A cleaning machine

Abstract

This invention pertains to the field of silicon wafer cleaning in the photovoltaic industry and discloses a cleaning machine. It includes a cleaning mechanism, an oxidation mechanism, a rinsing mechanism, and a drying mechanism arranged sequentially. Silicon wafers to be cleaned enter through the inlet of the cleaning tank in the cleaning mechanism. A partition is installed between the cleaning, oxidation, rinsing, and drying mechanisms, with elongated through holes for wafer transport on the partition. Each of the oxidation, rinsing, and cleaning mechanisms has a vertically mounted ultrasonic component and a spray component at its front end to spray the silicon wafers. Each of the cleaning, oxidation, rinsing, and drying mechanisms has several upper and lower double-layered conveyor rollers, and a guiding transfer component enables the sequential transfer of silicon wafers between the cleaning, oxidation, rinsing, and drying mechanisms. Furthermore, water-blocking components are installed in the cleaning, oxidation, and rinsing mechanisms. This design enhances the cleaning effect, reduces the breakage rate, improves the pass rate, and lowers the overall equipment cost.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer cleaning in the photovoltaic industry, and relates to a cleaning machine. Background Technology

[0002] In the photovoltaic industry, current silicon wafer cleaning machines use a tank cleaning method. The operation involves placing the silicon wafers in a special cleaning basket, and then sequentially placing the basket into various cleaning tanks for immersion and cleaning. However, existing silicon wafer cleaning machines suffer from problems such as cleaning foam interference, high rinsing water consumption, and poor cleaning effect. Furthermore, the current cleaning process is not sequential, requiring auxiliary equipment for handling, which increases costs and work cycle time, and further increases the silicon wafer loss rate. If a single tank is used with existing rollers for transfer, the cleaning, oxidation, rinsing, and drying processes interfere with each other, leading to chaotic cleaning and poor results. In addition, the existing cleaning, oxidation, rinsing, and drying processes cannot recycle water, resulting in high cleaning costs. Moreover, the existing ultrasonic structure leads to even higher overall water consumption and poor ultrasonic effect. The overall fragmentation rate is extremely high during the transfer process. Utility Model Content

[0003] To overcome the shortcomings of existing technologies, this utility model provides a cleaning machine that enables continuous and stable transportation and uninterrupted cleaning of silicon wafers, reducing manual operation, greatly improving the degree of automation, and increasing equipment capacity. By using roller conveyors to transport silicon wafers, the basket method is eliminated, enhancing the cleaning effect, reducing the breakage rate, increasing the pass rate, and lowering the overall equipment cost.

[0004] The above-mentioned objective of this utility model is achieved through the following technical solution:

[0005] A cleaning machine includes a cleaning mechanism, an oxidation mechanism, a rinsing mechanism, and a drying mechanism arranged in sequence. Silicon wafers to be cleaned enter through the inlet of the cleaning tank in the cleaning mechanism. A partition is provided between the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism, with elongated through holes for silicon wafer transport on the partition. An ultrasonic component is vertically installed in each of the oxidation mechanism, rinsing mechanism, and cleaning mechanism. A spray component is installed at the front end of each of the oxidation mechanism, rinsing mechanism, and cleaning mechanism to spray the silicon wafers. Several upper and lower double-layered conveyor rollers are installed in each of the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism. The two layers of conveyor rollers are guided and transferred sequentially through the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism via a guide and transfer component. Water-blocking components are also installed in the cleaning mechanism, oxidation mechanism, and rinsing mechanism to achieve solution isolation and prevent solution overflow between different tanks.

[0006] Existing feeding devices or wafer inserters feed the silicon wafers to be cleaned into the inlet of the cleaning tank of the cleaning mechanism.

[0007] The advantages of this utility model compared with the prior art are:

[0008] This utility model provides a cleaning machine in which the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism are connected by a single main drive hexagonal shaft through a specially defined structure. This drives the upper and lower layers of conveyor rollers, making the overall transmission more stable, greatly reducing silicon wafer loss, and significantly improving work efficiency. Furthermore, the working cycle time is significantly increased, allowing for continuous operation without interference.

[0009] This utility model provides a cleaning machine with water-blocking components, partitions, and side grooves in the cleaning mechanism, oxidation mechanism, and rinsing mechanism, achieving precise separation. Combined with a cleaning inlet water tank and a cleaning spray water tank in the cleaning mechanism, an oxidation water tank in the oxidation mechanism, and a rinsing water tank and a rinsing spray water tank in the rinsing mechanism, this design prevents liquid mixing between the various mechanisms and allows for continuous flow. It eliminates the need for additional handling functions, additional handling robots, or trusses, reducing the upper operating space and making it more suitable for various workshop conditions.

[0010] This utility model provides a cleaning machine that innovatively reverses the water flow direction of the rinsing mechanism through a special structure with a water-blocking component, resulting in better rinsing and shorter rinsing time. Furthermore, the cleaning mechanism incorporates a special vertical support limiting plate structure and height setting, along with side and bottom spraying. The side spraying removes interference from foam generated by the silicon wafer cleaning agent (small air bubbles adhere to the bottom of the silicon wafer when it is immersed in the liquid in the cleaning zone), while the bottom spraying uses water to remove these small air bubbles from the silicon wafer surface, preventing the areas with attached air bubbles from fully contacting the cleaning agent. This significantly improves cleaning efficiency and reduces manual operation. No manual removal or machine shutdown is required, and the cleaning effect is excellent.

[0011] The cleaning machine provided by this utility model uses a circulating water system, which reduces the cost of water sources and the use of water tanks, thereby lowering costs. Furthermore, this design ensures that the drainage of each mechanism does not interfere with each other.

[0012] This utility model provides a cleaning machine with upper and lower layers of conveying rollers in its cleaning, oxidation, rinsing, and drying mechanisms. Through a developed structure, floating transmission is achieved, preventing excessive pressure that could cause fragmentation, while also ensuring stable conveying due to insufficient lightness, thus solving the problem of high fragmentation rates in existing conveying systems. Furthermore, the innovative vertically arranged ultrasonic components differ from existing horizontally arranged ultrasonic components. Horizontal arrangements require two layers, demanding higher water levels and increasing the number of ultrasonic components, leading to increased overall cost, higher losses, and lower ultrasonic efficiency. The vertically arranged ultrasonic components solve these problems, and the continuous structure provides better ultrasonic performance. Attached Figure Description

[0013] Figure 1 This is a front view of a cleaning machine according to this utility model.

[0014] Figure 2 This is a perspective view of a cleaning machine according to this utility model.

[0015] Figure 3 yes Figure 2 A diagram after removing the frame.

[0016] Figure 4 This is the front view of the cleaning mechanism of this utility model.

[0017] Figure 5 This is a top view of the cleaning mechanism of this utility model.

[0018] Figure 6 yes Figure 5 AA sectional view.

[0019] Figure 7 This is a perspective view of the cleaning mechanism in Embodiment 2 of this utility model.

[0020] Figure 8 yes Figure 5 3D image A after removing the top frame.

[0021] Figure 9 yes Figure 8 A magnified schematic diagram of region I in the image.

[0022] Figure 10 yes Figure 5 The 3D image B after removing the top frame.

[0023] Figure 11 This is a perspective view of the oxidation tank of this utility model.

[0024] Figure 12 yes Figure 11 A magnified schematic diagram of region I in the image.

[0025] Figure 13 This is a perspective view of the rinsing tank of this utility model.

[0026] Figure 14 yes Figure 13 A magnified schematic diagram of region I in the image.

[0027] Figure 15 This is a schematic diagram of the cleaning tank structure of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0028] Figure 16 yes Figure 15The diagrams show enlarged views of certain areas, with Figure A showing an enlarged view of area I and Figure B showing an enlarged view of area II.

[0029] Figure 17 This is a schematic diagram of the oxidation tank structure of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0030] Figure 18 This is a schematic diagram of the rinsing tank of this utility model. To clearly show the location of the water-blocking plate and the side structure, other components at the top and bottom are not shown.

[0031] Figure 19 This is a perspective view of the cleaning tank of this utility model.

[0032] Figure 20 This is a structural diagram of the cleaning tank.

[0033] Figure 21 Figure A is a structural schematic diagram of the vertical support limiting plate of this utility model, and Figure B is a structural schematic diagram of the vertical support limiting plate A.

[0034] Figure 22 This is a schematic diagram of the structure of the guide and transmission component of this utility model.

[0035] Figure 23 Figure A is a structural schematic diagram of the ultrasonic component of this utility model, wherein Figure B is a structural schematic diagram after removing one side of the ultrasonic baffle, and Figure B is a structural schematic diagram after not removing the ultrasonic baffle.

