A heat dissipation device and system

Abstract

This utility model relates to the field of micro-fan technology, and particularly to a heat dissipation device and system. The heat dissipation device includes: an active diaphragm and a damping diaphragm arranged opposite each other, forming a compression cavity; the active diaphragm is capable of vibration; a first channel connecting the compression cavity to the outside, and a one-way valve assembly at the first channel for limiting unidirectional flow in the first channel; and a second channel connecting the compression cavity to the outside. This utility model, by setting a one-way valve assembly at the first channel to limit the direction of fluid flow, can form opposite unidirectional airflows at the first and second channels, separating the inlet and outlet airflows. This significantly increases the back pressure of the heat dissipation device, increases the effective airflow, and thus improves heat dissipation efficiency. The heat dissipation device can absorb low-temperature air from other locations and blow it onto the module to be cooled, resulting in low internal temperature rise and low output airflow temperature, which helps reduce power consumption and improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of micro-fan technology, and in particular to a heat dissipation device and system. Background Technology

[0002] With the miniaturization of electronic devices, the density of electronic components is constantly increasing. The heat dissipation problem inside the device and core components has become a research focus. In order to meet the needs of miniaturization, heat dissipation devices are also developing towards miniaturization. Against this background, micro fans (micro fans) are being used more and more. For example, Chinese patent with publication number CN120343877A discloses a standing wave heat dissipation device and system that can generate continuous airflow and improve the energy efficiency ratio to a certain extent.

[0003] However, the heat dissipation device described in the above patent has the problem of low back pressure because it uses the same channel for air intake and exhaust. When applied in scenarios with complex air duct structures, the output air pressure and air volume will drop significantly, resulting in small effective air volume and low heat dissipation efficiency. Utility Model Content

[0004] This invention provides a heat dissipation device and system, which aims to at least increase the back pressure of the heat dissipation device to a certain extent and improve the heat dissipation efficiency.

[0005] In a first aspect, the present invention provides a heat dissipation device, comprising: An active diaphragm and a damping diaphragm are arranged opposite each other, and the active diaphragm and the damping diaphragm surround each other to form a compression cavity, and the active diaphragm is capable of vibration; A first channel connects the compression chamber to the outside. A one-way valve assembly is provided at the first channel to limit one-way flow in the first channel. The second channel connects the compression cavity to the outside.

[0006] In some embodiments, the active diaphragm is capable of periodic vibration.

[0007] In some embodiments, the active diaphragm and the damping diaphragm are capable of vibrating in opposite directions at the same frequency to generate standing waves within the compression cavity.

[0008] In some embodiments, the first channel is a first through hole disposed on the damping diaphragm, and the one-way valve assembly is disposed on one side of the damping diaphragm; the one-way valve assembly includes a one-way diaphragm and a flexible connector, the one-way diaphragm corresponds to the first through hole, the flexible connector connects the one-way diaphragm and the damping diaphragm, and the one-way diaphragm can move closer to or further away from the damping diaphragm to periodically close and open the first channel.

[0009] In some embodiments, the one-way valve assembly is disposed on the side of the damping diaphragm close to the active diaphragm.

[0010] In some embodiments, the movement frequency of the unidirectional diaphragm is the same as the vibration frequency of the damping diaphragm, and the first channel opens when the damping diaphragm moves away from the active diaphragm.

[0011] In some embodiments, the one-way valve assembly further includes a base frame, the flexible connector connecting the base frame and the one-way diaphragm, and the base frame being fixed to the damping diaphragm.

[0012] In some embodiments, the base frame is a rectangular frame, the flexible connector is a flexible strip, and at least four of the flexible connectors stretch the unidirectional diaphragm in different directions.

[0013] In some embodiments, the flexible connector is an arc-shaped strip, with both ends connected to the base frame and the middle part connected to the unidirectional diaphragm.

[0014] In some embodiments, the unidirectional diaphragm has a petal-shaped structure and at least two outwardly protruding arcuate edge lines, with the middle portion of the flexible connector connected to the middle portion of the arcuate edge lines.

[0015] In some embodiments, the second channel includes a second through hole disposed on the damping diaphragm.

[0016] In some embodiments, the second channel includes a side opening disposed between the active diaphragm and the damping diaphragm.

[0017] In some embodiments, the second channel is a second through hole disposed on the damping diaphragm, and at least two second through holes are arranged around the first channel.

[0018] In some embodiments, a vibration mechanism is attached to the side of the active diaphragm away from the damping diaphragm, and the vibration mechanism can drive the active diaphragm to vibrate periodically.

[0019] In some embodiments, the vibration mechanism includes a piezoelectric ceramic sheet.

[0020] In some embodiments, at least two of the piezoelectric ceramic sheets are stacked and connected in parallel.

[0021] In some embodiments, a first electrode lead and a second electrode lead are also included, the first electrode lead being connected to the piezoelectric ceramic sheet and the second electrode lead being connected to the active diaphragm, the active diaphragm being capable of conducting electricity.

[0022] In some embodiments, the damping diaphragm has a recessed region on the side near the active diaphragm, and the active diaphragm covers the recessed region to form the compression cavity.

