Display device and electronic device including the same

Abstract

The utility model relates to display device and electronic device including this display device. Display device includes: display panel, including non -bonding area, this non -bonding area forms at the end portion part of display panel and defines the first side part and the second side part of end portion part of display panel, first substrate has the notch formed in it to correspond to non -bonding area to and including for driving display panel drive element, and second substrate is connected with the second end portion part of first substrate, wherein, display panel includes the first 1 test pad at the first side part of display panel, first 1 connection pad is bonded with first 1 test pad, second 1 connection pad is connected with first 1 connection pad through first line, second substrate includes the second 1 test pad bonded with second 1 connection pad and the first test point connected with second 1 test pad, and the portion of first line overlaps with drive element.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0112862, filed on August 22, 2024, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] Various embodiments of this disclosure relate to display devices and electronic devices including such display devices. Background Technology

[0004] With the development of information-based society, various demands have emerged for display devices capable of displaying images. As a result, various types of display devices have been developed, such as liquid crystal displays (LCDs), plasma display panels (PDPs), and organic light-emitting diode displays (OLEDs).

[0005] Typically, a display device may include a display panel and driving elements (e.g., a display driver integrated circuit (DDI)) for controlling the driving of the display panel. The driving elements may be mounted on a chip-on-film (COF), which may be bonded (e.g., compression bonded) to an end portion of the display panel. The COF may be bonded to the display panel using an adhesive resin (e.g., an anisotropic conductive film (ACF)). Specifically, an adhesive resin containing a plurality of conductive particles may be applied to an end portion of the display panel, and the COF may be positioned on the end portion of the display panel to which the adhesive resin has been applied. The COF and the display panel may be compressed together, and the display panel and the COF may be electrically connected via the conductive particles contained in the adhesive resin.

[0006] The bonding resistance between the display panel and the chip on film can affect the performance of the display device. Bonding resistance can be understood as the resistance encountered at the junction where different conductive materials are joined together, which can affect the effectiveness of grounding and bonding systems. For example, if the bonding resistance increases to a reference value or higher, the performance of the display device may be negatively affected. Therefore, a display device may include test pads and test points (TPs) for measuring the bonding resistance at the end portion (hereinafter referred to as the "bonding portion") where the display device and the chip on film are bonded. Utility Model Content

[0007] According to various embodiments of the present disclosure, a display device and an electronic device including the display device are provided that can inspect and / or monitor the bonding quality between a chip on film with a notch structure and a display panel.

[0008] Furthermore, according to another aspect of various embodiments of this disclosure, a display device having improved reliability for a display device and an electronic device including the display device are provided.

[0009] Furthermore, according to another aspect of various embodiments of this disclosure, a display device and an electronic device including the display device are provided that can improve (or enhance) the manufacturing efficiency of the display device.

[0010] The problems addressed in this disclosure are not limited to the technical problems described herein, and those skilled in the art will clearly understand from the following description other technical problems not described.

[0011] According to embodiments of the present disclosure, a display device may include: a display panel including a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel; a first substrate having a first end portion connected to the end portion of the display panel and a notch formed therein corresponding to the non-bonding region, and including a driving element configured to control the driving of the display panel; and a second substrate connected to a second end portion of the first substrate. The display panel may include a first-1 test pad disposed at the first side portion of the display panel and a first-2 test pad disposed at the second side portion of the display panel. The first substrate may include a first-1 connection pad coupled to the first-1 test pad, a first-2 connection pad coupled to the first-2 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, and a second-2 connection pad connected to the first-2 connection pad via a second line. The second substrate may include a second-1 test pad coupled to a second-1 connection pad, a second-2 test pad coupled to a second-2 connection pad, a first test point connected to the second-1 test pad, and a second test point connected to the second-2 test pad. A portion of the first line and a portion of the second line may overlap with the driving element.

[0012] According to an embodiment, the non-bonding area may include: an area that receives at least one component mounted on an external device on which the display panel is mounted; or an area with a display panel notch through which at least one component mounted on the external device passes.

[0013] According to an embodiment, the display panel may further include a first-3 test pad disposed on a first side portion of the display panel and a first-4 test pad disposed on a second side portion of the display panel, wherein the first side portion and the second side portion are separated by a non-bonding area. The first substrate may further include a first-3 connection pad bonded to the first-3 test pad, a first-4 connection pad bonded to the first-4 test pad, a second-3 connection pad connected to the first-3 connection pad via a third line, and a second-4 connection pad connected to the first-4 connection pad via a fourth line. The second substrate may further include a second-3 test pad bonded to the second-3 connection pad, a second-4 test pad bonded to the second-4 connection pad, a third test point connected to the second-3 test pad, and a fourth test point connected to the second-4 test pad.

[0014] According to the implementation, the first-1 test pad, the first-2 test pad, the first-3 test pad, the first-4 test pad, the first-1 connection pad, the first-2 connection pad, the first-3 connection pad, and the first-4 connection pad may each include four pads. The second-1 connection pad, the second-2 connection pad, the second-3 connection pad, the second-4 connection pad, the second-1 test pad, the second-2 test pad, the second-3 test pad, and the second-4 test pad may each include five pads. The first test point, the second test point, the third test point, and the fourth test point may each include six points.

[0015] According to an embodiment, at least one of the display panel and the first substrate may include at least one first alignment mark. At least one of the first substrate and the second substrate may include at least one second alignment mark.

[0016] According to the embodiments, the display panel and the first substrate can be bonded together using a film-on-glass (FOG) or film-on-board (FOB) method. The driving element can be bonded to the first substrate using a chip-on-film (COF) method. The first substrate and the second substrate can be bonded together using a film-on-film (FOF) method.

[0017] According to an embodiment, the first substrate can be formed as a single layer. The second substrate can be formed as a flexible printed circuit board.

[0018] According to the embodiment, portions of the first wire and the second wire can pass through the lower portion of the driving element.

