A high multi-layer high-thick copper PCB stator composite heat dissipation structure

Abstract

This utility model discloses a composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator, relating to the field of PCB technology. This composite heat dissipation structure includes a base plate, a mounting plate, and a multilayer substrate formed by alternating layers of conductive and insulating layers. The mounting plate is spaced above the base plate, and the multilayer substrate is spaced above the mounting plate. Several heat dissipation blocks penetrating the multilayer substrate are embedded in the multilayer substrate, with their top and bottom surfaces exposed on the upper and lower surfaces of the substrate, respectively. Heat pipes are embedded inside the multilayer substrate, forming a thermal coupling connection with the heat dissipation blocks. Heat dissipation channels connecting the heat dissipation blocks and heat pipes are provided at the edges of the multilayer substrate. By configuring the heat dissipation blocks, heat sinks, heat pipes, and heat dissipation channels, efficient composite heat dissipation is achieved, ensuring timely and uniform heat dissipation for the high-multilayer, high-thickness copper PCB stator during operation, thereby improving its performance and stability.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, and in particular to a composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator. Background Technology

[0002] In applications involving multilayer, thick copper PCB stators, the alternating layers of conductive and insulating materials, along with the significant copper thickness of each conductive layer, generate substantial heat during operation. However, existing heat dissipation structures have numerous shortcomings and fail to meet actual heat dissipation requirements.

[0003] Traditional heat dissipation methods are insufficient to effectively handle the high heat generated by multi-layered, thick copper PCB stators. For example, single heat sinks or fan cooling structures have limited heat dissipation efficiency and cannot dissipate heat in time, leading to excessively high PCB stator temperatures, which affects their performance and lifespan.

[0004] Therefore, in view of this situation, there is an urgent need to develop a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure to meet the needs of practical use. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology and its main objective is to provide a composite heat dissipation structure for high-multilayer, high-thickness copper PCB stators. By setting up a structure of heat sinks, heat pipes, and heat dissipation channels, it achieves efficient composite heat dissipation, ensuring that the high-multilayer, high-thickness copper PCB stator can dissipate heat in a timely and uniform manner during operation, thereby improving its performance and stability.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator includes a base plate, a mounting plate, and a multilayer substrate formed by alternating layers of conductive and insulating layers. The mounting plate is spaced above the base plate, and the multilayer substrate is spaced above the mounting plate. Several heat dissipation blocks penetrating the multilayer substrate are embedded in the multilayer substrate, with the top and bottom surfaces of the heat dissipation blocks exposed on the upper and lower surfaces of the multilayer substrate, respectively. A heat sink is disposed between the mounting plate and the multilayer substrate. A heat pipe is embedded inside the multilayer substrate, and the heat pipe is thermally coupled to the heat dissipation blocks. A heat dissipation channel connecting the heat dissipation blocks and the heat pipe is provided at the edge of the multilayer substrate.

[0008] As a preferred embodiment: a space is formed between the mounting plate and the laminated substrate, and the heat sink is installed in the space. There are two heat sinks, which are respectively disposed on both sides of the mounting plate and both heat sinks face the laminated substrate.

[0009] As a preferred embodiment: the heat dissipation channel is filled with a highly thermally conductive insulating medium, the heat dissipation block is a copper-embedded heat dissipation block, and there are several heat pipes arranged in parallel.

[0010] As a preferred embodiment: the copper thickness of each conductive layer in the multilayer conductive layer is greater than 105μm; heat dissipation plates are evenly distributed in the space between the mounting plate and the stacked substrate.

[0011] As a preferred embodiment, the mounting plate has mounting holes for mounting a heat sink, which is detachably mounted on the mounting plate through the mounting holes.

[0012] As a preferred embodiment: the lower end of the radiator is provided with a number of connecting posts and a number of mounting holes, with each connecting post corresponding to one of the mounting holes. The connecting posts can be bent and secured to the lower surface of the mounting plate. The radiator is detachably mounted on the mounting plate through the connecting posts and mounting holes.

[0013] As a preferred embodiment: the mounting plate has connection holes at its four corners, and the base plate has connection posts at its four corners corresponding to the connection holes. Bolts pass through the connection holes and the connection posts, and the mounting plate is detachably mounted on top of the base plate.

