Sensor package structure

Abstract

This application provides a sensor packaging structure, relating to the field of semiconductor packaging technology. The sensor packaging structure includes a substrate, a chip, a first colloid, a light-transmitting cover plate, a second colloid, and a third colloid. The chip is disposed on the substrate and electrically connected to it. A sensing area is provided on the side of the chip away from the substrate. The first colloid is disposed on the side of the chip away from the substrate and is located around the sensing area. The light-transmitting cover plate is disposed at the end of the first colloid away from the chip and covers the sensing area. The second colloid is disposed on the side of the substrate where the chip is located and surrounds the outer periphery of the chip; the second colloid has an exhaust port. The third colloid fills the space between the first and second colloids. By providing an exhaust port, it facilitates the emission of gases and volatiles during colloid curing, preventing residual gases or volatiles from contaminating the light-transmitting cover plate, thereby improving the image quality of the sensor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a sensor packaging structure. Background Technology

[0002] In existing sensor packaging structures, after the glass cover is attached, adhesive is applied again to form a surrounding area. During the subsequent baking process, the adhesive contains gas and volatile residues. These gas and volatile residues are difficult to expel from the cavity, resulting in voids in the adhesive and volatiles accumulating on the top of the glass cover, which contaminate the sensing area of ​​the chip, reduce the chip's performance, and affect the sensor's image quality. Utility Model Content

[0003] The purpose of this invention is to provide a sensor packaging structure that facilitates the discharge of gases and volatiles from the colloid, avoids contamination of the chip's sensing area by volatiles, and improves the quality of the packaging structure.

[0004] This utility model provides a sensor packaging structure, including: substrate; A chip is disposed on the substrate and electrically connected to the substrate; a sensing area is provided on the side of the chip away from the substrate; The first colloid is disposed on the side of the chip away from the substrate and located on the periphery of the sensing area; A light-transmitting cover plate is disposed at the end of the first colloid away from the chip and covers the sensing area; The second colloid is disposed on the side of the substrate on which the chip is disposed, and is arranged around the outer periphery of the chip; the second colloid is provided with an exhaust port; A third colloid; the third colloid is filled between the first colloid and the second colloid.

[0005] In an optional embodiment, the second colloid is below or flush with the light-transmitting cover plate.

[0006] In an optional embodiment, the chip and the substrate are wire bonded; the wire is located between the first colloid and the second colloid, and the third colloid covers the wire.

[0007] In an optional embodiment, the vent is located on the side of the second colloid opposite to the lead wire.

[0008] In an optional embodiment, the leads are located on opposite sides of the chip; the second colloid has two opposite sides near the leads, and at least one of the two sides is provided with the vent.

[0009] In an optional embodiment, one or more of the exhaust ports are provided on the side opposite to the lead wire.

[0010] In an optional embodiment, the third colloid is below or flush with the light-transmitting cover to expose the light-transmitting cover.

[0011] In an optional embodiment, the first colloid is a non-conductive colloid; the third colloid is a non-conductive colloid.

[0012] In an optional embodiment, the non-conductive colloid includes at least one of epoxy resin, silicone resin, and polyimide resin.

[0013] In an optional embodiment, the sidewall of the light-transmitting cover is provided with a groove, and the third colloid fills the groove.

[0014] In an optional embodiment, solder balls are provided on the side of the substrate away from the chip.

[0015] The sensor packaging structure provided in this embodiment of the utility model has the following advantages: The sensor packaging structure provided in this embodiment employs multiple dispensings of a first colloid, a second colloid, and a third colloid, which facilitates the release of gases and volatiles within the colloids. By forming an exhaust port in the second colloid, it facilitates the discharge of gases and volatiles during baking and curing, preventing voids in the colloid and contamination of the chip's sensing area by volatiles, thereby improving the chip's performance and the sensor's image quality. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 A schematic diagram of the sensor packaging structure provided in an embodiment of this utility model; Figure 2 A schematic diagram of the exhaust port of the sensor packaging structure provided in this embodiment of the utility model; Figure 3 This is another schematic diagram of the sensor packaging structure provided in the embodiment of the present utility model; Figure 4 for Figure 3 A magnified view of a portion of point A in the middle; Figure 5This is one of the process diagrams of the sensor packaging structure provided in the embodiments of this utility model; Figure 6 This is the second schematic diagram of the manufacturing process of the sensor packaging structure provided in this embodiment of the present utility model.

