A high-speed silicon wafer cleaning system

Abstract

This utility model belongs to the photovoltaic industry and discloses a high-speed silicon wafer cleaning system. It includes a feeding device, a cleaning mechanism, an oxidation mechanism, a rinsing mechanism, a drying mechanism, and a discharging device arranged sequentially. The feeding device feeds the silicon wafers to be cleaned into the inlet of the cleaning tank in the cleaning mechanism. The discharging device checks the dried silicon wafers for quality. A partition is installed between the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism, with elongated through holes for silicon wafer transport. Ultrasonic components are vertically installed in the oxidation mechanism, rinsing mechanism, and drying mechanism. Several upper and lower double-layered conveyor rollers are installed in each of these mechanisms, and the two layers of conveyor rollers are guided and transferred sequentially between the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism via a guide and transfer component. This significantly improves automation and reduces costs.

Description

Technical Field

[0001] This utility model belongs to the photovoltaic industry and relates to a high-speed silicon wafer cleaning system. Background Technology

[0002] In the industrial production chain of photovoltaic silicon wafers, the cleaning process is a crucial step that determines the quality of the wafers. In the silicon wafer manufacturing process of the photovoltaic industry, silicon ingots are fixed to a substrate with adhesive and then cut into wafers by slicing equipment. After cutting, the wafers first enter the de-adhesive section, where solvent dissolution or pyrolysis processes are used to completely remove the residual adhesive from the substrate. Once the wafer surface reaches a clean, adhesive-free standard, a fully automated wafer insertion machine arranges them one by one into a carrying basket according to an evenly spaced layout. The baskets full of wafers then enter the cleaning unit for cleaning.

[0003] However, traditional tank-type cleaning machines have three significant drawbacks: First, the cleaning basket is a high-frequency consumable part, requiring dedicated personnel for daily cleaning, inspection, and maintenance. Furthermore, with increased use, the grid is prone to deformation and wear, necessitating periodic replacement, which significantly increases long-term production and operating costs. Second, the grid support corners of the cleaning basket have natural cleaning dead zones. Ultrasonic energy is attenuated in these areas due to structural obstruction, and the reagent circulation rate slows down at the corners, making it difficult to fully remove impurities. This results in substandard cleanliness of the silicon wafers in certain areas, affecting photoelectric performance. Third, during the transfer, immersion, and removal of the cleaning basket, contact friction or rigid collisions easily occur between the silicon wafers and the grid support structure. Especially with frequent switching between multiple water tanks, the breakage rate of silicon wafers is much higher than with other cleaning technologies, directly leading to a decrease in production yield. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, this utility model provides a chain-type high-speed silicon wafer cleaning machine, which achieves continuous and stable transportation and uninterrupted cleaning of silicon wafers, reduces manual operation, greatly improves the degree of automation, and increases equipment capacity. By using roller conveyors to transport silicon wafers, the basket method is eliminated, enhancing the cleaning effect, reducing the breakage rate, increasing the pass rate, and lowering the overall equipment cost.

[0005] The above-mentioned objective of this utility model is achieved through the following technical solution:

[0006] A high-speed silicon wafer cleaning system includes a feeding device, a cleaning mechanism, an oxidation mechanism, a rinsing mechanism, a drying mechanism, and a discharging device arranged in sequence. The feeding device feeds the silicon wafers to be cleaned into the inlet of the cleaning tank in the cleaning mechanism. The discharging device checks the dried silicon wafers for quality; defective wafers are transferred through a waste removal assembly, while qualified wafers are transferred to a buffer box or a sorting machine conveyor via the discharging device. A partition is provided between the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism, and the partition has elongated through holes for silicon wafer transport. Furthermore, ultrasonic components are vertically installed in the oxidation, rinsing, and cleaning mechanisms. Spray components are installed at the front end of the oxidation, rinsing, and cleaning mechanisms to spray the silicon wafers. Several upper and lower double-layer conveyor rollers are installed in the cleaning, oxidation, rinsing, and drying mechanisms. The two layers of conveyor rollers are guided and transferred to the silicon wafers in sequence through the cleaning, oxidation, rinsing, and drying mechanisms. In addition, water-blocking components are installed in the cleaning, oxidation, and rinsing mechanisms to prevent solution leakage between different tanks and prevent solution overflow.

[0007] The advantages of this utility model compared with the prior art are:

[0008] This invention provides a high-speed silicon wafer cleaning system. Through a loading robot and Bernoulli suction cups in the loading device, a single motor drives a circular belt, and guide rails to achieve stable conveying and positioning adjustments. For silicon wafers less than 0.1mm thick—a particularly hard and brittle material—positioning adjustments are achieved during conveying with an extremely low breakage rate, significantly improving work efficiency, reducing the probability of malfunctions and repairs, lowering production costs, and ensuring long-term stable operation. The unloading robot and Bernoulli suction cups in the unloading device enhance the structure for removing debris and waste. This simple structure enables precise debris removal without manual intervention, downtime, or manual sorting, increasing the work cycle time and improving the degree of automation. The unloading robot effectively grasps silicon wafers through visual imaging, with a single wafer grasping cycle time of <0.5s.

[0009] This invention provides a high-speed silicon wafer cleaning system. The cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism utilize a single main drive hexagonal shaft through a specially designed structure to drive the upper and lower layers of conveyor rollers. This results in more stable overall transmission, significantly reducing silicon wafer loss and greatly improving work efficiency. Furthermore, the working cycle time is significantly increased, allowing for continuous and uninterrupted operation.

[0010] This utility model provides a high-speed silicon wafer cleaning system. The water-blocking components, partitions, and side grooves in the cleaning mechanism, oxidation mechanism, and rinsing mechanism achieve precise separation. In conjunction with the cleaning mechanism equipped with a cleaning inlet water tank and a cleaning spray water tank, the oxidation mechanism equipped with an oxidation water tank, and the rinsing mechanism equipped with a rinsing water tank and a rinsing spray water tank, the system ensures that the liquids of each mechanism do not mix and can flow continuously without the need for additional handling functions, additional handling robots, or gantry structures. This reduces the upper operating space and makes it more suitable for various workshop conditions.

[0011] This invention provides a high-speed silicon wafer cleaning system that innovatively reverses the water flow direction of the rinsing mechanism through a special structure with a water-blocking component, resulting in better rinsing and shorter rinsing time. Furthermore, the cleaning mechanism incorporates a special vertical support limiting plate structure and height setting, along with side and bottom spraying. The side spraying removes interference from foam generated by the silicon wafer cleaning agent (small air bubbles adhere to the bottom of the silicon wafer when it enters the cleaning zone and is immersed in the liquid). The bottom spraying removes these small air bubbles from the silicon wafer surface, preventing them from fully contacting the cleaning agent. This significantly improves cleaning efficiency and reduces manual operation. No manual removal or machine shutdown is required, and the cleaning effect is excellent.

[0012] This utility model provides a high-speed silicon wafer cleaning system that uses a circulating water system, which reduces the cost of water sources and the use of water tanks, thereby lowering costs. Furthermore, this design ensures that the drainage of each mechanism does not interfere with each other.

[0013] This invention provides a high-speed silicon wafer cleaning system. The cleaning, oxidation, rinsing, and drying mechanisms are equipped with upper and lower layers of conveying rollers. Through a developed structure, floating transmission is achieved, preventing excessive pressure that could cause fragmentation, while also ensuring stable conveying due to insufficient lightness, thus solving the problem of high fragmentation rates in existing systems. Furthermore, the innovative vertically arranged ultrasonic components differ from existing horizontally arranged ultrasonic components. Horizontal arrangements require two layers, demanding higher water levels and increasing the number of ultrasonic components, leading to increased overall cost. Horizontal arrangements also suffer from high losses and low ultrasonic efficiency. The vertically arranged ultrasonic components solve these problems, and the continuous structure provides better ultrasonic performance. Attached Figure Description

[0014] Figure 1 This is a front view of a high-speed silicon wafer cleaning system according to this utility model.

[0015] Figure 2 This is a perspective view of a high-speed silicon wafer cleaning system according to this utility model.

[0016] Figure 3This is a front view of the silicon wafer continuous processing device of this utility model.

[0017] Figure 4 This is a perspective view of the silicon wafer continuous processing device of this utility model.

[0018] Figure 5 yes Figure 4 A diagram after removing the frame.

[0019] Figure 6 This is the front view of the cleaning mechanism of this utility model.

[0020] Figure 7 This is a top view of the cleaning mechanism of this utility model.

[0021] Figure 8 yes Figure 7 AA sectional view.

[0022] Figure 9 This is a perspective view of the cleaning mechanism in Embodiment 2 of this utility model.

[0023] Figure 10 yes Figure 7 3D image A after removing the top frame.

[0024] Figure 11 yes Figure 10 A magnified schematic diagram of region I in the image.

[0025] Figure 12 yes Figure 7 The 3D image B after removing the top frame.

[0026] Figure 13 This is a perspective view of the oxidation tank of this utility model.

[0027] Figure 14 yes Figure 13 A magnified schematic diagram of region I in the image.

[0028] Figure 15 This is a perspective view of the rinsing tank of this utility model.

[0029] Figure 16 yes Figure 15 A magnified schematic diagram of region I in the image.

[0030] Figure 17 This is a schematic diagram of the cleaning tank structure of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0031] Figure 18 yes Figure 17 The diagrams show enlarged views of certain areas, with Figure A showing an enlarged view of area I and Figure B showing an enlarged view of area II.

[0032] Figure 19 This is a schematic diagram of the oxidation tank structure of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0033] Figure 20 This is a schematic diagram of the rinsing tank of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0034] Figure 21 This is a perspective view of the cleaning tank of this utility model.

[0035] Figure 22 This is a structural diagram of the cleaning tank.

[0036] Figure 23 Figure A is a structural schematic diagram of the vertical support limiting plate of this utility model, and Figure B is a structural schematic diagram of the vertical support limiting plate A.

[0037] Figure 24 This is a schematic diagram of the structure of the guide and transmission component of this utility model.

[0038] Figure 25 Figure A is a schematic diagram of the structure of the ultrasonic component of this utility model, wherein Figure B is a schematic diagram of the structure after removing one side of the ultrasonic baffle, and Figure B is a schematic diagram of the structure after removing the ultrasonic baffle.

[0039] Figure 26 Figure A is a three-dimensional view of the spray assembly A of this utility model, Figure B is a three-dimensional view after removing the dust cover, and Figure C is a three-dimensional view after removing the dust cover and the vertical baffle.

[0040] Figure 27 This is a structural diagram of the cleaning inlet water tank, where Figure A is a 3D view and Figure B is a 3D view of the cleaning inlet water tank after the water tank baffle is removed.

