Sensor packaging structure

Abstract

This application provides a sensor packaging structure, relating to the field of semiconductor packaging technology. The sensor packaging structure includes a substrate with a barrier structure, electronic components, a glass cover, and a protective layer. The electronic components are electrically connected to the substrate, and the barrier structure is located on the outer periphery of the electronic components. The glass cover is disposed on the side of the barrier structure away from the substrate. A first distance exists between the edge of the glass cover and the edge of the barrier structure away from the electronic components; the first distance is greater than 100 micrometers; the height of the protective layer is not lower than the surface of the glass cover away from the substrate. This structure helps to reduce the impact of cutting stress on the glass cover and barrier structure, improving the reliability of the packaging structure.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a sensor packaging structure. Background Technology

[0002] With the rapid development of the semiconductor industry, image sensor packaging structures mainly include charge-coupled device (CCD) image sensors, CMOS image processors, and photoelectric sensors. Therefore, image sensors can receive light signals and convert them into electrical signals. This enables image sensors to be used in various electronic products such as digital cameras, automotive image sensing modules, and surveillance cameras.

[0003] In current sensor packaging structures, a glass cover is attached before molding. After molding, the components are separated into individual products using a cutting process. This cutting process can easily cause microcracks at the glass edges, affecting the packaging quality. Utility Model Content

[0004] The purpose of this invention is to provide a sensor packaging structure that can improve the sensor packaging quality and structural reliability.

[0005] This utility model provides a sensor packaging structure, including:

[0006] A substrate with a retaining wall structure;

[0007] An electronic component, which is electrically connected to the substrate, and the barrier structure is located on the outer periphery of the electronic component;

[0008] A glass cover plate is disposed on the side of the barrier structure away from the substrate; there is a first distance between the edge of the glass cover plate and the edge of the barrier structure away from the electronic component; the first distance is greater than 100 micrometers;

[0009] A protective layer; the height of the protective layer is not lower than the surface of the glass cover away from the substrate.

[0010] In an optional embodiment, the thickness of the protective layer covering the sidewall of the glass cover is greater than or equal to the first distance.

[0011] In an optional embodiment, the retaining wall structure includes a support member that is bonded to the substrate using a first adhesive.

[0012] In an optional embodiment, the retaining wall structure includes a molding compound that is injection molded onto the substrate.

[0013] In an optional embodiment, the retaining wall structure and the substrate are integrally formed.

[0014] In an optional implementation, the first distance is greater than the width of the overlap between the glass cover and the retaining wall structure.

[0015] In an optional implementation, the protective layer is flush with the sidewall of the retaining wall structure.

[0016] In an optional embodiment, the protective layer covers the sidewalls of the retaining wall structure.

[0017] In an optional embodiment, the thickness of the protective layer covering the sidewall of the retaining wall structure is 100 micrometers to 150 micrometers.

[0018] In an optional embodiment, the protective layer has a guide structure on the side away from the substrate.

[0019] The sensor packaging structure provided in this embodiment of the invention leaves a first distance greater than 100 micrometers between the edge of the glass cover and the edge of the retaining wall structure. This makes the edge of the glass cover farther from the cutting path, thereby reducing the risk of microcracks caused by tensile stress during the cutting process. The protective layer protects the sidewalls of the glass cover and acts as a buffer during the cutting process, effectively protecting the glass cover and preventing defects such as microcracks, thus improving packaging quality and reliability. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the first sensor packaging structure provided in this embodiment of the present utility model;

[0022] Figure 2 A schematic diagram of the second sensor packaging structure provided in this embodiment of the present invention;

[0023] Figure 3 A schematic diagram of the third sensor packaging structure provided in this embodiment of the present utility model;

[0024] Figure 4 This is one of the process diagrams for the first sensor packaging structure provided in the embodiments of this utility model;

[0025] Figure 5 A second schematic diagram of the manufacturing process of the first sensor packaging structure provided in this embodiment of the present utility model;

[0026] Figure 6 A schematic diagram of the manufacturing process of another sensor packaging method provided in this embodiment of the present utility model;

[0027] Figure 7 This is one of the process diagrams for the second sensor packaging structure provided in this embodiment of the present invention;

[0028] Figure 8 This is the second schematic diagram of the manufacturing process of the second sensor packaging structure provided in this embodiment of the present invention;

[0029] Figure 9 A schematic diagram of the manufacturing process of another sensor packaging structure provided in this embodiment of the present utility model;

[0030] Figure 10 A schematic diagram of the manufacturing process of the third sensor packaging structure provided in this embodiment of the present invention.