[0023] In some embodiments, the active diaphragm is a composite material diaphragm, and the damping diaphragm is a metal diaphragm.

[0024] In some embodiments, the active diaphragm and the damping diaphragm are welded together at their edges.

[0025] In some embodiments, a housing is also included, the housing having a cavity for receiving the active diaphragm and the damping diaphragm, one end of the cavity being open, and the damping diaphragm being disposed on one side of the open cavity.

[0026] In some embodiments, the housing includes a base plate and a side frame, the base plate is provided with a pad, at least one of the active diaphragm and the damping diaphragm is provided with a side protrusion, the side frame is provided with a snap-fit ​​protrusion, the snap-fit ​​protrusion presses and fixes the side protrusion to the pad, and there is a gap between the active diaphragm and the base plate.

[0027] In a second aspect, the present invention provides a heat dissipation system, including a driving power supply and a heat dissipation device as described above, wherein the driving power supply is used to provide alternating voltage to the heat dissipation device.

[0028] Compared with the prior art, the beneficial effects of this utility model are as follows: The heat dissipation device of this invention utilizes the vibration of an active diaphragm to repeatedly increase and decrease the volume of the compression chamber, thereby driving gas to flow along the first and second channels. By setting a one-way valve assembly at the first channel to limit the direction of fluid flow, opposite unidirectional airflows can be formed at the first and second channels respectively. That is, one of the first and second channels is for gas to flow in, and the other is for gas to flow out, thus separating the inlet and outlet airflows. This can significantly increase the back pressure of the heat dissipation device, increase the effective air volume, and thus improve the heat dissipation efficiency. By separating the inlet and outlet airflows, the heat dissipation device can absorb low-temperature air from other locations and blow it onto the module to be cooled. The internal temperature rise of the heat dissipation device is low, and the output airflow temperature is low, which helps to reduce power consumption and improve heat dissipation efficiency. Attached Figure Description

[0029] Figure 1 This is an exploded view of the heat dissipation device described in the embodiment of this application (electrodes and casing omitted). Figure 2 This is a schematic diagram of the heat dissipation device described in the embodiment of this application (electrodes and outer casing omitted). Figure 3 This is a front view of the heat dissipation device described in the embodiment of this application (electrodes and housing omitted). Figure 4 This is a schematic diagram showing the arrangement of the damping diaphragm and one-way valve assembly described in the embodiments of this application; Figure 5 This is a schematic diagram of the heat dissipation device described in the embodiments of this application (outer shell omitted); Figure 6 This is a schematic diagram of the one-way valve assembly described in the embodiments of this application; Figure 7 This is a schematic diagram of the heat dissipation device described in an embodiment of this application; Figure 8 This is a schematic diagram of the heat dissipation device described in the embodiment of this application (side frame omitted). Figure 9 This is a schematic diagram of the structure of the base plate described in the embodiment of this application; Figure 10 This is a schematic diagram of a preferred structure of the active diaphragm and piezoelectric ceramic sheet described in the embodiments of this application.

[0030] Marked in the image: 1-Active diaphragm; 11-Metal layer; 12-Organic material layer; 2-Damping diaphragm; 21-Concave area; 22-Convex area; 23-Side opening; 3-First through hole; 4-Second through hole; 5- One-way valve assembly; 51-Unidirectional diaphragm; 52-Flexible connector; 53-Base frame; 6-Piezoelectric ceramic sheet; 7-First electrode lead; 8-Second electrode lead; 9-Shell; 91-Base plate; 92-Side frame; 93-Pad block; 94-Snap-fit ​​protrusion; 95-Side protrusion; 96-Pin electrode. Detailed Implementation

[0031] The present invention will be further described in detail below with reference to specific embodiments. However, it should not be construed as limiting the scope of the present invention to the following embodiments; all technologies implemented based on the content of the present invention fall within the scope of the present invention.

[0032] Unless otherwise specified, the use of terms such as "upper," "lower," "left," "right," "center," "inner," and "outer" to indicate orientation or positional relationships in the description of specific embodiments of this utility model is based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product / equipment / device is typically placed during use. These terms are merely for the purpose of facilitating the description of the utility model solution or simplifying the description in specific embodiments, enabling those skilled in the art to quickly understand the solution, and do not indicate or imply that a specific device / component / element must have a specific orientation, or be constructed and operated in a specific positional relationship. Therefore, they should not be construed as limitations on this utility model.

[0033] Furthermore, the use of terms such as "horizontal," "vertical," "suspended," and "parallel" does not imply that the corresponding device / component / element must be absolutely horizontal, vertical, suspended, or parallel, but rather that it can be slightly tilted or have a deviation. For example, "horizontal" merely means that its direction is more horizontal relative to "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Alternatively, it can be simplified to mean that the corresponding device / component / element, when set in a "horizontal," "vertical," "suspended," or "parallel" direction, can have an error / deviation of ±10% relative to the corresponding direction, more preferably within ±8%, more preferably within ±6%, more preferably within ±5%, and more preferably within ±4%. As long as the corresponding device / component / element is within the error / deviation range, it can still achieve its function in the present invention.