[0041] Figure 28 This is a structural diagram of the cleaning spray tank, where Figure A is a three-dimensional view and Figure B is a cross-sectional view of Figure A.

[0042] Figure 29 This is a schematic diagram of the drying tank.

[0043] Figure 30 This is the front view of the feeding device.

[0044] Figure 31 This is a three-dimensional view A of the feeding device.

[0045] Figure 32 This is a three-dimensional view of the feeding device, B.

[0046] Figure 33 Figure A shows a 3D view (C) and a partially enlarged schematic diagram of the feeding device. Figure B is a 3D view (C) and a partially enlarged schematic diagram of area I.

[0047] Figure 34 This is a three-dimensional view A of the feeding device.

[0048] Figure 35 This is a three-dimensional view of the feeding device, B.

[0049] Figure 36 This is a 3D view of the feeding roller conveyor assembly.

[0050] Figure 37 This is a three-dimensional view A showing the removal of the waste conveyor rollers and the waste discharge rollers.

[0051] Figure 38 This is a 3D view B showing the removal of the waste conveyor rollers and the waste discharge rollers.

[0052] Figure 39 This is a 3D view A of the sorting machine's conveyor roller conveyor.

[0053] Figure 40 This is a 3D view of the sorting machine's conveyor roller conveyor, diagram B.

[0054] In the diagram: 1. Cleaning mechanism, 2. Oxidation mechanism, 3. Rinsing mechanism, 4. Drying mechanism, 5. Feeding device, 6. Discharging device, 7. Workpiece, 101. Cleaning inlet water tank, 102. Cleaning spray water tank, 103. Spray assembly A, 104. Cleaning spray area inlet pipe, 105. Cleaning spray side pipe, 106. Cleaning spray drain pipe, 107. Return guide component, 108. Cleaning water pump, 109. Cleaning spray water pump, 110. Cleaning upper water-blocking roller A, 111. Cleaning upper water-blocking roller B, 112. Cleaning inlet water valve, 113. Auxiliary spray water valve, 114. Upper conveying roller, 115. Lower conveying roller, 116. Cleaning lower water-blocking roller, 117. Water-blocking plate, 118. Liquid level float switch A 119. Liquid level float switch B, 120. Cleaning tank outlet, 121. Cleaning frame, 122. Main water inlet pipe, 123. Pneumatic diaphragm valve A, 124. Cleaning tank drain pipe, 125. Main drive support base, 126. Main drive hexagonal shaft, 127. Driving bevel gear, 128. Driven bevel gear, 129. Driven gear, 130. Drive motor mounting plate, 131. Drive driving sprocket, 132. Drive chain, 133. Driven driven sprocket, 134. Sprocket fixing support plate, 135. Overflow guide pipe, 136. Temperature sensor A, 137. Ultrasonic vibrator, 138. Drive motor A, 139. Bearing, 140. Driving gear, 141. Temperature sensor fixing bracket, 142. Liquid level Float switch C, 143. Side groove, 144. Cleaning drain outlet A, 145. Cleaning spray drain outlet, 146. Lower upright plate, 147. Upper upright plate, 148. Block, 149. Adjusting bolt hole, 150. Cleaning drain outlet B, 151. Ultrasonic connecting pipe, 152. Cleaning pipe clamp, 153. Cleaning tank bottom plate, 154. Cleaning bottom nozzle, 155. Cleaning bottom spray pipe, 156. Insert block, 157. Ultrasonic bracket, 158. Ultrasonic groove, 159. Ultrasonic transducer, 160. Cleaning spray drain connection pipe, 201. Oxidation water tank, 202. Spray assembly B, 203. Oxidation spray area inlet pipe, 204. Oxidation upper water-blocking roller A, 205. Oxidation upper water-blocking roller B, 206. Oxidation drain 207. Oxidation reflux pipe, 208. Oxidation drain outlet B, 209. Oxidation spray drain pipe, 210. Oxidation spray drain outlet, 301. Rinse spray water tank, 302. Rinse water tank, 303. Spray assembly C, 304. Rinse oxidation inlet pipe, 305. Rinse spray area inlet pipe, 306. Rinse upper water-blocking roller A, 307. Rinse upper water-blocking roller B, 308. Flow meter, 309. Rinse inlet pipe, 310. Rinse tank drain pipe, 311. Rinse tank return water pipe, 312. Rinse tank return pipe, 313. Rinse spray return pipe, 314. Rinse reflux pipe A, 315. Rinse reflux pipe B, 316. Rinse spray drain pipe, 317. Rinse spray drain outlet, 318.319. Rinse drain outlet A; 401. Rinse drain outlet B; 402. Fan; 403. Air knife bracket; 404. Drying drain pipe; 405. Air knife; 406. Drying tank; 407. Drive motor B; 408. Drive drive wheel; 409. Chain; 410. Drive motor mounting plate; 501. Drive driven wheel; 502. Upper frame; 503. Column; 504. Lower frame; 505. Loading robot; 506. Suction cup connecting plate; 507. Bernoulli suction cup A; 508. Loading motor protective cover; 509. Synchronous belt pulley protective cover; 510. Loading motor; 511. Synchronous belt A; 512. Main drive shaft; 513. Follower shaft; 514. Guide bar; 515. Transmission. 516. Wheel support base; 517. Sensor water baffle; 518. Water collection box drain hole; 519. Manual ball valve A; 520. Mounting plate; 521. Synchronous belt B; 522. Tensioner mounting plate; 523. Driven wheel A; 524. Tensioner wheel; 525. Tensioning bolt; 526. Tensioning bolt mounting block; 601. Unloading frame; 602. Unloading robot; 603. Bernoulli suction cup B; 604. Vision camera mounting bracket; 605. Vision camera A; 606. Vision camera B; 607. Light source; 608. Waste removal cylinder; 609. Sorting machine conveyor roller; 610. Waste removal conveyor roller; 611. Gripping conveyor roller; 612. Positioning conveyor roller; 613. Waste box; 6 14. Buffer box, 615. Motor A, 616. Motor mounting bracket, 617. Coupling A, 618. Synchronous belt C, 619. Cylinder support bracket, 620. Movable rotating shaft, 621. Switch bracket, 622. Proximity switch, 623. Motor B, 624. Roller support frame, 625. Coupling B, 626. Mounting base, 627. Roller support plate A, 628. Connecting seat, 629. Transmission wheel support plate, 630. Pulley A, 10101. Heating rod A, 10102. Cleaning water inlet tank drain, 10103. Overflow drain pipe A, 10104. Pneumatic diaphragm valve B, 10105. Return pipe A, 10106. Top cover A, 10107. Temperature and level sensor A, 1 0108. Return chamber A, 10109. Pressure ring, 10110. Filter bag A, 10111. Cleaning water inlet tank, 10112. Water tank baffle, 10201. Overflow drain pipe B, 10202. Top cover B, 10203. Vertical pump mounting base, 10204. Return chamber B, 10205. Vertical pump outlet pipe, 10206. Pneumatic diaphragm valve C, 10207. Liquid level switch, 10208. Filter bag B, 10209. Filter basket, 10301. Cleaning tank inlet, 10302. Spray hood, 10303. Nozzle A, 10304. Upper spray pipe, 10305. Spray pipe mounting base, 10306. Lower spray pipe, 10307. Sensor mounting bracket, 10308.Fiber optic sensor, 10309. U-shaped pipe clamp, 10310. Lower spray baffle, 10311. Pressure gauge, 10312. Temperature sensor B, 10313. Manual ball valve B, 10314. Spray pipe inlet connector, 10315. Cleaning spray drain connector hole, 10316. Water baffle, 10317. Spray pipe bracket, 10501. Nozzle B, 11501. Mandrel, 11502. Conveyor pressure ring, 11503 60901. Limiting ring; 60902. Motor C; 60903. Motor mounting plate; 60904. Support leg; 60905. Roller conveyor support plate B; 60906. Roller conveyor connecting plate; 60907. Driven wheel B; 60908. Synchronous belt D; 60909. Drive shaft; 60910. Pulley mounting plate; 60911. Synchronous belt E; 60912. Pulley B; 60913. Coupling C. Detailed Implementation

[0055] The present invention will now be described in detail through specific embodiments, but this does not limit the scope of protection of the present invention. Unless otherwise specified, the components used in the present invention are commercially available.

[0056] This utility model provides a method for using a high-speed silicon wafer cleaning system, including the following steps:

[0057] Step 1: The loading device of the cleaning system transfers the incoming workpiece to the synchronous belt A of the conveying component of the loading conveyor guide mechanism via the loading robot and Bernoulli suction cup. After being aligned by the guide bar, it is conveyed to the cleaning mechanism.

[0058] Step 2: The silicon wafers to be cleaned are conveyed by the upper and lower conveyor rollers, and sequentially pass through the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism to achieve cleaning-oxidation-rinsing-drying. The cleaning mechanism, oxidation mechanism, and rinsing mechanism are equipped with ultrasonic components to assist in the overall cleaning, and water-blocking components are set to prevent interference between the mechanisms. The cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism use a main drive hexagonal shaft to drive the upper and lower conveyor rollers to achieve stable transmission. The upper conveyor roller of the upper layer has a floating structure to ensure stable transport of the silicon wafers.

[0059] Step 3: After the silicon wafers are dried, they are taken by a vision camera and removed by a waste discharge roller. The qualified silicon wafers are picked up by the discharge robot and placed on the sorting machine conveyor roller to be sent to the next process.

[0060] The water used in the cleaning, oxidation, and rinsing mechanisms is recycled. The cleaning mechanism is equipped with a cleaning inlet water tank and a cleaning spray water tank, the oxidation mechanism is equipped with an oxidation water tank, and the rinsing mechanism is equipped with a rinsing water tank and a rinsing spray water tank.

[0061] The cleaning water inlet tank is used to supply water to the cleaning tank in the cleaning mechanism, as well as the side spray and bottom spray of the cleaning tank. The water drained from the cleaning area of ​​the cleaning tank is returned to the cleaning water inlet tank, and after filtration, it is used as the water source to supply water to the cleaning tank, as well as the side spray and bottom spray of the cleaning tank.

[0062] The cleaning spray water tank is used to supply water to the spray area of ​​the cleaning tank in the cleaning mechanism. The drainage water from the spray area of ​​the oxidation tank is returned to the cleaning spray water tank, and after filtration, it is used as a water source to supply water to the spray area of ​​the cleaning tank.

[0063] The oxidation water tank is used to supply water to the oxidation tank. The drainage water in the middle of the oxidation tank is returned to the oxidation water tank and, after filtration, is used as a water source to supply water to the oxidation tank.