[0031] Icons: 100 - Sensor packaging structure; 110 - Substrate; 120 - Barrier structure; 121 - Support component; 122 - First colloid; 123 - Molded body; 125 - Coating groove; 130 - Electronic component; 140 - Glass cover plate; 141 - Second colloid; 142 - Chamfer; 150 - Protective layer; 151 - Guide structure; 160 - Solder ball. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0034] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0035] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0036] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0037] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0039] Please combine Figure 1This utility model provides a sensor packaging structure 100, including a substrate 110 with a retaining wall structure 120, an electronic component 130, a glass cover 140, and a protective layer 150. The electronic component 130 is electrically connected to the substrate 110, and the retaining wall structure 120 is located on the outer periphery of the electronic component 130. The glass cover 140 is disposed on the side of the retaining wall structure 120 away from the substrate 110, and there is a first distance W1 between the edge of the glass cover 140 and the edge of the retaining wall structure 120 away from the electronic component 130. The first distance W1 is greater than 100 micrometers. This arrangement makes the edge of the glass cover 140 farther from the cutting path, thereby reducing the risk of microcracks caused by tensile stress during the cutting process. The height of the protective layer 150 is not lower than the surface of the glass cover 140 away from the substrate 110. This can improve the effective protection of the sidewall of the glass cover 140 by the protective layer 150, prevent defects such as cracks in the glass cover 140, and thus improve the packaging quality and structural reliability.

[0040] Optionally, the glass cover 140 covers the electronic component 130. The width of the protective layer 150 is greater than or equal to the first distance. The width of the protective layer 150 can be understood as the thickness of the protective layer 150 covering the sidewall of the glass cover 140.

[0041] Optionally, the edge of the protective layer 150 is flush with the edge of the retaining wall structure 120, or the protective layer 150 covers the sidewall of the retaining wall structure 120. Covering the sidewall of the retaining wall structure 120 with the protective layer 150 can protect the retaining wall structure 120 and reduce the impact of cutting stress on the glass cover plate 140 and the retaining wall structure 120 during the cutting process.

[0042] Optionally, the thickness of the protective layer 150 covering the sidewall of the retaining wall structure 120 is a second distance W2, where W2 is 100µm to 150µm. The thickness of the protective layer 150 covering the sidewall of the glass cover plate 140 is W0, where W0 = W2 + W1.

[0043] In this embodiment, the first distance is greater than the overlap width of the glass cover plate 140 and the retaining wall structure 120, providing more coverage space for the protective layer and improving structural reliability.

[0044] Optionally, the retaining wall structure 120 includes a support member 121, which is bonded to the substrate 110 using a first adhesive 122. The support member 121 can be fixed to the substrate 110 by mounting, or the substrate 110 and the support member 121 can be fixedly connected by snap-fit, threaded connection or heat pressing, etc., which are not specifically limited here.

[0045] Optionally, the retaining wall structure 120 includes a molding compound 123, which is injection molded onto the substrate 110. (Please refer to...) Figure 2The retaining wall structure 120 is a plastic encapsulated body 123 formed on the substrate 110, and the protective layer 150 is formed on the substrate 110 by vacuum coating to protect the sidewalls of the retaining wall structure 120 and the glass cover plate 140. The protective layer 150 and the glass cover plate 140 are flush.

[0046] Optionally, the barrier structure 120 and the substrate 110 are integrally formed. This integrally formed structure is reliable, reduces packaging steps, and improves packaging efficiency. In this embodiment, the barrier structure 120 and the substrate 110 are made of the same or similar materials, which can reduce warping deformation caused by thermal expansion coefficients.

[0047] Optionally, a guide structure 151 is provided on the side of the protective layer 150 away from the substrate 110. The sidewall portion of the protective layer 150 covering the glass cover 140 is provided with a sloped or curved guide structure 151, such as rounded corners or right angles, or other similar guide slopes, to facilitate the expulsion of moisture from the surface of the glass cover 140, avoid ghosting or double images, and improve the packaging quality.