[0034] Furthermore, the use of terms such as "first," "second," and "third" in terminology is merely for distinguishing descriptions of identical or similar components and should not be interpreted as emphasizing or implying the relative importance of a particular component.

[0035] Furthermore, in the description of the embodiments of this utility model, "several", "multiple", and "several" represent at least two. The number can be any number, such as two, three, four, five, six, seven, eight, or nine, and can even exceed nine.

[0036] Furthermore, in the description of the technical solution of this utility model, unless otherwise explicitly specified / limited / restricted, the terms "set up," "install," "connect," "link," "equipped with," "laid out," and "arranged" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to common connection methods in the art, such as welding, riveting, bolting, and threaded connections. Such connections can be mechanical, electrical, or communication connections; they can be direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components.

[0037] Example In a first aspect, embodiments of this application provide a heat dissipation device, including a first diaphragm and a second diaphragm disposed opposite to each other, the first diaphragm and the second diaphragm surrounding a compression cavity, at least one of the first diaphragm and the second diaphragm being capable of vibration to cause the volume of the compression cavity to repeatedly increase and decrease, and also including a channel connecting the compression cavity and the outside.

[0038] In some embodiments, the channel includes a first channel and a second channel, wherein a one-way valve assembly 5 is provided at the first channel to limit one-way flow in the first channel.

[0039] The gas can flow from the outside into the compression chamber or from the compression chamber to the outside along the first channel.

[0040] The compression chamber is a variable-volume cavity. The volume of the compression chamber can be increased or decreased periodically, causing the internal air pressure in the compression chamber to change periodically relative to the external air pressure. When the volume of the compression chamber increases, the internal air pressure decreases, and gas flows into the compression chamber from the outside, forming an inward airflow. When the volume of the compression chamber decreases, the internal air pressure increases, and gas flows out of the compression chamber to the outside, forming an outward airflow. The function of the one-way valve assembly 5 is to ensure that the first channel only allows gas to flow inward or outward.

[0041] In some embodiments, a one-way valve structure is not provided at the second channel, and the second channel allows bidirectional airflow.

[0042] In some implementations, the first diaphragm is an active diaphragm 1 and the second diaphragm is a damping diaphragm 2. The active diaphragm 1 refers to a diaphragm structure that can actively vibrate or be directly connected to a vibration source, while the damping diaphragm 2 refers to a diaphragm that is used to cooperate with the active diaphragm 1 and is passively vibrating. In some application scenarios, the damping diaphragm 2 is also referred to as a passive diaphragm.

[0043] As is known to those skilled in the art, by tuning parameters such as the mass, compliance (hardness / softness of the connection system), and damping of the active diaphragm 1 and the damping diaphragm 2, the active diaphragm 1 and the damping diaphragm 2 can be made to vibrate in opposite directions at the same frequency. Vibration in opposite directions at the same frequency means that the vibration frequencies are equal and the phases are opposite, thereby generating a standing wave in the compression cavity. Under the action of the standing wave, the gas in the compression cavity is continuously compressed and pressurized, which can generate a continuous high-speed airflow that is ejected outward. Compared with the vibration of a single diaphragm that compresses the airflow, the formation of a standing wave through vibration in opposite directions at the same frequency can increase the velocity and flow rate of the output airflow.

[0044] As is known to those skilled in the art, by defining the first channel as a one-way flow channel through the one-way valve assembly 5, when the active diaphragm 1 and the damping diaphragm 2 vibrate at high frequency, the first channel and the second channel can present opposite flow states, that is, the second channel exhibits one-way flow opposite to the direction of the first channel. At this time, one of the first channel and the second channel is supplied with gas inflow, and the other is supplied with gas outflow, so that the intake airflow and the exhaust airflow are separated from each other. This is beneficial to increase the back pressure of the heat dissipation device, increase the effective airflow of the heat dissipation device, and thus increase the heat dissipation efficiency. Moreover, since the intake airflow and the exhaust airflow are separated from each other, the heat dissipation device can draw in fresh cold air from other locations and then blow it towards the high-temperature module to be cooled. Compared with the heat dissipation device where both the intake and exhaust airflows pass through the same channel, this heat dissipation device does not need to absorb or absorbs less hot air around the module to be cooled, and the temperature of the blown-out gas is lower, which can help the module to be cooled cool down faster. There is also little or no concern that the heat dissipation device itself will rapidly increase in temperature due to the intake of hot air, thereby affecting the normal operation of the heat dissipation device or increasing its energy consumption.

[0045] The principle behind the above phenomenon is as follows: If the first channel only allows gas to flow into the compression chamber from the outside, when the volume of the compression chamber shrinks, the internal air pressure increases, which will compress the gas and cause it to be output from the second channel, where there is an outward airflow; when the volume of the compression chamber increases, the internal air pressure decreases. At this time, because there is an outward airflow at the second channel, it will prevent the outside gas from flowing in to a certain extent, and the flow velocity at this point is greater than that at the first channel, resulting in a lower pressure at this point than at the first channel. This makes the outside gas more inclined to flow into the first channel, thus exhibiting the phenomenon of gas entering the compression chamber from the first channel and then being output from the second channel. Conversely, if the first channel only allows gas to flow from the compression chamber to the outside, when the volume of the compression chamber increases, the internal air pressure decreases. Under the action of the internal and external pressure difference, external gas will enter the compression chamber through the second channel, where there is an inward airflow. When the volume of the compression chamber decreases, the internal air pressure increases. At this time, because there is an inward airflow at the second channel, it will prevent the internal gas from flowing out to a certain extent, thus making the internal gas more inclined to be output from the first channel. Therefore, the phenomenon of gas entering the compression chamber from the second channel and then being output from the first channel is observed.

