A manual film pasting jig

Abstract

This utility model discloses a manual film-applying fixture, comprising: a main body with a top-opening receiving cavity and a connecting end within the receiving cavity; a magnet disposed within the receiving cavity and connected to the side wall of the receiving cavity; a sealing element disposed within the receiving cavity and located inside the magnet; and a blue film disposed at the bottom of a support ring, which is magnetically connected to the magnet. By adding a support ring, a magnet, and a sealing element, under the adsorption action of a vacuum device, the blue film on the support ring sinks from its center point, allowing the blue film to first contact the center point of the wafer at its center position, and then diffuse outwards in a circular manner to adhere the blue film to the wafer, thereby improving the film-applying speed and avoiding the generation of air bubbles.

Description

Technical Field

[0001] This utility model belongs to the field of film application equipment technology, and in particular relates to a manual film application fixture. Background Technology

[0002] The pressure sensor chip has a pressure-sensing film on its surface. Traditional laminating machines use rollers to flatten the blue film so that the thinned wafer and the blue film can be bonded together. The problem is that the pressure of the rollers will cause the adhesive layer of the blue film to come into contact with the sensing film of the wafer, resulting in bonding. During the bonding process, the adhesive layer of the blue film will damage the sensing film.

[0003] Foreign screen protector application fixtures use a method of manually applying the screen protector by drawing a cross with a cotton swab and then gradually drawing a circle. The advantage of this method is that because the technique is light, the adhesive layer of the blue film does not easily come into contact with the sensor film. The disadvantage is that the application speed is slow and air bubbles are easily formed. The air bubbles need to be manually popped with a needle after the film is applied and then the air is expelled with a cotton swab.

[0004] For example, a QFN film-applying fixture disclosed in patent number 201721587584.2 has a receiving groove on its main body. The bottom of the receiving groove is provided with a buffer layer to prevent the QFN chip from being crushed. The size of the receiving groove is larger than the size of the QFN chip but smaller than the size of the QFN frame. When the QFN chip is located in the receiving groove, the QFN frame is located at the top of the fixture body and is fixed by adsorption components. By providing a single receiving groove on the fixture body, an array of chips on the QFN can be accommodated simultaneously, eliminating the need to design multiple receiving grooves for different sizes of chips on the same QFN or different sizes of chips on different QFNs. Although it is suitable for multi-size chip operations, it still suffers from slow film application speed and a tendency to generate air bubbles. Utility Model Content

[0005] The purpose of this invention is to provide a manual film-applying tool to solve the technical problems of slow speed and easy generation of air bubbles in traditional film-applying equipment.

[0006] To solve the above-mentioned technical problems, the specific technical solution of this utility model is as follows:

[0007] In some embodiments of this application, a manual film-applying fixture is provided, comprising:

[0008] The main body has a receiving cavity with an opening at the top, and a connecting end is provided inside the receiving cavity;

[0009] A magnet, wherein the magnet is disposed within the receiving cavity and is connected to the side wall of the receiving cavity;

[0010] A sealing element, wherein the sealing element is disposed within the receiving cavity and is located inside the magnet;

[0011] A support ring, the bottom of which is provided with a blue film, which is magnetically connected to a magnet.

[0012] In some embodiments of this application, the connection end is connected to an external vacuum pumping device.

[0013] In some embodiments of this application, the main body is made of antistatic engineering plastic.

[0014] Compared with the prior art, the beneficial effects of this utility model are that the film-applying fixture of this utility model, by adding a support ring, a magnet and a sealing element, allows the blue film on the support ring to sink from the center point under the adsorption action of the vacuum equipment, so that the blue film first contacts the center point of the wafer at the center position, and then spreads outward in a circular manner to attach the blue film and the wafer, thereby improving the film-applying speed and avoiding the generation of air bubbles. Attached Figure Description

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0016] Figure 1 A schematic diagram of the wafer structure provided for an embodiment of this utility model;

[0017] Figure 2 Top view schematic diagrams of different sizes of jigs provided in embodiments of this utility model;