[0036] Figure 24 Figure A is a three-dimensional view of the spray assembly A of this utility model, Figure B is a three-dimensional view after removing the dust cover, and Figure C is a three-dimensional view after removing the dust cover and the vertical baffle.

[0037] Figure 25 This is a structural diagram of the cleaning inlet water tank, where Figure A is a 3D view and Figure B is a 3D view of the cleaning inlet water tank after the water tank baffle is removed.

[0038] Figure 26 This is a structural diagram of the cleaning spray tank, where Figure A is a three-dimensional view and Figure B is a cross-sectional view of Figure A.

[0039] Figure 27 This is a schematic diagram of the drying tank.

[0040] In the diagram: 1. Cleaning mechanism, 2. Oxidation mechanism, 3. Rinsing mechanism, 4. Drying mechanism, 7. Silicon wafer, 101. Cleaning inlet water tank, 102. Cleaning spray water tank, 103. Spray assembly A, 104. Cleaning spray area inlet pipe, 105. Cleaning spray side pipe, 106. Cleaning spray drain pipe, 107. Return guide, 108. Cleaning water pump, 109. Cleaning spray water pump, 110. Cleaning upper water-blocking roller A, 111. Cleaning upper water-blocking roller B, 112. Cleaning inlet water valve, 113. Auxiliary spray water valve, 114. Upper conveying roller, 115. Lower conveying roller, 116. Cleaning lower water-blocking roller, 117. Water-blocking plate, 118. Liquid level float switch A, 119. Liquid level float switch B, 120 121. Cleaning tank outlet; 122. Cleaning frame; 123. Main water inlet pipe; 124. Pneumatic diaphragm valve A; 125. Cleaning tank drain pipe; 126. Main drive support base; 127. Main drive hexagonal shaft; 128. Driving bevel gear; 129. Driven gear; 130. Drive motor mounting plate; 131. Drive driving sprocket; 132. Drive chain; 133. Drive driven sprocket; 134. Sprocket fixing support plate; 135. Overflow guide pipe; 136. Temperature sensor A; 137. Ultrasonic vibrator; 138. Drive motor A; 139. Bearing; 140. Driving gear; 141. Temperature sensor fixing bracket; 142. Liquid level float switch C; 143. Side tank; 144. 145. Cleaning drain outlet A; 146. Cleaning spray drain outlet; 147. Lower upright plate; 148. Upper upright plate; 149. Block; 150. Adjusting bolt hole; 151. Cleaning drain outlet B; 152. Ultrasonic connecting pipe; 153. Cleaning pipe clamp; 154. Cleaning tank bottom plate; 155. Cleaning bottom nozzle; 156. Cleaning bottom spray pipe; 157. Insert block; 158. Ultrasonic bracket; 159. Ultrasonic groove; 160. Ultrasonic transducer; 201. Cleaning spray drain pipe; 202. Oxidation water tank; 203. Spray assembly B; 204. Oxidation spray area inlet pipe; 205. Oxidation upper water-blocking roller A; 206. Oxidation upper water-blocking roller B; 207. Oxidation drain outlet A; 208. Oxidation return pipe; 209. Oxidation spray drain pipe, 210. Oxidation spray drain outlet, 301. Rinse spray water tank, 302. Rinse water tank, 303. Spray assembly C, 304. Rinse oxidation inlet pipe, 305. Rinse spray area inlet pipe, 306. Rinse upper water-blocking roller A, 307. Rinse upper water-blocking roller B, 308. Flow meter, 309. Rinse inlet pipe, 310. Rinse tank drain pipe, 311. Rinse tank return water pipe, 312. Rinse tank return pipe, 313. Rinse spray return pipe, 314. Rinse return pipe A, 315. Rinse return pipe B, 316. Rinse spray drain pipe, 317. Rinse spray drain outlet, 318. Rinse drain outlet A, 319. Rinse drain outlet B, 401.402. Fan, 403. Air knife bracket, 404. Drying drain pipe, 405. Air knife, 406. Drying tank body, 407. Drive motor B, 408. Drive drive wheel, 409. Chain, 410. Drive motor mounting plate, 10101. Drive driven wheel, 10101. Heating rod A, 10102. Cleaning water inlet tank drain port, 10103. Overflow drain pipe A, 10104. Pneumatic diaphragm valve B, 10105. Return pipe A, 10106. Top cover A, 10107. Temperature and liquid level sensor A, 10108. 10109. Return chamber A; 10110. Pressure ring; 10111. Filter bag A; 10111. Cleaning water inlet tank; 10112. Water tank baffle; 10201. Overflow drain pipe B; 10202. Top cover B; 10203. Vertical pump mounting base; 10204. Return chamber B; 10205. Vertical pump outlet pipe; 10206. Pneumatic diaphragm valve C; 10207. Liquid level switch; 10208. Filter bag B; 10209. Filter basket; 10301. Cleaning tank inlet; 10302. Spray hood; 103 03. Nozzle A, 10304. Upper spray pipe, 10305. Spray pipe mounting base, 10306. Lower spray pipe, 10307. Sensor mounting bracket, 10308. Fiber optic sensor, 10309. U-shaped pipe clamp, 10310. Lower spray baffle, 10311. Pressure gauge, 10312. Temperature sensor B, 10313. Manual ball valve B, 10314. Spray pipe inlet pipe, 10315. Cleaning spray drain pipe hole, 10316. Water baffle, 10317. Spray pipe bracket, 1050 1. Nozzle B; 11501. Mandrel; 11502. Conveyor Pressure Ring; 11503. Limit Ring; 60901. Motor C; 60902. Motor Mounting Plate; 60903. Support Leg; 60904. Roller Conveyor Support Plate B; 60905. Roller Conveyor Connecting Plate; 60906. Drive Wheel B; 60907. Driven Wheel B; 60908. Synchronous Belt D; 60909. Drive Shaft; 60910. Pulley Mounting Plate; 60911. Synchronous Belt E; 60912. Pulley B; 60913. Coupling C. Detailed Implementation

[0041] The present invention will now be described in detail through specific embodiments, but this does not limit the scope of protection of the present invention. Unless otherwise specified, the components used in the present invention are commercially available.

[0042] This utility model provides an operating method for a cleaning machine, including the following steps:

[0043] The silicon wafers to be cleaned are conveyed to the cleaning mechanism via an existing feeding mechanism or wafer inserter. The wafers are then conveyed sequentially through the cleaning mechanism, oxidation mechanism, rinsing mechanism, and drying mechanism by upper and lower conveyor rollers, achieving a cleaning-oxidation-rinsing-drying process. Ultrasonic components are installed in the cleaning, oxidation, and rinsing mechanisms to assist in overall cleaning, and water-blocking components prevent interference between mechanisms. A single main drive hexagonal shaft drives the upper and lower conveyor rollers for stable transmission. The upper conveyor roller in the upper layer has a floating structure to ensure stable wafer conveying. After drying, the wafers are conveyed to the next process via the existing unloading roller conveyor.

[0044] The water used in the cleaning, oxidation, and rinsing mechanisms is recycled. The cleaning mechanism is equipped with a cleaning inlet water tank and a cleaning spray water tank, the oxidation mechanism is equipped with an oxidation water tank, and the rinsing mechanism is equipped with a rinsing water tank and a rinsing spray water tank.

[0045] The cleaning water inlet tank is used to supply water to the cleaning tank in the cleaning mechanism, as well as the side spray and bottom spray of the cleaning tank. The water drained from the cleaning area of ​​the cleaning tank is returned to the cleaning water inlet tank, and after filtration, it is used as the water source to supply water to the cleaning tank, as well as the side spray and bottom spray of the cleaning tank.

[0046] The cleaning spray water tank is used to supply water to the spray area of ​​the cleaning tank in the cleaning mechanism. The drainage water from the spray area of ​​the oxidation tank is returned to the cleaning spray water tank, and after filtration, it is used as a water source to supply water to the spray area of ​​the cleaning tank.

[0047] The oxidation water tank is used to supply water to the oxidation tank. The drainage water in the middle of the oxidation tank is returned to the oxidation water tank and, after filtration, is used as a water source to supply water to the oxidation tank.

[0048] The rinsing spray water tank is used to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank. Part of the drainage water from the spray area of ​​the rinsing tank and the front end of the rinsing tank is returned to the rinsing spray water tank, and after filtration, it is used as a water source to supply water to the spray area of ​​the rinsing tank and the spray area of ​​the oxidation tank for spraying.

