Sealed device with electromagnetic shielding effect

CN224627018UActive Publication Date: 2026-08-11JIANGSU CHANGWU COMM TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-13
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

[0002]在接收机中,需要将窄带部分、宽带部分安装在机箱中,若将两者不规则直接安装在机箱中,由于两者发热量不同,热量传导过程中存在互相干扰,散热效果差

Benefits of technology

[0016]本实用新型的有益效果是,本实用新型通过在壳体组件内设置隔板将接收机中窄带部分、宽带部分分隔开,并且根据两者发热量不同分别适应性设置下层散热组件、上层散热组件,能够有效提高散热效果,同时将发热量小的窄带部分设置在下层,在热量上升过程中通过隔板、壳体组件直接引导到外部环境,避免出现热量传导干扰的问题,并且隔板、下层散热组件、上层散热组件均能够增大散热面积,实现机箱内部快速散热。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224627018U_ABST
    Figure CN224627018U_ABST
Patent Text Reader

Abstract

This utility model belongs to the technical field of electrical equipment enclosures, specifically relating to a sealed device with electromagnetic shielding effect. The sealed device includes: a housing assembly, a partition, a lower heat dissipation assembly, and an upper heat dissipation assembly. The partition is located inside the housing assembly, with its edge in contact with the housing assembly. The lower and upper heat dissipation assemblies are located on opposite sides of the partition and connected to it. The lower and upper heat dissipation assemblies dissipate heat from components in the narrow band and wide band portions of the housing assembly, respectively. This utility model effectively improves heat dissipation by separating the narrow and wide band portions using the partition. By placing the narrow band portion in the lower layer, heat is directly guided to the external environment through the partition and housing assembly during the heat rise process, avoiding heat conduction interference. The partition, lower heat dissipation assembly, and upper heat dissipation assembly all increase the heat dissipation area, achieving rapid heat dissipation inside the enclosure.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model belongs to the technical field of electrical equipment housings, specifically relating to devices that facilitate cooling, and more particularly to a sealed device with electromagnetic shielding effect. Background Technology

[0002] In a receiver, the narrowband and broadband components need to be installed in the chassis. If they are irregularly installed directly in the chassis, they will interfere with each other during heat conduction due to their different heat generation. This will result in poor heat dissipation.

[0003] Therefore, there is an urgent need to develop a new sealed device with electromagnetic shielding effect to solve the technical problem of mutual interference between irregularly installed narrow and wide band components in the chassis during heat conduction.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one sealed device with electromagnetic shielding effect.

[0006] In a first aspect, embodiments of this disclosure provide a sealed device, comprising: a housing assembly, a partition, a lower heat dissipation assembly, and an upper heat dissipation assembly; wherein the partition is located inside the housing assembly, the edge of the partition is in contact with the housing assembly, and the lower heat dissipation assembly and the upper heat dissipation assembly are respectively located on both sides of the partition and connected to the partition; the lower heat dissipation assembly and the upper heat dissipation assembly dissipate heat from each component in the narrow band portion and each component in the wide band portion of the housing assembly, respectively, and conduct the heat from each component to the lower heat dissipation assembly and the upper heat dissipation assembly, and conduct the heat to the external environment through the partition and the housing assembly.

[0007] In one optional embodiment, the housing assembly includes: a housing and two first heat dissipation units; the upper and lower cover plates of the housing are each provided with a plurality of first heat dissipation grooves to conduct heat; the two first heat dissipation units are respectively connected to the two side plates of the housing to conduct heat.

[0008] In one optional embodiment, the first heat dissipation unit includes: a plurality of first heat sinks; each of the first heat sinks is arranged sequentially on a corresponding side plate to conduct heat.

[0009] In one optional embodiment, the lower heat dissipation assembly includes: a first air blowing unit, a shielding cover, and a first back plate; the first air blowing unit, the shielding cover, and the first back plate are connected to a partition, the first air blowing unit is disposed facing the shielding cover, and the first back plate is disposed perpendicular to the partition and is attached to the housing assembly; the first air blowing unit is configured to blow air onto the shielding cover to dissipate heat from the components inside the shielding cover, so as to conduct heat to the partition and the first back plate, and conduct it to the external environment through the housing assembly.

[0010] In one optional embodiment, the first air blowing unit includes: a fan base, a first fan, and a plurality of second heat sinks; the fan base is connected to a partition, the first fan is mounted on the fan base and is oriented toward the shield, and each of the second heat sinks is arranged sequentially on the fan base.

[0011] In one optional embodiment, the shielding cover has a plurality of second heat dissipation slots, and the first back plate has a plurality of heat dissipation holes.