[0018] Figure 3 Top view schematic diagrams of different sizes of jigs provided in embodiments of this utility model;

[0019] Figure 4 This is a side view of the fixture structure provided in an embodiment of the present utility model;

[0020] Figure 5 This is a schematic diagram of step 1 in Example 1;

[0021] Figure 6 This is a schematic diagram of step 2 in Example 1;

[0022] Figure 7 This is a schematic diagram of step 3 in Example 1. Detailed Implementation

[0023] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0024] To better understand the purpose, structure, and function of this utility model, a more detailed description of this utility model is provided below with reference to the accompanying drawings.

[0025] Example 1

[0026] See appendix Figure 1-4 As shown, according to the embodiments of this application, it includes:

[0027] The main body 1 is a jig, and its appearance shape can be rectangular, polygonal, circular, irregular, etc. The main body 1 has a receiving cavity with an open top, and a connecting end 5 is provided in the receiving cavity. The shape of the corresponding receiving cavity can also be rectangular, polygonal, circular, irregular, etc., without limitation. It should be noted that the main body 1 is made of antistatic engineering plastic, and its receiving cavity is compatible with 6-inch and 8-inch wafers. The connecting end 5 can be provided on the side of the main body 1. The number of connecting ends 5 can be selected according to actual needs, without limitation.

[0028] Magnet 2, wherein the magnet 2 is disposed in the receiving cavity and is connected to the side wall of the receiving cavity;

[0029] Seal 3, which is disposed in the receiving cavity and is located inside the magnet 2;

[0030] The support ring 4 has a blue film at its bottom, which is magnetically connected to the magnet 2. The support ring 4 has a blue film on it. When the support ring 4 comes into contact with the magnet 2, it is attracted to the magnet 2. At the same time, a seal is formed between the support ring 4 and the sealing element 3. Then, a vacuum operation is performed on the space between the cavity and the blue film by a vacuum pumping device, so that the blue film is attached to the wafer surface.

[0031] The specific steps are as follows:

[0032] As attached Figure 5 As shown, step 1: Taking a 6-inch wafer as an example: place the thinned chip on the fixture;

[0033] As attached Figure 6 As shown, in step 2: place the support ring 4 with the blue film attached on the main body 1 in the direction shown in the figure. At this time, the magnet 2 on the main body 1 will attract the support ring 4, so that the sealing element 3 and the support ring 4 will form a seal.

[0034] As attached Figure 7 As shown, step 3: Turn on the vacuum pump (the vacuum level can be adjusted via the regulating valve; it should be 70% of the negative pressure test value detected by the pressure sensor, specifically determined according to the negative pressure design of the pressure sensor), allowing the blue film to descend from the center point and be applied to the wafer. Because the wafer is in a sealed environment, and the set negative pressure value is 70% of the wafer's maximum withstand pressure, it will not damage the product.

[0035] The technical effects achieved by the above technical solution in the embodiments of this application are as follows:

[0036] By adding a support ring 4, a magnet 2, and a sealing element 3, the blue film on the support ring 4 sinks from the center point under the adsorption of the vacuum equipment, so that the blue film contacts the center point of the wafer first, and then spreads outward in a circular manner to attach the blue film to the wafer. This achieves the effect of controlling the attachment effect, avoiding the generation of air bubbles, and improving the film attachment efficiency.

[0037] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0041] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A manual film-applying fixture, characterized in that, include: The main body has a receiving cavity with an opening at the top, and a connecting end is provided inside the receiving cavity; A magnet, wherein the magnet is disposed within the receiving cavity and is connected to the side wall of the receiving cavity; A sealing element, wherein the sealing element is disposed within the receiving cavity and is located inside the magnet; A support ring, the bottom of which is provided with a blue film, which is magnetically connected to a magnet.

2. The manual film-applying fixture according to claim 1, characterized in that, The connection end is connected to an external vacuum pumping device.

3. The manual film-applying fixture according to claim 1, characterized in that, The main body is made of antistatic engineering plastic.

Images