[0046] For a heat dissipation device where air intake and exhaust are through the same channel, gas input and output are two alternating steps. When outputting gas, the influence of the intake airflow must be overcome first, resulting in low back pressure of the heat dissipation device and difficulty in effective heat dissipation. In application scenarios with complex airflow structures, the air pressure and air volume of the heat dissipation device will drop significantly, up to 60% or more. During long-term operation, the heat dissipation device will generate heat by drawing in hot air, and the performance of the output airflow will deteriorate rapidly, reducing heat dissipation efficiency. At the same time, due to its own heat generation, the power consumption of the heat dissipation device increases, and its energy efficiency ratio decreases accordingly.

[0047] In some embodiments, the vibration frequency of the active diaphragm 1 and the damping diaphragm 2 is ≥20kHz. A frequency greater than or equal to 20kHz is an ultrasonic frequency, exceeding the range of normal human hearing. This significantly reduces the noise of the heat dissipation device. Furthermore, the high-frequency vibration allows for a large-scale compression of the airflow within the compression chamber, thereby increasing the velocity and flow rate of the output airflow. Further, the vibration frequency of the active diaphragm 1 and the damping diaphragm 2 is ≥25kHz.

[0048] Combination Figure 1 and Figure 2 In some embodiments, the first channel is a first through hole 3 provided on the damping diaphragm 2. The one-way valve assembly 5 is provided on one side of the damping diaphragm 2. The one-way valve assembly 5 includes a one-way diaphragm 51 and a flexible connector 52. The one-way diaphragm 51 corresponds to the first through hole 3. The flexible connector 52 connects the one-way diaphragm 51 and the damping diaphragm 2. The one-way diaphragm 51 can move closer to or further away from the damping diaphragm 2 to periodically close and open the first channel.

[0049] The first through-hole 3 connects the compression chamber to the outside. The one-way diaphragm 51 corresponds to the first through-hole 3. When the one-way diaphragm 51 is close to or attached to the damping diaphragm 2, it can cover the first through-hole 3 to block the airflow. When the one-way diaphragm 51 is away from the damping diaphragm 2, the first through-hole 3 is open to allow gas to flow through. The number of first through-holes 3 can be one or more. The one-way diaphragms 51 can also be a single connected piece or multiple spaced pieces. When the one-way diaphragm 51 is close to or attached to the damping diaphragm 2, it can cover all the first through-holes 3.

[0050] The one-way valve assembly 5 can be located on the side of the damping diaphragm 2 closer to the active diaphragm 1, or on the side of the damping diaphragm 2 further away from the active diaphragm 1. The one-way valve assembly 5 can switch the opening and closing state of the first through hole 3 by moving the one-way diaphragm 51 closer to or further away from the damping diaphragm 2. When the movement frequency of the one-way valve assembly 5 relative to the damping diaphragm 2 is equal to the vibration frequency of the damping diaphragm 2, the open or closed state of the first through hole 3 can correspond to the increase or decrease in the volume of the compression cavity. That is, when the volume of the compression cavity increases, the first through hole 3 is in one of the open and closed states, and when the volume of the compression cavity decreases, the first through hole 3 is in the other of the open and closed states. Therefore, the first through hole 3 is designed to allow only one-way airflow.

[0051] The flexible connector 52 is a flexible connection structure that connects the unidirectional diaphragm 51 and the damping diaphragm 2. It is used to limit the distance of the unidirectional diaphragm 51 from the damping diaphragm 2. The flexibility allows the flexible connector 52 to undergo slight deformation, thereby allowing the unidirectional diaphragm 51 to move relative to the damping diaphragm 2.

[0052] The one-way diaphragm 51 can be driven by airflow to move relative to the damping diaphragm 2. For example, if the one-way valve assembly 5 is located on the side of the damping diaphragm 2 close to the active diaphragm 1, when the volume of the compression chamber increases, under the action of the internal and external pressure difference, the external gas flows inward, and the airflow around the first through hole 3 can push the one-way diaphragm 51 away from the damping diaphragm 2, and the first through hole 3 is unobstructed; when the volume of the compression chamber decreases, under the action of the internal and external pressure difference, the internal gas flows outward, and the airflow around the first through hole 3 can push the one-way diaphragm 51 close to and adhere to the damping diaphragm 2, and the first through hole 3 is closed. Conversely, if the one-way valve assembly 5 is located on the side of the damping diaphragm 2 away from the active diaphragm 1, when the volume of the compression chamber increases, under the action of the internal and external pressure difference, the external gas flows inward, and the airflow around the first through hole 3 can push the one-way diaphragm 51 closer to and adhere to the damping diaphragm 2, and the first through hole 3 is closed; when the volume of the compression chamber decreases, under the action of the internal and external pressure difference, the internal gas flows outward, and the airflow around the first through hole 3 can push the one-way diaphragm 51 away from the damping diaphragm 2, and the first through hole 3 is unobstructed.

