A hot plate cover

Abstract

This utility model relates to the field of wafer heating technology and discloses a heating plate cover, including a shell, a first heat insulation component, and a second heat insulation component. The first and second heat insulation components are arranged between the heating plate base and the inner cavity of the shell. The second heat insulation component is a vacuum shell structure. The second heat insulation component and the first heat insulation component are arranged alternately to form a heat insulation cavity. This utility model, through the two heat insulation components, maintains the heat inside the heating cavity, prevents heat loss, ensures uniform temperature inside the heating cavity, and improves the heating effect on the wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer heating technology, specifically a hot plate cover. Background Technology

[0002] During the wafer fabrication process, the wafer needs to be heated. The heating device is a hot plate structure. The existing hot plate includes a hot plate cover, a hot plate core, and a hot plate substrate. The hot plate core is embedded in the hot plate substrate. The hot plate cover and the hot plate substrate form a heating cavity in which the wafer is heated.

[0003] In existing technologies, the hot plate cover is equipped with an exhaust pipe to vent air from the hot plate during heating. However, the existing hot plate cover lacks a proper heat insulation structure, causing heat from the heating cavity to be transferred to the outside through the hot plate cover. This results in wasted heat and heat loss, leading to uneven temperature distribution within the heating cavity and affecting wafer processing performance. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a hot plate cover that solves the problem that existing hot plate covers lack a perfect heat insulation structure, causing heat in the heating cavity to be transferred to the outside through the hot plate cover, thus affecting the wafer processing effect.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A hot plate cover includes a shell, a first heat insulation component and a second heat insulation component. The first heat insulation component and the second heat insulation component are arranged between the hot plate base and the inner cavity of the shell. The first heat insulation component is a semi-enclosed cavity structure, and the second heat insulation component is a vacuum shell structure. The second heat insulation component and the first heat insulation component are arranged at intervals to form a heat insulation cavity.

[0007] Preferably, an exhaust component is provided on one side of the first heat insulation component. The exhaust component is used to exhaust the heating cavity formed by the first heat insulation component and the hot plate substrate. An air vent is connected to the exhaust component.

[0008] Preferably, a magnetic structure is provided on one side of the exhaust assembly, which can be magnetically connected to the hot plate base through the magnetic structure.

[0009] Preferably, the first heat insulation component has detachable plate-shaped parts on both sides, and the hot plate base is provided with a guide rail that slides and matches the plate-shaped parts, and the guide rail is arranged with a groove for limiting and inserting with the plate-shaped parts near the exhaust component.

[0010] Preferably, the exhaust assembly includes a main exhaust chamber and two partition plates with through holes. The through holes on the two partition plates are staggered. The two partition plates are spaced apart in the main exhaust chamber, and the main exhaust chamber is divided into a first connecting chamber and a second connecting chamber on both sides of the partition plates. The first connecting chamber is connected to the heating chamber, and the second connecting chamber is connected to the air outlet.

[0011] Preferably, a push-pull frame plate is fixedly provided on the outer wall of the main exhaust chamber, and two magnetic structures are symmetrically arranged on the end face of the push-pull frame plate near the first heat insulation component.

[0012] Preferably, the hot plate base has an opening on the side away from the exhaust assembly in the middle, for feeding a wafer workpiece into a placement groove arranged in the middle of the hot plate base. The hot plate base is also provided with no less than 4 connecting bases, and the connecting bases are fixedly provided with magnetically connected parts that are magnetically connected to the magnetic attraction mechanism.

[0013] Preferably, a support frame is fixedly connected to the lower end face of the second heat insulation component, and the support frame is detachably connected to the connecting base.

[0014] This utility model has the following beneficial effects:

[0015] The top cover of the hot plate uses a first heat insulation component as the first layer of insulation to prevent a large amount of heat from being transferred outwards, thus preventing uneven heat distribution within the heating cavity. The second heat insulation assembly is a vacuum shell structure. Since there is no heat transfer medium in a vacuum, the heat emitted from the first heat insulation component is isolated from the external environment, thereby concentrating the heat insulated cavity between the first and second heat insulation components and preventing heat loss. Furthermore, isolating the heat within this cavity reduces the temperature difference between the upper and lower sides of the first heat insulation component, further reducing heat loss through the first heat insulation component and increasing temperature uniformity. Additionally, isolating the heat within the heat insulated cavity keeps the first heat insulation component at a relatively high temperature, reducing the condensation of chemical substances generated during wafer heating onto the first heat insulation component and preventing contamination inside the heating cavity. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention after it is installed with the hot plate substrate from a first-view perspective.