[0049] The rinsing water tank supplies water to the rinsing tank of the rinsing mechanism. The drainage water from the rinsing tank at the rear terminal returns to the rinsing water tank. A flow meter is installed at the outlet of the rinsing water tank to monitor the water consumption.

[0050] The cleaning system can be equipped with an existing wafer inserter, which has a four-channel roller conveyor for feeding. After the silicon wafers are conveyed through the wafer inserter's roller conveyor, the feeding device transfers the workpiece silicon wafers to the cleaning mechanism.

[0051] The cleaning conditions in the cleaning tank of the cleaning mechanism are as follows: silicon wafer cleaning agent is added (to the cleaning inlet water tank), and the cleaning temperature is maintained at 40-60℃. The oxidation conditions in the oxidation tank of the oxidation mechanism are: hydrogen peroxide and sodium hydroxide are used together as oxidants (added to the oxidation water tank), and the oxidation temperature is maintained at 40-50℃. The rinsing tank of the rinsing mechanism uses pure water for rinsing, and the rinsing temperature is maintained at 50-60℃. The concentration of silicon wafer cleaning agent is 1-5 wt%, the concentration of hydrogen peroxide is 20 wt%, and the concentration of sodium hydroxide is 20 wt%. The silicon wafer cleaning agent and oxidant are added periodically according to the operating conditions.

[0052] The cleaning machine has three different cleaning stations: a cleaning station implemented by the cleaning mechanism, an oxidation station implemented by the oxidation mechanism, and a rinsing station implemented by the rinsing mechanism. Each station is equipped with a corresponding water tank and water container (cleaning tank, oxidation tank, rinsing tank, cleaning inlet water tank, oxidation water tank, rinsing water tank) to receive the cleaning solution. Silicon wafers are immersed in the solution for cleaning when passing through the water tanks. The water inlet pipes connected to the water tanks (cleaning inlet water tank, oxidation water tank, rinsing water tank) are equipped with electric ball valves, which can control the valve opening to regulate the water flow rate. The water tanks (cleaning inlet tank, oxidation tank, and rinsing tank) are equipped with heaters to heat the liquid in the tanks to the temperature required for cleaning. Liquid level float switches in the water tanks (cleaning inlet tank, oxidation tank, and rinsing tank) are used to detect the liquid level and prevent the heaters from burning dry, the pump from drying out, or the water level from overflowing due to excessive heat. The water tanks (cleaning inlet tank, oxidation tank, and rinsing tank) have an upper overflow drain pipe and a bottom waste water tank drain pipe. When the water level in the tank is too high, the cleaning fluid and foam will overflow from the overflow drain pipe. When the water tank needs to drain the cleaning fluid, simply open the pneumatic diaphragm valve connected to the waste water tank drain pipe. The bottom spray of the cleaning mechanism is used to spray cleaning fluid to remove small air bubbles adhering to the bottom of the silicon wafers when they are immersed in water. The silicon wafer cleaning agent in the cleaning tank generates a large amount of foam during circulation. The side spray of the cleaning mechanism is used to spray and blow away the foam, returning it to the cleaning water tank to prevent foam accumulation in the cleaning tank. The cleaning tank is enclosed by water-blocking components to form a cleaning zone for storing cleaning fluid. The silicon wafers are conveyed through the cleaning zone by upper and lower conveyor rollers for immersion and cleaning. The cleaning fluid in the cleaning zone continuously seeps out from the gaps between the upper and lower water-blocking rollers A and B, and then into the side tank. The side tank is connected to return pipe A. After being filtered at the top of the cleaning water tank, the cleaning fluid returns to the bottom of the cleaning water tank. In the oxidation mechanism, oxidant needs to be added to the oxidation tank or the oxidation water tank. A pump connected to the oxidation water tank at the oxidation station draws the cleaning solution from the oxidation water tank into the oxidation tank. The cleaning solution then flows back to the oxidation water tank from the side tank for filtration, and after filtration, it flows back to the bottom of the oxidation water tank to form a cycle. The cleaning solution in the rinsing tank is pure water. After cleaning the silicon wafers, half of the cleaning solution in the rinsing tank is returned to the rinsing water tank, and the other half is returned to the rinsing spray water tank. The rinsing spray water tank is connected to a water pump, which then uses the cleaning solution for spraying in the spray areas of the oxidation and rinsing mechanisms. This is to prevent cross-contamination of cleaning solutions from different cleaning stations. The cleaning solution sprayed in the rinsing mechanism's spray area flows back to the rinsing spray water tank, and the cleaning solution sprayed in the oxidation mechanism's spray area flows back to the cleaning spray water tank of the cleaning mechanism for reuse. Finally, the wastewater is discharged through the cleaning spray drain pipe.

[0053] Example 1

[0054] A cleaning machine includes a cleaning mechanism 1, an oxidation mechanism 2, a rinsing mechanism 3, and a drying mechanism 4 arranged sequentially. A partition is provided between the cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4. The partition has elongated through holes for transporting silicon wafers. An ultrasonic component is vertically installed inside each of the oxidation mechanism 2, rinsing mechanism 3, and cleaning mechanism 1. A spray component is installed at the front end of each of the oxidation mechanism 2, rinsing mechanism 3, and cleaning mechanism 1 to spray the silicon wafers. Several upper and lower layered conveying rollers are installed inside each of the cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4. The two layers of conveying rollers are guided and transferred sequentially through the cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 via a guide and transfer component. A water-blocking component is also provided inside the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3 to block water.

[0055] The cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 are each equipped with several upper and lower layer conveying rollers. The silicon wafers flow through the gap between the upper and lower layer conveying rollers. The two ends of the upper and lower layer conveying rollers are respectively set on the vertical support limiting plate. One end of the upper and lower layer conveying rollers is connected to the bearing 139, and the other end passes through the vertical support limiting plate and is connected to the main drive hexagonal shaft 126 in the guide transmission assembly to realize transmission.

[0056] The cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 share a main drive hexagonal shaft 126. The two ends of the main drive hexagonal shaft 126 are connected to the output ends of drive motor A138 and drive motor B406, respectively. Drive motor A138 is located outside the cleaning mechanism 1, and drive motor B406 is located outside the drying mechanism 4.

[0057] The drive motor A138 is mounted below the cleaning tank of the cleaning mechanism 1 via the drive motor mounting plate 130. The output end of the drive motor A138 is connected to the drive sprocket 131. The drive sprocket 131 and the drive driven sprocket 133 are connected via the drive chain 132. The drive driven sprocket 133 is mounted on the outer wall of the cleaning tank of the cleaning mechanism 1 via the sprocket fixing support plate 134. The drive driven sprocket 133 is connected to the main drive hexagonal shaft 126.

[0058] The drive motor B406 is mounted below the drying chamber of the drying mechanism 4 via the drive motor mounting plate 409. The output end of the drive motor B406 is connected to the drive drive wheel 407. The drive drive wheel 407 is connected to the drive driven wheel 410 via the chain 408. The drive driven wheel 410 is mounted on the outer wall of the drying chamber of the drying mechanism 4 via the sprocket mounting plate. The drive driven wheel 410 is connected to the main drive hexagonal shaft 126.

[0059] The upper and lower conveyor rollers are an upper conveyor roller 114 and a lower conveyor roller 115, respectively. The upper conveyor roller 114 is located above the lower conveyor roller 115. The guiding and transmission assembly includes a main drive hexagonal shaft 126, on which several driving bevel gears 127 are mounted. The driving bevel gears 127 mesh with driven bevel gears 128. The driving bevel gears 127 and driven bevel gears 128 are arranged perpendicularly to each other, with the driving bevel gears 127 vertically positioned and the driven bevel gears 128 horizontally positioned. One end of the upper conveyor roller 114 is connected to the driven gear 129, and one end of the lower conveyor roller 115 is connected to the driving gear 140. The driven gear 129 meshes with the driving gear 140, and the driven bevel gear 128 is located at the front end of the driving gear 140. The driving gear 140 and the driven bevel gear 128 are mounted on a spindle 11501.

[0060] The main drive hexagonal shaft 126 is installed in the side grooves 143 of the cleaning mechanism 1, oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4 through several main drive support seats 125. The two ends of the main drive hexagonal shaft 126 extend out of the cleaning mechanism 1 and the drying mechanism 4 respectively.