[0053] In a preferred embodiment, the one-way valve assembly 5 is disposed on the side of the damping diaphragm 2 close to the active diaphragm 1, which allows the one-way valve assembly 5 to open and close more completely and respond faster. At this time, the first channel is the inlet for gas input and the second channel is the outlet for gas output. Since the second channel is not obstructed, the flow rate and flow volume of the gas output from the second channel are higher.

[0054] Combination Figure 1 and Figure 2In some embodiments, the first through hole 3 is located in the middle of the damping diaphragm 2, and the unidirectional diaphragm 51 corresponds to the position of the first through hole 3. The flexible connector 52 connects the periphery of the unidirectional diaphragm 51 to tension the unidirectional diaphragm 51. The active diaphragm 1 and the damping diaphragm 2 are connected by the edge. When the active diaphragm 1 and the damping diaphragm 2 vibrate in opposite directions at the same frequency, their middle parts exhibit periodic opposite and opposite movements. When they move in opposite directions, the middle part of the damping diaphragm 2 has an outward arc, so that the first through hole 3 in the middle part of the damping diaphragm 2 moves away from the unidirectional diaphragm 51, and the first through hole 3 is unobstructed. When they move in opposite directions, the middle part of the damping diaphragm 2 returns to the center or has an inward arc, so that the first through hole 3 in the middle part of the damping diaphragm 2 approaches or adheres to the unidirectional diaphragm 51, and the first through hole 3 is closed.

[0055] Combination Figure 6 In some embodiments, to facilitate the connection between the one-way diaphragm 51 and the damping diaphragm 2, the one-way valve assembly 5 further includes a base frame 53, and a flexible connector 52 connects the base frame 53 and the one-way diaphragm 51. The one-way diaphragm 51 can be installed by fixing the base frame 53 to the damping diaphragm 2. It can be pre-fabricated as follows: Figure 6 The one-way valve assembly 5 shown includes a base frame 53, a flexible connector 52, and a one-way diaphragm 51. The base frame 53 is then fixed to the damping diaphragm 2 to simplify the manufacturing process.

[0056] Combination Figure 6 In some embodiments, the base frame 53 is a rectangular frame, the unidirectional diaphragm 51 can be located inside the base frame 53, the flexible connector 52 can be a flexible strip, and at least four flexible connectors 52 connect the four sides of the unidirectional diaphragm 51 and stretch the unidirectional diaphragm 51 in different directions so that the surface of the unidirectional diaphragm 51 opens up, so that the unidirectional diaphragm 51 can cover and close the first through hole 3.

[0057] Combination Figure 6 In some embodiments, the flexible connector 52 is further defined as an arc-shaped strip. Both ends of the flexible connector 52 are connected to the base frame 53, and the middle part of the flexible connector 52 is connected to the one-way diaphragm 51. This can improve the connection strength and connection stability of the flexible strip while reducing the number of flexible strips, and enable the flexible connector 52 to stretch the one-way diaphragm 51 in more directions, which helps to reduce the probability of deformation of the one-way diaphragm 51 and improve the structural reliability of the one-way valve assembly 5.

[0058] Combination Figure 6 In some embodiments, the one-way diaphragm 51 has a petal-shaped structure. The petal-shaped one-way diaphragm 51 has multiple outwardly protruding arc-shaped edge lines, which means that the one-way diaphragm 51 has multiple outwardly protruding arc-shaped portions. For the circular first through hole 3, setting the one-way diaphragm 51 to a petal-shaped structure can better cover and seal the first through hole 3 with less increase in the area of ​​the one-way diaphragm 51, thereby improving the sealing effect and reducing air leakage.

[0059] More preferably, the middle part of the flexible connector 52 is connected to the middle part of the arc-shaped edge line.

[0060] In some embodiments, the one-way valve assembly 5 is also called a diaphragm one-way valve due to its small thickness. Using this one-way valve structure helps to reduce the thickness of the heat dissipation device and meet the requirements of miniaturization.

[0061] As is known to those skilled in the art, due to the operating mode of the one-way valve assembly 5, a small amount of gas may flow in the opposite direction to the flow direction allowed by the first channel. Compared with the overall gas flow rate, this small amount of gas does not affect the normal functioning of the heat dissipation device described in this application. Of course, improving the gas blocking efficiency of the one-way valve assembly 5 can improve the heat dissipation efficiency of the heat dissipation device to a certain extent.

[0062] Combination Figure 2 In some embodiments, the second channel is a second through hole 4 provided on the damping diaphragm 2. The second through hole 4 is not covered by the unidirectional diaphragm 51. During the periodic vibration of the active diaphragm 1, the volume of the compression cavity periodically increases and decreases, and high-speed airflow can be continuously output at the second through hole 4. In this case, since both the first channel and the second channel are located on the surface of the damping diaphragm 2, both air intake and exhaust occur on the surface of the damping diaphragm 2, and a surface-inlet and surface-outlet heat dissipation device can be made.

