A type of air-cooled duct device

Abstract

This application provides an airflow cooling duct device, including an integrated airflow chamber; symmetrical mounting ears are provided on both sides of the airflow chamber; each mounting ear has at least one vertically arranged mounting hole; the airflow chamber is connected to a chassis or cabinet through the mounting holes and connectors, so that the opening of the airflow chamber faces the air inlet of the chassis and the ground air outlet, forming a semi-enclosed cold air channel; the cavity of the airflow chamber is at a preset angle, so that the cold air channel forms a gradually narrowing directional airflow. This solves the problem that cold air is difficult to enter the equipment in existing downflow systems, allowing cold air to flow more effectively to the equipment and avoiding the situation where the external temperature of the equipment is low while the internal temperature is high. The preset angle of the airflow chamber cavity forms a gradually narrowing directional airflow, which helps to gather cold air and generate a relatively higher air pressure in the airflow chamber than in the chassis, prompting the cold air to enter the chassis quickly and improving heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of computer room heat dissipation devices, and in particular to an air duct cooling device. Background Technology

[0002] An IDC (Internet Data Center) room is not only a data storage center but also a data circulation center. It should be located in the area where data exchange is most concentrated on the Internet, and it houses a large number of network devices such as servers and switches to provide network services. Because these devices need to operate continuously, they generate a significant amount of heat. Therefore, air conditioning systems are typically used to control the temperature of the data center to ensure the smooth operation of the equipment.

[0003] To improve cooling efficiency, current data center air conditioning systems generally adopt a floor ventilation method (i.e., downdraft system). This means that an air duct is built from the air conditioner outlet and extends to the floor of the data center, and the air is discharged from the floor upwards, so that the cool air can dissipate heat from the bottom up on the server racks, which can greatly improve the heat dissipation efficiency.

[0004] Existing downdraft systems are relatively mature, but because network equipment or servers are stacked on racks, they cannot effectively dissipate heat. That is, the cold air from the downdraft system, after exiting the ground, cannot effectively enter the equipment's interior. Consequently, the internal temperature of the equipment is not adequately cooled, potentially leading to a situation where the external temperature is low while the internal temperature is high. Therefore, this invention proposes an air-guiding cooling duct device to at least partially solve the problems that exist in the prior art. Utility Model Content

[0005] In view of the aforementioned problems, this application is made in order to provide an air-cooling duct device that overcomes or at least partially solves the aforementioned problems.

[0006] A cooling duct device, comprising:

[0007] Integrated flow guide compartment;

[0008] The flow guide chamber is symmetrically provided with mounting ears on both sides; each mounting ear has at least one mounting hole arranged vertically.

[0009] The airflow chamber is connected to the chassis or cabinet through the mounting holes and connectors, so that the opening of the airflow chamber faces the air inlet of the chassis and the ground air outlet, forming a semi-enclosed cold air channel.

[0010] The cavity of the air guide chamber is tilted at a preset angle, so that the cold air channel forms a gradually narrowing directional air duct.

[0011] Optionally, the mounting holes include at least two transverse slots and at least one longitudinal slot, and the connector is a screw; the flow guide chamber is connected to the chassis or cabinet via the transverse slots and / or the longitudinal slots using screws.

[0012] Optionally, the flow guide chamber is provided with an orientation-adjustable suppression fin.

[0013] Optionally, the suppression fins are hinged within the airflow chamber, and the suppression fins face the chassis.

[0014] Optionally, the flow guide chamber is made of a magnetic metal;

[0015] A magnet is also hinged to the upper end of the suppression fin.

[0016] Optionally, the cavity of the flow guide chamber is inclined at an angle of 30°-75° to form a gradually narrowing directional air duct.

[0017] Optionally, the cavity is tilted at a 45° angle.