[0061] The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B. Vertical support limiting plate B is located on the side adjacent to the guide and transmission assembly. Vertical support limiting plates A and B face each other. Vertical support limiting plate A includes a lower upright plate 146 and an upper upright plate 147. The upper upright plate 147 is located above the lower upright plate 146 and has several grooves. The distance between any two adjacent grooves is the same as the width of the ultrasonic transducer 137. Insert blocks 156 and blocking blocks 148 are installed in the grooves. Insert blocks 156 are located above the blocking blocks 148. The circular channel formed between the insert blocks 156 and the grooves allows the spindle 11501 of the lower conveying roller 115 to pass through. The circular channel formed between the bottom of the blocking blocks 148 and the insert blocks 156 allows the spindle 11501 of the lower conveying roller 115 to pass through. The upper plate is adjusted and connected to the lower plate by several adjusting bolts.

[0062] Drainage openings are provided on the lower upright plate 146 of vertical support limit plate A and vertical support limit plate B according to specific working conditions.

[0063] In cleaning mechanism 1, the height of vertical support limiting plate A is higher than the height of vertical support limiting plate B. In oxidation mechanism 2, rinsing mechanism 3, and drying mechanism 4, the height of vertical support limiting plate A is the same as the height of vertical support limiting plate B.

[0064] In the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3, a temperature sensor A136 and a liquid level float switch C142 are also installed on the vertical support limiting plate B. The temperature sensor A136 and the liquid level float switch C142 are arranged side by side. The temperature sensor A136 is connected to the vertical support limiting plate B through the temperature sensor fixing bracket 141, and the liquid level float switch C142 is connected to the vertical support limiting plate B through the liquid level float switch C142 fixing bracket.

[0065] The upper conveyor roller 114 includes a spindle 11501, on which several pressure components are arranged at equal intervals. Each pressure component includes a conveyor pressure ring 11502 and a limiting ring 11503, with a limiting ring 11503 at each end of the conveyor pressure ring 11502. The spindle 11501 is made of stainless steel. The conveyor pressure ring 11502 is made of PVDF material.

[0066] The lower conveyor roller 115 is a PP roller with an internal spindle 11501 and an outer circumference made of PP material. The spindle 11501 is a stainless steel shaft.

[0067] The ultrasonic component is located inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets 157, and several ultrasonic transducers 137 are arranged on the ultrasonic brackets 157. The ultrasonic transducers 137 are arranged continuously, and an ultrasonic groove 158 is arranged between two adjacent ultrasonic transducers 137. The spindles 11501 of the upper conveying roller 114 and the lower conveying roller 115 pass through the ultrasonic grooves 158 and are inserted into the vertical support limiting plate A or the vertical support limiting plate B.

[0068] A commercially available ultrasonic transducer 159 is installed inside the ultrasonic transducer box 137; an ultrasonic connecting tube 151 is preferably also provided on the top of the ultrasonic transducer box 137 for connection with an ultrasonic generator.

[0069] The cleaning mechanism 1 includes a cleaning tank, a cleaning inlet water tank 101, and a cleaning spray water tank 102. The cleaning tank is equipped with a spray zone and a cleaning zone, with a partition between the cleaning zone and the spray zone. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly A103 for spraying the silicon wafers. After spraying, the silicon wafers enter the cleaning zone for cleaning. Both the cleaning zone and the spray zone are equipped with upper and lower layers of conveyor rollers. Water-blocking components are installed at both the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The cleaning tank is equipped with side channels 143. 143 is located on the side of the spray area and the cleaning area; the upper part of the side groove 143 is used to place the guide and transfer components, and the bottom is used for drainage and return water; the cleaning inlet water tank 101 and the cleaning spray water tank 102 are located below the cleaning tank. The cleaning inlet water tank 101 is connected to the bottom of the cleaning tank to supply water to the cleaning tank, and the cleaning inlet water tank 101 is connected to the side of the cleaning tank to allow water to return. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 on the side of the cleaning tank to allow side spraying, and the cleaning spray water tank 102 is connected to the spray assembly A103 to supply water to the spray area. The cleaning tank is mounted on the cleaning frame 121.

[0070] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. Water-blocking components near the spray zone include an upper water-blocking roller A110 and a lower water-blocking roller 116. The upper water-blocking roller A110 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank. Water-blocking components near the oxidation mechanism 2 include an upper water-blocking roller B111 and a lower water-blocking roller 116. The upper water-blocking roller B111 is positioned above the lower water-blocking roller 116, and a water-blocking plate 117 is tangentially positioned below the lower water-blocking roller 116, vertically mounted on the bottom plate 153 of the cleaning tank.

[0071] The upper water-blocking rollers A110 and B111 are made of stainless steel mandrels with polypropylene sleeves on the outside, and PP sponge is then placed on the outside of the polypropylene sleeves. The lower water-blocking roller 116 is made of stainless steel mandrels with polypropylene sleeves on the outside.

[0072] The outer diameters of the upper water-blocking rollers A110 and B111 are larger than the outer diameter of the upper conveying roller 114, and the outer diameter of the lower water-blocking roller 116 is larger than the outer diameter of the lower conveying roller 115. The upper water-blocking rollers A110 and B111 are set at the same height.

[0073] An overflow guide pipe 135 is also provided at the front end of the side groove 143 in the cleaning area. The overflow guide pipe 135 is connected to the return pipe A10105 of the cleaning water inlet tank 101 to realize water return. The overflow guide pipe 135 and the return pipe A10105 together form the return guide component 107 to achieve stable water return.

[0074] When used in the cleaning tank, surface additives are added for cleaning the silicon wafers of workpiece 7. During actual cleaning, the cleaning spray side pipe 105 is set above the vertical support limiting plate A. The cleaning spray side pipe 105 sprays water, spraying the foam floating on the upper layer toward the side of the vertical support limiting plate B. The vertical support limiting plate A is higher than the vertical support limiting plate B. The foam is washed into the side groove 143 by the spray, thus removing the foam.

[0075] Several nozzles B10501 are installed on the cleaning spray side pipe 105.

[0076] The cleaning spray side pipe 105 is connected to the cleaning inlet water tank 101 via an auxiliary spray side pipe. The cleaning inlet water tank 101 is connected to the cleaning spray side pipe 105 in sequence via the main inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray side pipe. An auxiliary spray water valve 113 is installed on the auxiliary spray pipe.

[0077] The spray assembly A103 is connected to the cleaning spray water tank 102 via the cleaning spray area inlet pipe 104.

[0078] In the cleaning tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the oxidation mechanism 2 and the partition is provided with a cleaning drain outlet B150 at the bottom of the vertical support limiting plate B at this water-blocking area. The water-blocking area formed by the water-blocking plate 117 near the spray assembly A103 and the partition is provided with a cleaning drain outlet A144 at the bottom of the vertical support limiting plate B at this water-blocking area. Cleaning drain outlets B150 and A144 are connected to the side groove 143.

[0079] A cleaning tank outlet 120 is provided on the partition separating the cleaning tank from the oxidation tank of the oxidation mechanism 2.

[0080] The cleaning tank also includes a bottom plate 153. A bottom water inlet pipe is installed on the bottom plate 153, which is connected to a water tank 101. Several bottom cleaning spray pipes 155 are connected to the bottom water inlet pipe, and are perpendicular to the bottom water inlet pipe. Several bottom cleaning nozzles 154 are installed on each bottom cleaning spray pipe 155. The bottom cleaning spray pipes 155 are mounted on the bottom plate 153 via pipe clamps 152. The bottom cleaning spray pipes 155 are parallel to the partitions, and the nozzles of the bottom cleaning spray pipes 155 are positioned with their nozzles facing the gap between the upper conveying roller 114 and the lower conveying roller 115. A main water inlet is also installed on the bottom plate 153, which is connected to the water tank 101 via a bottom main water inlet pipe. A water inlet valve 112 is installed on the bottom main water inlet pipe. The bottom main water inlet pipe is connected to the cleaning water inlet tank 101 via the main water inlet pipe 122. The bottom cleaning water inlet main pipe is connected to the cleaning water inlet tank 101 via the auxiliary spray branch pipe. The cleaning water inlet tank 101 is connected to the bottom cleaning water inlet main pipe in sequence via the main water inlet pipe 122, the auxiliary spray pipe, and the auxiliary spray branch pipe.

[0081] The bottom plate 153 of the cleaning tank is also connected to a drain pipe 124 for drainage. A pneumatic diaphragm valve A123 is installed on the drain pipe 124.

[0082] The upper conveying roller 114 and the lower conveying roller 115 do not contact the ultrasonic component.

[0083] A through hole is provided in the middle of the partition in the side groove 143 area of ​​the spray zone and the cleaning zone to guide the transmission component through.