[0063] Combination Figure 2 In some embodiments, to increase the air outlet area, the damping diaphragm 2 is provided with at least two second through holes 4. Further, at least two second through holes 4 are arranged around the first through hole 3. In the exemplary example, eight second through holes 4 are arranged around the first through hole 3. There is a gap between the second through holes 4 and the first through hole 3 to reduce the influence between the intake airflow and the exhaust airflow. This type of heat dissipation device has a large air outlet area and a large air volume, and is suitable for heat dissipation in slightly larger spaces.

[0064] Combination Figure 2 and Figure 3 In some embodiments, the second channel is a side opening 23 disposed between the active diaphragm 1 and the damping diaphragm 2. The side opening 23 can be located on the side of the opposite surface of the active diaphragm 1 and the damping diaphragm 2. The side opening 23 connects the compression cavity and the outside. In this structure, the distance between the air inlet and the air outlet is large, and the mutual influence between the air inlet and the air outlet is small. Moreover, since the active diaphragm 1 and the damping diaphragm 2 are both thin sheets with small thickness, the area of ​​the side opening 23 is also relatively small, and the output airflow is relatively concentrated, which is suitable for heat dissipation of heat sources in confined spaces.

[0065] Combination Figure 1 , Figure 2 and Figure 4In some embodiments, the second channel includes a second through hole 4 disposed on the damping diaphragm 2 and a side opening 23 disposed between the active diaphragm 1 and the damping diaphragm 2.

[0066] Combination Figure 4 In some embodiments, the damping diaphragm 2 has a recessed region 21 on the side near the active diaphragm 1, and the edge of the damping diaphragm 2 has an upwardly convex region 22 to surround the recessed region 21. The active diaphragm 1 covers the recessed region 21 to form a compression cavity. The upwardly convex region 22 and the recessed region 21 have different surface heights. The active diaphragm 1 and the damping diaphragm 2 can be connected by edge welding. The welding strength is high, and the connection can be kept stable under high frequency vibration. Moreover, the welding has little impact on the vibration frequency of the diaphragm, which facilitates the tuning of the vibration frequency of the active diaphragm 1 and the damping diaphragm 2.

[0067] Combination Figure 4 More preferably, the side opening 23 can be formed by cutting off a portion of the convex region 22, so that the compression cavity can be connected to the outside through the cut-off channel.

[0068] In some embodiments, a vibration mechanism is attached to the side of the active diaphragm 1 away from the damping diaphragm 2, and the vibration mechanism can drive the active diaphragm 1 to vibrate periodically.

[0069] Combination Figure 1 In some embodiments, the vibration mechanism includes a piezoelectric ceramic sheet 6, which is an electronic component that uses the piezoelectric effect to convert electrical energy into mechanical energy. Applying an alternating voltage to the piezoelectric ceramic sheet 6 causes it to vibrate periodically, thereby driving the active diaphragm 1 attached to it to vibrate. In an exemplary example, the piezoelectric ceramic sheet 6 includes a central piezoelectric ceramic material and electrode materials on both sides. The electrode material can be silver, and the piezoelectric ceramic sheet 6 can be formed by depositing silver layers on both surfaces of the sheet-like piezoelectric ceramic material.

[0070] In some embodiments, to further enhance the vibration intensity of the vibration mechanism, the vibration mechanism includes at least two piezoelectric ceramic sheets 6 stacked together, all of which are connected in parallel so that their vibration frequencies and phases are equal, thereby superimposing to form a larger amplitude.

[0071] In some embodiments, the active diaphragm 1 is a composite material diaphragm, which is formed by combining two or more materials. By combining multiple materials, it is convenient to adjust the vibration frequency of the active diaphragm 1 and enable the active diaphragm 1 to have sufficient strength, rigidity and stability. Preferably, the composite material diaphragm may include two or more organic materials, such as fibers and resins.

[0072] Combination Figure 10In some embodiments, the active diaphragm 1 further includes a metal layer 11 and an organic material layer 12 bonded together. The organic material layer 12 is located on the side of the metal layer 11 closest to the piezoelectric ceramic sheet 6. The shape of the organic material layer 12 may be the same as that of the piezoelectric ceramic sheet 6, and the two are bonded together. The organic material layer 12 may include a fibrous material, which can protect the piezoelectric ceramic sheet 6 to reduce the risk of breakage. The organic material layer 12 is conductive and can be made by adding conductive fillers. Multiple materials can be bonded together. To better cope with the differences in thermal expansion coefficients between different materials, a unique multilayer material bonding process using differential pressure and step-curing can be adopted.

[0073] In some embodiments, the piezoelectric ceramic sheet 6 is a circular sheet, and the piezoelectric ceramic sheet 6 is disposed in the middle of the active diaphragm sheet 1.

[0074] In some embodiments, the damping diaphragm 2 is a metal diaphragm; further, the composition of the damping diaphragm 2 is similar to that of stainless steel.