[0064] The rinsing spray water tank is used to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank. Part of the drainage water from the spray area of ​​the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank, and after filtration, it is used as a water source to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank for spraying.

[0065] The rinsing water tank supplies water to the rinsing tank of the rinsing mechanism. The drainage water from the rinsing tank at the rear terminal returns to the rinsing water tank. A flow meter is installed at the outlet of the rinsing water tank to monitor the water consumption.

[0066] The cleaning system can be equipped with an existing wafer inserter, which has a four-channel roller conveyor for feeding. After the silicon wafers are conveyed through the wafer inserter's roller conveyor, the feeding device transfers the workpiece silicon wafers to the cleaning mechanism.

[0067] The cleaning conditions in the cleaning tank of the cleaning mechanism are as follows: silicon wafer cleaning agent is added (to the cleaning inlet water tank), and the cleaning temperature is maintained at 40-60℃. The oxidation conditions in the oxidation tank of the oxidation mechanism are: hydrogen peroxide and sodium hydroxide are used together as oxidants (added to the oxidation water tank), and the oxidation temperature is maintained at 40-50℃. The rinsing tank of the rinsing mechanism uses pure water for rinsing, and the rinsing temperature is maintained at 50-60℃. The concentration of silicon wafer cleaning agent is 1-5 wt%, the concentration of hydrogen peroxide is 20 wt%, and the concentration of sodium hydroxide is 20 wt%. The silicon wafer cleaning agent and oxidant are added periodically according to the operating conditions.

[0068] Example 1

[0069] A high-speed silicon wafer cleaning system includes a feeding device 5, a cleaning mechanism 1, an oxidation mechanism 2, a rinsing mechanism 3, a drying mechanism 4, and a discharging device 6 arranged sequentially. The feeding device 5 feeds the silicon wafers to be cleaned into the inlet 10301 of the cleaning tank of the cleaning mechanism 1. The discharging device 6 checks whether the dried silicon wafers are qualified. Unqualified wafers are transferred through a waste removal component, while qualified wafers are transferred by the discharging device 6 to a buffer box 614 or a sorting machine conveyor roller 609. A partition is provided between the cleaning mechanism 1, the oxidation mechanism 2, the rinsing mechanism 3, and the drying mechanism 4. An elongated through-hole is provided for silicon wafer transport. Ultrasonic components are vertically installed in oxidation mechanism 2, rinsing mechanism 3, and cleaning mechanism 1. Spray components are installed at the front end of oxidation mechanism 2, rinsing mechanism 3, and cleaning mechanism 1 to spray the silicon wafers. Several upper and lower double-layer conveying rollers are provided in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4. The two layers of conveying rollers are guided and transferred to realize the sequential transfer of silicon wafers in cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 through a guide and transfer component. Water-blocking components are also provided in cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3.

[0070] The feeding device 5 is located in front of the cleaning mechanism 1. The feeding device 5 includes a feeding frame, a feeding robot 504 is installed on the upper part of the feeding frame, a Bernoulli suction cup A506 for transporting silicon wafers is installed at the bottom of the feeding robot 504, a water receiving box is installed at the lower part of the feeding frame, and several feeding conveying and guiding mechanisms for transporting and guiding silicon wafers are installed in front of the water receiving box. The conveying and guiding mechanisms are driven by a feeding motor 509 and a synchronous belt group.

[0071] The feeding, conveying, and guiding mechanism includes two sets of conveying components, which are arranged one in front of the other. The conveying component located in front is positioned directly opposite the inlet 10301 of the cleaning tank of the cleaning mechanism 1. A feeding motor 509 is located on one side of the conveying component in front, and a synchronous belt group is located on the other side. The two conveying components are connected by the synchronous belt group to achieve synchronous conveying. A guide strip 514 for guiding and adjusting silicon wafers is also provided at the front end of the conveying component in front.

[0072] The length of the front-mounted transport component may be different from or the same as the length of the rear-mounted transport component. This is to accommodate silicon wafers of different lengths for transport and buffering.

[0073] A feeding switch bracket is installed on the side of the rear conveyor assembly, and a feeding proximity switch is installed on the feeding switch bracket.

[0074] The conveying assembly includes a conveying bracket, with a pair of drive wheels at each end of the upper part of the conveying bracket. The two drive wheels on the same side of the upper part of the conveying bracket are connected by a synchronous belt A511. The drive wheels are mounted on the feeding conveyor base plate via drive wheel support seats 515.

[0075] The two sets of conveying components share a single feeding motor 509 for drive transmission. The output end of the feeding motor 509 is connected to one end of the main drive shaft 512. The main drive shaft 512 is sequentially connected to several transmission wheels on the conveying components and then connected to the driving pulley A523 of the synchronous belt set to achieve drive. The driven pulley A522 of the synchronous belt set is connected to the follower shaft 513. The other end of the follower shaft 513 is sequentially connected to several transmission wheels on another set of conveying components and then connected to the bearing 139.

[0076] Each of the front conveyor components has a guide bar 514 on both sides. The guide bar 514 has a tapered structure, with its pointed bottom corner located at the rear conveyor component. The front end of the guide bar 514 is fixed to the feeding conveyor base plate by a pin.

[0077] The material conveying and guiding mechanism is mounted on the feeding conveyor base plate. The feeding motor 509 is mounted on the feeding conveyor base plate via the feeding motor mounting base 510. The feeding conveyor base plate is mounted on the feeding frame.

[0078] The synchronous belt assembly includes a driving pulley A523, a driven pulley A522, and a tensioning pulley 524. The driving pulley A523 and driven pulley A522 are arranged side-by-side, and the tensioning pulley 524 is positioned below them. The driving pulley A523, driven pulley A522, and tensioning pulley 524 are connected by a synchronous belt B520. The driving pulley A523 and driven pulley A522 are mounted on a mounting plate 519 via brackets, and the tensioning pulley 524 is mounted on a tensioning pulley mounting plate 521 via brackets. The tensioning pulley mounting plate 521 is mounted on the mounting plate 519 via tensioning bolts 525. The mounting plate 519 is positioned on the feeding conveyor base plate. The tensioning bolts 525 pass through a tensioning bolt mounting block 526 and connect to the tensioning pulley mounting plate 521.

[0079] The number of conveying and guiding mechanisms can be set according to the working conditions.

[0080] The feeding frame includes an upper frame 501 and a lower frame 503, which are connected and fixed by a column 502.

[0081] The bottom of the loading robot 504 is equipped with a suction cup connecting plate 505. The loading robot 504 is connected to the Bernoulli suction cup A506 through the suction cup connecting plate 505. Each loading robot 504 is equipped with two Bernoulli suction cups A506 at its bottom.

[0082] The loading robot 504 is a parallel spider robot; the preferred model is: Qiaoshou QS-D3-XL600.

[0083] The water receiving box is provided with a water receiving box drain hole 517. The bottom of the water receiving box drain hole 517 is connected to the material discharge pipe. The material discharge pipe is provided with a manual ball valve A518.

[0084] The outer cover of the feeding motor 509 is equipped with a feeding motor protective cover 507. The outer cover of the synchronous belt assembly is equipped with a synchronous pulley protective cover 508.

[0085] Preferably, the main drive shaft 512 is connected to the rear drive wheel on the front transmission assembly, and the follower shaft 513 is connected to the front drive wheel on the rear transmission assembly.

[0086] The front end of the material conveying base plate is also equipped with a sensor baffle 516 for water blocking.

[0087] The cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 are each equipped with several upper and lower layer conveying rollers. The silicon wafers flow through the gap between the upper and lower layer conveying rollers. The two ends of the upper and lower layer conveying rollers are respectively set on the vertical support limiting plate. One end of the upper and lower layer conveying rollers is connected to the bearing 139, and the other end passes through the vertical support limiting plate and is connected to the main drive hexagonal shaft 126 in the guide transmission assembly to realize transmission.

[0088] The cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 share a main drive hexagonal shaft 126. The two ends of the main drive hexagonal shaft 126 are connected to the output ends of drive motor A138 and drive motor B406, respectively. Drive motor A138 is located outside the cleaning mechanism 1, and drive motor B406 is located outside the drying mechanism 4.

[0089] The drive motor A138 is mounted below the cleaning tank of the cleaning mechanism 1 via the drive motor mounting plate 130. The output end of the drive motor A138 is connected to the drive sprocket 131. The drive sprocket 131 and the drive driven sprocket 133 are connected via the drive chain 132. The drive driven sprocket 133 is mounted on the outer wall of the cleaning tank of the cleaning mechanism 1 via the sprocket fixing support plate 134. The drive driven sprocket 133 is connected to the main drive hexagonal shaft 126.

[0090] The drive motor B406 is mounted below the drying chamber of the drying mechanism 4 via the drive motor mounting plate 409. The output end of the drive motor B406 is connected to the drive drive wheel 407. The drive drive wheel 407 is connected to the drive driven wheel 410 via the chain 408. The drive driven wheel 410 is mounted on the outer wall of the drying chamber of the drying mechanism 4 via the sprocket mounting plate. The drive driven wheel 410 is connected to the main drive hexagonal shaft 126.

[0091] The upper and lower conveyor rollers are an upper conveyor roller 114 and a lower conveyor roller 115, respectively. The upper conveyor roller 114 is located above the lower conveyor roller 115. The guiding and transmission assembly includes a main drive hexagonal shaft 126, on which several driving bevel gears 127 are mounted. The driving bevel gears 127 mesh with driven bevel gears 128. The driving bevel gears 127 and driven bevel gears 128 are arranged perpendicularly to each other, with the driving bevel gears 127 vertically positioned and the driven bevel gears 128 horizontally positioned. One end of the upper conveyor roller 114 is connected to the driven gear 129, and one end of the lower conveyor roller 115 is connected to the driving gear 140. The driven gear 129 meshes with the driving gear 140, and the driven bevel gear 128 is located at the front end of the driving gear 140. The driving gear 140 and the driven bevel gear 128 are mounted on a spindle 11501.

[0092] The main drive hexagonal shaft 126 is installed in the side grooves 143 of the cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 through several main drive support seats 125. The two ends of the main drive hexagonal shaft 126 extend out of the cleaning mechanism 1 and the drying mechanism 4 respectively.