[0014] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it is achieved by adopting a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure provided in this application:

[0015] First, efficient composite heat dissipation: The heat sink penetrates through the laminated substrate, directly transferring heat from the inside of the laminated substrate to the outside; the heat sink dissipates heat from both sides of the laminated substrate, increasing the heat dissipation area; the heat pipe is thermally coupled to the heat sink and connected through the heat dissipation channel, forming an efficient heat conduction network, realizing composite heat dissipation and improving heat dissipation efficiency.

[0016] Secondly, uniform heat dissipation: Several parallel heat pipes and evenly distributed heat dissipation plates enable heat to be conducted more evenly from the inside of the laminated substrate to the outside, avoiding the problem of local overheating and improving the stability and reliability of the PCB stator.

[0017] Third, it is easy to install and maintain: The detachable installation method of the radiator and the mounting plate, as well as the detachable connection between the mounting plate and the base plate, make the installation, replacement and maintenance of the entire heat dissipation structure more convenient, reducing production costs and maintenance difficulty.

[0018] To more clearly illustrate the structural features and effects of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a first-view three-dimensional structural diagram of a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure according to the present invention.

[0020] Figure 2 This is a second-view three-dimensional structural diagram of a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure according to the present invention.

[0021] Figure 3 This is a third-view perspective three-dimensional structural diagram of a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure according to the present invention.

[0022] Figure 4 This is a three-dimensional structural diagram of the heat sink, heat pipe, and heat dissipation channel of this utility model;

[0023] Figure 5 This utility model Figure 2 Enlarged view of point M in the middle.

[0024] Explanation of reference numerals in the attached diagram:

[0025] In the diagram: 10, base plate; 20, mounting plate; 21, mounting hole; 22, connecting hole; 30, laminated substrate; 31, heat sink; 32, heat pipe; 33, heat dissipation channel; 40, radiator; 41, connecting post; 50, heat sink plate. Detailed Implementation

[0026] This utility model is as follows Figures 1 to 5 As shown, a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure includes a base plate 10, a mounting plate 20, and a laminated substrate 30 formed by alternating layers of conductive and insulating layers, wherein:

[0027] The mounting plate 20 is spaced above the base plate 10, and the laminated substrate 30 is spaced above the mounting plate 20. A plurality of heat sinks 31 penetrating the laminated substrate 30 are embedded in the laminated substrate 30, and the top and bottom surfaces of the heat sinks 31 are exposed on the upper and lower surfaces of the laminated substrate 30, respectively. A heat sink 40 is provided between the mounting plate 20 and the laminated substrate 30. A heat pipe 32 is embedded inside the laminated substrate 30, and the heat pipe 32 is thermally coupled to the heat sinks 31. The edge of the laminated substrate 30 is provided with a heat dissipation channel 33 connecting the heat sinks 31 and the heat pipe 32.

[0028] When the multilayer, thick copper PCB stator, i.e., the laminated substrate 30, generates heat during operation, the heat is first transferred to the heat sink 31 embedded within the laminated substrate 30. The heat sink 31 then conducts the heat to its exposed top and bottom surfaces. Simultaneously, the heat pipe 32 is thermally coupled to the heat sink 31, conducting heat through the heat dissipation channel 33 to the edge of the laminated substrate 30. The heat sink 40 dissipates heat from both sides of the laminated substrate 30, dissipating the heat away.

[0029] The heat sink 31 penetrates the stacked substrate 30 and can directly conduct heat from inside the stacked substrate 30 to the outside; the heat sink 40 dissipates heat from both sides of the stacked substrate 30, increasing the heat dissipation area; the heat pipe 32 is thermally coupled to the heat sink 31 and connected through the heat dissipation channel 33, forming a highly efficient heat conduction network, realizing composite heat dissipation and improving heat dissipation efficiency.

[0030] A gap is formed between the mounting plate 20 and the laminated substrate 30. The heat sink 40 is installed in the gap. There are two heat sinks 40, which are respectively disposed on both sides of the mounting plate 20 and both heat sinks 40 face the laminated substrate 30.

[0031] The heat dissipation channel 33 is filled with a highly thermally conductive insulating medium. The heat sink 31 is a copper-embedded heat sink 31. There are several heat pipes 32 arranged in parallel.