[0019] According to an embodiment, the driving element may include a first-1 driving pad portion, a first-2 driving pad portion electrically connected to the first-1 driving pad portion, a second-1 driving pad portion, and a second-2 driving pad portion electrically connected to the second-1 driving pad portion. A first line may include a first-1 line connecting the first-1 connecting pad to the first-1 driving pad portion and a first-2 line connecting the first-2 driving pad portion to the second-1 connecting pad. A second line may include a second-1 line connecting the first-2 connecting pad to the second-1 driving pad portion and a second-2 line connecting the second-2 driving pad portion to the second-2 connecting pad.

[0020] According to an embodiment, the second substrate may further include a fifth test point and a sixth test point, the fifth test point and the sixth test point being configured to measure the overall bonding resistance including a first bonding resistance between the display panel and the first substrate and a second bonding resistance between the first substrate and the second substrate.

[0021] According to embodiments of this disclosure, an electronic device may include: a housing; and a display device mounted in the housing. The display device may include: a display panel including a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel; a first substrate having a first end portion connected to the end portion of the display panel and a notch formed therein corresponding to the non-bonding region, and including a driving element configured to control the driving of the display panel; and a second substrate connected to a second end portion of the first substrate. The display panel may include a first-1 test pad disposed at the first side portion of the display panel and a first-2 test pad disposed at the second side portion of the display panel. The first substrate may include a first-1 connection pad coupled to the first-1 test pad, a first-2 connection pad coupled to the first-2 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, and a second-2 connection pad connected to the first-2 connection pad via a second line. The second substrate may include a second-1 test pad coupled to a second-1 connection pad, a second-2 test pad coupled to a second-2 connection pad, a first test point connected to the second-1 test pad, and a second test point connected to the second-2 test pad. A portion of the first line and a portion of the second line may overlap with the driving element.

[0022] According to embodiments of the present disclosure, a display device may include: a display panel including a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel; a first substrate having a first end portion connected to the end portion of the display panel and a notch formed therein corresponding to the non-bonding region, and including a driving element configured to control the driving of the display panel; and a second substrate connected to a second end portion of the first substrate. The display panel may include a first-1 test pad and a first-3 test pad disposed at the first side portion of the display panel. The first substrate may further include a first-1 connection pad coupled to the first-1 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, a first-3 connection pad coupled to the first-3 test pad, and a second-3 connection pad connected to the first-3 connection pad via a third line. The second substrate may further include a second-1 test pad coupled to the second-1 connection pad, a first test point connected to the second-1 test pad, a second-3 test pad coupled to the second-3 connection pad, and a third test point connected to the second-3 test pad. The first line portion can overlap with the driving element.

[0023] According to an embodiment, the display panel may further include a first-2 test pad and a first-4 test pad disposed on a second side portion of the display panel. The first substrate may further include a first-2 connection pad coupled to the first-2 test pad, a second-2 connection pad connected to the first-2 connection pad via a second line, a first-4 connection pad coupled to the first-4 test pad, and a second-4 connection pad connected to the first-4 connection pad via a fourth line. The second substrate may further include a second-2 test pad coupled to the second-2 connection pad, a second test point connected to the second-2 test pad, a second-4 test pad coupled to the second-4 connection pad, and a fourth test point connected to the second-4 test pad. A portion of the second line may overlap with a driving element. Attached Figure Description

[0024] The above and other objects, features and advantages of this disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0025] Figure 1 This is a view showing a display device according to an embodiment of the present disclosure;

[0026] Figure 2A It is along Figure 1 A sectional view taken by line A-A';

[0027] Figure 2B This is a view showing in detail a portion of the display panel in the configuration of a display device according to an embodiment of the present disclosure;

[0028] Figure 2C This is a view showing in detail the configuration of the first substrate in a display device according to an embodiment of the present disclosure;

[0029] Figure 2D This is a view showing in detail a portion of a second substrate in the configuration of a display device according to an embodiment of the present disclosure;

[0030] Figure 2E This is a view showing an example of the combination of a display panel, a first substrate, and a second substrate in a display device according to an embodiment of the present disclosure;

[0031] Figure 3A This is a view showing a connection structure that connects the first-1 connection pad to the second-1 connection pad and the first-2 connection pad to the second-2 connection pad according to an embodiment of the present disclosure;

[0032] Figure 3B This is a view showing a connection structure that connects the first-1 connection pad to the second-1 connection pad and the first-2 connection pad to the second-2 connection pad according to an embodiment of the present disclosure;

[0033] Figure 4A This is a view illustrating an example of inspecting the bonding quality between the display panel and the first substrate according to an embodiment of the present disclosure;

[0034] Figure 4B This is a view illustrating an example of inspecting the bonding quality between a first substrate and a second substrate according to an embodiment of the present disclosure;

[0035] Figure 5A This is a view showing a display device according to another embodiment of the present disclosure;

[0036] Figure 5B This is a view showing a display device according to another embodiment of the present disclosure;

[0037] Figure 6 This is a view illustrating an electronic device according to an embodiment of the present disclosure;

[0038] Figure 7A Is when Figure 6 Electronic devices include Figure 1 The display device is a sectional view taken along line B-B'; and

[0039] Figure 7B Is when Figure 6 Electronic devices include Figure 5B The display device is a sectional view taken along line B-B'. Detailed Implementation

[0040] In the following description, various embodiments of the present disclosure will be described with reference to the accompanying drawings. Specific embodiments of the present disclosure will be illustrated in the drawings, and specific embodiments of the present disclosure will be described in the following detailed description associated with them, but this is not intended to limit the embodiments of the present disclosure to a particular form. For example, it will be apparent to those skilled in the art to which this disclosure pertains that various modifications can be made to the embodiments of the present disclosure.