[0084] The spray assembly A103 is disposed between two partitions. The outer partition has a cleaning tank inlet 10301, and the inner partition has a spray assembly A103 outlet. The inner partition is used to separate the spraying area and the cleaning area. The spray assembly A103 is separated from the lower part of the side groove 143 by a vertical support limiting plate B. However, a cleaning spray drain outlet 145 is provided below the vertical support limiting plate B in the area of ​​the spray assembly A103. A cleaning spray drain pipe 160 is provided on the outer wall of the side groove 143 corresponding to the spray assembly A103. The cleaning spray drain pipe 160 is connected to the cleaning spray drain pipe 106 to realize drainage in the area of ​​the spray assembly A103.

[0085] The spray assembly A103 includes an upper spray pipe 10304 and a lower spray pipe 10306. The upper spray pipe 10304 is positioned above the lower spray pipe 10306. The upper spray pipe 10304 and the lower spray pipe 10306 are connected by a spray connecting pipe. Both the upper spray pipe 10304 and the lower spray pipe 10306 are provided with a number of nozzles A10303. A baffle plate 10316 is provided at the front end of the upper spray pipe 10304. A number of fiber optic sensors 10308 are provided on the baffle plate 10316. A lower spray baffle plate 10310 is provided at the front end of the lower spray pipe 10306.

[0086] Several fiber optic sensors 10308 are mounted on the baffle plate 10316 via sensor mounting brackets 10307.

[0087] The water baffle 10316 is connected to the spray pipe bracket 10317. The water baffle 10316 has a Z-shaped structure, with its bottom and top plates angled for waterproofing. The lower spray baffle 10310 is installed on the bottom surface of the spray zone floor plate. The lower spray baffle 10310 has a Z-shaped structure, with its bottom and top plates angled for waterproofing.

[0088] The lower spray pipe 10306 is mounted on the bottom surface of the spray area base plate via the lower spray pipe mounting base 10305. The upper spray pipe 10304 is fixed to the spray pipe bracket 10317 above it via U-shaped pipe clamps 10309. The nozzle A10303 on the upper spray pipe 10304 is set downwards, and the nozzle A10303 on the lower spray pipe 10306 is set upwards.

[0089] The top of the spray assembly A103 is covered by a spray hood 10302, and a spray gripper is provided on the top surface of the spray hood 10302.

[0090] The spray pipe bracket 10317 is fixed on the cleaning frame.

[0091] The upper spray pipe 10304, the lower spray pipe 10306, and the spray connecting pipe are in a U-shaped structure. The upper spray pipe 10304 is also provided with a spray pipe water inlet pipe 10314 at the end that is not connected to the spray connecting pipe. The spray pipe water inlet pipe 10314 is set vertically and is connected to the water inlet pipe 104 of the cleaning spray area.

[0092] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the water inlet pipe 104 of the cleaning spray area, in the direction of water inlet.

[0093] The cleaning water inlet tank 101 includes a cleaning water inlet tank body 10111. A heating rod A10101 is installed at the bottom of the cleaning water inlet tank body 10111. A return chamber A10108 is installed above the heating rod A10101. The upper part of one end of the return chamber A10108 is connected to the return pipe A10105. The bottom of the other end of the return chamber A10108 is connected to the bottom of the cleaning water inlet tank body 10111 through a filter bag A10110. The filter bag A10110 is installed on the bottom surface of the return chamber A10108 through a pressure ring 10109.

[0094] A cleaning water pump 108 is installed on the side of the cleaning water inlet tank 101, and the cleaning water pump 108 is connected to the water outlet of the cleaning water inlet tank 101. The cleaning water pump 108 is installed on the main water inlet pipe 122.

[0095] A removable water tank baffle 10112 is also installed on the side wall of the cleaning water inlet tank 10111.

[0096] The cleaning water inlet tank 101 is also equipped with a temperature and level sensor A10107, which is inserted from the top of the cleaning water inlet tank 10111 into the lower part of the cleaning spray tank 102 but does not contact the bottom surface. A level float switch A118 is also installed in the lower part of the cleaning water inlet tank 101.

[0097] The top surface of the cleaning inlet tank 10111 is also provided with a top cover A10106, which is located above the filter bag A10110 in the return chamber A10108.

[0098] A cleaning water inlet tank drain port 10102 is provided on the bottom side of the cleaning water inlet tank body 10111. The cleaning water inlet tank drain port 10102 is connected to the cleaning water inlet tank drain pipe. A pneumatic diaphragm valve B10104 is provided on the cleaning water inlet tank drain pipe.

[0099] An overflow drain pipe A10103 is also connected to the upper side of the cleaning inlet tank 10111.

[0100] The cleaning spray tank 102 includes a cleaning spray tank body, on which a cleaning spray water pump 109 is installed. The cleaning spray water pump 109 is vertically positioned and partially inserted into the cleaning spray tank body. The cleaning spray water pump 109 is connected to a vertical pump outlet pipe 10205 within the cleaning spray tank body. The vertical pump outlet pipe 10205 extends out of the top surface of the cleaning spray tank body and is configured to connect to the cleaning spray zone inlet pipe 104. A return chamber B10204 is also provided at the upper part of the cleaning spray tank body. A return water inlet is provided on the upper side of the return chamber B10204 for returning water. The bottom of the return chamber B10204 is connected to the bottom of the cleaning spray tank body through a filter bag B10208. The filter bag B10208 is mounted on the bottom surface of the return chamber B10204 through a pressure ring 10109. A filter basket 10209 is fitted over the filter bag. The upper part of the filter basket 10209 is set on the bottom surface of the reflux chamber B10204 via a pressure ring 10109.

[0101] The top surface of the cleaning spray box is also equipped with a top cover B10202, which is located above the filter bag B10208 in the return chamber B10204.

[0102] The lower part of the cleaning spray tank 102 is also equipped with two liquid level switches 10207, which are liquid level float switches B119.

[0103] The cleaning spray water pump 109 is connected to the cleaning spray box via the vertical pump mounting base 10203.

[0104] A cleaning spray tank drain outlet is provided on the bottom side of the cleaning spray tank. The cleaning spray tank drain outlet is connected to the cleaning spray tank drain pipe. A pneumatic diaphragm valve C10206 is installed on the cleaning spray tank drain pipe.

[0105] An overflow drain pipe B10201 is also connected to the upper side of the cleaning spray tank 102.

[0106] The oxidation mechanism 2 includes an oxidation tank and an oxidation water tank 201. The oxidation tank is equipped with a spray zone and an oxidation zone, with a partition between them. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly B202 to spray the silicon wafers. After spraying, the silicon wafers enter the oxidation zone for oxidation. Both the oxidation zone and the spray zone have upper and lower layers of conveyor rollers. Water-blocking components are installed at both the front and rear ends of the oxidation zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The oxidation tank has side channels 1. 43. Side groove 143 is located on the side of the oxidation zone and spray zone; the upper part of the side groove 143 is used to place the guide and transfer components, and the bottom is used for drainage and return water; the oxidation water tank 201 is located below the oxidation tank, and the oxidation water tank 201 is connected to the bottom of the oxidation tank to enable water inlet to the oxidation tank, and the oxidation water tank 201 is connected to the side of the oxidation tank to enable water return; the inlet of the cleaning spray water tank 102 is connected to the oxidation spray drain outlet 210 on the side wall of the side groove 143 in the spray zone of the oxidation tank to enable water supply to the spray zone of the cleaning tank. The oxidation tank is set on the oxidation frame.

[0107] The oxidation water tank 201 does not have a return pipe A10105 at the top; instead, the location of the return pipe A10105 is replaced with a return flow pipe. The other structural features are the same as those of the cleaning inlet water tank 101.

[0108] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. The water-blocking components near the spray zone include an upper oxidation water-blocking roller A204 and a lower oxidation water-blocking roller. The upper oxidation water-blocking roller A204 is positioned above the lower oxidation water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower oxidation water-blocking roller, with the water-blocking plate 117 vertically mounted on the bottom plate of the oxidation tank. The water-blocking components near the rinsing mechanism 3 include an upper oxidation water-blocking roller B205 and a lower oxidation water-blocking roller. The upper oxidation water-blocking roller B205 is positioned above the lower oxidation water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower oxidation water-blocking roller, with the water-blocking plate 117 vertically mounted on the bottom plate of the oxidation tank.

[0109] The upper water-blocking rollers A204 and B205 are made of stainless steel core shafts with polypropylene sleeves around the outside, and PP sponge is then placed around the outside of the polypropylene sleeves. The lower water-blocking rollers are made of stainless steel core shafts with polypropylene sleeves around the outside.

[0110] The outer diameters of the upper water-blocking rollers A204 and B205 are larger than the outer diameter of the upper conveying roller 114, and the outer diameter of the lower water-blocking roller is larger than the outer diameter of the lower conveying roller 115. The upper water-blocking rollers A204 and B205 are set at the same height.