[0012] In one optional embodiment, the upper heat dissipation assembly includes: a second air blowing unit, a plurality of first heat dissipation fins, and a second back plate; the second air blowing unit and the second back plate are connected to a partition, and each of the first heat dissipation fins is mounted on the partition so that each component is located between the corresponding first heat dissipation fin and the partition, and the second air blowing unit is disposed toward each of the first heat dissipation fins; the second back plate is disposed perpendicular to the partition and is attached to the housing assembly; the second air blowing unit is configured to blow air onto each of the first heat dissipation fins to dissipate heat from each component between the first heat dissipation fin and the partition, so as to conduct heat to the partition and the second back plate, and conduct it to the external environment through the housing assembly.

[0013] In one optional embodiment, the second air blowing unit includes: a plurality of second fans; each second fan is connected to a partition, and each second fan is respectively arranged facing the corresponding first heat dissipation fin.

[0014] In one alternative embodiment, a plurality of second heat dissipation fins are sequentially arranged on the second back plate.

[0015] In one optional embodiment, the upper heat dissipation assembly further includes: a heat-conducting layer and a plurality of heat-conducting pipes; the heat-conducting layer is located between the first heat dissipation fins and the partition and is in contact with the corresponding components, and the heat-conducting layer is connected to the corresponding second heat dissipation fins through the corresponding heat-conducting pipes.

[0016] The beneficial effects of this utility model are that by setting a partition inside the housing assembly to separate the narrowband and wideband portions of the receiver, and by adaptively setting the lower and upper heat dissipation components according to the different heat generation of the two, the heat dissipation effect can be effectively improved. At the same time, the narrowband portion with lower heat generation is placed in the lower layer, and during the heat rise process, it is directly guided to the external environment through the partition and housing assembly, avoiding the problem of heat conduction interference. Furthermore, the partition, lower heat dissipation component, and upper heat dissipation component can all increase the heat dissipation area, realizing rapid heat dissipation inside the chassis.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 An external structural diagram of a sealing device from an upper view, provided as an embodiment of this disclosure; Figure 2 An external structural diagram of a sealing device from a lower view, provided for an embodiment of this disclosure; Figure 3 This is a structural diagram of a lower-layer heat dissipation assembly provided in an embodiment of the present disclosure; Figure 4 This is a structural diagram of an upper heat dissipation component provided in an embodiment of the present disclosure.

[0021] In the picture: 1. Housing assembly; 11. Housing; 111. Top cover; 112. Bottom cover; 113. First heat dissipation slot; 114. Side plate; 12. First heat dissipation unit; 121. First heat dissipation fin; 2. Partition; 3. Lower heat dissipation assembly; 31. First air blowing unit; 311. Fan mount; 312. First fan; 313. Second heat sink; 32. Shielding cover; 321. Second heat dissipation slot; 33. First backplate; 331. Heat dissipation hole; 4. Upper heat dissipation assembly; 41. Second air blowing unit; 411. Second fan; 42. First heat dissipation fins; 43. Second backplate; 431. Second heat dissipation fins; 44. Thermal conductive layer; 45. Thermal conductive pipes. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0024] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0025] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0026] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise clearly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0027] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0028] Research revealed that the receiver is installed in a 3U chassis, which has standard dimensions of 13.33 cm (5.25 inches) high and 48.26 cm (19 inches) wide. Due to limited internal space, it is impossible to accommodate enough fans or high-volume fans. Therefore, the internal components of the receiver mainly rely on heat conduction. If the narrowband and broadband components are installed in the chassis, and they are irregularly installed directly in the chassis, there will be mutual interference during heat conduction due to the different heat generation of the two components, resulting in poor heat dissipation.

[0029] Based on the above research, this disclosure provides a sealed device and receiver for a receiver, which separates the narrowband portion and the wideband portion by a partition and adaptively sets the lower heat dissipation component and the upper heat dissipation component, thereby effectively improving the heat dissipation effect.

[0030] The shortcomings of the above solutions are the result of the utility model inventor's practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as contributions made by the utility model inventor to this disclosure.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0033] like Figures 1 to 4 As shown, at least one embodiment provides a sealed device comprising: a housing assembly 1, a partition 2, a lower heat dissipation assembly 3, and an upper heat dissipation assembly 4; wherein the partition 2 is located inside the housing assembly 1, the edge of the partition 2 is in contact with the housing assembly 1, the lower heat dissipation assembly 3 and the upper heat dissipation assembly 4 are respectively located on both sides of the partition 2 and connected to the partition 2; the lower heat dissipation assembly 3 and the upper heat dissipation assembly 4 dissipate heat from each component in the narrow band portion and each component in the wide band portion within the housing assembly 1, respectively, and conduct the heat from each component to the lower heat dissipation assembly 3 and the upper heat dissipation assembly 4, and conduct the heat to the external environment through the partition 2 and the housing assembly 1.