[0041] Figure 1 This is a view showing a display device according to an embodiment of the present disclosure. Figure 2A It is along Figure 1 A sectional view taken by line A-A'. Figure 2B This is a view showing in detail a portion of the display panel in the configuration of a display device according to an embodiment of the present disclosure. Figure 2C This is a view showing in detail the configuration of the first substrate in a display device according to an embodiment of the present disclosure. Figure 2D This is a view showing in detail a portion of a second substrate in the configuration of a display device according to an embodiment of the present disclosure. Figure 2E This is a view showing an example of the combination of a display panel, a first substrate, and a second substrate in a display device according to an embodiment of the present disclosure. Figure 3A This is a view showing a connection structure that connects the first-1 connection pad to the second-1 connection pad and the first-2 connection pad to the second-2 connection pad according to an embodiment of the present disclosure. Figure 3B This is a view showing a connection structure that connects the first-1 connection pad to the second-1 connection pad and the first-2 connection pad to the second-2 connection pad according to an embodiment of the present disclosure.

[0042] According to embodiments of this disclosure, the bonding resistance can be measured at one or more test points. Test points can be selected based on the expected stress.

[0043] According to embodiments of this disclosure, the display panel may include a notch structure in the region where the chip-on-film is bonded. The chip-on-film bonded to the display panel with the notch structure may also have a notch structure. In a chip-on-film with a notch structure, significant bonding stress may occur at the end portions of the bonding area and around the notch (such as the side portions of a cut). According to embodiments of this disclosure, a method for inspecting and / or managing (e.g., monitoring) the bonding resistance around the notch is provided.

[0044] See Figure 1 , Figures 2A to 2B as well as Figures 3A to 3B The display device 1000 according to the embodiments of the present disclosure may include a display panel 100, a first substrate 200 and a second substrate 300.

[0045] Display panel 100 can output (e.g., display) various images (e.g., still images or moving images). Display panel 100 can be formed of various materials. For example, display panel 100 can be formed of inorganic materials (e.g., glass) and / or organic materials (such as metals, plastics, or resins). Display panel 100 can be formed of rigid or flexible materials. Display panel 100 can be formed as transparent or opaque.

[0046] See Figure 1 The display panel 100 may include a display area DA and a non-display area NDA.

[0047] The display area DA can display an image (e.g., a still image or a moving image). The display area DA can include a plurality of pixels P and a pixel driving element for driving each pixel P. Pixel P can be a unit for displaying an image and can be an organic light-emitting element. For example, pixel P can be the smallest unit for displaying an image and can be an organic light-emitting element. This is merely an example and is not necessarily limiting of this disclosure. For example, pixel P can be a liquid crystal display element or an electrophoretic display element. The pixel driving element can control the driving (e.g., emitting light) of each pixel P. The pixel driving element can include at least one thin-film transistor and at least one capacitor, but is not necessarily limited thereto.

[0048] A non-display area NDA can be formed around the display area DA, and pixels P may not be formed in the non-display area NDA. For example, the non-display area NDA can be formed on the lower, upper, left, and right sides of the display area DA. The non-display area NDA may include various lines (e.g., lines for supplying power to each pixel P and providing image signals, or lines for recognizing touch).

[0049] See Figure 2A and Figure 2B The display panel 100 may include a first notch 120 (e.g., a display panel notch) formed by removing a portion of the non-display area NDA. Various components on an external device coupled to the display device 1000 (e.g., a charging port or SIM card slot) may be positioned (or located) in this portion of the area. For example, components may pass through the display panel 100 through the first notch 120. The portion of the area where the first notch 120 is formed is not bonded to the first substrate 200 and may be referred to as a non-bonded area. Furthermore, the display panel 100 may include panel pad portions 110 formed in the non-display area NDA.

[0050] The panel pad portion 110 may include multiple pads for driving the display panel 100 and managing the bonding quality (e.g., bonding resistance) between the display panel 100 and the first substrate 200. For example, as Figure 2BAs shown, the panel pad portion 110 may include a first-1 test pad 111, a first-2 test pad 112, a first-3 test pad 113, and a first-4 test pad 114. The first-1 test pad 111 and the first-2 test pad 112 may be inner test pads, and the first-3 test pad 113 and the first-4 test pad 114 may be outer test pads.

[0051] like Figure 2B As shown, a non-bonding area, including a first notch 120, may be provided on the end portion of the display panel 100. The first notch 120 may be located at the center of the end portion of the display panel 100, but is not necessarily limited thereto. For example, the first notch 120 may be offset to one side of the end portion of the display panel 100.

[0052] First-1 test pad 111 and first-2 test pad 112 may be formed at a location adjacent to (e.g., within a specified distance) the first notch 120. For example, first-1 test pad 111 may be formed at a location adjacent to a first side portion (e.g., the left side) of the first notch 120, and first-2 test pad 112 may be formed at a location adjacent to a second side portion (e.g., the right side) of the first notch 120. For example, first-1 test pad 111 may be formed at a location adjacent to the first side portion (e.g., the left side) of the first notch 120, with no other pads disposed between first-1 test pad 111 and the first side portion of the first notch 120, and first-2 test pad 112 may be disposed at a location adjacent to the second side portion (e.g., the right side) of the first notch 120, with no other pads disposed between first-2 test pad 112 and the second side portion of the first notch 120.

[0053] Simultaneously, the first-3 test pad 113 and the first-4 test pad 114 can be formed at positions spaced apart from the first notch 120. The first-3 test pad 113 and the first-4 test pad 114 can be formed at positions spaced apart from the first notch 120 by a specified distance or further. For example, the first-3 test pad 113 can be formed (or positioned) on a first side portion (e.g., the left side) of the display panel 100, and the first-4 test pad 114 can be formed on a second side portion (e.g., the right side) of the display panel 100. The first side portion and the second side portion of the display panel 100 can be located at the end portions of the display panel 100 and can be separated by the non-bonding area of ​​the first notch 120.