[0111] An oxidation reflux pipe 207 is also provided in the middle area of ​​the side tank 143 in the oxidation zone. The oxidation reflux pipe 207 is connected to the reflux pipe of the oxidation water tank 201 to realize water return.

[0112] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the inlet pipe 203 of the oxidation spray zone, in the direction of water inlet.

[0113] The spray assembly B202 is connected to the rinsing spray water tank 301 through the oxidation spray zone inlet pipe 203 to achieve spray water supply.

[0114] In the oxidation tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the rinsing mechanism 3 and the partition has an oxidation drain outlet A206 at the bottom of the vertical support limiting plate B. The water-blocking area formed by the water-blocking plate 117 near the spray assembly B202 has an oxidation drain outlet B208 at the bottom of the vertical support limiting plate B. Oxidation drain outlets A206 and B208 are connected to the side groove 143.

[0115] The oxidation tank outlet is provided on the partition separating the oxidation tank from the rinsing tank of the rinsing mechanism 3.

[0116] The oxidation tank also includes an oxidation tank bottom plate, on which an oxidation main water inlet is provided. The oxidation main water inlet is connected to the oxidation water tank through a bottom oxidation main water inlet pipe, and an oxidation water inlet valve is provided on the bottom oxidation main water inlet pipe.

[0117] The oxidation tank bottom plate is also connected to an oxidation tank drain pipe for drainage. A regulating valve is installed on the oxidation tank drain pipe. The regulating valve is a pneumatic diaphragm valve.

[0118] A through hole is provided in the middle of the partition plate in the side groove 143 area of ​​the oxidation zone and the spray zone to guide the transmission component through.

[0119] Spray assembly B202 has the same structure as spray assembly A103. The spray pipe inlet pipe of spray assembly B202 is connected to the oxidation spray zone inlet pipe 203, and the oxidation spray zone inlet pipe 203 is connected to the rinsing spray water tank 301 of the rinsing mechanism 3. Spray assembly B202 is set between two partitions. The outer partition is shared with the cleaning tank, and the inner partition is provided with the spray assembly B202 outlet. The inner partition is used to separate the spray zone and the oxidation zone. Spray assembly B202 is separated from the lower part of the side groove 143 by the vertical support limiting plate B. However, the oxidation spray drain port 210 is set below the vertical support limiting plate B in the area of ​​spray assembly B202. The oxidation spray drain pipe 209 is set on the outer wall of the side groove 143 corresponding to spray assembly B202. The oxidation spray drain pipe 209 is connected to the cleaning spray water tank 102 to realize the water supply to the area of ​​the cleaning tank spray assembly A103.

[0120] The rinsing mechanism 3 includes a rinsing tank, a rinsing spray water tank 301, and a rinsing water tank 302. The rinsing tank contains a spray zone and a rinsing zone, with a partition between them. The partition has channels for silicon wafers to pass through. The spray zone is equipped with a spray assembly C303 to spray the silicon wafers. After spraying, the silicon wafers enter the rinsing zone for rinsing. Both the rinsing and spray zones have upper and lower layers of conveyor rollers. Water-blocking components are installed at the front and rear ends of the rinsing zone. The silicon wafers flow through the gap between the upper and lower layers of conveyor rollers. The rinsing tank contains a side groove 143 located on the sides of the rinsing and spray zones. The upper part of the tank 143 is used to house the guiding and conveying components, while its bottom is used for drainage and return water. The rinsing water tank 302 and the rinsing spray water tank 301 are located below the rinsing tank. The rinsing water tank 302 is connected to the bottom of the rinsing tank to supply water to it, and connected to the side of the rinsing tank to allow water return. The rinsing spray water tank 301 is connected to the front side of the rinsing tank and to the rinsing spray drainage pipe 316 on the side wall of the tank 143 in the spray area of ​​the rinsing tank to allow water return. The outlet of the rinsing spray water tank 301 is connected to the rinsing oxidation inlet pipe 304 to supply water to the spray areas of both the rinsing tank and the oxidation tank. The rinsing tank is mounted on a rinsing frame.

[0121] The rinsing water tank 302 has the same structure as the oxidation water tank 201. The rinsing spray water tank 301 has the same structure as the cleaning spray water tank 102.

[0122] Each water-blocking component has an upper conveying roller 114 and a lower conveying roller 115 on its outer side. Water-blocking components near the spray zone include an upper rinsing water-blocking roller A306 and a lower rinsing water-blocking roller. The upper rinsing water-blocking roller A306 is positioned above the lower rinsing water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower rinsing water-blocking roller, with the water-blocking plate 117 vertically positioned on the bottom plate of the rinsing tank. Water-blocking components near the drying mechanism 4 include an upper rinsing water-blocking roller B307 and a lower rinsing water-blocking roller. The upper rinsing water-blocking roller B307 is positioned above the lower rinsing water-blocking roller, and a water-blocking plate 117 is tangentially positioned below the lower rinsing water-blocking roller, with the water-blocking plate 117 vertically positioned on the bottom plate of the rinsing tank.

[0123] The upper water-blocking rollers A306 and B307 of the rinsing system are made of stainless steel core shafts with polypropylene sleeves around the outside, and PP sponge is then placed around the outside of the polypropylene sleeves. The lower water-blocking rollers of the rinsing system are made of stainless steel core shafts with polypropylene sleeves around the outside.

[0124] The outer diameters of the upper water-blocking rollers A306 and B307 in the rinsing process are larger than the outer diameter of the upper conveying roller 114, while the outer diameter of the upper water-blocking roller B307 is larger than that of the upper water-blocking roller A306. The outer diameter of the lower water-blocking roller in the rinsing process is larger than that of the lower conveying roller 115. The upper water-blocking rollers A306 and B307 in the rinsing process are set at different heights. The height of the upper water-blocking roller B307 is greater than that of the upper water-blocking roller A306.

[0125] The rinsing and oxidation inlet pipe 304 is connected to the rinsing spray zone inlet pipe 305 and the oxidation spray zone inlet pipe 203 respectively; the rinsing spray zone inlet pipe 305 is connected to the spray pipe inlet connector in the spray assembly C303, and the oxidation spray zone inlet pipe 203 is connected to the spray pipe inlet connector in the spray assembly B202.

[0126] A manual ball valve B10313, a pressure gauge 10311, and a temperature sensor B10312 are sequentially installed on the water inlet pipe 305 of the rinsing spray area, in the direction of water inlet.

[0127] A rinsing return pipe A314 is also provided in the rear section of the side tank 143 in the rinsing area. The rinsing return pipe A314 is connected to the rinsing tank return water pipe 311 of the rinsing water tank 302 to realize water return. A rinsing return pipe B315 is also provided on the outer wall of the side tank 143 in the rinsing area near the spray area. The rinsing return pipe B315 is connected to the rinsing spray water tank 301 through the rinsing tank return pipe 312.

[0128] The spray assembly C303 is connected to the rinsing spray water tank 301 through the rinsing spray zone inlet pipe 305 to achieve spray water supply.

[0129] In the rinsing tank, among the two water-blocking plates 117, the water-blocking area formed by the water-blocking plate 117 near the drying mechanism 4 and the partition has a rinsing drain outlet B319 at its bottom. The water-blocking area formed by the water-blocking plate 117 near the spray assembly C303 has a rinsing drain outlet A318 at its bottom. Both rinsing drain outlets A318 and B319 are connected to the side groove 143.

[0130] A flow meter 308 is installed at the outlet of the rinsing water pump in the rinsing water tank 302 to monitor water consumption.

[0131] The rinsing tank outlet is provided on the partition separating the rinsing tank from the drying tank of the drying mechanism 4.

[0132] The rinsing tank also includes a bottom plate, on which a main rinsing inlet is provided. The main rinsing inlet is connected to the rinsing water pump outlet of the rinsing water tank 302 via a rinsing inlet pipe 309. A rinsing inlet valve is provided on the rinsing inlet pipe 309. The main rinsing inlet is located on the side near the drying mechanism 4.

[0133] The bottom plate of the rinsing tank is also connected to a rinsing tank drain pipe 310 for drainage. A regulating valve is installed on the rinsing tank drain pipe 310. The regulating valve is a pneumatic diaphragm valve.

[0134] A through hole is provided in the middle of the partition in the side groove 143 area between the rinsing zone and the spray zone to guide the passage of the conveying components.

