inner layer is located in the middle of the snap-fit ​​connecting block. A side telescopic moving block is located at the end of the plug-in telescopic inner layer. A bottom contact high-temperature resistant rubber pad is located on the side of the side telescopic moving block and the snap-fit ​​connecting block. The bottom contact high-temperature resistant rubber pad is bonded to the ceramic sheet using adhesive. The side telescopic moving blocks and snap-fit ​​connecting pillars are connected. By turning the adjustment knob, the telescopic threaded pillars can be moved through the threaded action. The ceramic plate structure can be pressed and installed to the designated position through the side telescopic moving blocks and snap-fit ​​connecting pillars on both sides. After the improvement of this utility model, the installation, connection and disassembly of the inverter IGBT heat dissipation structure based on single-sided copper-clad ceramic plates can be made more convenient, thereby effectively improving the installation and disassembly efficiency of the staff, and thus effectively improving the practicality of the inverter IGBT heat dissipation structure based on single-sided copper-clad ceramic plates. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet after installation.

[0020] Figure 2 This is an enlarged schematic diagram of the heat dissipation structure of the inverter IGBT based on a single-sided copper-clad ceramic sheet at position A.

[0021] Figure 3 This is a top-view cross-sectional view of the heat dissipation structure of the inverter IGBT based on a single-sided copper-clad ceramic sheet according to this utility model, located at position A.

[0022] In the diagram: 1. Ceramic plate structure; 2. Copper-clad side layer; 3. Side fins of the radiator; 4. Radiator shell; 5. Active copper brazing layer; 6. Adjustment knob; 7. Telescopic threaded post; 8. Snap-fit ​​connecting post block; 9. Side telescopic moving block; 10. Moving limit moving block one; 11. Moving limit moving slot two; 12. Moving limit moving block two; 13. Bottom contact high-temperature resistant rubber pad layer; 14. Insert-connect telescopic inner layer; 15. Moving limit moving slot one. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] This utility model provides, for example Figure 1-3 As shown, an inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet includes a ceramic sheet structure 1 and a side copper-clad layer 2 disposed on the side of the ceramic sheet structure 1. The single-sided copper-clad ceramic sheet is in direct contact with the heat sink, reducing thermal resistance in the heat conduction path and improving heat dissipation efficiency. It is low-cost: the single-sided copper-clad structure is less expensive than the double-sided copper-clad structure and is suitable for mass production. It has high reliability: the high thermal conductivity and mechanical strength of the ceramic sheet ensure the long-term reliability of the system. It has a wide range of applications: suitable for inverters of various power levels, especially high power density applications.

[0025] A toggle adjustment knob 6 is located on the side of the ceramic sheet structure 1. A telescopic threaded post 7 is located in the middle of the toggle adjustment knob 6. A snap-fit ​​connecting post 8 is located at the end of the telescopic threaded post 7. A plug-in telescopic inner layer 14 is located in the middle of the snap-fit ​​connecting post 8. A side telescopic moving block 9 is located at the end of the plug-in telescopic inner layer 14. A bottom contact high-temperature resistant rubber pad 13 is located on the side of the side telescopic moving block 9 and the snap-fit ​​connecting post 8. The bottom contact high-temperature resistant rubber pad 13 is attached to the side telescopic moving block by adhesive. The 9 and the snap-fit ​​connecting column 8 are connected. By turning the adjusting knob 6, the telescopic threaded column 7 can be moved through the thread action. The ceramic plate structure 1 can be pressed and installed to the designated position by connecting the side telescopic moving blocks 9 and the snap-fit ​​connecting column 8 on both sides. After the improvement of this utility model, the installation, connection and disassembly of the inverter IGBT heat dissipation structure based on the single-sided copper-clad ceramic plate can be made more convenient, thereby effectively improving the installation and disassembly efficiency of the staff, and thus effectively improving the practicality of the inverter IGBT heat dissipation structure based on the single-sided copper-clad ceramic plate.

[0026] like Figure 3As shown, a second movable limiting block 12 is provided on the side of the telescopic threaded column 7. The second movable limiting block 12 and the telescopic threaded column 7 are an integral structure. A second limiting groove 11 is provided on the outer side of the second movable limiting block 12. The second limiting groove 11 is a groove formed by the ceramic sheet structure 1. The length of the second limiting groove 11 is the range of movement of the second movable limiting block 12. The setting of the second movable limiting block 12 and the second limiting groove 11 can prevent the telescopic threaded column 7 from rotating when the adjustment knob 6 is turned for adjustment, so that the telescopic threaded column 7 can only perform horizontal extension and insertion movements.