[0017] Figure 2 This is a schematic diagram of the structure of the present invention after it is installed with the hot plate substrate from a second perspective.

[0018] Figure 3 This is a cross-sectional view of the present invention after installation with the hot plate substrate;

[0019] Figure 4 This is a schematic diagram of the disassembled structure of this utility model;

[0020] Figure 5This is a schematic diagram of the cross-sectional structure of the present invention after it is installed with the hot plate substrate in the AA direction.

[0021] In the figure: 1. Hot plate base; 11. Opening; 2. Connecting base; 3. First heat insulation component; 31. Plate-shaped component; 4. Air extraction component; 41. First connecting cavity; 42. Partition plate; 43. Main exhaust cavity; 44. Push-pull frame plate; 45. Second connecting cavity; 46. Magnetic structure; 5. Air outlet; 6. Second heat insulation component; 7. Support frame; 8. Outer shell. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] A hot plate cover includes a shell 8, a first heat insulation component 3 and a second heat insulation component 6. The first heat insulation component 3 and the second heat insulation component 6 are arranged between the hot plate base 1 and the inner cavity of the shell 8. The first heat insulation component 3 is a semi-enclosed cavity structure, and the second heat insulation component 6 is a vacuum shell structure. The second heat insulation component 6 and the first heat insulation component 3 are arranged at intervals to form a heat insulation cavity.

[0024] like Figure 1 , Figure 2 and Figure 3 As shown, in this technical solution, the first heat insulation component 3 serves as the first heat insulation structure, preventing a large amount of heat from being transferred outwards, thus avoiding uneven heat distribution within the heating cavity. The second heat insulation assembly is a vacuum shell structure. Since there is no heat transfer medium in a vacuum, the heat emitted from the first heat insulation component 3 can be isolated from the external environment, thereby concentrating the heat in the heat insulation cavity between the first heat insulation component 3 and the second heat insulation component 6, preventing heat loss. Furthermore, isolating the heat within this cavity reduces the temperature difference between the upper and lower sides of the first heat insulation component 3, further reducing heat loss through the first heat insulation component 3 and increasing temperature uniformity. Additionally, isolating the heat within the heat insulation cavity keeps the first heat insulation component 3 at a higher temperature, reducing the condensation of chemical substances generated during wafer heating on the first heat insulation component 3 and preventing contamination inside the heating cavity.

[0025] In the above technical solution, the first heat insulation component is a semi-enclosed cavity structure. In actual applications, the shape of the first heat insulation component can be designed according to needs and is not unique.

[0026] Specifically, such as Figure 3As shown, in this technical solution, an exhaust assembly is provided on one side of the first heat insulation component 3. The exhaust assembly is used to exhaust the heating cavity formed by the first heat insulation component 3 and the hot plate substrate 1. An air vent 5 is connected to the exhaust assembly. By using the exhaust assembly in conjunction with the air vent 5, the chemical substances generated during the heating process of the wafer in the heating cavity can be extracted.

[0027] Since chemicals located far from the exhaust assembly need to move from left to right, they inevitably come into contact with the first heat insulation component 3, thus adhering to it. The exhaust assembly also comes into contact with the chemicals, causing contamination. Therefore, it is necessary to ensure that the exhaust assembly and the first heat insulation component 3 can be easily disassembled for cleaning. In this technical solution, a magnetic structure 46 is provided on one side of the exhaust assembly, which can be magnetically connected to the hot plate base, as detailed below. Figure 5 As shown,

[0028] To ensure the smooth sliding of the first heat insulation component 3 and prevent it from moving during use, this technical solution provides detachable plate-shaped parts 31 on both sides of the first heat insulation component 3. A guide rail is provided on the heat plate base 1 to slide and match the plate-shaped parts 31, and a groove is arranged near the exhaust component on the guide rail to limit and insert into the plate-shaped parts 31, specifically as follows... Figure 4 As shown. By setting a guide rail on the hot plate base 1, and setting a groove in the guide rail, a plate-shaped member 31 is set at the corresponding position of the first heat insulation component 3. When the first heat insulation component 3 is installed, the groove and the plate-shaped member 31 cooperate to limit the first heat insulation component 3. When the first heat insulation component 3 needs to be replaced, it is only necessary to lift it slightly upward when pulling it out to separate the plate-shaped member 31 from the groove.