[0093] The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B. Vertical support limiting plate B is located on the side adjacent to the guide and transmission assembly. Vertical support limiting plates A and B face each other. Vertical support limiting plate A includes a lower upright plate 146 and an upper upright plate 147. The upper upright plate 147 is located above the lower upright plate 146 and has several grooves. The distance between any two adjacent grooves is the same as the width of the ultrasonic transducer 137. Insert blocks 156 and blocking blocks 148 are installed in the grooves. Insert blocks 156 are located above the blocking blocks 148. The circular channel formed between the insert blocks 156 and the grooves allows the spindle 11501 of the lower conveying roller 115 to pass through. The circular channel formed between the bottom of the blocking blocks 148 and the insert blocks 156 allows the spindle 11501 of the lower conveying roller 115 to pass through. The upper plate is adjusted and connected to the lower plate by several adjusting bolts.

[0094] Drainage openings are provided on the lower upright plate 146 of vertical support limit plate A and vertical support limit plate B according to specific working conditions.

[0095] In cleaning mechanism 1, the height of vertical support limiting plate A is higher than the height of vertical support limiting plate B. In oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4, the height of vertical support limiting plate A is the same as the height of vertical support limiting plate B.

[0096] In the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3, a temperature sensor A136 and a liquid level float switch C142 are also installed on the vertical support limiting plate B. The temperature sensor A136 and the liquid level float switch C142 are arranged side by side. The temperature sensor A136 is connected to the vertical support limiting plate B through the temperature sensor fixing bracket 141, and the liquid level float switch C142 is connected to the vertical support limiting plate B through the liquid level float switch C142 fixing bracket.

[0097] The upper conveyor roller 114 includes a spindle 11501, on which several pressure components are arranged at equal intervals. Each pressure component includes a conveyor pressure ring 11502 and a limiting ring 11503, with a limiting ring 11503 at each end of the conveyor pressure ring 11502. The spindle 11501 is made of stainless steel. The conveyor pressure ring 11502 is made of PVDF material.

[0098] The lower conveyor roller 115 is a PP roller with an internal spindle 11501 and an outer circumference made of PP material. The spindle 11501 is a stainless steel shaft.

[0099] The ultrasonic component is located inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets 157, and several ultrasonic transducers 137 are arranged on the ultrasonic brackets 157. The ultrasonic transducers 137 are arranged continuously, and an ultrasonic groove 158 is arranged between two adjacent ultrasonic transducers 137. The spindles 11501 of the upper conveying roller 114 and the lower conveying roller 115 pass through the ultrasonic grooves 158 and are inserted into the vertical support limiting plate A or the vertical support limiting plate B.

[0100] A commercially available ultrasonic transducer 159 is installed inside the ultrasonic transducer box 137; an ultrasonic connecting tube 151 is preferably also provided on the top of the ultrasonic transducer box 137 for connection with an ultrasonic generator.

[0101] The cleaning mechanism 1 includes a cleaning tank, a cleaning inlet water tank 101, and a cleaning spray water tank 102. The cleaning tank is equipped with a spray zone and a cleaning zone, with a partition between the cleaning zone and the spray zone. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly A103 for spraying the silicon wafers. After spraying, the silicon wafers enter the cleaning zone for cleaning. Both the cleaning zone and the spray zone are equipped with upper and lower layers of conveyor rollers. Water-blocking components are installed at both the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The cleaning tank is equipped with side channels 143. 143 is located on the side of the spray area and the cleaning area; the upper part of the side groove 143 is used to place the guide and transfer components, and the bottom is used for drainage and return water; the cleaning inlet water tank 101 and the cleaning spray water tank 102 are located below the cleaning tank. The cleaning inlet water tank 101 is connected to the bottom of the cleaning tank to supply water to the cleaning tank, and the cleaning inlet water tank 101 is connected to the side of the cleaning tank to allow water to return. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 on the side of the cleaning tank to allow side spraying, and the cleaning spray water tank 102 is connected to the spray assembly A103 to supply water to the spray area. The cleaning tank is mounted on the cleaning frame 121.

[0102] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. Water-blocking components near the spray zone include an upper water-blocking roller A110 and a lower water-blocking roller 116. The upper water-blocking roller A110 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank. Water-blocking components near the oxidation mechanism 2 include an upper water-blocking roller B111 and a lower water-blocking roller 116. The upper water-blocking roller B111 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank.

[0103] The upper water-blocking rollers A110 and B111 are made of stainless steel mandrels with polypropylene sleeves on the outside, and PP sponge is then placed on the outside of the polypropylene sleeves. The lower water-blocking roller 116 is made of stainless steel mandrels with polypropylene sleeves on the outside.

[0104] The outer diameters of the upper water-blocking rollers A110 and B111 are larger than the outer diameter of the upper conveying roller 114, and the outer diameter of the lower water-blocking roller 116 is larger than the outer diameter of the lower conveying roller 115. The upper water-blocking rollers A110 and B111 are set at the same height.

[0105] An overflow guide pipe 135 is also provided at the front end of the side groove 143 in the cleaning area. The overflow guide pipe 135 is connected to the return pipe A10105 of the cleaning water inlet tank 101 to realize water return. The overflow guide pipe 135 and the return pipe A10105 together form the return guide component 107 to achieve stable water return.

[0106] When used in the cleaning tank, surface additives are added for cleaning the silicon wafers of workpiece 7. During actual cleaning, the cleaning spray side pipe 105 is set above the vertical support limiting plate A. The cleaning spray side pipe 105 sprays water, spraying the foam floating on the upper layer toward the side of the vertical support limiting plate B. The vertical support limiting plate A is higher than the vertical support limiting plate B. The foam is washed into the side groove 143 by the spray, thus removing the foam.

[0107] Several nozzles B10501 are installed on the cleaning spray side pipe 105.

[0108] The cleaning spray side pipe 105 is connected to the cleaning inlet water tank 101 via an auxiliary spray side pipe. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 in sequence via the main inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray side pipe. An auxiliary spray water valve 113 is installed on the auxiliary spray pipe.

[0109] The spray assembly A103 is connected to the cleaning spray water tank 102 via the cleaning spray area inlet pipe 104.

[0110] In the cleaning tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the oxidation mechanism 2 and the partition is provided with a cleaning drain outlet B150 at the bottom of the vertical support limiting plate B at this water-blocking area. The water-blocking area formed by the water-blocking plate 117 near the spray assembly A103 and the partition is provided with a cleaning drain outlet A144 at the bottom of the vertical support limiting plate B at this water-blocking area. Cleaning drain outlets B150 and A144 are connected to the side groove 143.

[0111] A cleaning tank outlet 120 is provided on the partition separating the cleaning tank from the oxidation tank of the oxidation mechanism 2.

[0112] The cleaning tank also includes a bottom plate 153. A bottom water inlet pipe is installed on the bottom plate 153, which is connected to a water tank 101. Several bottom cleaning spray pipes 155 are connected to the bottom water inlet pipe, and are perpendicular to the bottom water inlet pipe. Several bottom cleaning nozzles 154 are installed on each bottom cleaning spray pipe 155. The bottom cleaning spray pipes 155 are mounted on the bottom plate 153 via pipe clamps 152. The bottom cleaning spray pipes 155 are parallel to the partitions, and the nozzles of the bottom cleaning spray pipes 155 are positioned with their nozzles facing the gap between the upper conveying roller 114 and the lower conveying roller 115. A main water inlet is also installed on the bottom plate 153, which is connected to the water tank 101 via a bottom main water inlet pipe. A water inlet valve 112 is installed on the bottom main water inlet pipe. The bottom main water inlet pipe is connected to the cleaning water inlet tank 101 via the main water inlet pipe 122. The bottom cleaning water inlet main pipe is connected to the cleaning water inlet tank 101 via the auxiliary spray branch pipe. The cleaning water inlet tank 101 is connected to the bottom cleaning water inlet main pipe in sequence via the main water inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray branch pipe.

[0113] The bottom plate 153 of the cleaning tank is also connected to a drain pipe 124 for drainage. A pneumatic diaphragm valve A123 is installed on the drain pipe 124.

[0114] The upper conveying roller 114 and the lower conveying roller 115 do not contact the ultrasonic component.

[0115] A through hole is provided in the middle of the partition in the side groove 143 area of ​​the spray zone and the cleaning zone to guide the transmission component through.

[0116] The spray assembly A103 is disposed between two partitions. The outer partition has a cleaning tank inlet 10301, and the inner partition has a spray assembly A103 outlet. The inner partition is used to separate the spraying area and the cleaning area. The spray assembly A103 is separated from the lower part of the side groove 143 by a vertical support limiting plate B. However, a cleaning spray drain outlet 145 is provided below the vertical support limiting plate B in the area of ​​the spray assembly A103. A cleaning spray drain pipe 160 is provided on the outer wall of the side groove 143 corresponding to the spray assembly A103. The cleaning spray drain pipe 160 is connected to the cleaning spray drain pipe 106 to realize drainage in the area of ​​the spray assembly A103.

[0117] The spray assembly A103 includes an upper spray pipe 10304 and a lower spray pipe 10306. The upper spray pipe 10304 is positioned above the lower spray pipe 10306. The upper spray pipe 10304 and the lower spray pipe 10306 are connected by a spray connecting pipe. Both the upper spray pipe 10304 and the lower spray pipe 10306 are provided with a number of nozzles A10303. A baffle plate 10316 is provided at the front end of the upper spray pipe 10304. A number of fiber optic sensors 10308 are provided on the baffle plate 10316. A lower spray baffle plate 10310 is provided at the front end of the lower spray pipe 10306.

[0118] Several fiber optic sensors 10308 are mounted on the baffle plate 10316 via sensor mounting brackets 10307.

[0119] The water baffle 10316 is connected to the spray pipe bracket 10317. The water baffle 10316 has a Z-shaped structure, with its bottom and top plates angled for waterproofing. The lower spray baffle 10310 is installed on the bottom surface of the spray zone floor plate. The lower spray baffle 10310 has a Z-shaped structure, with its bottom and top plates angled for waterproofing.

[0120] The lower spray pipe 10306 is mounted on the bottom surface of the spray area base plate via the lower spray pipe mounting base 10305. The upper spray pipe 10304 is fixed to the spray pipe bracket 10317 above it via U-shaped pipe clamps 10309. The nozzle A10303 on the upper spray pipe 10304 is set downwards, and the nozzle A10303 on the lower spray pipe 10306 is set upwards.

[0121] The top of the spray assembly A103 is covered by a spray hood 10302, and a spray gripper is provided on the top surface of the spray hood 10302.

[0122] The spray pipe bracket 10317 is fixed on the cleaning frame.

[0123] The upper spray pipe 10304, the lower spray pipe 10306, and the spray connecting pipe are in a U-shaped structure. The upper spray pipe 10304 is also provided with a spray pipe water inlet pipe 10314 at the end that is not connected to the spray connecting pipe. The spray pipe water inlet pipe 10314 is set vertically and is connected to the water inlet pipe 104 of the cleaning spray area.