[0034] Specifically, thermal grease is applied to the surfaces of components with high power consumption and heat generation, allowing direct connection between the component surface and housing assembly 1 or indirect connection via partition 2, lower heat dissipation assembly 3, and upper heat dissipation assembly 4. This reduces the operating temperature of these components, preventing damage and aging, and extending their service life. Partition 2, lower heat dissipation assembly 3, and upper heat dissipation assembly 4 are reliably fixed to housing assembly 1 via guide rails and thermally conductive locking strips, using stainless steel screws, stainless steel flat washers, and stainless steel spring washers to ensure the equipment meets specified vibration and impact requirements.

[0035] In at least one embodiment, by setting a partition 2 inside the housing assembly 1 to separate the narrowband portion and the wideband portion of the receiver, and by adaptively setting the lower heat dissipation assembly 3 and the upper heat dissipation assembly 4 according to the different heat generation of the two, the heat dissipation effect can be effectively improved. At the same time, the narrowband portion with lower heat generation is set in the lower layer, and during the heat rise process, it is directly guided to the external environment through the partition 2 and the housing assembly 1, avoiding the problem of heat conduction interference. Furthermore, the partition 2, the lower heat dissipation assembly 3, and the upper heat dissipation assembly 4 can all increase the heat dissipation area, realizing rapid heat dissipation inside the chassis.

[0036] In at least one embodiment, please refer to Figure 1 , Figure 2The housing assembly 1 includes: a housing 11 and two first heat dissipation units 12; the upper cover plate 111 and the lower cover plate 112 of the housing 11 are each provided with a plurality of first heat dissipation grooves 113 to conduct heat; the two first heat dissipation units 12 are respectively connected to the two side plates 114 of the housing 11 to conduct heat.

[0037] Specifically, the enclosure 11 is made of rust-resistant aluminum, which not only meets the requirements of mechanical strength and weight, but also improves the heat dissipation effect.

[0038] Specifically, please refer to Figure 1 , Figure 2 By opening the first heat dissipation groove 113 in the upper cover plate 111 and the lower cover plate 112, the heat dissipation area can be increased and the heat dissipation effect can be improved.

[0039] Specifically, please refer to Figure 1 , Figure 2 By setting the first heat dissipation unit 12 on the side plate 114, the heat dissipation area can be increased and the heat dissipation effect can be improved.

[0040] In at least one embodiment, please refer to Figure 1 , Figure 2 The first heat dissipation unit 12 includes: a plurality of first heat dissipation fins 121; each of the first heat dissipation fins 121 is arranged sequentially on the corresponding side plate 114 to conduct heat.

[0041] Specifically, the function of the first heat sink 121 is to increase the heat dissipation area of ​​the side plate 114, which in turn helps to quickly guide the heat inside the enclosure 11 to the external environment.

[0042] In at least one embodiment, please refer to Figure 3 The lower heat dissipation assembly 3 includes: a first air blowing unit 31, a shielding cover 32, and a first back plate 33; the first air blowing unit 31, the shielding cover 32, and the first back plate 33 are connected to the partition 2, the first air blowing unit 31 is disposed facing the shielding cover 32, and the first back plate 33 is disposed perpendicular to the partition 2 and is attached to the housing assembly 1; the first air blowing unit 31 is configured to blow air onto the shielding cover 32 to dissipate heat from the components inside the shielding cover 32, so as to conduct heat to the partition 2 and the first back plate 33, and conduct it to the external environment through the housing assembly 1.

[0043] Specifically, the shielding cover 32 serves to conduct heat and provide electromagnetic shielding.

[0044] Specifically, the first blowing unit 31 can generate airflow in the lower layer to quickly remove the heat generated by the components inside the shield 32.

[0045] Specifically, the first back plate 33 serves to strengthen the connection between the partition 2 and the box 11.

[0046] Specifically, the first backplate 33 also facilitates wiring between the upper and lower layers.

[0047] Specifically, the first backplate 33 can also increase the contact area between the partition 2 and the housing 11, thereby improving the heat dissipation effect.

[0048] Specifically, the narrow band is installed inside the shielding cover 32. The narrow band has relatively low power consumption and low heat generation. It is stacked to occupy one layer and heat is transferred through the connection between the shielding cover 32 and the partition 2 and the box 11.