[0054] The first substrate 200 can be connected to the display panel 100 and the second substrate 300. For example, the first substrate 200 may have a first end portion connected to the display panel 100 and a second end portion connected to the second substrate 300. Specifically, as Figure 2A As shown, the first-1 substrate pad portion 210 of the first substrate 200 and the panel pad portion 110 of the display panel 100 can be bonded (e.g., by compression bonding using an adhesive resin such as an anisotropic conductive film (ACF)), and the first-2 substrate pad portion 220 of the first substrate 200 and the second substrate pad portion 310 of the second substrate 300 can be bonded. Meanwhile, in Figure 2A The diagram shows that the display panel 100 and the second substrate 300 can be bonded to the same surface (e.g., the upper surface) of the first substrate 200, but the display panel 100 can be bonded to the upper surface (or lower surface) of the first substrate 200 and the second substrate 300 can be bonded to the lower surface (or upper surface) of the first substrate 200.

[0055] The first substrate 200 can be formed of a flexible material. For example, the first substrate 200 can be a film-type flexible printed circuit board (FPCB). The first substrate 200 can be bonded to the display panel 100 in a form of film on glass (FOG) or film on board (FOB). At the same time, the first substrate 200 can be bonded to the second substrate 300 in a form of film on film (FOF).

[0056] According to an embodiment, the first substrate 200 can be formed as a single layer. Furthermore, as... Figure 2C As shown, the first substrate 200 may have a second notch 230 formed therein to correspond to the first notch 120. In addition, the first substrate 200 may include a first-1 substrate pad portion 210, a first-2 substrate pad portion 220, and a driving element 250.

[0057] The driving element 250 can control the driving of the display panel 100. The driving element 250 can be controlled from an external device (e.g., Figure 6The motherboard (not shown) of the electronic device 60 shown receives various power and drive signals (e.g., initialization signals, scan signals, data signals, or compensation signals) for controlling the drive of the display panel 100, and supplies the received power and drive signals to the display panel 100. The driving element 250 may include a display driver integrated circuit (DDI). The driving element 250 may be coupled to the first substrate 200 in a chip-on-film (COF) manner. For example, the driving element 250 may be positioned at the central portion of the first substrate 200. For example, the driving element 250 may be positioned at the central portion of the first substrate 200 defined by at least one of the width or height of the first substrate 200. Here, the height of the first substrate 200 may be determined between the lower end of the second notch 230 and the second end portion of the first substrate 200 connected to the second substrate 300. According to an embodiment, the driving element 250 may be positioned on the first substrate 200 aligned with the second notch 230.

[0058] like Figure 2C As shown, the second notch 230 may be provided on the first end portion of the first substrate 200. The second notch 230 may be provided at the central portion of the end portion of the first substrate 200, but is not necessarily limited thereto. For example, the second notch 230 may be offset to one side of the end portion of the first substrate 200 to correspond to the position of the first notch 120.

[0059] The first substrate pad portion 210 may include multiple pads for driving the display panel 100 and managing the bonding quality (e.g., bonding resistance) between the display panel 100 and the first substrate 200. For example, as Figure 2C As shown, the first-1 substrate pad portion 210 may include a first-1 connection pad 211, a first-2 connection pad 212, a first-3 connection pad 213, and a first-4 connection pad 214. The first-1 connection pads 211 and 212 may be first inner connection pads, and the first-3 connection pads 213 and 214 may be first outer connection pads. The first-1 connection pads 211, 212, 313, and 414 may be coupled to the first-1 test pads 111, 112, 113, and 114, respectively. Here, the first-1 connection pad 211, the first-2 connection pad 212, the first-3 connection pad 213, the first-4 connection pad 214, the first-1 test pad 111, the first-2 test pad 112, the first-3 test pad 113, and the first-4 test pad 114 may each include four pads, but they are not necessarily limited to this.

[0060] The first-2 substrate pad portion 220 may include multiple pads for driving the display panel 100 and managing the bonding quality (e.g., bonding resistance) between the first substrate 200 and the second substrate 300. For example, as Figure 2C As shown, the first-2 substrate pad portion 220 may include a second-1 connection pad 221, a second-2 connection pad 222, a second-3 connection pad 223, and a second-4 connection pad 224. The second-1 connection pad 221 and the second-2 connection pad 222 may be second inner connection pads, and the second-3 connection pad 223 and the second-4 connection pad 224 may be second outer connection pads. Figure 2E As shown, the second-1 connection pad 221, the second-2 connection pad 222, the second-3 connection pad 223, and the second-4 connection pad 224 can be connected to the first-1 connection pad 211, the first-2 connection pad 212, the first-3 connection pad 213, and the first-4 connection pad 214 respectively via line portions 240. For example, the second-1 connection pad 221 can be connected to the first-1 connection pad 211 via the first line 241, the second-2 connection pad 222 can be connected to the first-2 connection pad 212 via the second line 242, the second-3 connection pad 223 can be connected to the first-3 connection pad 213 via the third line 243, and the second-4 connection pad 224 can be connected to the first-4 connection pad 214 via the fourth line 244.

[0061] According to the embodiment, portions of the first line 241 and the second line 242 may overlap with the driving element 250. For example, the first line 241 and the second line 242 may be connected to the driving element 250. Specifically, as... Figure 3A As shown, the first-1 connecting pad 211 can be connected to the first-1 driving pad portion 251-1 via the first-1 line 241-1, and the second-1 connecting pad 221 can be connected to the first-2 driving pad portion 251-2 via the first-2 line 241-2. In this case, the first-1 driving pad portion 251-1 and the first-2 driving pad portion 251-2 can be electrically connected inside the driving element 250. Similarly, the first-2 connecting pad 212 can be connected to the second-1 driving pad portion 252-1 via the second-1 line 242-1, and the second-2 connecting pad 222 can be connected to the second-2 driving pad portion 252-2 via the second-2 line 242-2. In this case, the second-1 driving pad portion 252-1 and the second-2 driving pad portion 252-2 can be electrically connected inside the driving element 250.

[0062] As another example, such as Figure 3BAs shown, the first line 241 and the second line 242 can pass through the lower portion of the driving element 250 and are not connected to the driving element 250. In this case, the driving element 250 may not have driving pads formed in the region (hereinafter referred to as the "overlapping region") 255 that overlaps with the first line 241 and the second line 242. This is because, due to the single-layer structure of the first substrate 200, when driving pads are present in the overlapping region 255, it is impossible to prevent short circuits between the lines connected to the respective driving pads and the first line 241 and the second line 242.