[0018] This application has the following advantages:

[0019] In the embodiments of this application, an integrated airflow guide chamber is used. The airflow guide chamber has symmetrical mounting ears on both sides. Each mounting ear has at least one vertically arranged mounting hole. The airflow guide chamber is connected to a chassis or cabinet through the mounting holes and connectors, such that the opening of the airflow guide chamber faces the air inlet of the chassis and the ground air outlet, forming a semi-enclosed cold air channel. The cavity of the airflow guide chamber has a preset angle, making the cold air channel form a gradually narrowing directional airflow. This solves the problem of cold air being difficult to enter the equipment in existing downdraft systems, allowing cold air to flow more effectively to the equipment and avoiding a situation where the external temperature of the equipment is low while the internal temperature is high. The preset angle of the airflow guide chamber cavity forms a gradually narrowing directional airflow, which helps to gather cold air and generate a relatively higher air pressure within the airflow guide chamber compared to the chassis, prompting the cold airflow to quickly enter the chassis and improving heat dissipation efficiency. Attached Figure Description

[0020] To more clearly illustrate the technical solution of this application, the drawings used in the description of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of an air-guiding cooling duct device provided in one embodiment of this application;

[0022] Figure 2 This is an application schematic diagram of an air-guiding cooling duct device provided in one embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of an air-guiding cooling duct device with internal suppression fins provided in an embodiment of this application;

[0024] Figure 4 This is a schematic diagram of the structure of a cooling duct device with magnetic plates on the suppression fins, according to an embodiment of this application.

[0025] Figure 5 for Figure 4 Enlarged view of section A in the middle.

[0026] In the attached diagram, 10 is the airflow chamber; 11 is the mounting ear; 12 is the transverse waist hole; 13 is the longitudinal waist hole; 14 is the suppression fin; and 15 is the magnet. Detailed Implementation

[0027] To make the objectives, features, and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] Reference Figures 1 to 5 This application illustrates an airflow cooling duct device, comprising: an integrated airflow chamber 10; symmetrical mounting ears 11 on both sides of the airflow chamber 10; each mounting ear 11 having at least one mounting hole arranged vertically; the airflow chamber 10 being connected to a chassis or cabinet via the mounting holes and connectors, such that the opening of the airflow chamber 10 faces the air inlet of the chassis and the ground air outlet, forming a semi-enclosed cooling air duct; the cavity of the airflow chamber 10 having a preset tilt angle, causing the cooling air duct to form a gradually narrowing directional airflow duct.

[0029] The main feature is the addition of an integrated airflow guide chamber 10 at the bottom of the PC farm chassis or towards the cold air inlet, creating a dedicated cold air channel. This allows the cool air delivered from below the rack to smoothly enter the core heat-generating areas inside the chassis (such as the GPU, CPU, and power supply module), effectively improving heat dissipation efficiency. This device requires no active fan or additional power supply, has a simple structure, is easy to modify, and is suitable for high-density deployment scenarios, significantly reducing the risk of equipment downtime due to thermal runaway. Real-world testing showed that under the same environmental conditions (room temperature 24°C, operating load 90%), the peak chassis temperature using this device decreased from approximately 85°C to 72°C, resulting in more stable equipment operation and no performance throttling or system crashes triggered by high temperatures.

[0030] Utilizing the cool air supplied by the underfloor air supply system in the computer room, the airflow path is altered by the airflow guide structure in the air duct structure, guiding the cool air to flow evenly from bottom to top across the heat-generating components. The airflow guide chamber 10 is set at an angle or bend, and can be flexibly arranged according to the chassis structure to form a relatively enclosed airflow area, allowing the cool air to preferentially pass through the core heat dissipation area, thereby improving the overall cooling effect.

[0031] The integrated airflow guide chamber connects to the chassis or cabinet via symmetrically arranged mounting ears and holes on both sides, with the openings facing the chassis air inlet and the ground air vent, forming a semi-enclosed cold air channel. This solves the problem of cold air being difficult to enter the equipment in existing downdraft systems, allowing cold air to flow more effectively to the equipment and avoiding a situation where the external temperature of the equipment is low while the internal temperature is high. The 10-cavity airflow guide chamber is at a preset angle, forming a gradually narrowing directional airflow channel, which helps to gather cold air and generate a relatively higher air pressure within the airflow guide chamber compared to the chassis, prompting the cold airflow to quickly enter the chassis and improving heat dissipation efficiency.