[0049] In at least one embodiment, please refer to Figure 3 The first air blowing unit 31 includes: a fan base 311, a first fan 312 and a plurality of second heat sinks 313; the fan base 311 is connected to the partition 2, the first fan 312 is mounted on the fan base 311 and the first fan 312 is positioned facing the shield 32, and each of the second heat sinks 313 is arranged sequentially on the fan base 311.

[0050] Specifically, the first fan 312 generates airflow towards the shield 32, while the narrow band portion inside the shield 32 generates relatively little heat. During the upward process, the heat is directly conducted to the external environment by the shield 32, the partition 2, and the housing assembly 1, thereby avoiding the problem of heat interference in the narrow band and the wide band.

[0051] Specifically, providing a second heat sink 313 on the fan mount 311 can reduce the impact of additional heat generated by the first fan 312.

[0052] In at least one embodiment, please refer to Figure 3 The shielding cover 32 is provided with a plurality of second heat dissipation slots 321, and the first back plate 33 is provided with a plurality of heat dissipation holes 331. By increasing the heat dissipation area, the heat dissipation effect is improved.

[0053] In at least one embodiment, please refer to Figure 4 The upper heat dissipation assembly 4 includes: a second air blowing unit 41, a plurality of first heat dissipation fins 42 and a second back plate 43; the second air blowing unit 41 and the second back plate 43 are connected to the partition 2, and each of the first heat dissipation fins 42 is mounted on the partition 2 so that each component is located between the corresponding first heat dissipation fin 42 and the partition 2, and the second air blowing unit 41 is arranged facing each of the first heat dissipation fins 42; the second back plate 43 is arranged perpendicular to the partition 2 and is attached to the housing assembly 1; the second air blowing unit 41 is configured to blow air onto each of the first heat dissipation fins 42 to dissipate heat from each component between the first heat dissipation fin 42 and the partition 2, so as to conduct heat to the partition 2 and the second back plate 43, and conduct it to the external environment through the housing assembly 1.

[0054] Specifically, the wide section is located on the upper layer, and a second air blowing unit 41 is installed on its side to accelerate the air circulation on its surface and transfer heat to the housing assembly 1. At the same time, the wide section is in close contact with the partition 2 to conduct heat dissipation and reduce the temperature of the wide section.

[0055] Specifically, the narrowband portion and the wideband portion are separated by the partition 2, which reduces heat interference between the two and also reduces electromagnetic interference.

[0056] Specifically, the placement of the first heat dissipation fin 42 can also improve the electromagnetic shielding effect. In at least one embodiment, please refer to Figure 4 The second air blowing unit 41 includes: a plurality of second fans 411; each second fan 411 is connected to the partition 2, and each second fan 411 is respectively arranged facing the corresponding first heat dissipation fin 42.

[0057] Specifically, to avoid excessive heat concentration, the wide section is installed on the upper layer to facilitate the upward circulation of heat. The first heat dissipation fin 42 with a reasonable depth is used, and a second fan 411 is installed on its side. The continuous blowing of the second fan 411 can accelerate the air circulation on its surface, transfer heat to the housing assembly 1, and accelerate the reduction of the temperature of the first heat dissipation fin 42.

[0058] In at least one embodiment, please refer to Figure 4 Several second heat dissipation fins 431 are arranged sequentially on the second back plate 43 to increase the heat dissipation area and improve the heat dissipation effect.

[0059] In at least one embodiment, please refer to Figure 4 The upper heat dissipation component 4 further includes: a heat-conducting layer 44 and a plurality of heat-conducting pipes 45; the heat-conducting layer 44 is located between the first heat dissipation fin 42 and the partition plate 2 and is in contact with the corresponding component, and the heat-conducting layer 44 is connected to the corresponding second heat dissipation fin 431 through the corresponding heat-conducting pipes 45.

[0060] Meanwhile, to ensure the normal operation of the broadband section, the heat-conducting layer 44 is made of brass, and with the brass heat-conducting key heat pipe, heat can be quickly transferred to the second back plate 43.

[0061] In summary, this utility model effectively improves heat dissipation by separating the narrowband and wideband portions of the receiver within the housing assembly using a partition. Furthermore, it adapts the lower and upper heat dissipation components to the different heat generation levels of the two portions, thereby avoiding heat conduction interference. Additionally, placing the narrowband portion, which generates less heat, in the lower layer allows the heat to be directly guided to the external environment through the partition and housing assembly during its rise, preventing heat conduction interference. Moreover, the partition, lower heat dissipation component, and upper heat dissipation component all increase the heat dissipation area, enabling rapid heat dissipation within the chassis.