[0124] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the water inlet pipe 104 of the cleaning spray area, in the direction of water inlet.

[0125] The cleaning water inlet tank 101 includes a cleaning water inlet tank body 10111. A heating rod A10101 is installed at the bottom of the cleaning water inlet tank body 10111. A return chamber A10108 is installed above the heating rod A10101. The upper part of one end of the return chamber A10108 is connected to the return pipe A10105. The bottom of the other end of the return chamber A10108 is connected to the bottom of the cleaning water inlet tank body 10111 through a filter bag A10110. The filter bag A10110 is installed on the bottom surface of the return chamber A10108 through a pressure ring 10109.

[0126] A cleaning water pump 108 is installed on the side of the cleaning water inlet tank 101, and the cleaning water pump 108 is connected to the water outlet of the cleaning water inlet tank 101. The cleaning water pump 108 is installed on the main water inlet pipe 122.

[0127] A removable water tank baffle 10112 is also installed on the side wall of the cleaning water inlet tank 10111.

[0128] The cleaning water inlet tank 101 is also equipped with a temperature and level sensor A10107, which is inserted from the top of the cleaning water inlet tank 10111 into the lower part of the cleaning spray tank 102 but does not contact the bottom surface. A level float switch A118 is also installed in the lower part of the cleaning water inlet tank 101.

[0129] The top surface of the cleaning inlet tank 10111 is also provided with a top cover A10106, which is located above the filter bag A10110 in the return chamber A10108.

[0130] A cleaning water inlet tank drain port 10102 is provided on the bottom side of the cleaning water inlet tank body 10111. The cleaning water inlet tank drain port 10102 is connected to the cleaning water inlet tank drain pipe. A pneumatic diaphragm valve B10104 is provided on the cleaning water inlet tank drain pipe.

[0131] An overflow drain pipe A10103 is also connected to the upper side of the cleaning water inlet tank 10111.

[0132] The cleaning spray tank 102 includes a cleaning spray tank body, on which a cleaning spray water pump 109 is installed. The cleaning spray water pump 109 is vertically positioned and partially inserted into the cleaning spray tank body. The cleaning spray water pump 109 is connected to a vertical pump outlet pipe 10205 within the cleaning spray tank body. The vertical pump outlet pipe 10205 extends out of the top surface of the cleaning spray tank body and is configured to connect to the cleaning spray zone inlet pipe 104. A return chamber B10204 is also provided at the upper part of the cleaning spray tank body. A return water inlet is provided on the upper side of the return chamber B10204 for returning water. The bottom of the return chamber B10204 is connected to the bottom of the cleaning spray tank body through a filter bag B10208. The filter bag B10208 is mounted on the bottom surface of the return chamber B10204 through a pressure ring 10109. A filter basket 10209 is fitted over the filter bag. The upper part of the filter basket 10209 is set on the bottom surface of the reflux chamber B10204 via a pressure ring 10109.

[0133] The top surface of the cleaning spray box is also equipped with a top cover B10202, which is located above the filter bag B10208 in the return chamber B10204.

[0134] The lower part of the cleaning spray tank 102 is also equipped with two liquid level switches 10207, which are liquid level float switches B119.

[0135] The cleaning spray water pump 109 is connected to the cleaning spray box via the vertical pump mounting base 10203.

[0136] A cleaning spray tank drain outlet is provided on the bottom side of the cleaning spray tank. The cleaning spray tank drain outlet is connected to the cleaning spray tank drain pipe. A pneumatic diaphragm valve C10206 is installed on the cleaning spray tank drain pipe.

[0137] An overflow drain pipe B10201 is also connected to the upper side of the cleaning spray tank 102.

[0138] The oxidation mechanism 2 includes an oxidation tank and an oxidation water tank 201. The oxidation tank is equipped with a spray zone and an oxidation zone, with a partition between them. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly B202 to spray the silicon wafers. After spraying, the silicon wafers enter the oxidation zone for oxidation. Both the oxidation zone and the spray zone have upper and lower layers of conveyor rollers. Water-blocking components are installed at both the front and rear ends of the oxidation zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The oxidation tank has side channels 1. 43. Side groove 143 is located on the side of the oxidation zone and spray zone; the upper part of the side groove 143 is used to place the guide and transfer components, and the bottom is used for drainage and return water; the oxidation water tank 201 is located below the oxidation tank, and the oxidation water tank 201 is connected to the bottom of the oxidation tank to enable water inlet to the oxidation tank, and the oxidation water tank 201 is connected to the side of the oxidation tank to enable water return; the inlet of the cleaning spray water tank 102 is connected to the oxidation spray drain outlet 210 on the side wall of the side groove 143 in the spray zone of the oxidation tank to enable water supply to the spray zone of the cleaning tank. The oxidation tank is set on the oxidation frame.

[0139] The oxidation water tank 201 does not have a return pipe A10105 at the top; instead, the location of the return pipe A10105 is replaced with a return flow pipe. Other structural features are the same as those of the cleaning inlet water tank 101. The water-blocking components in the oxidation zone are the same as those in the cleaning zone.

[0140] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. The water-blocking components near the spray zone include an upper oxidation water-blocking roller A204 and a lower oxidation water-blocking roller. The upper oxidation water-blocking roller A204 is positioned above the lower oxidation water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower oxidation water-blocking roller, with the water-blocking plate 117 vertically mounted on the bottom plate of the oxidation tank. The water-blocking components near the rinsing mechanism 3 include an upper oxidation water-blocking roller B205 and a lower oxidation water-blocking roller. The upper oxidation water-blocking roller B205 is positioned above the lower oxidation water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower oxidation water-blocking roller, with the water-blocking plate 117 vertically mounted on the bottom plate of the oxidation tank.

[0141] The upper water-blocking rollers A204 and B205 are made of stainless steel core shafts with polypropylene sleeves around the outside, and PP sponge is then placed around the outside of the polypropylene sleeves. The lower water-blocking rollers are made of stainless steel core shafts with polypropylene sleeves around the outside.

[0142] The outer diameters of the upper water-blocking rollers A204 and B205 are larger than the outer diameter of the upper conveying roller 114, and the outer diameter of the lower water-blocking roller is larger than the outer diameter of the lower conveying roller 115. The upper water-blocking rollers A204 and B205 are set at the same height.

[0143] An oxidation reflux pipe 207 is also provided in the middle area of ​​the side tank 143 in the oxidation zone. The oxidation reflux pipe 207 is connected to the reflux pipe of the oxidation water tank 201 to realize water return.

[0144] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the inlet pipe 203 of the oxidation spray zone, in the direction of water inlet.

[0145] The spray assembly B202 is connected to the rinsing spray water tank 301 through the oxidation spray zone inlet pipe 203 to achieve spray water supply.

[0146] In the oxidation tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the rinsing mechanism 3 and the partition has an oxidation drain outlet A206 at the bottom of the vertical support limiting plate B. The water-blocking area formed by the water-blocking plate 117 near the spray assembly B202 has an oxidation drain outlet B208 at the bottom of the vertical support limiting plate B. Oxidation drain outlets A206 and B208 are connected to the side groove 143.

[0147] The oxidation tank outlet is provided on the partition separating the oxidation tank from the rinsing tank of the rinsing mechanism 3.

[0148] The oxidation tank also includes an oxidation tank bottom plate, on which an oxidation main water inlet is provided. The oxidation main water inlet is connected to the oxidation water tank through a bottom oxidation main water inlet pipe, and an oxidation water inlet valve is provided on the bottom oxidation main water inlet pipe.

[0149] The oxidation tank bottom plate is also connected to an oxidation tank drain pipe for drainage. A regulating valve is installed on the oxidation tank drain pipe. The regulating valve is a pneumatic diaphragm valve.

[0150] A through hole is provided in the middle of the partition plate in the side groove 143 area of ​​the oxidation zone and the spray zone to guide the transmission component through.

[0151] Spray assembly B202 has the same structure as spray assembly A103. The spray pipe inlet pipe of spray assembly B202 is connected to the oxidation spray zone inlet pipe 203, and the oxidation spray zone inlet pipe 203 is connected to the rinsing spray water tank 301 of the rinsing mechanism 3. Spray assembly B202 is set between two partitions. The outer partition is shared with the cleaning tank, and the inner partition is provided with the spray assembly B202 outlet. The inner partition is used to separate the spray zone and the oxidation zone. Spray assembly B202 is separated from the lower part of the side groove 143 by the vertical support limiting plate B. However, the oxidation spray drain port 210 is set below the vertical support limiting plate B in the area of ​​spray assembly B202. The oxidation spray drain pipe 209 is set on the outer wall of the side groove 143 corresponding to spray assembly B202. The oxidation spray drain pipe 209 is connected to the cleaning spray water tank 102 to realize the water supply to the area of ​​the cleaning tank spray assembly A103.

[0152] The rinsing mechanism 3 includes a rinsing tank, a rinsing spray water tank 301, and a rinsing water tank 302. The rinsing tank contains a spray zone and a rinsing zone, with a partition between them. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly C303 to spray the silicon wafers. After spraying, the silicon wafers enter the rinsing zone for rinsing. Both the rinsing and spray zones have upper and lower layers of conveyor rollers. Water-blocking components are installed at the front and rear ends of the rinsing zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The rinsing tank contains a side groove 143 located on the sides of the rinsing and spray zones. The upper part of the tank 143 is used to house the guiding and conveying components, while its bottom is used for drainage and return water. The rinsing water tank 302 and the rinsing spray water tank 301 are located below the rinsing tank. The rinsing water tank 302 is connected to the bottom of the rinsing tank to supply water to it, and connected to the side of the rinsing tank to allow water return. The rinsing spray water tank 301 is connected to the front side of the rinsing tank and to the rinsing spray drainage pipe 316 on the side wall of the tank 143 in the spray area of ​​the rinsing tank to allow water return. The outlet of the rinsing spray water tank 301 is connected to the rinsing oxidation inlet pipe 304 to supply water to the spray areas of both the rinsing tank and the oxidation tank. The rinsing tank is mounted on a rinsing frame.

[0153] The rinsing water tank 302 has the same structure as the oxidation water tank 201. The rinsing spray water tank 301 has the same structure as the cleaning spray water tank 102.