[0027] like Figure 3 As shown, a movable limiting block 10 is provided on the side of the plug-in telescopic inner layer 14. The movable limiting block 10 and the plug-in telescopic inner layer 14 are an integral structure. A limiting groove 15 is provided on the outer side of the movable limiting block 10. The length of the limiting groove 15 is the movement range of the movable limiting block 10. The setting of the limiting groove 15 and the movable limiting block 10 can restrict the movement of the plug-in telescopic inner layer 14 and prevent it from detaching from the snap-fit ​​connecting column 8 and falling off.

[0028] like Figure 1 As shown, an active metal copper brazing layer 5 is provided between the ceramic sheet structure 1 and the side copper cladding layer 2. The ceramic sheet structure 1 and the side copper cladding layer 2 are connected together by the active metal copper brazing layer 5. The active metal copper brazing layer 5 plays a connecting role. The active metal copper brazing layer 5 relies on active metal solder to achieve high-temperature metallurgical bonding between aluminum nitride and oxygen-free copper, which has high bonding strength and reliability in thermal cycling.

[0029] like Figure 1 As shown, a heat sink side fin body 3 is provided on the side of the ceramic plate structure 1. The structure of the heat sink side fin body 3 is composed of a series of thin plates arranged at equal intervals. A heat sink shell 4 is provided on the side of the heat sink side fin body 3. The heat sink shell 4 and the heat sink side fin body 3 are an integral structure. The arrangement of the heat sink side fin body 3 can improve airflow, thereby improving the heat dissipation capacity of the heat sink.

[0030] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure for an inverter IGBT based on a single-sided copper-clad ceramic sheet, comprising a ceramic sheet structure (1) and a side copper-clad layer (2) disposed on the side of the ceramic sheet structure (1). characterized in that A toggle adjustment knob (6) is provided on the side of the ceramic sheet structure (1). A telescopic threaded post (7) is provided in the middle of the toggle adjustment knob (6). A snap-fit ​​connecting post (8) is provided at the end of the telescopic threaded post (7). A plug-in telescopic inner layer (14) is provided in the middle of the snap-fit ​​connecting post (8). A side telescopic moving block (9) is provided at the end of the plug-in telescopic inner layer (14). A bottom contact high-temperature resistant rubber pad (13) is provided on the side of the side telescopic moving block (9) and the snap-fit ​​connecting post (8). The bottom contact high-temperature resistant rubber pad (13) is connected to the side telescopic moving block (9) and the snap-fit ​​connecting post (8) by adhesive. By toggling the toggle adjustment knob (6), the telescopic threaded post (7) can be moved by the thread action. The ceramic sheet structure (1) can be connected to the designated position by the side telescopic moving blocks (9) and the snap-fit ​​connecting post (8) on both sides.

2. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 1, characterized in that: A movable limiting block 2 (12) is provided on the side of the telescopic threaded column (7), and the movable limiting block 2 (12) and the telescopic threaded column (7) are an integral structure.

3. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 2, characterized in that: A limiting moving groove 2 (11) is provided at the outer position of the moving limiting moving block 2 (12). The limiting moving groove 2 (11) is a groove formed by the ceramic sheet structure (1). The length of the limiting moving groove 2 (11) is the moving range of the moving limiting moving block 2 (12).

4. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 1, characterized in that: A movable limiting block (10) is provided on the side of the plug-in telescopic inner layer (14), and the movable limiting block (10) and the plug-in telescopic inner layer (14) are an integral structure.

5. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 4, characterized in that: A limiting groove (15) is provided at the outer position of the moving limiting block (10), and the length of the limiting groove (15) is the moving range of the moving limiting block (10).

6. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 1, characterized in that: An active metal copper brazing layer (5) is provided between the ceramic sheet structure (1) and the side copper cladding layer (2), and the ceramic sheet structure (1) and the side copper cladding layer (2) are connected together by the active metal copper brazing layer (5).

7. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 1, characterized in that: The ceramic plate structure (1) has a heat sink side fin body (3) on its side, and the structure of the heat sink side fin body (3) is composed of a series of thin plates arranged at equal intervals.

8. The inverter IGBT heat dissipation structure based on a single-sided copper-clad ceramic sheet according to claim 7, characterized in that: A radiator shell (4) is provided on the side of the radiator side fin body (3), and the radiator shell (4) and the radiator side fin body (3) are an integral structure.

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