[0075] Combination Figure 5 In some embodiments, to facilitate power supply to the piezoelectric ceramic sheet 6, a first electrode lead 7 and a second electrode lead 8 are also included. The first electrode lead 7 is connected to the piezoelectric ceramic sheet 6, and the second electrode lead 8 is connected to the active diaphragm 1. The piezoelectric ceramic sheet 6 and the active diaphragm 1 are directly bonded or indirectly bonded through conductive materials.

[0076] Combination Figure 7 In some embodiments, the heat dissipation device further includes a housing 9 having a cavity for accommodating an active diaphragm 1 and a damping diaphragm 2, with one side of the cavity open. The damping diaphragm 2 is disposed on the open side of the cavity so that a first through hole 3 and a second through hole 4 disposed on the damping diaphragm 2 communicate with the outside.

[0077] Combination Figure 7 , Figure 8 and Figure 9 In some embodiments, further for ease of assembly and fixation, the housing 9 includes a base plate 91 and a side frame 92. The base plate 91 is provided with a pad 93, and at least one of the active diaphragm 1 and the damping diaphragm 2 is provided with a side protrusion 95. The side frame 92 is provided with a snap-fit ​​protrusion 94. The side protrusion 95 can be pressed and fixed onto the pad 93 by the snap-fit ​​protrusion 94, thereby fixing the active diaphragm 1 and the damping diaphragm 2 to the housing 9. More preferably, the base plate 91 and the side frame 92 are fabricated separately, allowing the base plate 91 and the side frame 92 to be fixedly connected after the active diaphragm 1 and the damping diaphragm 2 are installed into the side frame 92, so that the pad 93, the side protrusion 95, and the snap-fit ​​protrusion 94 fit tightly. By providing the pad 93, a gap can be created between the active diaphragm 1 and the base plate 91, facilitating the vibration of the active diaphragm 1. Preferably, the side protrusion 95 is provided on the active diaphragm 1.

[0078] Combination Figure 7 In some embodiments, for a heat dissipation device with a side opening 23, in order to reduce the obstruction of the side opening 23 by the housing 9 and output high-speed airflow, a notch corresponding to the side opening 23 may be provided on the side frame 92.

[0079] Combination Figure 5 , Figure 7 and Figure 8 In some embodiments, to facilitate the connection of the heat dissipation device to the PCB board or other structures, the heat dissipation device further includes a pin electrode 96. The pin electrode 96 can be fixed to the housing 9. At least one pin electrode 96 is connected to the first electrode lead 7 and at least one pin electrode 96 is connected to the second electrode lead 8. The pin electrode 96 can be made of conductive materials such as copper and can supply power to the heat dissipation device through the pin electrode 96.

[0080] The heat dissipation device described in this embodiment can be a piezoelectric micro fan.

[0081] In use, the pin electrode 96 can be directly soldered to the PCB board or directly fixed to the internal structure of the whole machine, so that the heat dissipation device blows air towards the internal heat-generating element. The pin electrode 96 has various structural forms, such as surface mount, bottom mount, dual in-line, and bent pin. Preferably, for the micro fan with a front exhaust structure, a dual in-line package can be used. In use, the pins can be directly soldered to the PCB board or mounted on the whole machine structure through the micro fan pins. After the micro fan is packaged, tape and reel packaging can be used to facilitate automated surface mount and through-hole assembly of the whole machine. For the micro fan with a side exhaust structure, a surface mount structure can be used, and it can be directly soldered to the PCB board through a surface mount process.

[0082] The piezoelectric microfan described in this embodiment separates the air inlet and outlet, solving problems such as low gas compression efficiency, partial intake of hot air during exhaust, low back pressure of the microfan, and significant air pressure loss, especially when used in complex air ducts. It can effectively reduce the intake of hot air, reduce the heat generation of the microfan body, and increase the back pressure of the microfan. By having the airflow enter and exit through different outlets, fresh and cold air is drawn in, improving the heat dissipation effect of the microfan. It can continuously and stably output high wind speed (>10m / s) and large flow rate (>2L / min) gas, and the noise can be controlled below 30dB.

[0083] The piezoelectric microfan described in this embodiment has a simple structure and a thickness of less than 1.5mm, with some piezoelectric microfans even less than 1mm, which can meet the stringent requirements of ultra-thin devices; in the example, the dimensions of the piezoelectric microfan are 10mm×10mm×0.6mm.

[0084] In a second aspect, embodiments of this application provide a heat dissipation system, including a drive power supply and a heat dissipation device as described above, wherein the drive power supply is used to provide alternating voltage to the heat dissipation device.

[0085] In some implementations, the driving power supply may be a power supply with a frequency ≥25KHz, a voltage of 50V~110V, and a power consumption ≤0.4W, to ensure the continuous, stable, and high-speed operation of the heat dissipation device.

[0086] Furthermore, the driving power supply can be an intelligent driving power supply with temperature compensation and adaptive capacitive load excitation. The output frequency of the driving power supply and the resonant frequency of the active diaphragm 1 are always kept consistent to achieve the effect of maximum displacement.