[0048] Optionally, solder balls 160 are provided on the side of the substrate 110 away from the electronic component 130. The electronic component 130 is a sensor chip, which is a standard-mount chip and electrically connected to the substrate 110 by wire bonding.

[0049] Please combine Figure 3 Optionally, the protective layer 150 formed by vacuum coating can be higher than the surface of the glass cover plate 140 during the coating process, meaning the protective layer 150 covers the sidewalls and top of the glass cover plate 140. The coating on the upper surface of the glass cover plate 140 can be removed subsequently by methods such as adhesive removal or etching to expose the upper surface of the glass cover plate 140.

[0050] Please combine Figures 4 to 5 The first sensor packaging structure 100 proposed in this embodiment of the present invention mainly includes the following steps in its packaging method:

[0051] Step S1: Provide a substrate 110 having a retaining wall structure 120.

[0052] Step S2: Attach electronic components 130 to the substrate 110; wherein the barrier structure 120 is located on the outer periphery of the electronic components 130.

[0053] Step S3: Attach a glass cover plate 140 to the side of the barrier structure 120 away from the substrate 110; wherein there is a first distance between the edge of the glass cover plate 140 and the edge of the barrier structure 120 away from the electronic component 130.

[0054] Step S4: A protective layer 150 is formed on the substrate 110, the protective layer 150 at least covering the sidewall of the glass cover plate 140.

[0055] Step S5: Cut the protective layer 150 along the first cutting line;

[0056] Step S6: Cut the substrate 110 along the second cutting channel to separate it into individual products. The width of the second cutting channel is greater than or equal to the width of the first cutting channel.

[0057] In this embodiment, when attaching the glass cover plate 140, a first distance is left between the edge of the glass cover plate 140 and the edge of the retaining wall structure 120. This ensures that during subsequent cutting, the edge of the glass cover plate 140 is further from the cutting path, thereby reducing the risk of microcracks caused by tensile stress during the cutting process. The protective layer 150, which protects the sidewalls of the glass cover plate 140, acts as a buffer during cutting, effectively protecting the glass cover plate 140 and preventing defects such as microcracks. The first distance also provides sufficient space for the formation of the protective layer 150, ensuring that the thickness of the protective layer 150 covering the sidewalls of the glass cover plate 140 is sufficiently large to fully exert its protective and buffering effects, effectively protecting the glass cover plate 140. Furthermore, the two-stage cutting process employed in this application disperses and reduces cutting stress, minimizing its impact on the glass cover plate 140 and the retaining wall structure 120, thereby improving encapsulation quality and reliability.

[0058] In step S1, the barrier structure 120 can be integrally formed with the substrate 110 or separately connected. Optionally, a substrate 110 is provided first, and the barrier structure 120 is a support member 121 mounted on the substrate 110. The material of the substrate 110 includes, but is not limited to, polyester or polyimide, PET and other resin sheets, epoxy resin and other polymers, heat-resistant resin boards (e.g., bismaleimide triazine resin boards) or fiber-reinforced resin boards (e.g., glass fiber reinforced epoxy resin boards).

[0059] In this embodiment, the retaining wall structure 120 includes a support member 121, which can be made of the same material as the substrate 110. For example, the support member 121 can be made of heat-resistant resin board (e.g., bismaleimide triazine resin board) or fiber-reinforced resin board (e.g., glass fiber reinforced epoxy resin board).

[0060] When mounting the support member 121, the support member 121 is attached to the surface of the substrate 110 using a first adhesive 122. The first adhesive 122 is then cured again by baking, making the support member 121 more firmly fixed.

[0061] In step S2, the electronic component 130 uses a sensor chip. Optionally, the chip is a wire bonded chip. The chip is mounted on the substrate 110, and the substrate 110 and the chip are electrically connected by wire bonding. It can be understood that multiple sensor chips can be mounted on the same substrate 110, and each sensor chip has a retaining wall structure 120 around its periphery.

[0062] Optionally, after step S1 or step S2, the retaining wall structure 120 is further cut. In this embodiment, the support member 121 is cut to reduce its width. This arrangement, by cutting the support member 121 before attaching the glass cover plate 140, avoids the impact of cutting stress on the glass cover plate 140, preventing cracks from forming due to cutting stress. Secondly, cutting the support member 121 increases the distance between adjacent support members 121, providing more space for the subsequent formation of the protective layer 150. The protective layer 150 can be thicker, providing better protection and cushioning for the sidewalls of the support member 121 and the glass cover plate 140. It also increases the contact area between the protective layer 150 and the substrate 110, improving the bonding strength between the protective layer 150 and both the substrate 110 and the support member 121.