[0032] The mounting holes include at least two horizontal slotted holes 12 and at least one vertical slotted hole 13, and the connector is a screw. The airflow chamber 10 is connected to the chassis or cabinet via the horizontal slotted holes 12 and / or the vertical slotted holes 13 using screws. Connecting to the chassis or cabinet via these slotted holes facilitates screw position adjustment. This system can adapt to both standard and customized non-standard chassis, as well as situations where slight deformation of the equipment casing during transportation causes screw hole misalignment, or where misalignment of the bushings during cabinet assembly causes screw hole position deviation. For example, when the left and right screw holes of the chassis are misaligned, one side of the screw can be tightened but not fully secured, and the other side can be adjusted via the horizontal slotted holes to align before tightening the screw. If the screw holes are vertically misaligned, the longer vertical slotted hole can provide auxiliary fixing. Specifically, the horizontal and vertical slots 12 and 13 facilitate screw adjustment. Since equipment chassis come in standard and custom non-standard types, and the screw hole positions may differ, and slight deformation of the equipment casing during transportation may cause screw hole misalignment, these slots allow for adaptation. The screw holes on the rack are generally located on its backing strips. During rack assembly, the backing strips may not be perfectly aligned, resulting in non-standard dimensions, similar to the aforementioned reasons. These slots allow for screw hole position adaptation. For example, if there is a left-right deviation, one side's screw can be tightened but not fully secured until the other side is adjusted and aligned, then the screw can be tightened completely. Figure 1 As shown, the longitudinal waist hole 13 is relatively long, which can better accommodate the staggered screw holes and is used for auxiliary fixation.

[0033] It should be noted that the width of the slot may be larger than the screw nut. Using a washer to adapt it is a common method and will not be elaborated on.

[0034] Furthermore, the airflow guide chamber 10 is equipped with adjustable suppression fins 14. These adjustable fins 14 allow for flexible adjustment of the suppression fins' orientation based on the location of the chassis air inlet or the position of heat-generating components inside the device, guiding cool air more precisely to the areas requiring heat dissipation and improving the targeted nature of the cooling process. For example, when a certain area within the device, such as near the CPU, generates significant heat, the suppression fins can be adjusted to concentrate the cool air towards that area.

[0035] Furthermore, the suppression fin 14 is hinged within the airflow guide chamber 10, and the suppression fin 14 faces the chassis. This allows for easier angle adjustment of the suppression fin 14 to meet the cooling requirements of different chassis air inlet positions and internal equipment. Taking the different air inlet positions of different chassis models as an example, the suppression fin can be easily rotated to accurately align it with the air inlet.

[0036] For example, the airflow guide chamber 10 is made of a magnetic metal; a magnet 15 is also hinged to the upper end of the suppression fin 14. The airflow guide chamber 10 is made of a magnetic metal, and a magnet 15 is hinged to the upper end of the suppression fin. When the airflow from the air outlet is strong, causing the suppression fin to deviate or become unstable, the angle of the suppression fin can be adjusted to face the air inlet of the chassis, and then the magnet 15 can be flipped upwards and attracted into the airflow guide chamber to fix the position of the suppression fin. Without a front cover, no screws are needed for fixing; the suppression fin can be directly adjusted to direct the cool airflow towards high-heat components such as the GPU and CPU. To prevent the suppressor fins 14 from deviating from the chassis exhaust vent or becoming unstable when the airflow from the air outlet is strong, the suppressor fins 14 can be adjusted so that their angle faces the chassis intake vent. Then, the magnetic piece 15 is flipped upwards and attached to the airflow guide chamber 10, thus fixing the suppressor fins 14 in a specific position. Since no screws are required for fixing, the suppressor fins 14 can be easily adjusted according to the position of the chassis intake vent. Alternatively, in the absence of a front cover, the suppressor fins 14 can be directly adjusted so that the cool airflow is directed directly at the high-heat areas, such as the GPU and CPU.

[0037] In some embodiments of this application, the cavity of the airflow guide chamber 10 is tilted at an angle of 30°-75°, forming a gradually narrowing directional air duct. The 30°-75° tilt angle refers to the overall angle between the upper plane and the side plane of the airflow guide chamber 10. This angle ensures that when the cold airflow reaches the tilted position, it is guided upwards at an angle, blocked by the upper plane, causing the cold air to converge within the airflow guide chamber 10 and generate a higher air pressure relative to the chassis, allowing the cold airflow to quickly enter the chassis. The 30°-75° tilt angle of the airflow guide chamber cavity ensures that when the cold airflow reaches the tilted position, it is guided upwards at an angle, blocked by the upper plane, causing the cold air to converge within the airflow guide chamber and generate higher air pressure, allowing it to quickly enter the chassis. In a practical application in an IDC data center, using an airflow guide chamber with this tilt angle range significantly reduces the internal temperature of the equipment and significantly improves the heat dissipation effect.