[0087] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipating device, characterized by, include: An active diaphragm (1) and a damping diaphragm (2) are arranged opposite to each other, and the active diaphragm (1) and the damping diaphragm (2) enclose a compression cavity, and the active diaphragm (1) is capable of vibration; The first channel connects the compression chamber to the outside. A one-way valve assembly (5) is provided at the first channel. The one-way valve assembly (5) is used to limit the one-way flow of the first channel. The second channel connects the compression cavity to the outside.

2. The heat dissipation device according to claim 1, characterized in that, The active diaphragm (1) is capable of periodic vibration; the active diaphragm (1) and the damping diaphragm (2) are capable of vibrating in opposite directions at the same frequency to generate standing waves in the compression cavity.

3. The heat dissipation device according to claim 1, characterized in that, The first channel is a first through hole (3) provided on the damping diaphragm (2), and the one-way valve assembly (5) is provided on one side of the damping diaphragm (2); The one-way valve assembly (5) includes a one-way diaphragm (51) and a flexible connector (52). The one-way diaphragm (51) corresponds to the first through hole (3). The flexible connector (52) connects the one-way diaphragm (51) and the damping diaphragm (2). The one-way diaphragm (51) can move closer to or further away from the damping diaphragm (2) to periodically close and open the first channel.

4. The heat dissipation device according to claim 3, characterized in that, The one-way valve assembly (5) is disposed on the side of the damping diaphragm (2) near the active diaphragm (1).

5. The heat dissipation device according to claim 4, characterized in that, The movement frequency of the unidirectional diaphragm (51) is the same as the vibration frequency of the damping diaphragm (2), and the first channel opens when the damping diaphragm (2) moves away from the active diaphragm (1).

6. The heat dissipation device according to claim 3, characterized in that, The one-way valve assembly (5) also includes a base frame (53), and the flexible connector (52) connects the base frame (53) and the one-way diaphragm (51). The base frame (53) is fixed to the damping diaphragm (2).

7. The heat dissipation device according to claim 6, characterized in that, The base frame (53) is a rectangular frame, the flexible connector (52) is a flexible strip, and at least four of the flexible connectors (52) stretch the unidirectional diaphragm (51) in different directions.

8. The heat dissipation device according to claim 7, characterized in that, The flexible connector (52) is an arc-shaped strip. Both ends of the flexible connector (52) are connected to the base frame (53), and the middle part of the flexible connector (52) is connected to the unidirectional diaphragm (51).

9. The heat dissipation device according to claim 8, characterized in that, The unidirectional diaphragm (51) has a petal-shaped structure and at least two outwardly protruding arc-shaped edge lines. The middle part of the flexible connector (52) is connected to the middle part of the arc-shaped edge lines.

10. The heat dissipation device according to claim 1, characterized in that: The second channel includes a second through hole (4) disposed on the damping diaphragm (2); And / or, the second channel includes a side opening (23) disposed between the active diaphragm (1) and the damping diaphragm (2).

11. The heat dissipation device according to claim 1, characterized in that, The second channel is a second through hole (4) disposed on the damping diaphragm (2), and at least two second through holes (4) are arranged around the first channel.

12. The heat dissipation device according to claim 1, characterized in that, A vibration mechanism is attached to the side of the active diaphragm (1) away from the damping diaphragm (2), and the vibration mechanism can drive the active diaphragm (1) to vibrate periodically.

13. The heat dissipation device according to claim 12, characterized in that, The vibration mechanism includes a piezoelectric ceramic sheet (6); at least two of the piezoelectric ceramic sheets (6) are stacked and connected in parallel.

14. The heat dissipation device according to claim 13, characterized in that, It also includes a first electrode lead (7) and a second electrode lead (8), the first electrode lead (7) being connected to the piezoelectric ceramic sheet (6), and the second electrode lead (8) being connected to the active diaphragm (1), the active diaphragm (1) being conductive.

15. The heat dissipation device according to claim 1, characterized in that: The damping diaphragm (2) has a recessed area (21) on the side near the active diaphragm (1), and the active diaphragm (1) covers the recessed area (21) to form the compression cavity; And / or, the active diaphragm (1) is a composite material diaphragm, and the damping diaphragm (2) is a metal diaphragm; And / or, the active diaphragm (1) and the damping diaphragm (2) are welded together at their edges.

16. The heat dissipation device according to claim 1, characterized in that, It also includes a housing (9) having a cavity for accommodating the active diaphragm (1) and the damping diaphragm (2), one end of the cavity being open, and the damping diaphragm (2) being disposed on one side of the open cavity.

17. The heat dissipation device according to claim 16, characterized in that, The housing (9) includes a base plate (91) and a side frame (92). A pad (93) is provided on the base plate (91). At least one of the active diaphragm (1) and the damping diaphragm (2) is provided with a side protrusion (95). A snap-fit ​​protrusion (94) is provided on the side frame (92). The snap-fit ​​protrusion (94) presses and fixes the side protrusion (95) onto the pad (93). There is a gap between the active diaphragm (1) and the base plate (91).

18. A heat dissipation system, characterized in that, It includes a driving power supply and a heat dissipation device as described in any one of claims 1-17, wherein the driving power supply is used to provide an alternating voltage to the heat dissipation device.

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