[0154] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. Water-blocking components near the spray zone include an upper rinsing water-blocking roller A306 and a lower rinsing water-blocking roller. The upper rinsing water-blocking roller A306 is positioned above the lower rinsing water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower rinsing water-blocking roller, with the water-blocking plate 117 vertically positioned on the bottom plate of the rinsing tank. Water-blocking components near the drying mechanism 4 include an upper rinsing water-blocking roller B307 and a lower rinsing water-blocking roller. The upper rinsing water-blocking roller B307 is positioned above the lower rinsing water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower rinsing water-blocking roller, with the water-blocking plate 117 vertically positioned on the bottom plate of the rinsing tank.

[0155] The upper water-blocking rollers A306 and B307 of the rinsing system are made of stainless steel core shafts with polypropylene sleeves around the outside, and PP sponge is then placed around the outside of the polypropylene sleeves. The lower water-blocking rollers of the rinsing system are made of stainless steel core shafts with polypropylene sleeves around the outside.

[0156] The outer diameters of the upper water-blocking rollers A306 and B307 in the rinsing process are larger than the outer diameter of the upper conveying roller 114, while the outer diameter of the upper water-blocking roller B307 is larger than that of the upper water-blocking roller A306. The outer diameter of the lower water-blocking roller in the rinsing process is larger than that of the lower conveying roller 115. The upper water-blocking rollers A306 and B307 in the rinsing process are set at different heights. The height of the upper water-blocking roller B307 is greater than that of the upper water-blocking roller A306.

[0157] The rinsing and oxidation inlet pipe 304 is connected to the rinsing spray zone inlet pipe 305 and the oxidation spray zone inlet pipe 203 respectively; the rinsing spray zone inlet pipe 305 is connected to the spray pipe inlet connector in the spray assembly C303, and the oxidation spray zone inlet pipe 203 is connected to the spray pipe inlet connector in the spray assembly B202.

[0158] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the water inlet pipe 305 of the rinsing spray area, in the direction of water inlet.

[0159] A rinsing return pipe A314 is also provided in the rear section of the side tank 143 in the rinsing area. The rinsing return pipe A314 is connected to the rinsing tank return water pipe 311 of the rinsing water tank 302 to realize water return. A rinsing return pipe B315 is also provided on the outer wall of the side tank 143 in the rinsing area near the spray area. The rinsing return pipe B315 is connected to the rinsing spray water tank 301 through the rinsing tank return pipe 312.

[0160] The spray assembly C303 is connected to the rinsing spray water tank 301 through the rinsing spray zone inlet pipe 305 to achieve spray water supply.

[0161] In the rinsing tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the drying mechanism 4 and the partition has a rinsing drain outlet B319 at its bottom. The water-blocking area formed by the water-blocking plate 117 near the spray assembly C303 has a rinsing drain outlet A318 at its bottom. Both rinsing drain outlets A318 and B319 are connected to the side groove 143.

[0162] A flow meter 308 is installed at the outlet of the rinsing water pump in the rinsing water tank 302 to monitor water consumption.

[0163] The rinsing tank outlet is provided on the partition separating the rinsing tank from the drying tank of the drying mechanism 4.

[0164] The rinsing tank also includes a bottom plate, on which a main rinsing inlet is provided. The main rinsing inlet is connected to the rinsing water pump outlet of the rinsing water tank 302 via a rinsing inlet pipe 309. A rinsing inlet valve is provided on the rinsing inlet pipe 309. The main rinsing inlet is located on the side near the drying mechanism 4.

[0165] The bottom plate of the rinsing tank is also connected to a rinsing tank drain pipe 310 for drainage. A regulating valve is installed on the rinsing tank drain pipe 310. The regulating valve is a pneumatic diaphragm valve.

[0166] A through hole is provided in the middle of the partition in the side groove 143 area between the rinsing zone and the spray zone to guide the passage of the conveying components.

[0167] Spray assembly C303 has the same structure as spray assembly A103. The spray pipe inlet pipe of spray assembly C303 is connected to the rinsing spray zone inlet pipe 305. The rinsing spray zone inlet pipe 305 is connected to the rinsing spray water tank 301 through the rinsing oxidation inlet pipe 304. The spray assembly C303 is positioned between two partitions. The outer partition is shared with the oxidation tank, while the inner partition has a discharge port for the spray assembly C303. The inner partition separates the spraying area from the rinsing area. The spray assembly C303 is separated from the lower part of the side trough 143 by a vertical support limiting plate B. However, a rinsing spray drain outlet 317 is located below the vertical support limiting plate B in the area of ​​the spray assembly C303. A rinsing spray drain pipe 316 is installed on the outer wall of the side trough 143 corresponding to the spray assembly C303. The rinsing spray drain pipe 316 is connected to the rinsing spray water tank 301 through a rinsing spray return pipe 313 to supply water to the spray assembly B202 and the spray assembly C303.

[0168] The drying mechanism 4 includes a drying tank, with a partition at each end of the drying tank. The partition is provided with a channel for silicon wafers to pass through. The partition near the rinsing mechanism 3 shares a partition with the rinsing mechanism 3. The channel on the other partition is used to convey the processed silicon wafers to the feeding device 6.

[0169] A drying zone is set up inside the drying tank, with upper and lower layers of conveyor rollers within the drying zone. Silicon wafers flow through the gap between these rollers. A side groove 143 is located on the side of the drying zone; the upper part of the side groove 143 is used to house guiding and transferring components, and the bottom is used for drainage. Several air knives 404 are installed within the drying zone, mounted on the bottom plate of the drying tank via air knife supports 402. The air knives 404 are connected to a fan 401 located below the drying tank body 405 via air ducts. The air knives 404 are arranged in upper and lower layers. The air outlets are positioned to face the gap between the upper and lower conveyor rollers.

[0170] The drying trough and fan 401 are installed on the drying rack.

[0171] The drying tank also includes a drying tank body 405, and a drying drain pipe 403 is connected to the bottom of the drying tank body 405.

[0172] The unloading device 6 includes an unloading frame 601. An unloading robot 602 for unloading and a vision camera group for inspecting silicon wafers are arranged on the upper part of the unloading frame 601. The vision camera group is located at the front end of the unloading robot 602. A bottom support plate is arranged on the bottom of the unloading frame 601. A waste removal conveyor roller 610, a positioning conveyor roller 612, and a gripping conveyor roller 611 are arranged sequentially on the bottom support plate. A buffer box 614 is arranged at the end of the gripping conveyor roller 611. A sorting machine conveyor roller 609 is arranged on the side adjacent to the gripping conveyor roller 611. A waste removal and lowering drive assembly is arranged below the waste removal conveyor roller 610 to tilt the waste removal conveyor roller 610 downward so that unqualified silicon wafers enter the waste box 613. The waste box 613 is also equipped at the front end of the waste removal and lowering drive assembly.

[0173] The waste removal conveyor roller 610 includes several feeding conveyor components and several waste removal conveyor components, with a waste removal and lowering drive component installed below each waste removal conveyor component.

[0174] Several material conveying components are mounted on the mounting base 626. The material conveying components are equidistantly arranged. Each material conveying component includes two roller support plates A627. The two roller support plates A627 are connected by a connecting seat 628, which is mounted on the mounting base 626. Each end of each roller support plate A627 is provided with a pulley A630. The pulleys A630 located on the same roller support plate A627 are connected by a synchronous belt C618.

[0175] A motor B623 is installed on the outer side of one of the several material conveying assemblies. The output of motor B623 is connected to the several material conveying assemblies via a material conveying drive shaft to achieve power transmission. Motor B623 is connected to the material conveying drive shaft via coupling B625. The bottom of motor B623 is fixed by a motor mounting bracket.

[0176] Several waste removal conveying components are equidistantly arranged. Each unloading conveying component includes two roller support plates A627. The two roller support plates A627 are connected by a connecting seat 628. A roller support frame 624 is provided on the outer side of one end of each roller support plate A627 to support the roller support plate A627. A pulley A630 is provided at each end of each roller support plate A627. The pulleys A630 located on the same roller support plate A627 are connected by a synchronous belt C618.

[0177] A motor A615 is installed on the outer side of one of the several waste removal conveying assemblies. The output of motor A615 is connected to the several waste removal conveying assemblies via a waste removal conveying drive shaft to achieve power transmission. Motor A615 and the waste removal conveying drive shaft are connected by coupling A617. The bottom of motor A615 is fixed by a motor A fixing bracket. The waste removal conveying drive shaft passes through the roller support frame 624 and is connected to pulley A630.

[0178] A switch bracket 621 is provided on the connecting seat 628 of the waste conveying assembly. A proximity switch 622 is provided on the switch bracket 621. The height of the proximity switch 622 is lower than the height of the roller support plate A627. The switch bracket 621 is located between the two roller support plates A627.

[0179] The removal and lowering drive assembly includes a waste removal cylinder 608, which is mounted on the bottom support plate via a cylinder support bracket 619. The front end of the cylinder rod of the waste removal cylinder 608 is connected to the bottom of the connecting seat 628 on the waste removal conveying assembly to drive the waste removal conveying assembly to move horizontally and downward.

[0180] Motor A615 is mounted on roller support frame 624 via motor mounting bracket 616. Roller support frame 624 and motor A615 are located at the same end.

[0181] The pulley A630 is mounted on the roller support plate A627 via the transmission wheel support plate 629.

[0182] The exhaust cylinder 608 is mounted on the cylinder support bracket 619 via a movable rotating shaft 620.

[0183] The gripping conveyor roller conveyor 611 includes several gripping conveyor belt groups, which are set on the bottom fixed frame and are equidistantly arranged. A gripping conveyor motor is set on the outer side of the outer gripping conveyor belt group. The output end of the gripping conveyor motor is connected to the several gripping conveyor belt groups through a gripping conveyor drive shaft to achieve transmission.

[0184] The gripping conveyor belt assembly includes two gripping conveyor belt pulley support plates, which are connected by a support plate connecting seat. The support plate connecting seat is set on the bottom fixed frame. Each gripping conveyor belt pulley support plate has a gripping conveyor belt pulley at each end. The two gripping conveyor belt pulleys on the same gripping conveyor belt pulley support plate are connected by a gripping conveyor belt synchronous belt.

[0185] The output end of the gripping conveyor motor is connected to the gripping conveyor drive shaft, and the gripping conveyor drive shaft is connected to several gripping conveyor pulleys on the same end.

[0186] The bottom of the gripping conveyor motor is fixed by setting a gripping conveyor motor fixing frame.

[0187] The positioning conveyor roller 612 includes several positioning conveyor belt groups, which are set on the bottom fixed frame and are equidistantly arranged. A positioning conveyor motor is set on the outer side of the outer positioning conveyor belt group. The output end of the positioning conveyor motor is connected to the several positioning conveyor belt groups through the positioning conveyor drive shaft to achieve transmission.