[0018] Icons: 100 - Sensor packaging structure; 110 - Substrate; 120 - Chip; 121 - Sensing area; 123 - Lead wire; 130 - First colloid; 140 - Light-transmitting cover plate; 141 - Groove; 150 - Second colloid; 151 - Exhaust port; 160 - Third colloid; 170 - Solder ball. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] Please combine Figure 1 and Figure 2 This utility model provides a sensor packaging structure 100, including a substrate 110, a chip 120, a first colloid 130, a light-transmitting cover plate 140, a second colloid 150, and a third colloid 160. The chip 120 is disposed on the substrate 110 and electrically connected to it. A sensing area 121 is provided on the side of the chip 120 away from the substrate 110. The first colloid 130 is disposed on the side of the chip 120 away from the substrate 110 and is located around the sensing area 121. The light-transmitting cover plate 140 is disposed at the end of the first colloid 130 away from the chip 120 and covers the sensing area 121. The second colloid 150 is disposed on the side of the substrate 110 where the chip 120 is located and surrounds the outer periphery of the chip 120; the second colloid 150 has an exhaust port 151. The third colloid 160 fills the space between the first colloid 130 and the second colloid 150. Applying the first colloid 130, the second colloid 150, and the third colloid 160 in multiple applications facilitates the release of gases and volatiles within the colloids. By forming an exhaust port 151 in the second colloid 150, it facilitates the removal of gases and volatiles during baking and curing, preventing voids in the colloid and contamination of the sensing area 121 of the chip 120 by volatiles, thereby improving the working performance of the chip 120 and the image quality of the sensor.

[0027] Optionally, the second colloid 150 is lower than or flush with the light-transmitting cover plate 140 to ensure that the light-transmitting cover plate 140 is not contaminated by the colloid. Optionally, the third colloid 160 is lower than or flush with the light-transmitting cover plate 140 to expose the light-transmitting cover plate 140. This ensures that the light-transmitting cover plate 140 is not contaminated by the colloid, improves light transmission quality, and prevents blemishes or ghosting in the image sensor image. In this embodiment, the light-transmitting cover plate 140 can be a glass plate or other transparent plate, and no specific limitation is made here.

[0028] Optionally, the chip 120 and the substrate 110 are bonded using wires 123. In this embodiment, the chip 120 is a front-mounted chip 120, and the chip 120 is an image sensor chip 120. The wires 123 enable electrical connection between the substrate 110 and the chip 120. One end of the wire 123 is soldered to the chip 120, and the other end is soldered to the substrate 110. The wire 123 is located between the first colloid 130 and the second colloid 150, and the third colloid 160 covers the wire 123, providing protection for the wire 123 and the soldered structure.

[0029] Optionally, the vent 151 is located on the side of the second colloid 150 opposite to the lead 123. The vent 151 is used to expel gases and volatiles from the colloid during baking and curing. It is easy to understand that if gases are difficult to expel during the baking and curing process, voids may appear in the colloid layer, easily causing cracking or delamination. If volatiles are difficult to expel during the baking and curing process, they may accumulate on the top of the glass cover or contaminate the sensing area 121 of the chip 120, resulting in poor image quality or chip 120 failure. In this embodiment, by providing the vent 151, it is beneficial for gases and volatiles in the colloid to be expelled, thereby effectively solving the above problems.

[0030] Optionally, the leads 123 are located on opposite sides of the chip 120. The second colloid 150 has two opposite sides near the leads 123, and at least one of the two sides is provided with an exhaust port 151. In other words, in this embodiment, the exhaust port 151 and the leads 123 are located on the same side of the chip 120. This arrangement is beneficial for utilizing the capillary action of the leads 123 to improve the fluidity of the colloid, allowing for better air expulsion from the area enclosed by the second colloid 150, and also allows the leads 123 to help the third colloid 160 fill the exhaust port 151, thereby improving the sealing performance of the structure.

[0031] Optionally, one or more vents 151 are provided on the side of the second colloid 150 opposite to the lead 123. The number of vents 151 can be flexibly set according to actual needs. The shape of the vents 151 is not limited to triangle, rectangle, pentagon, hexagon, octagon, circle, ellipse, semicircle or other arbitrary shapes. In this embodiment, the position of the vents 151 on the second colloid 150 is located within the projection area of ​​the chip 120 on the second colloid 150. In this way, the positions of the vents 151 and the lead 123 are closer, which is beneficial to exerting the capillary effect of the lead 123.

[0032] Optionally, the first colloid 130 is a non-conductive colloid; the third colloid 160 is a non-conductive colloid. The non-conductive colloid includes at least one of epoxy resin, silicone resin, and polyimide resin.

[0033] Optionally, solder balls 170 are provided on the side of the substrate 110 away from the chip 120. The solder balls 170 can be used to solder the substrate 110 to a circuit board or other circuit module.

[0034] Please combine Figure 3 and Figure 4 Optionally, the sidewall of the light-transmitting cover 140 is provided with a groove 141, and the third colloid 160 fills the groove 141, which helps to improve the bonding force between the light-transmitting cover 140 and the third colloid 160, making the sidewall bonding more reliable. If the cross-section of the light-transmitting cover 140 is quadrilateral, that is, the light-transmitting cover 140 has four sidewalls, any one or more of these sidewalls are provided with a groove 141. In this embodiment, to improve the bonding force, each of the four sidewalls of the light-transmitting cover 140 is provided with a groove 141.

[0035] Please combine Figure 5 and Figure 6 The sensor packaging structure 100 provided in this embodiment of the present invention has the following packaging method: (1) Take a substrate 110 and mount a chip 120 and other components on the substrate 110. Optionally, the chip 120 is a standard chip 120, such as an image sensor chip 120. A wire bonding process is used to form a lead 123 between the chip 120 and the substrate 110. The lead 123 realizes the electrical connection between the substrate 110 and the chip 120.