[0063] In step S3, a glass cover plate 140 is attached to the retaining wall structure 120, and the glass cover plate 140 covers the electronic component 130. Optionally, adhesive is applied to the support member 121 to form a second adhesive 141, and the glass cover plate 140 is attached to the support member 121. The second adhesive 141 is baked to cure, ensuring a reliable connection between the glass cover plate 140 and the support member 121. In this embodiment, there is a first distance W1 between the edge of the glass cover plate 140 and the edge of the retaining wall structure 120 away from the electronic component 130. In other words, the overlap width between the glass cover plate 140 and the support member 121 is less than the width of the support member 121, causing the support member 121 to extend beyond the edge of the glass cover plate 140 by the first distance. This design provides sufficient space for the formation of the protective layer 150, making the formation process of the protective layer 150 more convenient. For example, when forming the protective layer 150 using the dispensing process, the dispensing space is larger, and the dispensing efficiency is higher, which is conducive to forming a wider protective layer 150. That is, the protective layer 150 protects the sidewall of the glass cover plate 140 with greater thickness, resulting in better protective performance and a better cushioning effect. In addition, the setting of the first distance W1 can improve the bonding between the protective layer 150 and the glass cover plate 140 and the support member 121, making the structure more stable and reliable. Furthermore, after setting the first distance, the edge of the glass cover plate 140 is farther from the cutting track, which can reduce the impact of cutting stress on the glass cover plate 140 and reduce the risk of microcracks in the glass cover plate 140.

[0064] In step S4, a protective layer 150 can be formed on the edge of the glass cover plate 140 by dispensing adhesive. The protective layer 150 is used to protect the sidewalls of the glass cover plate 140, acting as a buffer to prevent microcracks in the glass cover plate 140 caused by traditional cutting processes. The width of the protective layer 150 covers the first distance. If the width of the protective layer 150 is greater than or equal to the first distance, it can better protect the sidewalls of the glass cover plate 140.

[0065] In step S5, the width of the first cut is less than or equal to the distance between the two support members 121, and only the protective layer 150 between two adjacent support members 121 is cut. This reduces the impact of cutting stress on the glass cover 140 and the support members 121, preventing loosening of the glass cover 140 and the support members 121, and preventing problems such as microcracks in the glass cover 140. It can be understood that after the first cut, removing part of the protective layer 150 creates a cutting groove between the two support members 121, releasing some of the cutting stress. Furthermore, the first cut only cuts the protective layer 150, without reaching the substrate 110, further reducing cutting stress. Optionally, the depth of the first cut is greater than the thickness of the glass cover 140, but less than or equal to the sum of the thicknesses of the support members 121 and the glass cover 140. That is, the maximum cutting depth reaches the surface of the substrate 110 on the side where the support members 121 are located, thus reducing the tensile stress generated during the cutting process.

[0066] Please combine Figure 6 Optionally, in some embodiments, the width of the first cut can be greater than the distance between the two supports 121. In this case, the supports 121 will be cut, and the protective layer 150 between the two supports 121 will be removed. It should be noted that in the encapsulation structure obtained in this embodiment, the sidewalls of the supports 121 do not have the protective layer 150. The protective layer 150 is located on top of the supports 121 and protects the sidewalls of the glass cover 140.

[0067] In step S6, a second cut is performed. Optionally, the substrate 110 is cut to form a single product. Optionally, the width of the second cut is equal to the width of the first cut, that is, cutting continues along the first cut, with the cutter penetrating the substrate 110. This two-cutting process results in a relatively small cutting depth each time, leading to high cutting efficiency and reduced wear on the cutting tool. Furthermore, this generates less cutting stress, minimizing the impact on the glass cover 140 and the support member 121. In this embodiment, the second cut only cuts the substrate 110, further minimizing the impact on the glass cover 140 and preventing microcracks in the glass cover 140.