[0063] The second substrate 300 can be formed of a flexible material. For example, the second substrate 300 can be formed as a flexible printed circuit board (FPCB). The second substrate 300 can be connected to the first substrate 200. See, for example, [link to documentation]. Figure 2A One end of the second substrate 300 can be connected to the other end of the first substrate 200. Specifically, the second substrate pad portion 310 of the second substrate 300 can be connected to the first-2 substrate pad portion 220 of the first substrate 200 in a film-on-film (FOF) manner.

[0064] According to an embodiment, the second substrate 300 may include a second substrate pad portion 310 and a test point portion 320.

[0065] The second substrate pad portion 310 may include multiple pads for driving the display panel 100 and managing the bonding quality (e.g., bonding resistance) between the first substrate 200 and the second substrate 300. For example, as Figure 2D As shown, the second substrate pad portion 310 may include a second-1 test pad 311, a second-2 test pad 312, a second-3 test pad 313, and a second-4 test pad 314. The second-1 test pad 311 and the second-2 test pad 312 may be inner test pads, and the second-3 test pad 313 and the second-4 test pad 314 may be outer test pads. The second-1 test pad 311, the second-2 test pad 312, the second-3 test pad 313, and the second-4 test pad 314 may be coupled to the second-1 connection pad 221, the second-2 connection pad 222, the second-3 connection pad 223, and the second-4 connection pad 224, respectively. Here, the second-1 test pad 311, the second-2 test pad 312, the second-3 test pad 313, the second-4 test pad 314, the second-1 connection pad 221, the second-2 connection pad 222, the second-3 connection pad 223, and the second-4 connection pad 224 may each include five pads, but they are not necessarily limited to this.

[0066] Test point portion 320 may be formed on the second substrate 300 to expose to the outside. Test point portion 320 may include a first test point 321, a second test point 322, a third test point 323, and a fourth test point 324. The first test point 321 and the second test point 322 may be inner test points, and the third test point 323 and the fourth test point 324 may be outer test points. The first test point 321, the second test point 322, the third test point 323, and the fourth test point 324 may be connected to the second-1 test pad 311, the second-2 test pad 312, the second-3 test pad 313, and the second-4 test pad 314, respectively. Here, the first test point 321, the second test point 322, the third test point 323, and the fourth test point 324 may each include six points, but they are not necessarily limited to this.

[0067] First test point 321, second test point 322, third test point 323, and fourth test point 324 may be formed on the second substrate 300 to be exposed to the outside. This is to allow a measuring element (e.g., a measuring probe) of an external device (not shown) for measuring the bonding resistance to make physical contact with these test points.

[0068] At the same time, despite Figures 2B to 2D Not shown, but the display panel 100 and / or the first substrate 200 may include at least one (e.g., in...). Figure 2E In the case of four, there are four first alignment marks 11, which serve as alignment references between the display panel 100 and the first substrate 200. Furthermore, the first substrate 200 and / or the second substrate 300 may include at least one (e.g., in...). Figure 2E In the case of two) the second alignment mark 12, the second alignment mark 12 is the alignment reference between the first substrate 200 and the second substrate 300.

[0069] Despite Figure 1 Although not shown, the display device 1000 may also include a touch electrode portion and a touch sensor on the display panel 100.

[0070] As described herein, the display device 1000 according to embodiments of the present disclosure can test the internal bonding quality (e.g., bonding resistance) of the second substrate 300 bonded to the display panel 100 via the first-1 test pad 111 and the first-2 test pad 112. Furthermore, the display device 1000 can test the external bonding quality of the second substrate 300 via the first-3 test pad 113 and the first-4 test pad 114. In other words, embodiments of the present disclosure can manage (or monitor) the bonding quality between the first substrate 200 with a notch structure and the display panel 100, thereby improving (or enhancing) the reliability of the display device 1000. Furthermore, embodiments of the present disclosure can provide (e.g., distribute) display devices 1000 with uniform quality.

[0071] like Figure 2C and Figure 3A As shown, the second notch 230 may be provided in the first end portion of the first substrate 200. Specifically, as Figure 2C As shown, the second notch 230 can have a rectangular shape, but is not necessarily limited to this. For example, as Figure 3A As shown, the second notch 230 can have the shape of half an octagon. The second notch 230 can also have another shape, such as a semicircle. Furthermore, the first notch 120 and the second notch 230 can have the same shape or different shapes.

[0072] Figure 4A This is a view illustrating an example of inspecting the bonding quality between the display panel and the first substrate according to an embodiment of the present disclosure, and Figure 4B This is a view illustrating an example of inspecting the bonding quality between a first substrate and a second substrate according to an embodiment of the present disclosure.

[0073] See Figure 4A and Figure 4B According to the embodiments of this disclosure Figure 1 , Figures 2A to 2B and Figures 3A to 3B The display device 1000 can measure the first bonding quality (e.g., first bonding resistance) between the display panel 100 and the first substrate 200 and the second bonding quality (e.g., second bonding resistance) between the first substrate 200 and the second substrate 300 through first test points 321 to fourth test points 324. For example, the first bonding quality of the area (hereinafter referred to as the first bonding area) 411 where the first-1 test pad 111 and the first-1 connection pad 211 can be bonded can be measured through the first test point 321, and the second bonding quality of the area (hereinafter referred to as the second bonding area) 412 where the second-1 connection pad 221 and the second-1 test pad 311 can be bonded can be measured through the second test point 321. Specifically, as Figure 4AAs shown, an external device (not shown) can apply a specified voltage V1-V2 to the third terminal 3 and the fourth terminal 4 of the first test point 321, measure the current I1 between the first terminal 1 and the fifth terminal 5 (the fifth terminal 5 can be connected to ground G, for example), and calculate the first bonding resistance of the first bonding region 411 based on the applied voltage V1-V2 and the measured current I1. Furthermore, as... Figure 4B As shown, an external device (not shown) can apply a specified voltage V1-V2 to the third terminal 3 and the fourth terminal 4, measure the current I2 between the third terminal 3 and the second terminal 2 (the second terminal 2 may be connected to ground G, for example), and then calculate the second bonding resistance of the second bonding region 412 based on the applied voltage V1-V2 and the measured current I2.