[0062] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0063] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as the second element, component, region, layer, or segment.

[0064] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0065] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0066] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A sealed device with electromagnetic shielding effect, characterized in that, include: The housing assembly (1), the partition (2), the lower heat dissipation assembly (3), and the upper heat dissipation assembly (4); among which The partition (2) is located inside the housing assembly (1), and the edge of the partition (2) is in contact with the housing assembly (1). The lower heat dissipation assembly (3) and the upper heat dissipation assembly (4) are located on both sides of the partition (2) and connected to the partition (2). The lower heat dissipation component (3) and the upper heat dissipation component (4) dissipate heat from each component in the narrow band and the wide band of the housing component (1), respectively, and conduct the heat from each component to the lower heat dissipation component (3) and the upper heat dissipation component (4), and conduct the heat to the external environment through the partition (2) and the housing component (1).

2. The sealed device with electromagnetic shielding effect as described in claim 1, characterized in that, The housing assembly (1) includes: a housing (11) and two first heat dissipation units (12); The upper cover plate (111) and lower cover plate (112) of the box (11) are each provided with a number of first heat dissipation grooves (113) to conduct heat. The two first heat dissipation units (12) are respectively connected to the two side plates (114) of the housing (11) to conduct heat.

3. The sealed device with electromagnetic shielding effect as described in claim 2, characterized in that, The first heat dissipation unit (12) includes: a plurality of first heat dissipation fins (121); Each of the first heat sinks (121) is arranged sequentially on the corresponding side plate (114) to conduct heat.

4. The sealed device with electromagnetic shielding effect as described in claim 1, characterized in that, The lower heat dissipation assembly (3) includes: a first air blowing unit (31), a shielding cover (32), and a first back plate (33); The first blowing unit (31), the shield (32), the first back plate (33) are connected to the partition (2). The first blowing unit (31) is arranged facing the shield (32), and the first back plate (33) is arranged perpendicular to the partition (2) and is attached to the housing assembly (1). The first blowing unit (31) is configured to blow air onto the shield (32) to dissipate heat from the components inside the shield (32), so as to conduct heat to the partition (2), the first back plate (33), and to the external environment via the housing assembly (1).

5. The sealed device with electromagnetic shielding effect as described in claim 4, characterized in that, The first air blowing unit (31) includes: a fan base (311), a first fan (312) and a plurality of second heat sinks (313). The fan mount (311) is connected to the partition (2), the first fan (312) is mounted on the fan mount (311) and the first fan (312) is positioned facing the shield (32), and each of the second heat sinks (313) is arranged sequentially on the fan mount (311).

6. The sealed device with electromagnetic shielding effect as described in claim 4, characterized in that, The shielding cover (32) has several second heat dissipation slots (321), and the first back plate (33) has several heat dissipation holes (331).

7. The sealed device with electromagnetic shielding effect as described in claim 1, characterized in that, The upper heat dissipation assembly (4) includes: a second air blowing unit (41), a plurality of first heat dissipation fins (42), and a second back plate (43). The second air blowing unit (41), the second back plate (43) are connected to the partition (2), and each of the first heat dissipation fins (42) is mounted on the partition (2) so that each component is located between the corresponding first heat dissipation fin (42) and the partition (2), and the second air blowing unit (41) is arranged facing each of the first heat dissipation fins (42); The second back plate (43) is disposed perpendicular to the partition (2) and is attached to the housing assembly (1); The second air blowing unit (41) is configured to blow air onto each of the first heat dissipation fins (42) to dissipate heat from each component between the first heat dissipation fins (42) and the partition (2), so as to conduct heat to the partition (2), the second back plate (43), and to the external environment through the housing assembly (1).

8. The sealed device with electromagnetic shielding effect as described in claim 7, characterized in that, The second blowing unit (41) includes: a plurality of second fans (411); Each of the second fans (411) is connected to the partition (2), and each of the second fans (411) is respectively positioned facing the corresponding first heat dissipation fins (42).

9. The sealed device with electromagnetic shielding effect as described in claim 7, characterized in that, Several second heat dissipation fins (431) are arranged sequentially on the second back plate (43).

10. The sealed device with electromagnetic shielding effect as described in claim 9, characterized in that, The upper heat dissipation component (4) also includes: a heat-conducting layer (44) and several heat-conducting pipes (45). The heat-conducting layer (44) is located between the first heat dissipation fin (42) and the partition (2) and is in contact with the corresponding component. The heat-conducting layer (44) is connected to the corresponding second heat dissipation fin (431) through the corresponding heat-conducting pipe (45).