[0135] Spray assembly C303 has the same structure as spray assembly A103. The spray pipe inlet pipe of spray assembly C303 is connected to the rinsing spray zone inlet pipe 305. The rinsing spray zone inlet pipe 305 is connected to the rinsing spray water tank 301 through the rinsing oxidation inlet pipe 304. The spray assembly C303 is positioned between two partitions. The outer partition is shared with the oxidation tank, while the inner partition has a discharge port for the spray assembly C303. The inner partition separates the spraying area from the rinsing area. The spray assembly C303 is separated from the lower part of the side trough 143 by a vertical support limiting plate B. However, a rinsing spray drain outlet 317 is located below the vertical support limiting plate B in the area of ​​the spray assembly C303. A rinsing spray drain pipe 316 is installed on the outer wall of the side trough 143 corresponding to the spray assembly C303. The rinsing spray drain pipe 316 is connected to the rinsing spray water tank 301 through a rinsing spray return pipe 313 to supply water to the spray assembly B202 and the spray assembly C303.

[0136] The drying mechanism 4 includes a drying tank, with a partition at each end of the drying tank. The partition is provided with a channel for silicon wafers to pass through. The partition near the rinsing mechanism 3 shares a partition with the rinsing mechanism 3. The channel on the other partition is used to convey the processed silicon wafers to the feeding device 6.

[0137] A drying zone is set up inside the drying tank, with upper and lower layers of conveyor rollers within the drying zone. Silicon wafers flow through the gap between these rollers. A side groove 143 is located on the side of the drying zone; the upper part of the side groove 143 is used to house guiding and transferring components, and the bottom is used for drainage. Several air knives 404 are installed within the drying zone, mounted on the bottom plate of the drying tank via air knife supports 402. The air knives 404 are connected to a fan 401 located below the drying tank body 405 via air ducts. The air knives 404 are arranged in upper and lower layers. The air outlets are positioned to face the gap between the upper and lower conveyor rollers.

[0138] The drying trough and fan 401 are installed on the drying rack.

[0139] The drying tank also includes a drying tank body 405, and a drying drain pipe 403 is connected to the bottom of the drying tank body 405.

[0140] Furthermore, the workpiece 7 in this utility model is a silicon wafer.

[0141] This utility model is also equipped with a PLC control system, including the cleaning inlet water tank 101, cleaning spray water tank 102, spray assembly A103, cleaning water pump 108, cleaning spray water pump 109, cleaning inlet water valve 112, auxiliary spray water valve 113, level float switch A118, level float switch B119, pneumatic diaphragm valve A123, temperature sensor A136, ultrasonic generator, drive motor A138, level float switch C142, cleaning bottom nozzle 154, oxidation water tank 201, rinsing spray water tank 301, rinsing water tank 302, and spray... The following components are connected to the PLC control system: shower assembly B202, spray assembly C303, flow meter 308, fan 401, drive motor B406, heating rod A10101, pneumatic diaphragm valve B10104, temperature and level sensor A10107, pneumatic diaphragm valve C10206, level switch 10207, nozzle A10303, fiber optic sensor 10308, pressure gauge 10311, temperature sensor B10312, nozzle B10501, motor C60901, feeding proximity switch, oxidation water inlet valve, regulating valve, and rinsing water inlet valve. No specific model is required; the only requirement is to achieve the desired function.

[0142] Example 2

[0143] Example 1 describes a type of cleaning machine that can be set up in two, either side by side or in an upper and lower layer. When set up in an upper and lower layer, the water tanks of the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3 can share the water tank of the lower layer.

[0144] In specific operation: The silicon wafer 7 transferred from the existing wafer inserter (a commercially available product is not the subject of this utility model application, but is only used for illustrative purposes) is conveyed to the inlet 10301 of the cleaning tank in the cleaning mechanism 1. Driven by drive motors A138 and B406, the main drive hexagonal shaft 126 is simultaneously driven, which in turn sequentially drives the active bevel gear 127, driven bevel gear 128, active gear 140, and driven gear 129 to rotate. This, in turn, drives the silicon wafer 7 through the gap between the upper and lower conveyor rollers. The vertically arranged ultrasonic component performs ultrasonic operation. The silicon wafer 7 is sequentially cleaned by the cleaning mechanism 1, oxidized by the oxidation mechanism 2, rinsed by the rinsing mechanism 3, and dried by the drying mechanism 4. During the cleaning by the cleaning mechanism 1, the silicon wafer 7 first enters the spray component A103 in the spray area. The fiber optic sensor 10308 feeds back the silicon wafer arrival signal to the PLC control system, which then provides operating instructions for the cleaning spray tank 102. The nozzle A10303 sprays water onto the silicon wafer 7 from top to bottom. The sprayed water is drained through the cleaning spray drain pipe 160 and cleaning spray drain pipe 106 set on the outer wall along the bottom of the side groove 143 corresponding to the spray area. After being sprayed, the silicon wafer 7 passes through a two-layer conveyor roller and then between the upper cleaning water-blocking roller A110 and the lower cleaning water-blocking roller 116 before entering the cleaning area for cleaning. After being cleaned with the surfactant solution in the cleaning area, the silicon wafer 7 passes through the upper cleaning water-blocking roller B111 and the lower cleaning water-blocking roller 116 and then through a two-layer conveyor roller before entering the oxidation mechanism 2 for oxidation. In the cleaning area of ​​the cleaning mechanism 1, the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B. The side spray system in cleaning mechanism 1 blows the top layer of foam towards the side trough 143. The foam flows into the side trough and back into the cleaning water tank 101, where it can be discharged through the overflow drain pipe A10103. The bottom spray system in cleaning mechanism 1 removes small air bubbles from the silicon wafer 7. After cleaning by cleaning mechanism 1, the silicon wafer 7 enters the spray assembly B in oxidation mechanism 2 through the outlet 120 of the cleaning tank for spraying. Its conveying, ultrasonic, and water blocking functions are the same as those in cleaning mechanism 1. After oxidation by oxidation mechanism 1, the silicon wafer 7 enters the rinsing mechanism 3 for rinsing. The water flow direction of rinsing is opposite to the flow direction of silicon wafer 7, and the height of the water blocking roller B307 in rinsing is higher than that of the water blocking roller A306 in rinsing. This reverse rinsing provides a better rinsing effect. After rinsing, the silicon wafer 7 enters the drying mechanism 4, where it is dried by the air knife 404 and then conveyed through the channel groove on the partition to the unloading device 6 for unloading.The water used in the cleaning mechanism 1, oxidation mechanism 2, and rinsing mechanism 3 is recycled. The cleaning mechanism 1 is equipped with a cleaning inlet water tank 101 and a cleaning spray water tank 102, the oxidation mechanism 2 is equipped with an oxidation water tank 201, and the rinsing mechanism 3 is equipped with a rinsing water tank 302 and a rinsing spray water tank 301. The cleaning inlet water tank 101 supplies water to the cleaning tank in the cleaning mechanism 1, as well as to the side spray and bottom spray of the cleaning tank. The drainage water from the cleaning area of ​​the cleaning tank is returned to the cleaning inlet water tank 101, filtered, and then used as the water source for cleaning. The cleaning tank includes a spray tank for the cleaning tank and a bottom spray tank. The cleaning spray water tank 102 is used to supply water to the spray area of ​​the cleaning tank in the cleaning mechanism 1. The drainage water from the spray area of ​​the oxidation tank is returned to the cleaning spray water tank 102 and, after filtration, is used as a water source to supply water to the spray area of ​​the cleaning tank. The oxidation water tank 201 is used to supply water to the oxidation tank of the oxidation water tank 201. The drainage water from the middle of the oxidation tank is returned to the oxidation water tank 201 and, after filtration, is used as a water source to supply water to the oxidation tank. A flow meter 308 is installed at the outlet of the oxidation water tank 201 to monitor the water consumption. The rinsing spray water tank 301 supplies water to the spray areas of the rinsing tank and the oxidation tank. The drainage water from the spray areas of the rinsing tank and the front end of the rinsing tank returns to the rinsing spray water tank 301, where it is filtered and used as a water source for spraying the spray areas of the rinsing tank and the oxidation tank. The rinsing water tank 302 supplies water to the rinsing tank of the rinsing mechanism 3. The drainage water from the rinsing tank, located at the rear end, returns to the rinsing water tank 302. A flow meter 308 is installed at the outlet of the rinsing water tank 302 to monitor the water consumption. The silicon wafer 7 is transferred from the drying mechanism 4 to the next process.

[0145] The embodiments described above are merely preferred embodiments of this utility model, and not all feasible embodiments of this utility model. For those skilled in the art, any obvious modifications made without departing from the principles and spirit of this utility model should be considered to be included within the scope of protection of the claims of this utility model.