[0074] At the same time, using the same method as described herein with reference to the first test point 321, by Figure 1 , Figure 2D and Figure 2E The second test points 322 to the fourth test points 324 shown measure the first and second bonding qualities of the corresponding bonding regions. Therefore, a detailed description of the repeated method for measuring the bonding quality via the second test points 322 to the fourth test points 324 can be omitted or simplified.

[0075] Figure 5A This is a view showing a display device according to another embodiment of the present disclosure.

[0076] See Figure 5A The display device 5000 according to embodiments of the present disclosure can be similar to Figure 1 The display device 1000. Therefore, in the configuration of the display device 5000, configurations similar to those of the display device 1000 are referred to by the same reference numerals, and their repeated detailed descriptions may be omitted or simplified.

[0077] The display device 5000 may further include a fifth test point 325 and a sixth test point 326, which are used to measure the overall bonding resistance, including a first bonding resistance between the display panel 100 and the first substrate 200 and a second bonding resistance between the first substrate 200 and the second substrate 300. The first test points 321 to the sixth test points 326 may form a ring structure. For example, as... Figure 5A As shown, the fifth test point 325 can be connected to the fourth test point 324, the fourth test point 324 can be connected to the second test point 322, the second test point 322 can be connected to the first test point 321, the first test point 321 can be connected to the third test point 323, and the third test point 323 can be connected to the sixth test point 326.

[0078] According to embodiments of this disclosure, the display panel 100 and the first substrate 200 may define an opening 520. The opening 520 may include a first opening portion 530 and a second opening portion 540. The first opening portion 530 may be defined by a first notch 120, and the second opening portion 540 may be defined by a second notch 230. The first notch 120 and the first opening portion 530 may be omitted. The width of the first opening portion 530 and the width of the second opening portion 540 may be the same or different. For example, the width of the second opening portion 540 may be greater than the width of the first opening portion 530. For example, the first substrate 200 may expose a portion around the opening 520 on the upper surface of the display panel 100. That is, the width of the end portion of the first substrate 200 defining the second notch 230 may be fully supported by the display panel 100.

[0079] According to embodiments of this disclosure, the display device 5000 can inspect for abnormalities in bonding quality based on the overall bonding resistance measured by the fifth test point 325 and the sixth test point 326. For example, when the overall bonding resistance is not greater than (or less than) a specified reference value, embodiments of this disclosure can determine that there are no problems with the bonding between the display panel 100 and the first substrate 200 and / or the bonding between the first substrate 200 and the second substrate 300. On the other hand, when the overall bonding resistance exceeds (or exceeds) the specified reference value, embodiments of this disclosure can determine that there are problems with the bonding between the display panel 100 and the first substrate 200 and / or the bonding between the first substrate 200 and the second substrate 300. In this case, the bonding resistance of each part can be measured using the first test points 321 to the fourth test points 324, and the location of the bonding problem can be identified based on the measurement results. In other words, various embodiments of this disclosure can inspect for abnormalities in bonding quality using the overall bonding resistance, and when an abnormality is detected, the location of the bonding problem can be detected twice and accurately. In this way, embodiments of this disclosure can improve the manufacturing efficiency of the display device.

[0080] Figure 5B This is a view showing a display device according to another embodiment of the present disclosure.

[0081] See Figure 5B The display device 5500 according to embodiments of the present disclosure can be similar to Figure 1 The display device 1000. Therefore, in the configuration of the display device 5500, configurations similar to those of the display device 1000 are referred to by the same reference numerals, and their repeated detailed descriptions may be omitted or simplified.

[0082] The display device 5500 is configured in a manner that does not form a notch in the display panel 101, and a portion of the display panel 101 (e.g., forming a notch) Figure 1 The area of ​​the first notch 120 of the display device 1000 may be set (or specified) as an area that is not bonded to the first substrate 200 (hereinafter referred to as the non-bonded area). The non-bonded area may include an area that receives at least one component 150 mounted on an external device when the display device 5500 is bonded to an external device (e.g., an area where the separation distance between the display panel 101 and the component 150 is not greater than (or less than) the thickness of the first substrate 200). Figure 5B The first substrate 200 and the second substrate 300 and Figure 1 The first substrate 200 and the second substrate 300 are the same (or similar). In other words, even if there is no notch in the display panel 101, Figure 5B The first substrate 200 may also have a second notch 230 formed therein (see Figure 2C ), to avoid (or prevent) interference from components 150 on external devices.

[0083] At the same time, with Figure 5A The display device is the same as the 5000. Figure 5B The display device 5500 may also include a fifth test point and a sixth test point for measuring the overall bonding resistance.

[0084] Figure 6 This is a view illustrating an electronic device according to an embodiment of the present disclosure. Figure 7A Is when Figure 6 Electronic devices include Figure 1 The display device is a cross-sectional view taken along line B-B', and Figure 7B Is when Figure 6 Electronic devices include Figure 5B The display device is a sectional view taken along line B-B'.

[0085] See Figure 6 and Figures 7A to 7BThe electronic device 60 according to embodiments of this disclosure may include various types of electronic devices. For example, the electronic device 60 according to embodiments of this disclosure may include rigid, flexible, foldable, rollable, or wearable portable communication devices (e.g., mobile phones, smartphones, smartwatches, or tablets), computer devices (e.g., laptops or monitors), portable multimedia devices (e.g., portable game consoles), portable medical devices, photographic devices (e.g., digital cameras or camcorders), multimedia devices installed, embedded, or integrally formed with a vehicle (e.g., displays for vehicles, head-up displays), or home appliance devices (e.g., televisions). Furthermore, the electronic device 60 according to embodiments of this disclosure is not necessarily limited to the devices described herein and may include various types of products (e.g., augmented reality or virtual reality displays, billboards, or video walls).