[0038] Furthermore, the cavity is tilted at a 45° angle. This specific angle allows for optimal airflow guidance and pressure convergence under various operating conditions, maximizing heat dissipation efficiency. In server racks with extremely high heat dissipation requirements, the use of a 45° tilted airflow cooling system significantly improves server stability and operating efficiency.

[0039] Furthermore, the aforementioned flow guide hopper 10 can be customized to different sizes according to actual needs, such as... Figure 2 As shown, where, Figure 2 (a) is a larger size and a smaller angle of inclination, such as a 30° angle of inclination; Figure 2 (b) The size is appropriate, and the tilt angle is appropriate, for example, 45° tilt angle; Figure 2 (c) is smaller in size and has a larger tilt angle, such as 70° tilt angle. When stacked in a cabinet, the different sizes of the airflow chambers 10 can prevent the lower airflow chamber 10 from blocking the upper one, ensuring that equipment with high heat dissipation requirements can achieve better heat dissipation effect.

[0040] This airflow cooling duct device is very easy to install and use, and is suitable for PC farm equipment that has been deployed or is about to be deployed. Its main principle is: by adding a guide chamber 10 to the front of the chassis, a bottom-up airflow structure is formed, which allows the cool air supplied from the bottom of the cabinet to be directed to the high-heat areas inside the chassis, thereby improving heat dissipation efficiency.

[0041] The operating steps are as follows: Measure and determine the installation location: Based on the structural dimensions of the PC farm chassis, determine the installation location of the air duct device, which is usually located at the bottom of the chassis or in the area of ​​the cold air inlet.

[0042] Install the airflow guide chamber 10: Fix the customized size airflow guide chamber 10 inside the chassis in an inclined or three-dimensional layout, and connect it to the chassis shell with screws or clips to ensure that the air duct forms a smooth guiding path.

[0043] Alignment with the downdraft system: Ensure that the air inlet of the air duct device is aligned with the air supply channel at the bottom of the cabinet so that the cool air can enter the device smoothly and be guided to the core area of ​​the chassis.

[0044] Start the equipment: Turn on the computer room air supply system and the PC farm, and observe whether the cold air passes smoothly through the air duct and is distributed to the heat-generating components such as GPU, CPU, and power supply.

[0045] This device requires no additional power supply or control system. It relies on the kinetic energy of the cold air itself and the air pressure difference to guide the airflow, effectively preventing the cold air from escaping or turbulent, and improving the uniformity of heat dissipation.

[0046] Although preferred embodiments of the present application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present application.

[0047] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0048] The above provides a detailed description of the air-guiding cooling duct device provided in this application. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A cooling duct device, characterized in that, include: Integrated flow guide compartment; The flow guide chamber is symmetrically provided with mounting ears on both sides; each mounting ear has at least one mounting hole arranged vertically. The airflow chamber is connected to the chassis or cabinet through the mounting holes and connectors, so that the opening of the airflow chamber faces the air inlet of the chassis and the ground air outlet, forming a semi-enclosed cold air channel. The cavity of the air guide chamber is tilted at a preset angle, so that the cold air channel forms a gradually narrowing directional air duct.

2. The air-guiding cooling duct device according to claim 1, characterized in that, The mounting holes include at least two horizontal slots and at least one vertical slot, and the connector is a screw; the flow guide chamber is connected to the chassis or cabinet via the horizontal slots and / or the vertical slots using screws.

3. The air-guiding cooling duct device according to claim 1, characterized in that, The flow guide chamber is equipped with an adjustable suppression fin.

4. The air-guiding cooling duct device according to claim 3, characterized in that, The suppression fins are hinged within the airflow chamber, and the suppression fins face the chassis.

5. The air-guiding cooling duct device according to claim 4, characterized in that, The flow guide chamber is made of a magnetic metal; A magnet is also hinged to the upper end of the suppression fin.

6. The air-guiding cooling duct device according to claim 1, characterized in that, The cavity of the flow guide chamber is inclined at an angle of 30°-75°, forming a gradually narrowing directional air duct.

7. The air-guiding cooling duct device according to claim 6, characterized in that, The cavity is tilted at a 45° angle.

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