Claims

1. A cleaning machine, characterized in that, The process includes the following steps: a cleaning mechanism (1), an oxidation mechanism (2), a rinsing mechanism (3), and a drying mechanism (4) arranged in sequence; a partition is set between the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3), and the drying mechanism (4), and a long through hole is set on the partition for silicon wafer transport; an ultrasonic component is vertically set in the oxidation mechanism (2), the rinsing mechanism (3), and the cleaning mechanism (1); a spray component is set at the front end of the oxidation mechanism (2), the rinsing mechanism (3), and the cleaning mechanism (1) to spray the silicon wafer; several upper and lower two-layer conveying rollers are set in the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3), and the drying mechanism (4); the two-layer conveying rollers realize the sequential transfer of the silicon wafer in the cleaning mechanism (1), the oxidation mechanism (2), the rinsing mechanism (3), and the drying mechanism (4) through the guide and transfer component; and a water-blocking component is also set in the cleaning mechanism (1), the oxidation mechanism (2), and the rinsing mechanism (3).

2. The cleaning machine as described in claim 1, characterized in that, The cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4) are each equipped with several upper and lower layer conveying rollers. The silicon wafers flow through the gap between the upper and lower layer conveying rollers. The two ends of the upper and lower layer conveying rollers are respectively set on the vertical support limiting plate. One end of the upper and lower layer conveying rollers is connected to the bearing (139), and the other end is inserted through the vertical support limiting plate and connected to the main drive hexagonal shaft (126) in the guide transmission assembly to realize transmission.

3. The cleaning machine as described in claim 1, characterized in that, The cleaning mechanism (1) includes a cleaning tank, a cleaning inlet water tank (101), and a cleaning spray tank (102). A spray zone and a cleaning zone are set up inside the cleaning tank. A partition is set between the cleaning zone and the spray zone, and a channel groove for silicon wafers to pass through is set on the partition. A spray assembly A (103) is set up in the spray zone to spray the silicon wafers. After spraying, the silicon wafers enter the cleaning zone for cleaning. Both the cleaning zone and the spray zone are equipped with upper and lower layers of conveying rollers. Water-blocking components are set at the front and rear ends of the cleaning zone. The silicon wafers flow through the gap between the upper and lower layers of conveying rollers. A side groove (143) is set up inside the cleaning tank. The side groove (143) is positioned... On the sides of the spray area and the cleaning area; the upper part of the side groove (143) is used to place the guide and transfer components, and the bottom is used for drainage and return water; the cleaning inlet water tank (101) and the cleaning spray water tank (102) are set below the cleaning tank. The cleaning inlet water tank (101) is connected to the bottom of the cleaning tank to realize water inlet to the cleaning tank. The cleaning inlet water tank (101) is connected to the side of the cleaning tank to realize water return. The cleaning inlet water tank (101) is connected to the cleaning spray side pipe (105) on the side of the cleaning tank to realize side spraying. The cleaning spray water tank (102) is connected to the spray component A (103) to realize water supply to the spray area.

4. A cleaning machine as described in claim 1, characterized in that, The cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4) share a main drive hexagonal shaft (126). The two ends of the main drive hexagonal shaft (126) are connected to the output ends of drive motor A (138) and drive motor B (406), respectively. Drive motor A (138) is located outside the cleaning mechanism (1), and drive motor B (406) is located outside the drying mechanism (4).

5. A cleaning machine as described in claim 1, characterized in that, The upper and lower conveyor rollers are an upper conveyor roller (114) and a lower conveyor roller (115), respectively; the upper conveyor roller (114) is located above the lower conveyor roller (115); the guide transmission assembly includes a main drive hexagonal shaft (126), on which several driving bevel gears (127) are sleeved, and the driving bevel gears (127) mesh with driven bevel gears (128). The driving bevel gears (127) and driven bevel gears (128) are arranged perpendicular to each other. The bevel gear (127) is vertically arranged, and the driven bevel gear (128) is horizontally arranged; one end of the upper conveying roller (114) is connected to the driven gear (129), and one end of the lower conveying roller (115) is connected to the driving gear (140). The driven gear (129) meshes with the driving gear (140), and the driven bevel gear (128) is arranged at the front end of the driving gear (140). The driving gear (140) and the driven bevel gear (128) are arranged on a mandrel (11501). The main drive hexagonal shaft (126) is set in the side groove (143) of the cleaning mechanism (1), oxidation mechanism (2), rinsing mechanism (3) and drying mechanism (4) through several main drive support seats (125). The two ends of the main drive hexagonal shaft (126) extend out of the cleaning mechanism (1) and the drying mechanism (4) respectively.

6. A cleaning machine as described in claim 2, characterized in that, The vertical support limiting plate includes vertical support limiting plate A and vertical support limiting plate B; vertical support limiting plate B is located on the side adjacent to the guide transmission component, and vertical support limiting plate A and vertical support limiting plate B are arranged facing each other. Vertical support limiting plate A includes a lower upright plate (146) and an upper upright plate (147); the upper upright plate (147) is located above the lower upright plate (146), and several grooves are provided on the upper upright plate (147). The distance between every two adjacent grooves is the same as the width of the ultrasonic transducer (137); insert blocks (156) and block blocks (148) are provided in the grooves; insert blocks (156) are located in the block blocks (148). Above, the circular channel formed between the insert (156) and the groove is used for the passage of the spindle (11501) of the lower conveying roller (115); the circular channel formed between the bottom of the block (148) and the insert (156) is used for the passage of the spindle (11501) of the lower conveying roller (115); the upper plate is adjusted and connected to the lower plate by several adjusting bolts; in the cleaning mechanism (1), the height of the vertical support limiting plate A is higher than the height of the vertical support limiting plate B; in the oxidation mechanism (2), rinsing mechanism (3), and drying mechanism (4), the height of the vertical support limiting plate A is the same as the height of the vertical support limiting plate B.

7. A cleaning machine as described in claim 2, characterized in that, In the cleaning mechanism (1), an upper conveying roller (114) and a lower conveying roller (115) are provided on the outer side of each water-blocking component; the water-blocking components near the spray area include an upper water-blocking roller A (110) and a lower water-blocking roller (116). The upper water-blocking roller A (110) is positioned above the lower water-blocking roller (116), and a water-blocking plate (117) is tangentially positioned below the lower water-blocking roller (116). 17) Vertically set on the bottom plate (153) of the cleaning tank; the water-blocking components near the oxidation mechanism (2) include the upper water-blocking roller B (111) and the lower water-blocking roller (116). The upper water-blocking roller B (111) is set above the lower water-blocking roller (116), and the water-blocking plate (117) is tangentially set below the lower water-blocking roller (116). The water-blocking plate (117) is vertically set on the bottom plate (153) of the cleaning tank. The water-blocking component of the oxidation mechanism (2) has the same structure as the water-blocking component of the cleaning mechanism (1); in the rinsing mechanism (3), the height of the upper water-blocking roller B (307) is higher than the height of the upper water-blocking roller A (306).

8. A cleaning machine as described in claim 2, characterized in that, The ultrasonic component is set inside the vertical support limiting plate A and the vertical support limiting plate B. The ultrasonic component includes several ultrasonic brackets (157), and several ultrasonic transducers (137) are set on the ultrasonic brackets (157). The several ultrasonic transducers (137) are set continuously. An ultrasonic groove (158) is set between two adjacent ultrasonic transducers (137). The spindles (11501) of the upper conveying roller (114) and the lower conveying roller (115) pass through the ultrasonic groove (158) and are inserted into the vertical support limiting plate A or the vertical support limiting plate B. The height of the upper water-blocking roller B (307) of the water-blocking component in the rinsing mechanism (3) is higher than the height of the upper water-blocking roller A (306).

9. A cleaning machine as described in claim 5, characterized in that, The upper conveying roller (114) includes a spindle (11501), and a number of pressing components are arranged on the spindle (11501). The pressing components are arranged at equal intervals. The pressing components include a conveying pressure ring (11502) and a limiting ring (11503). A limiting ring (11503) is arranged at each end of the conveying pressure ring (11502).

10. A cleaning machine as described in claim 6, characterized in that, In the cleaning mechanism (1), oxidation mechanism (2), and rinsing mechanism (3), a temperature sensor A (136) and a liquid level float switch C (142) are also installed on the vertical support limiting plate B. The temperature sensor A (136) and the liquid level float switch C (142) are arranged side by side. The temperature sensor A (136) is connected to the vertical support limiting plate B through the temperature sensor fixing bracket (141), and the liquid level float switch C (142) is connected to the vertical support limiting plate B through the liquid level float switch C (142) fixing bracket.

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