[0086] According to an embodiment, the electronic device 60 may include a display device 6000. The display device 6000 may be mounted in a housing 600 of the electronic device 60. For example, the display device 6000 may be mounted in the housing 600 so that it is exposed to the outside through the front side (through the front surface) of the electronic device 60. The display device 6000 may provide (e.g., display) various images (e.g., still images or moving images).

[0087] According to the implementation method, such as Figure 7A As shown, when the display device 6000 has a similar Figure 1 When the display device 1000 has the same (or similar) structure, the upper surface of the component 150 mounted on the main printed circuit board MB inside the housing 600 can be tightly positioned with the lower surface of the cover window CW through the first notch 120 of the display panel 100 and the second notch 230 of the first substrate 200. As another example, such as Figure 7B As shown, when the display device 6000 has a similar Figure 5B When the display device 5500 has the same (or similar) structure, the upper surface of the component 150 mounted on the main circuit board MB inside the housing 600 can be tightly positioned with the lower surface of the display panel 101 through the second notch 230 passing through the first substrate 200.

[0088] Other configurations of the display device 6000 can be combined with... Figure 1 Display device 1000, Figure 5A Display device 5000 or Figure 5B The display device 6000 is the same as or similar to the display device 5500. Therefore, repeated detailed descriptions of the display device 6000 may be omitted or simplified.

[0089] Additionally, the display device 6000 may include a touch panel that supports touch input (e.g., finger touch and pen touch). For example, the display device 6000 may include a touch panel that is formed separately from or integrally with it.

[0090] Furthermore, as an example, the case where the display device 1000 includes one first substrate 200 has been described. However, according to some embodiments, the display device 1000 may include two or more first substrates 200.

[0091] Various embodiments of this disclosure can inspect the bonding quality (or inspect the quality of the display device) between a first substrate (e.g., a chip-on-film) with a notch structure and a display panel. Furthermore, various embodiments of this disclosure can manage (or monitor) the bonding quality between the first substrate with the notch structure and the display panel. For example, the bonding quality can be monitored during bonding. Signals determined using test points can be used to control the operation of the bonding system of the display panel, the first substrate, and the second substrate, for example, stopping the pressing when a specific signal is sensed at the test point. In this way, various embodiments of this disclosure can improve (or enhance) the reliability of the display device.

[0092] Furthermore, various embodiments of this disclosure can provide (or distribute) display devices with uniform quality. In other words, various embodiments of this disclosure can prevent the provision of defective display devices in which the display panel and the first substrate are not properly bonded.

[0093] Furthermore, various embodiments of this disclosure can inspect for any abnormalities in the bonding quality during (or after) the manufacturing of the display device. For example, various embodiments of this disclosure can inspect for any abnormalities in the bonding quality by adding test points for measuring the overall bonding resistance. In this way, various embodiments of this disclosure can improve the manufacturing efficiency of the display device.

[0094] The various embodiments of this disclosure are not necessarily limited to those exemplified herein, and those skilled in the art can understand more diverse effects from the description set forth in this disclosure.

[0095] Various embodiments and terms used herein are employed. Embodiments are not limited to the technical features described herein. Embodiments may be interpreted as including various modifications, equivalents, or substitutions. Regarding the description of the drawings, the same components shown in different drawings may be referred to by the same reference numerals. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the corresponding component in other respects (e.g., importance or order). It will be understood that, whether or not the terms “operational ground” or “communication ground” are used, if a component (e.g., the first component) is referred to as “attached to” or “connected to” another component (e.g., the second component), then this means that the component can be attached to the other component directly (e.g., wired), wirelessly, or via a third component.

[0096] The term "module" as used in the various embodiments of this disclosure can include units implemented in hardware, software, or firmware, and can be used interchangeably with, for example, logic, logic blocks, sections, or circuits. A module can be an integrally formed part or the smallest unit or part of a part that performs one or more functions. For example, according to embodiments, a module can be implemented as an application-specific integrated circuit (ASIC).

[0097] Various embodiments of this disclosure can be implemented by software (e.g., a program) including one or more instructions stored in a storage medium (e.g., internal or external memory) readable by a machine (e.g., electronic device 60). For example, among one or more instructions stored in the storage medium, a processor of the machine (e.g., electronic device 60) can invoke at least one instruction and can execute that instruction. This allows at least one function to be executed according to the invoked at least one instruction. The one or more instructions may include code produced by a compiler or code that can be executed by a decoder. Storage media readable by a device may be provided in the form of non-transitory storage media. Here, "non-transitory storage media" means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), and with regard to this term, no distinction is made between cases where data is semi-permanently stored in the storage medium and cases where data is temporarily stored in the storage medium.

[0098] Methods according to various embodiments of this disclosure can be provided as included in a computer program product. The computer program product can be traded between a seller and a buyer. The computer program product can be distributed in the form of a storage medium readable by a device (e.g., an optical disc read-only memory (CD-ROM)), or distributed through an app store, or distributed directly between two user devices or online (e.g., downloading and uploading). In online distribution, at least a portion of the computer program product can be at least temporarily stored or temporarily generated in a storage medium readable by a device (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0099] According to various embodiments, each component or element (e.g., a module or program) described herein may include one or more entities, and some of these entities may be detached and assigned to other components. According to various embodiments, one or more components or their operations may be omitted from the components described herein, or one or more other components or their operations may be added to the component. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as the functions performed by the corresponding components among the multiple components before integration. According to various embodiments, operations performed by modules, programs, or other components may be performed sequentially, in parallel, repeatedly, or heuristically; one or more operations may be run in a different order or omitted, or one or more other operations may be added to them.