[0032] The base plate 10 provides a stable support foundation for the entire heat dissipation structure, ensuring structural stability. Mounting plates 20 are spaced above the base plate 10, and stacked substrates 30 are spaced above the mounting plates 20. This layered layout provides sufficient space for the installation of subsequent heat dissipation components and heat dissipation, preventing heat accumulation and promoting good airflow for efficient heat dissipation. The heat sink 31 penetrates the stacked substrate 30, with its top and bottom surfaces exposed, allowing for rapid heat transfer from the multiple conductive layers inside the stacked substrate 30 to its upper and lower surfaces. This increases the contact area between heat and the outside environment, accelerates heat dissipation, and effectively reduces the internal temperature of the stacked substrate 30. The space between the mounting plates 20 and the stacked substrate 30 provides a mounting location for the heat sink 40. Two heat sinks 40 are positioned on either side of the mounting plate 20, facing the stacked substrate 30, simultaneously dissipating heat from both sides, increasing the heat dissipation area and efficiency. Compared to a single heatsink 40, it can dissipate heat generated by the laminated substrate 30 more quickly, effectively reducing the operating temperature of the PCB stator. The high thermal conductivity insulating medium filled in the heat dissipation channel 33 can efficiently conduct heat while ensuring electrical insulation, rapidly transferring the heat from the heat pipes 32 and heat sink 31 to the edge of the heat dissipation structure, promoting heat dissipation. The copper-embedded heat sink 31 has good thermal conductivity, enabling it to quickly absorb heat from inside the laminated substrate 30 and conduct it away. Several parallel heat pipes 32 are thermally coupled to the heat sink 31, forming a highly efficient heat conduction network. The heat pipes 32 can utilize the phase change cycle of the internal working fluid to quickly transfer heat from high-temperature areas to low-temperature areas, further improving heat dissipation efficiency. Furthermore, the parallel arrangement makes heat conduction more uniform, avoiding localized overheating.

[0033] Each conductive layer in this multilayer conductive layer has a single copper layer thickness greater than 105μm. Heat sinks 50 are evenly distributed within the space between the mounting plate 20 and the laminated substrate 30. Due to the thicker copper layers, the multilayer, thicker copper PCB stator generates more heat during operation. The evenly distributed heat sinks 50 between the mounting plate 20 and the laminated substrate 30 further increase the heat dissipation area, assisting the heat sink 40 and other heat dissipation components in dissipating heat, effectively addressing the high heat generated by the thick copper layers, improving the overall heat dissipation capacity of the heat dissipation structure, and ensuring that the PCB stator maintains a stable temperature even under high load operation.

[0034] The mounting plate 20 has mounting holes 21 for mounting the radiator 40, which is detachably mounted on the mounting plate 20 through the mounting holes 21. The mounting holes 21 on the mounting plate 20 allow the radiator 40 to be easily installed on the mounting plate 20, and the detachable design facilitates the replacement and maintenance of the radiator 40. When the radiator 40 malfunctions or requires a performance upgrade, it can be quickly disassembled and replaced with a new radiator 40, reducing maintenance time and costs and improving the maintainability of the equipment.

[0035] The lower end of the radiator 40 is provided with several connecting posts 41 and several mounting holes 21. Each connecting post 41 corresponds one-to-one with a mounting hole 21. The connecting posts 41 can be bent and secured to the lower surface of the mounting plate 20. The radiator 40 is detachably mounted on the mounting plate 20 via the connecting posts 41 and mounting holes 21. The connecting posts 41 at the lower end of the radiator 40 correspond one-to-one with the mounting holes 21 on the mounting plate 20, and the connecting posts 41 can be bent and secured to the lower surface of the mounting plate 20. This connection method ensures the radiator 40 is securely installed and facilitates installation and disassembly. Compared to traditional fixed connection methods, the bendable and secure method is more flexible during installation, allowing for quick installation and easy disassembly, thus improving work efficiency.

[0036] The mounting plate 20 has connection holes 22 at its four corners, and the base plate 10 has connection posts 41 at its four corners corresponding to the connection holes 22. Bolts pass through the connection holes 22 and the connection posts 41. The mounting plate 20 is detachably mounted on top of the base plate 10.

[0037] The mounting plate 20 is connected to the connecting holes 22 at the four corners of the mounting plate 20 and the connecting posts 41 at the four corners of the base plate 10 by bolts, ensuring a stable and reliable connection between the mounting plate 20 and the base plate 10. This detachable connection method facilitates the assembly and disassembly of the entire heat dissipation structure, offering significant advantages in production, transportation, and maintenance. For example, components can be easily assembled and debugged during production; during transportation, each component can be disassembled and packaged separately, reducing transportation space and the risk of damage; and during maintenance, the entire structure can be easily disassembled and repaired.