[0188] The positioning conveyor belt assembly includes two positioning conveyor belt pulley support plates, which are connected by a support plate connecting seat. The support plate connecting seat is set on the bottom fixed frame. Each positioning conveyor belt pulley support plate has a positioning conveyor belt pulley at each end. The positioning conveyor belt pulleys located on the same positioning conveyor belt pulley support plate are connected by a positioning conveyor belt synchronous belt.

[0189] The output end of the positioning conveyor motor is connected to the positioning conveyor drive shaft, and the positioning conveyor drive shaft is connected to several positioning conveyor pulleys at the same end.

[0190] The bottom of the positioning conveyor motor is fixed by setting a positioning conveyor motor fixing frame.

[0191] The sorting machine conveyor roller 609 includes several roller support plates B60904. Two roller support plates B60904 form a group. Each roller support plate B60904 has a pulley B60912 at both ends. The two pulleys B60912 on the same roller support plate B60904 are connected by a synchronous belt E60911. A motor C60901 is installed on the outermost roller support plate B60904. The output end of the motor C60901 is connected to the drive wheel B60906. The drive wheel B60906 is connected to the driven wheel B60907 by a synchronous belt D60908 to achieve transmission. The driven wheel B60907 is connected to the pulley B60912 on the roller support plate B60904 by a transmission shaft 60909.

[0192] Driven wheel B60907, drive shaft 60909, and pulley B60912 located at the same end have the same center. Two adjacent roller support plates B60904 that do not belong to the same group are connected to two drive shafts 60909 by coupling C60913.

[0193] The number of roller support plates B60904 is selected according to the actual working conditions. Four roller support plates B60904 are preferably set, and two roller support plates B60904 in a group are connected by a roller connecting plate B60905. The distance between two roller support plates B60904 in a group is less than the width of the silicon wafer in workpiece 7.

[0194] The bottom of the roller support plate B60904 is equipped with support legs 60903 to fix the sorting machine conveyor roller 609.

[0195] Motor C60901 is mounted on the adjacent roller support plate B60904 via motor mounting plate 60902. Drive wheel B60906 is mounted on motor mounting plate 60902 via mounting bracket.

[0196] The pulley B60912 is mounted on the roller support plate B60904 via the pulley mounting plate 60910.

[0197] The vision camera group includes vision camera A605 and vision camera B606; vision camera A605 is used to detect whether the silicon wafer is fragmented, and vision camera B606 is used to locate the position of the silicon wafer; vision camera A605 and vision camera B606 are respectively mounted on the unloading rack 601 via vision camera mounting bracket 604, and light source 607 is provided at adjacent positions of vision camera A605 and vision camera B606.

[0198] The bottom of the unloading robot 602 is connected to the Bernoulli suction cup B603 via a suction cup connecting transition plate, and two Bernoulli suction cups B603 are set on the bottom of each unloading robot 602.

[0199] The unloading robot 602 is a parallel spider robot; the preferred model is: Qiaoshou QS-D3-XL600.

[0200] The waste bin 613 is tilted at an angle of 15-30 degrees. The buffer bin 614 is also tilted at an angle of 15-30 degrees. The buffer bin 614 is mounted on the bottom support plate via a buffer bracket.

[0201] Furthermore, the workpiece 7 in this utility model is a silicon wafer.

[0202] This utility model is also equipped with a PLC control system, including the cleaning inlet water tank 101, cleaning spray water tank 102, spray assembly A103, cleaning water pump 108, cleaning spray water pump 109, cleaning inlet water valve 112, auxiliary spray water valve 113, level float switch A118, level float switch B119, pneumatic diaphragm valve A123, temperature sensor A136, ultrasonic generator, drive motor A138, level float switch C142, cleaning bottom nozzle 154, oxidation water tank 201, rinsing spray water tank 301, rinsing water tank 302, spray assembly B202, spray assembly C303, flow meter 308, fan 401, drive motor B406, loading robot 504, loading motor 509, unloading robot 602, and video... The following components are connected to the PLC control system: camera A605, vision camera B606, waste removal cylinder 608, sorting machine conveyor roller 609, waste removal conveyor roller 610, gripping conveyor roller 611, positioning conveyor roller 612, motor A615, proximity switch 622, motor B623, heating rod A10101, pneumatic diaphragm valve B10104, temperature and liquid level sensor A10107, pneumatic diaphragm valve C10206, liquid level switch 10207, nozzle A10303, fiber optic sensor 10308, pressure gauge 10311, temperature sensor B10312, nozzle B10501, motor C60901, feeding proximity switch, oxidation water inlet valve, regulating valve, rinsing water inlet valve, gripping conveyor motor, and positioning conveyor motor. No specific model is required; the only requirement is to achieve the desired function.

[0203] Example 2

[0204] Example 1 describes a high-speed silicon wafer cleaning system that can be configured in two ways, either side-by-side or in an upper and lower layer. When configured in an upper and lower layer, the water tanks of the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3 can share the water tank of the lower layer.

[0205] In specific operation: The loading device 5 transfers the silicon wafer 7 from the existing wafer inserter (the commercially available product is not the point of this utility model application, but is only used to explain the operation). The loading device 5 then uses the Bernoulli suction cup A506 at the bottom of the loading robot 504 to transport the silicon wafer 7 to the loading conveyor guide mechanism. The Bernoulli suction cup A506 transports the silicon wafer 7 to the conveyor assembly located behind it. A loading proximity switch is set on its side. After the silicon wafer 7 is in place, the Bernoulli suction cup A506 at the bottom of the loading robot 504 is released, and the loading motor 509 starts to work. With the cooperation of the synchronous belt group, the two sets of conveyor assemblies are driven to synchronously transmit the silicon wafer 7. The silicon wafer 7 is guided into the two guide bars 514 by the bottom sharp corner of the guide bar 514. Due to the conical structure and the front pin connection and fixed setting, the silicon wafer 7 is gradually aligned during the transmission and its position is adjusted to be correct. During the transmission, the silicon wafer 7, which has been adjusted to be correct, is conveyed to the cleaning tank inlet 10301 in the cleaning mechanism 1 through the conveyor assembly located in front. The sensor-mounted water baffle 516 significantly reduces water entering the cleaning mechanism 1. The silicon wafer 7 is conveyed from the feeding device 5 to the cleaning mechanism 1. Driven by drive motors A138 and B406, the main drive hexagonal shaft 126 is simultaneously driven, which in turn sequentially drives the active bevel gear 127, driven bevel gear 128, active gear 140, and driven gear 129 to rotate. This, in turn, drives the silicon wafer 7 through the gap between the upper and lower conveyor rollers. Simultaneously, the vertically positioned ultrasonic component performs ultrasonic operation. The silicon wafer 7 sequentially passes through the cleaning mechanism 1 for cleaning, the oxidation mechanism 2 for oxidation, the rinsing mechanism 3 for rinsing, and the drying mechanism 4 for drying. During the cleaning process in the cleaning mechanism 1, the silicon wafer 7 first enters the spray assembly A103 in the spray zone. The fiber optic sensor 10308 feeds back the silicon wafer arrival signal to the PLC control system, which then issues the cleaning spray instructions. The water tank 102 is instructed to spray water from the nozzle A10303 onto the silicon wafer 7 from top to bottom. The sprayed water is drained through the cleaning spray drain pipe 160 and cleaning spray drain pipe 106 set on the outer wall along the bottom of the side groove 143 corresponding to the spray area. After being sprayed, the silicon wafer 7 passes through a two-layer conveyor roller and then between the upper cleaning water-blocking roller A110 and the lower cleaning water-blocking roller 116 before entering the cleaning area for cleaning. After being cleaned with the surfactant solution in the cleaning area, the silicon wafer 7 passes through the upper cleaning water-blocking roller B111 and the lower cleaning water-blocking roller 116 and then through a two-layer conveyor roller before entering the oxidation mechanism 2 for oxidation. In the cleaning area of ​​the cleaning mechanism 1, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. The side spraying device in the cleaning mechanism 1 sprays the top layer of foam towards the side groove 143. The foam flows into the side groove and back into the cleaning water tank 101. It can be discharged through the overflow drain pipe A10103 in the cleaning water tank 101. The bottom spraying device in the cleaning mechanism 1 can remove small air bubbles from the silicon wafer 7.After being cleaned by the cleaning mechanism 1, the silicon wafers 7 enter the spray assembly B in the oxidation mechanism 2 through the outlet 120 of the cleaning tank for spraying. The conveying, ultrasonic, and water-blocking mechanisms are the same as those in the cleaning mechanism 1. After oxidation by the oxidation mechanism 1, the silicon wafers 7 enter the rinsing mechanism 3 for rinsing. The water flow direction in the rinsing is opposite to the flow direction of the silicon wafers 7, and the height of the water-blocking roller B307 in the rinsing is greater than the height of the water-blocking roller A306 in the rinsing. This reverse rinsing method ensures better rinsing results. After rinsing, the silicon wafers 7 enter the drying mechanism 4, where they are dried by the air knife 404 and then conveyed through the channel groove on the partition to the unloading device 6 for unloading. The water used in the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3 is recycled. The cleaning mechanism 1 is equipped with a cleaning inlet water tank 101 and a cleaning spray water tank 102, the oxidation mechanism 2 is equipped with an oxidation water tank 201, and the rinsing mechanism 3 is equipped with a rinsing water tank 302 and a rinsing spray water tank 301. The cleaning inlet water tank 101 supplies water to the cleaning tank in the cleaning mechanism 1, as well as to the side spray and bottom spray of the cleaning tank. The drainage water from the cleaning area of ​​the cleaning tank is returned to the cleaning inlet water tank 101, filtered, and then used as the water source for cleaning. The cleaning tank includes a spray tank for the cleaning tank and a bottom spray tank. The cleaning spray water tank 102 is used to supply water to the spray area of ​​the cleaning tank in the cleaning mechanism 1. The drainage water from the spray area of ​​the oxidation tank is returned to the cleaning spray water tank 102 and, after filtration, is used as a water source to supply water to the spray area of ​​the cleaning tank. The oxidation water tank 201 is used to supply water to the oxidation tank of the oxidation water tank 201. The drainage water from the middle of the oxidation tank is returned to the oxidation water tank 201 and, after filtration, is used as a water source to supply water to the oxidation tank. A flow meter 308 is installed at the outlet of the oxidation water tank 201 to monitor the water consumption. The rinsing spray water tank 301 is used to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank. The drainage water from the spray area of ​​the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank 301. After filtration, it is used as a water source to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank. The rinsing water tank 302 is used to supply water to the rinsing tank of the rinsing mechanism 3. The drainage water from the rinsing tank located at the rear end is returned to the rinsing water tank 302. A flow meter 308 is installed at the outlet of the rinsing water tank 302 to monitor the water consumption.