Claims

1. A display device, characterized in that, The display device includes: A display panel includes a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel. A first substrate has a first end portion connected to the end portion of the display panel and a notch formed in the first end portion corresponding to the non-bonding area, and includes a driving element configured to control the driving of the display panel; and The second substrate is connected to the second end portion of the first substrate. The display panel includes a first-1 test pad disposed on the first side portion of the display panel and a first-2 test pad disposed on the second side portion of the display panel. The first substrate includes a first-1 connection pad coupled to the first-1 test pad, a first-2 connection pad coupled to the first-2 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, and a second-2 connection pad connected to the first-2 connection pad via a second line. The second substrate includes a second-1 test pad coupled to the second-1 connection pad, a second-2 test pad coupled to the second-2 connection pad, a first test point connected to the second-1 test pad, and a second test point connected to the second-2 test pad. A portion of the first line and a portion of the second line overlap with the driving element.

2. The display device according to claim 1, characterized in that, The non-binding region includes: An area that receives at least one component mounted on an external device, to which the display device is mounted; or The area is formed with a display panel notch so that at least one component mounted on the external device passes through it.

3. The display device according to claim 1, characterized in that, The display panel further includes a first-3 test pad disposed on the first side portion of the display panel and a first-4 test pad disposed on the second side portion of the display panel, wherein the first side portion and the second side portion are separated by the non-bonding area. The first substrate further includes a first-3 connection pad coupled to the first-3 test pad, a first-4 connection pad coupled to the first-4 test pad, a second-3 connection pad connected to the first-3 connection pad via a third line, and a second-4 connection pad connected to the first-4 connection pad via a fourth line. The second substrate further includes a second-3 test pad coupled to the second-3 connection pad, a second-4 test pad coupled to the second-4 connection pad, a third test point coupled to the second-3 test pad, and a fourth test point coupled to the second-4 test pad.

4. The display device according to claim 3, characterized in that, The first-1 test pad, the first-2 test pad, the first-3 test pad, the first-4 test pad, the first-1 connection pad, the first-2 connection pad, the first-3 connection pad, and the first-4 connection pad each include four pads. The second-1 connection pad, the second-2 connection pad, the second-3 connection pad, the second-4 connection pad, the second-1 test pad, the second-2 test pad, the second-3 test pad, and the second-4 test pad each include five pads. The first test point, the second test point, the third test point, and the fourth test point each include six points.

5. The display device according to claim 1, characterized in that, The first substrate is formed as a single layer. The second substrate is formed as a flexible printed circuit board, and The portion of the first line and the portion of the second line pass through the lower portion of the drive element.

6. The display device according to claim 1, characterized in that, The driving element includes a first-1 driving pad portion, a first-2 driving pad portion electrically connected to the first-1 driving pad portion, a second-1 driving pad portion, and a second-2 driving pad portion electrically connected to the second-1 driving pad portion. The first line includes a first-1 line connecting the first-1 connection pad to the first-1 drive pad portion and a first-2 line connecting the first-2 drive pad portion to the second-1 connection pad, and The second line includes a second-1 line that connects the first-2 connecting pad to the second-1 driving pad portion and a second-2 line that connects the second-2 driving pad portion to the second-2 connecting pad.

7. The display device according to claim 1, characterized in that, The second substrate further includes a fifth test point and a sixth test point, the fifth test point and the sixth test point being configured to measure the overall bonding resistance, including a first bonding resistance between the display panel and the first substrate and a second bonding resistance between the first substrate and the second substrate.

8. An electronic device, characterized in that, The electronic device includes: Casing; and The display device is installed in the housing. The display device includes: A display panel includes a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel. A first substrate has a first end portion connected to the end portion of the display panel and a notch formed in the first end portion corresponding to the non-bonding area, and includes a driving element configured to control the driving of the display panel; and The second substrate is connected to the second end portion of the first substrate. The display panel includes a first-1 test pad disposed on the first side portion of the display panel and a first-2 test pad disposed on the second side portion of the display panel. The first substrate includes a first-1 connection pad coupled to the first-1 test pad, a first-2 connection pad coupled to the first-2 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, and a second-2 connection pad connected to the first-2 connection pad via a second line. The second substrate includes a second-1 test pad coupled to the second-1 connection pad, a second-2 test pad coupled to the second-2 connection pad, a first test point connected to the second-1 test pad, and a second test point connected to the second-2 test pad. A portion of the first line and a portion of the second line overlap with the driving element.

9. A display device, characterized in that, The display device includes: A display panel includes a non-bonding region formed at an end portion of the display panel and defining a first side portion and a second side portion of the end portion of the display panel. A first substrate has a first end portion connected to the end portion of the display panel and a notch formed in the first end portion corresponding to the non-bonding area, and includes a driving element configured to control the driving of the display panel; and The second substrate is connected to the second end portion of the first substrate. The display panel includes a first-1 test pad and a first-3 test pad disposed on the first side portion of the display panel. The first substrate includes a first-1 connection pad coupled to the first-1 test pad, a second-1 connection pad connected to the first-1 connection pad via a first line, a first-3 connection pad coupled to the first-3 test pad, and a second-3 connection pad connected to the first-3 connection pad via a third line. The second substrate includes a second-1 test pad coupled to the second-1 connection pad, a first test point coupled to the second-1 test pad, a second-3 test pad coupled to the second-3 connection pad, and a third test point coupled to the second-3 test pad. A portion of the first line overlaps with the driving element.

10. The display device according to claim 9, Its features are, The display panel includes a first-2 test pad and a first-4 test pad disposed on the second side portion of the display panel. The first substrate includes a first-2 connection pad coupled to the first-2 test pad, a second-2 connection pad connected to the first-2 connection pad via a second line, a first-4 connection pad coupled to the first-4 test pad, and a second-4 connection pad connected to the first-4 connection pad via a fourth line. The second substrate includes a second-2 test pad coupled to the second-2 connection pad, a second test point coupled to the second-2 test pad, a second-4 test pad coupled to the second-4 connection pad, and a fourth test point coupled to the second-4 test pad. A portion of the second line overlaps with the driving element.

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