[0068] Of course, in some other embodiments, the width of the second cutting groove can be greater than the width of the first cutting groove. That is, the second cut not only cuts the substrate 110, but also the protective layer 150, and may even cut the support member 121. Since a cutting groove has been formed after the first cut, the cutting groove can effectively release the stress generated by the second cut, reduce the impact of the second cut on the glass cover 140 and the protective layer 150, and prevent the glass cover 140 from developing microcracks.

[0069] Optionally, before or after the first cut, solder balls 160 may be formed by attaching them to the side of the substrate 110 away from the electronic component 130. In this embodiment, solder balls are attached to the substrate 110 after the protective layer 150 is formed.

[0070] It should be noted that the top of the protective layer 150, i.e., the side furthest from the substrate 110, can be designed as a guide structure 151 with an inclined angle or a rounded transition, similar to a right angle, rounded corner, or inclined slope. This design facilitates the expulsion of moisture from the surface of the glass cover 140, preventing ghosting and double images during image sensor operation and improving packaging quality.

[0071] Optionally, the second sensor packaging structure 100 provided in this embodiment can also adopt the following packaging method:

[0072] Please combine Figures 7 to 8 In step S1, a substrate 110 is first provided, and the barrier structure 120 is a molding compound 123 formed by molding or coating on the substrate 110. The substrate 110 and the molding compound 123 are made of the same material, including but not limited to polyester or polyimide, PET or other resin sheets or epoxy resin or other polymers.

[0073] Optionally, a molding process, such as pressure injection molding, can be used to mold the liquid encapsulant 123 onto the substrate 110 to form a barrier structure 120.

[0074] Optionally, cutting the molding compound 123 reduces its width, increases the distance between two adjacent retaining wall structures 120, and reduces the impact of subsequent cutting stress on the retaining wall structure 120 and the glass cover plate 140. It should also be noted that cutting the retaining wall structure 120 before forming the protective layer 150 can utilize the burrs or surface generated after cutting to improve the bonding force between the protective layer 150 and the retaining wall structure 120. In this embodiment, the cutting width when cutting the molding compound 123 is W3; that is, the width of two adjacent retaining wall structures 120 after cutting is W3.

[0075] Steps S2 and S3 are the same as in the previous implementation, and will not be repeated here.

[0076] In step S4, a protective layer 150 is formed on the substrate 110 using a vacuum coating method. The protective layer 150 protects the sidewalls of the glass cover 140 and fills the gaps between adjacent retaining wall structures 120. The coating height is flush with the side of the glass cover 140 away from the substrate 110, and the coating width covers a first distance. After coating, solder balls 160 are formed on the side of the substrate 110 away from the coating. The solder ball 160 material can be Sn-Ag alloy or Sn-Ni-Ag alloy, etc.

[0077] Optionally, the coating mold is provided with protrusions, which, after coating, can form coating grooves 125 between adjacent retaining wall structures 120. The coating grooves 125 can release thermal stress and cutting stress during subsequent cutting, acting as a buffer to reduce the impact of the tensile stress of the cutting tool on the glass cover 140 and retaining wall structure 120, preventing structural loosening and reduced reliability of the glass cover 140 and retaining wall structure 120; and reducing the risk of cracks in the glass cover 140. Optionally, the coating material can be at least one or more of epoxy resin, silica, and polyethylene film.

[0078] In the coating process, a mold of a specific shape can be used to form an arc or tilted structure on the top of the encapsulated body 123 on the side wall of the formed protective glass cover 140, so that water vapor on the surface of the glass cover 140 can be discharged, thereby improving the encapsulation quality.

[0079] It is easy to understand that the coating groove 125 can position the cutting path, prevent cutting deviation, and reduce the risk of damage to the glass cover plate 140. During the first cut, the cut can be made along the groove wall of the coating groove 125, meaning the width of the first cutting path is equal to the width of the coating groove 125. This also allows the coating groove 125 to reduce the cutting depth of the first cut, lower cutting stress, slow down the wear of the cutting tool, and improve cutting efficiency. In this embodiment, the first cut is made along the coating groove 125 to the surface of the substrate 110. Of course, in other embodiments, the width of the first cutting path can be flexibly designed, and can be greater than or less than the width of the coating groove 125; this is not specifically limited here. Optionally, the width W4 of the first cutting path is less than or equal to W3.