[0038] This composite heat dissipation structure for high-multilayer, high-thickness copper PCB stators, through the spaced arrangement of the base plate 10, mounting plate 20, and laminated substrate 30, and the cooperation of components such as heat sink 31, heat radiator 40, heat pipe 32, and heat dissipation channel 33, forms a complete and efficient heat dissipation system. It breaks through the limitations of traditional single heat dissipation methods, utilizing multiple heat dissipation means to work together effectively to cope with the large amount of heat generated by the high-multilayer, high-thickness copper PCB stator, ensuring its operation in a stable temperature environment and improving the performance and reliability of the PCB stator.

[0039] The usage method and principle of this high-multilayer, high-thickness copper PCB stator composite heat dissipation structure are as follows:

[0040] When the multilayer, thick copper PCB stator, i.e., the laminated substrate, generates heat during operation, the heat is first transferred to the heat sink embedded within the laminated substrate. The heat sink then conducts the heat to its exposed top and bottom surfaces. Simultaneously, heat pipes are thermally coupled to the heat sink, conducting heat through heat dissipation channels to the edges of the laminated substrate. Heat sinks then dissipate heat from both sides of the laminated substrate, dissipating the heat away.

[0041] The key design feature of this utility model lies in achieving heat dissipation through a high-multilayer, high-thickness copper PCB stator composite heat dissipation structure provided in this application:

[0042] First, efficient composite heat dissipation: The heat sink penetrates through the laminated substrate, directly transferring heat from the inside of the laminated substrate to the outside; the heat sink dissipates heat from both sides of the laminated substrate, increasing the heat dissipation area; the heat pipe is thermally coupled to the heat sink and connected through the heat dissipation channel, forming an efficient heat conduction network, realizing composite heat dissipation and improving heat dissipation efficiency.

[0043] Secondly, uniform heat dissipation: Several parallel heat pipes and evenly distributed heat dissipation plates enable heat to be conducted more evenly from the inside of the laminated substrate to the outside, avoiding the problem of local overheating and improving the stability and reliability of the PCB stator.

[0044] Third, it is easy to install and maintain: The detachable installation method of the radiator and the mounting plate, as well as the detachable connection between the mounting plate and the base plate, make the installation, replacement and maintenance of the entire heat dissipation structure more convenient, reducing production costs and maintenance difficulty.

[0045] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator, characterized in that: The system includes a base plate, a mounting plate, and a multilayer substrate formed by alternating layers of conductive and insulating layers. The mounting plate is spaced above the base plate, and the multilayer substrate is spaced above the mounting plate. Several heat sinks penetrating the multilayer substrate are embedded in the multilayer substrate, with the top and bottom surfaces of the heat sinks exposed on the upper and lower surfaces of the multilayer substrate, respectively. A heat sink is provided between the mounting plate and the multilayer substrate. A heat pipe is embedded inside the multilayer substrate, and the heat pipe is thermally coupled to the heat sinks. A heat dissipation channel connecting the heat sinks and the heat pipes is provided at the edge of the multilayer substrate.

2. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 1, characterized in that: A gap is formed between the mounting plate and the laminated substrate. The heat sink is installed in the gap. There are two heat sinks, which are respectively located on both sides of the mounting plate and both heat sinks face the laminated substrate.

3. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 1, characterized in that: The heat dissipation channel is filled with a highly thermally conductive insulating medium. The heat sink is a copper-embedded heat sink with several heat pipes arranged in parallel.

4. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 1, characterized in that: The copper thickness of each conductive layer in the multilayer conductive layer is greater than 105 μm; heat sinks are evenly distributed in the space between the mounting plate and the stacked substrate.

5. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 1, characterized in that: The mounting plate has mounting holes for mounting a heat sink, which is detachably mounted on the mounting plate through the mounting holes.

6. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 5, characterized in that: The lower end of the radiator is provided with several connecting posts and several mounting holes. Each of the connecting posts corresponds to one of the mounting holes. The connecting posts can be bent and fixed to the lower surface of the mounting plate. The radiator is detachably mounted on the mounting plate through the connecting posts and mounting holes.

7. The composite heat dissipation structure for a high-multilayer, high-thickness copper PCB stator according to claim 1, characterized in that: The mounting plate has connection holes at its four corners, and the base plate has connection posts at its four corners corresponding to the connection holes. Bolts pass through the connection holes and the connection posts. The mounting plate is detachably mounted on top of the base plate.

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