[0029] like Figure 5 As shown, in this technical solution, the exhaust assembly includes a main exhaust chamber 43 and two partition plates 42 with through holes. The through holes on the two partition plates 42 are staggered. The two partition plates 42 are arranged at intervals in the main exhaust chamber 43, and the main exhaust chamber 43 is divided into a first connecting chamber 41 and a second connecting chamber 45 on both sides of the partition plates 42. The first connecting chamber 41 is connected to the heating chamber, and the second connecting chamber 45 is connected to the air outlet 5.

[0030] In the above scheme, the two partition plates 42 can form a buffer zone between them, preventing the rapid loss of heat in the heating cavity. At the same time, the staggered arrangement of the through holes can slow down the flow between the first connecting cavity 41 and the buffer zone, thereby slowing down the heat loss from the second connecting cavity 45 and ensuring the uniformity of heating of the wafer workpiece in the heating cavity.

[0031] In this technical solution, a push-pull bracket plate 44 is fixedly installed on the outer wall of the main exhaust chamber 43, and two magnetic attraction structures 46 are symmetrically arranged on the end face of the push-pull bracket plate 44 near the first heat insulation component 3.

[0032] like Figure 4 As shown, in this technical solution, an opening 11 is provided on the side of the hot plate base 1 away from the exhaust assembly, for feeding the wafer workpiece into the placement groove arranged in the middle of the hot plate base 1. The hot plate base 1 is also provided with no less than 4 connecting bases 2, and a magnetically connected mating part for magnetic attraction mechanism is fixedly provided on the connecting base 2.

[0033] The opening 11 on the hot plate base 1 facilitates quick loading and unloading of workpieces. The connecting base 2 ensures stable installation with the second heat insulation component 6 and the exhaust component.

[0034] The lower end face of the second heat insulation component 6 is fixedly connected to a support frame 7, and the support frame 7 is detachably connected to the connecting base 2.

[0035] The first heat insulation component 3 is made of a material with moderate thermal conductivity and high temperature resistance, such as aluminum. The second heat insulation component 6 is a vacuum shell structure. Since there is no medium for heat transfer in a vacuum, the heat emitted from the first heat insulation component 3 can be isolated from the external environment. In this case, the second heat insulation component 6 can be made of stainless steel.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the phrase "comprising an element defined as..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A hot plate cover, characterized in that, It includes an outer shell, a first heat insulation component and a second heat insulation component. The first heat insulation component and the second heat insulation component are arranged between the hot plate base and the inner cavity of the outer shell. The second heat insulation component is a vacuum shell structure. The second heat insulation component and the first heat insulation component are arranged at intervals to form a heat insulation cavity.

2. The hot plate cover of claim 1, wherein: An exhaust assembly is provided on one side of the first heat insulation component. The exhaust assembly is used to exhaust the heating cavity formed by the first heat insulation component and the hot plate substrate. An air vent is connected to the exhaust assembly.

3. The hot plate cover according to claim 2, characterized in that: A magnetic structure is provided on one side of the exhaust assembly, which can be magnetically connected to the hot plate base.

4. The hot plate cover according to claim 3, characterized in that: The first heat insulation component has detachable plate-shaped parts on both sides. The hot plate base is provided with a guide rail that slides and matches the plate-shaped parts, and the guide rail is arranged with a groove for limiting and inserting with the plate-shaped parts near the exhaust component.

5. The hot plate cover according to any one of claims 2-4, characterized in that: The exhaust assembly includes a main exhaust chamber and two partition plates with through holes. The through holes on the two partition plates are staggered. The two partition plates are spaced apart in the main exhaust chamber, and the main exhaust chamber is divided into a first connecting chamber and a second connecting chamber on both sides of the partition plates. The first connecting chamber is connected to the heating chamber, and the second connecting chamber is connected to the air outlet.

6. The hot plate cover according to claim 5, characterized in that: A push-pull frame plate is fixedly installed on the outer wall of the main exhaust chamber, and two magnetic structures are symmetrically arranged on the end face of the push-pull frame plate near the first heat insulation component.

7. The hot plate cover according to claim 6, characterized in that: The hot plate base has an opening on the side away from the exhaust assembly in the middle, for feeding wafer workpieces into the placement slot arranged in the middle of the hot plate base. The hot plate base is also provided with no less than 4 connecting bases, and the connecting bases are fixedly provided with magnetically connected parts that are magnetically attracted to the magnetic attraction mechanism.

8. The hot plate cover according to claim 7, characterized in that: The lower end face of the second heat insulation component is fixedly connected to a support frame, and the support frame is detachably connected to the connecting base.

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