[0206] Silicon wafers 7 are transferred from the drying mechanism 4 to the waste removal conveyor roller 610. The vision camera group on the unloading device 6 takes pictures for inspection. When fragmented silicon wafers 7 pass through the waste removal conveyor component in the waste removal conveyor roller 610, the proximity switch 622 on the waste removal conveyor component detects the workpiece silicon wafer 7. The waste removal cylinder 608 in the waste removal lowering drive component retracts its cylinder rod, and the waste removal conveyor component tilts downwards to transfer the fragments to the waste box 613. The waste removal cylinder 608 extends its cylinder rod without affecting the subsequent transfer of silicon wafers 7. The vision camera group on the unloading device 6 takes pictures for inspection. Qualified silicon wafers 7 are transferred by the unloading robot 602 to the sorting machine conveyor roller 609 for the next process. Some qualified silicon wafers 7 that the unloading robot 602 cannot transfer in time are sent to the buffer box 614 via the gripping conveyor roller 611.

[0207] The embodiments described above are merely preferred embodiments of this utility model, and not all feasible embodiments of this utility model. For those skilled in the art, any obvious modifications made without departing from the principles and spirit of this utility model should be considered to be included within the scope of protection of the claims of this utility model.

Claims

1. A high-speed silicon wafer cleaning system, characterized in that, The system includes a feeding device (5), a cleaning mechanism (1), an oxidation mechanism (2), a rinsing mechanism (3), a drying mechanism (4), and a discharging device (6) arranged in sequence. The feeding device (5) is used to feed the silicon wafers to be cleaned into the inlet (10301) of the cleaning tank of the cleaning mechanism (1). The discharging device (6) is used to check whether the dried silicon wafers are qualified. Unqualified waste wafers are transferred through the waste removal component, and qualified silicon wafers are transferred to the buffer box (614) or the sorting machine conveyor roller (609) through the discharging device (6). A partition is set between the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3), and the drying mechanism (4). The partition is equipped with a device for silicon wafers. The wafer is transported through a long through hole, and ultrasonic components are vertically installed in the oxidation mechanism (2), rinsing mechanism (3), and cleaning mechanism (1). Spraying components are installed at the front end of the oxidation mechanism (2), rinsing mechanism (3), and cleaning mechanism (1) to spray the silicon wafer. Several upper and lower two-layer conveying rollers are installed in the cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4). The two-layer conveying rollers realize the sequential transfer of the silicon wafer in the cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4) through the guide and transfer components. Water-blocking components are also installed in the cleaning mechanism (1), oxidation mechanism (2), and rinsing mechanism (3).

2. The high-speed silicon wafer cleaning system as described in claim 1, characterized in that, The feeding device (5) is located in front of the cleaning mechanism (1). The feeding device (5) includes a feeding frame, a feeding robot (504) is located on the upper part of the feeding frame, a Bernoulli suction cup A (506) for transporting silicon wafers is located at the bottom of the feeding robot (504), a water receiving box is located at the lower part of the feeding frame, and several feeding conveying and guiding mechanisms for conveying and guiding silicon wafers are located in front of the water receiving box. The conveying and guiding mechanisms are driven by a feeding motor (509) and a synchronous belt group. The feeding conveying and guiding mechanism includes two sets of conveying components. The two sets of conveying components are arranged one in front of the other. The conveying component located in front is positioned directly opposite the cleaning tank inlet (10301) of the cleaning mechanism (1). A feeding motor (509) is located on one side of the conveying component located in front, and a synchronous belt group is located on the other side. The two conveying components are connected by the synchronous belt group to achieve synchronous conveying. A guide strip (514) for guiding and adjusting silicon wafers is also provided at the front end of the conveying component located in front.

3. The high-speed silicon wafer cleaning system as described in claim 1, characterized in that, The cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4) are each equipped with several upper and lower layer conveying rollers. The silicon wafers flow through the gap between the upper and lower layer conveying rollers. The two ends of the upper and lower layer conveying rollers are respectively set on the vertical support limiting plate. One end of the upper and lower layer conveying rollers is connected to the bearing (139), and the other end is inserted through the vertical support limiting plate and connected to the main drive hexagonal shaft (126) in the guide transmission assembly to realize transmission.

4. The high-speed silicon wafer cleaning system as described in claim 1, characterized in that, The cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4) share a main drive hexagonal shaft (126). The two ends of the main drive hexagonal shaft (126) are connected to the output ends of drive motor A (138) and drive motor B (406), respectively. Drive motor A (138) is located outside the cleaning mechanism (1), and drive motor B (406) is located outside the drying mechanism (4).

5. The high-speed silicon wafer cleaning system as described in claim 1, characterized in that, The upper and lower conveyor rollers are an upper conveyor roller (114) and a lower conveyor roller (115), respectively; the upper conveyor roller (114) is located above the lower conveyor roller (115); the guide transmission assembly includes a main drive hexagonal shaft (126), on which several driving bevel gears (127) are sleeved, and the driving bevel gears (127) mesh with driven bevel gears (128). The driving bevel gears (127) and driven bevel gears (128) are arranged perpendicular to each other. The bevel gear (127) is vertically arranged, and the driven bevel gear (128) is horizontally arranged; one end of the upper conveying roller (114) is connected to the driven gear (129), and one end of the lower conveying roller (115) is connected to the driving gear (140). The driven gear (129) meshes with the driving gear (140), and the driven bevel gear (128) is arranged at the front end of the driving gear (140). The driving gear (140) and the driven bevel gear (128) are arranged on a mandrel (11501). The main drive hexagonal shaft (126) is set in the side groove (143) of the cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3) and drying mechanism (4) through several main drive support seats (125). The two ends of the main drive hexagonal shaft (126) extend out of the cleaning mechanism (1) and the drying mechanism (4) respectively.

6. The high-speed silicon wafer cleaning system as described in claim 3, characterized in that, The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B; vertical support limiting plate B is located on the side adjacent to the guide transmission component, and vertical support limiting plate A and vertical support limiting plate B are arranged facing each other. Vertical support limiting plate A includes a lower upright plate (146) and an upper upright plate (147); the upper upright plate (147) is located above the lower upright plate (146), and several grooves are provided on the upper upright plate (147). The distance between every two adjacent grooves is the same as the width of the ultrasonic transducer (137); insert blocks (156) and block blocks (148) are provided in the grooves; insert blocks (156) are located in the block blocks (148). Above, the circular channel formed between the insert (156) and the groove is used for the passage of the spindle (11501) of the lower conveying roller (115); the circular channel formed between the bottom of the block (148) and the insert (156) is used for the passage of the spindle (11501) of the lower conveying roller (115); the upper plate is adjusted and connected to the lower plate by several adjusting bolts; in the cleaning mechanism (1), the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B; in the oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4), the height of the vertical support limiting plate A is the same as the height of the vertical support limiting plate B.

7. The high-speed silicon wafer cleaning system as described in claim 6, characterized in that, The ultrasonic component is set inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets (157), and several ultrasonic transducers (137) are set on the ultrasonic brackets (157). The several ultrasonic transducers (137) are set continuously. An ultrasonic groove (158) is set between two adjacent ultrasonic transducers (137). The spindles (11501) of the upper conveying roller (114) and the lower conveying roller (115) pass through the ultrasonic groove (158) and are inserted into the vertical support limiting plate A or the vertical support limiting plate B. The height of the upper water-blocking roller B (307) of the water-blocking component in the rinsing mechanism (3) is higher than the height of the upper water-blocking roller A (306).

8. The high-speed silicon wafer cleaning system as described in claim 6, characterized in that, The unloading device (6) includes an unloading frame (601). An unloading robot (602) for unloading and a vision camera group for inspecting silicon wafers are set on the upper part of the unloading frame (601). The vision camera group is set at the front end of the unloading robot (602). A bottom support plate is set on the bottom of the unloading frame (601). A waste removal conveyor roller (610), a positioning conveyor roller (612), and a gripping conveyor roller (611) are set sequentially on the bottom support plate. A buffer box (614) is set at the end of the gripping conveyor roller (611). A sorting machine conveyor roller (609) is set on the side adjacent to the gripping conveyor roller (611). A waste removal and lowering drive assembly is set below the waste removal conveyor roller (610) to tilt the waste removal conveyor roller (610) downward so that unqualified silicon wafers enter the waste box (613). A waste box (613) is also provided at the front end of the waste removal and lowering drive assembly.

9. A high-speed silicon wafer cleaning system as described in claim 6, characterized in that, The cleaning mechanism (1) includes a cleaning tank, a cleaning inlet water tank (101), and a cleaning spray water tank (102). The cleaning tank contains a spray zone and a cleaning zone, with a partition between the cleaning zone and the spray zone. A channel groove for the silicon wafer to pass through is provided on the partition. The spray zone is equipped with a spray assembly A (103) for spraying the silicon wafer. The sprayed silicon wafer enters the cleaning zone for cleaning. Both the cleaning zone and the spray zone are equipped with upper and lower layers of conveying rollers. Water-blocking components are provided at the front and rear ends of the cleaning zone. The silicon wafer flows through the gap between the upper and lower layers of conveying rollers. The cleaning tank contains a side groove (143). Located on the side of the spray zone and the cleaning zone; the upper part of the side groove (143) is used to place the guide and transfer components, and the bottom is used for drainage and return water; the cleaning inlet water tank (101) and the cleaning spray water tank (102) are set below the cleaning tank. The cleaning inlet water tank (101) is connected to the bottom of the cleaning tank to realize water inlet to the cleaning tank. The cleaning inlet water tank (101) is connected to the side of the cleaning tank to realize water return. The cleaning inlet water tank (101) is connected to the cleaning spray side pipe (105) on the side of the cleaning tank to realize side spraying. The cleaning spray water tank (102) is connected to the spray component A (103) to realize water supply to the spray zone.

10. A high-speed silicon wafer cleaning system as described in claim 9, characterized in that, The spray assembly A (103) includes an upper spray pipe (10304) and a lower spray pipe (10306). The upper spray pipe (10304) is located above the lower spray pipe (10306). The upper spray pipe (10304) and the lower spray pipe (10306) are connected by a spray connecting pipe. Both the upper spray pipe (10304) and the lower spray pipe (10306) are provided with a number of nozzles A (10303). A baffle plate (10316) is provided at the front end of the upper spray pipe (10304). A number of fiber optic sensors (10308) are provided on the baffle plate (10316). A lower spray baffle plate (10310) is provided at the front end of the lower spray pipe (10306).

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