[0080] The second cut involves cutting the substrate 110 to separate it into individual products. The width of the second cut needs to be greater than the width of the coating groove 125 to remove the coating groove 125. During the second cut, it is possible to cut only the substrate 110, or to cut the protective layer 150 and the substrate 110, or to cut the molding compound 123 and the substrate 110; no specific limitation is made here.

[0081] It should be noted that the cutting of the retaining wall structure 120 can be completed before the step of attaching the glass cover plate 140, or after the protective layer 150 is formed, or the retaining wall structure 120 can be cut in the two processes mentioned above. No specific limitation is made here.

[0082] Please combine Figure 9 Optionally, in some embodiments, a molding compound 123 may be first injection molded onto the substrate 110, serving as a retaining wall structure 120. The molding compound 123 is then cut to a width of W3. A glass cover plate 140 is then attached, followed by the formation of a protective layer 150 using adhesive dispensing. Solder balls 160 are then formed on the substrate 110. Finally, the product is cut and separated to form individual units.

[0083] Optionally, the sidewalls of the glass cover 140 have chamfers 142, which facilitates the formation of a protective layer 150 with a guide structure 151 on top after adhesive dispensing. This allows moisture to escape from the surface of the glass cover 140, preventing ghosting or double images. Furthermore, the chamfered edges on the glass cover 140 reduce the risk of cracking during processes such as mounting, dispensing, or vacuum lamination, thus improving encapsulation quality.

[0084] Please combine Figure 10 After the glass cover plate 140 is attached, a protective layer 150 is formed by vacuum lamination. During the lamination process, the height of the protective layer 150 can be higher than the surface of the glass cover plate 140, meaning the protective layer 150 covers the sidewalls and top of the glass cover plate 140. Optionally, the protective layer 150 covers the sidewalls of the retaining wall structure 120. The lamination on the upper surface of the glass cover plate 140 can be removed subsequently by methods such as adhesive removal or etching to expose the upper surface of the glass cover plate 140. In the cut individual products, the protective layer 150 covers the sidewalls of the glass cover plate 140 and the edge portions of the upper surface of the glass cover plate 140.

[0085] In summary, the sensor packaging structure 100 provided by this utility model embodiment has the following beneficial effects:

[0086] The retaining wall structure 120 extends beyond the edge of the glass cover plate 140 by a first distance, increasing the thickness of the protective layer 150 and effectively protecting the glass cover plate 140. Furthermore, multiple cuts are employed to reduce the impact of cutting stress on the glass cover plate 140 and the retaining wall structure 120, thus improving the packaging quality. Secondly, the top of the protective layer 150 is designed with a sloped or curved guide surface to facilitate the expulsion of moisture from the surface of the glass cover plate 140, thereby improving the performance of the sensor chip.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A sensor package structure, characterized by, include: A substrate with a retaining wall structure; An electronic component, which is electrically connected to the substrate, and the barrier structure is located on the outer periphery of the electronic component; A glass cover plate is disposed on the side of the barrier structure away from the substrate; there is a first distance between the edge of the glass cover plate and the edge of the barrier structure away from the electronic component; the first distance is greater than 100 micrometers; A protective layer; the height of the protective layer is not lower than the surface of the glass cover away from the substrate.

2. The sensor package structure of claim 1, wherein, The thickness of the protective layer covering the sidewall of the glass cover is greater than or equal to the first distance.

3. The sensor package structure of claim 1, wherein, The retaining wall structure includes a support member, which is bonded to the substrate using a first adhesive.

4. The sensor package structure of claim 1, wherein, The retaining wall structure includes a molding compound, which is injection molded onto the substrate.

5. The sensor package structure of claim 1, wherein, The retaining wall structure and the substrate are integrally formed.

6. The sensor package structure of claim 1, wherein, The first distance is greater than the width of the overlap between the glass cover and the retaining wall structure.

7. The sensor package structure of claim 1, wherein, The protective layer is flush with the sidewall of the retaining wall structure.

8. The sensor package structure of claim 1, wherein, The protective layer covers the sidewalls of the retaining wall structure.

9. The sensor package structure of claim 8, wherein, The thickness of the protective layer covering the sidewall of the retaining wall structure is 100 micrometers to 150 micrometers.

10. The sensor package structure according to any one of claims 1 to 9, characterized in that, The protective layer has a guide structure on the side away from the substrate.

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