[0036] (2) Using a dispensing process, adhesive is dispensed outside the sensing area 121 of the chip 120 to form a first adhesive 130. The first adhesive 130 is a fence structure surrounding the sensing area 121.

[0037] (3) The light-transmitting cover plate 140, such as glass, is attached to the first colloid 130. The first colloid 130 is cured by baking process to fix the light-transmitting glass. Optionally, the first colloid 130 is a non-conductive colloid, and its material can be any one or more of epoxy resin, silicone resin and polyimide resin.

[0038] (4) Apply adhesive to the substrate 110 surrounding the chip 120 using a dispensing process to form a second adhesive 150. The second adhesive 150 has a notch, i.e., an exhaust port 151. The second adhesive 150 is cured by baking.

[0039] A third adhesive 160 is then filled between the first adhesive 130 and the second adhesive 150 using a dispensing process. The third adhesive 160 is a non-conductive adhesive that covers the lead structure 123 of the chip 120, protecting both the chip 120 and the lead structure 123. After filling with the third adhesive 160, the light-transmitting cover plate 140 needs to be exposed. The second adhesive 150 and the third adhesive 160 are then baked and cured.

[0040] Optionally, the second colloid 150 can be formed by dispensing adhesive and then baked and cured. Then, the third colloid 160 can be formed by dispensing adhesive and then baked and cured. Alternatively, the second colloid 150 and the third colloid 160 can be formed by dispensing adhesive and then baked and cured. No specific limitation is made here.

[0041] It should be noted that when the second colloid 150 is applied, the application height of the second colloid 150 is higher than the upper surface of the light-transmitting cover plate 140. When the second colloid 150 cures and shrinks, its height will decrease, and the cured second colloid 150 will be lower than or flush with the upper surface of the light-transmitting cover plate 140.

[0042] (5) Solder balls 170 are formed on the back side of the substrate 110 using a ball-planting process. The material of the solder balls 170 can be tin silver, tin nickel silver, etc.

[0043] (6) Perform the cutting process to form individual products. Cut along the second colloid 150 during cutting.

[0044] In this embodiment, after the first colloid 130 is applied, it is baked to pre-form. After the second colloid 150 is applied, it is baked to cure, thereby achieving complete curing of the first colloid 130 and the second colloid 150. In this way, the gas and volatiles during the complete curing process can be discharged through the exhaust port 151, preventing residual volatiles from contaminating the sensing area 121 of the chip 120.

[0045] The sensor packaging structure 100 provided in this embodiment of the utility model has the following beneficial effects: The sensor encapsulation structure 100 provided in this embodiment of the present invention has an exhaust port 151 provided in the second colloid 150, which is conducive to the discharge of gas and volatiles in the first colloid 130, thereby avoiding voids, cracks or delamination in the first colloid 130, and also effectively preventing residual volatiles after baking of the first colloid 130 from contaminating the sensing area 121 of the chip 120, thereby improving the quality and working performance of the image sensor.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A sensor packaging structure, characterized in that, include: substrate; A chip is disposed on the substrate and electrically connected to the substrate; a sensing area is provided on the side of the chip away from the substrate; First colloid; The first colloid is disposed on the side of the chip away from the substrate and is located on the periphery of the sensing area; A light-transmitting cover plate is disposed at the end of the first colloid away from the chip and covers the sensing area; The second colloid is disposed on the side of the substrate on which the chip is disposed, and is arranged around the outer periphery of the chip; the second colloid is provided with an exhaust port; A third colloid; the third colloid is filled between the first colloid and the second colloid.

2. The sensor packaging structure according to claim 1, characterized in that, The second colloid is below or flush with the light-transmitting cover plate.

3. The sensor packaging structure according to claim 1, characterized in that, The chip and the substrate are wire bonded; the wire is located between the first colloid and the second colloid, and the third colloid covers the wire.

4. The sensor packaging structure according to claim 3, characterized in that, The vent is located on the side of the second colloid opposite to the lead wire.

5. The sensor packaging structure according to claim 3, characterized in that, The leads are located on opposite sides of the chip; the second colloid has two opposite sides near the leads, and at least one of the two sides is provided with the vent.

6. The sensor packaging structure according to claim 5, characterized in that, One or more exhaust ports are provided on the side opposite to the lead wire.

7. The sensor packaging structure according to claim 1, characterized in that, The third colloid is below or flush with the light-transmitting cover plate to expose the light-transmitting cover plate.

8. The sensor packaging structure according to claim 1, characterized in that, The first colloid is a non-conductive colloid; the third colloid is a non-conductive colloid.

9. The sensor packaging structure according to claim 1, characterized in that, The side wall of the light-transmitting cover is provided with a groove, and the third colloid fills the groove.

10. The sensor packaging structure according to any one of claims 1 to 9, characterized in that, The substrate has solder balls on the side away from the chip.

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