Silicon wafer shaping mechanism and silicon wafer laser processing apparatus

Abstract

This invention provides a silicon wafer straightening mechanism and a silicon wafer laser processing device. The silicon wafer straightening mechanism is used to straighten silicon wafers conveyed along the conveying direction. The silicon wafer straightening mechanism includes a fixed base, a transmission component mounted on the fixed base, and a first straightening component and a second straightening component respectively disposed on the fixed base and connected to the transmission component. The first straightening component is movable along the width direction perpendicular to the conveying direction and is used to straighten the left and right sides of the silicon wafer. The second straightening component is movable along the conveying direction and the height direction perpendicular to the conveying direction and is used to straighten the front and rear sides of the silicon wafer. The silicon wafer straightening mechanism of this invention can straighten all four sides of the silicon wafer simultaneously, ensuring the uniformity of the silicon wafer placement position, thereby ensuring the stability of the silicon wafer laser processing quality.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic manufacturing equipment, and more specifically, it relates to a silicon wafer straightening mechanism and a silicon wafer laser processing equipment. Background Technology

[0002] The manufacturing process of solar cells involves multiple laser processing steps, including laser sintering, laser polycrystalline silicon (POLY) thinning, and laser back contact (BC) film opening. Automated equipment is primarily responsible for the loading, unloading, and handling of silicon wafers; the stability, efficiency, and contact methods of loading and unloading directly affect the final quality, production capacity, and power generation efficiency of the silicon wafers. With the rise of the global new energy industry, the pace of technological updates and iterations in solar silicon wafer laser processes is accelerating. During the loading and unloading process, silicon wafer straightening mechanisms are used to straighten the wafers. However, most widely used silicon wafer straightening mechanisms currently rely on two opposing contact parts to straighten the opposite sides of the wafer, a method that is insufficient in terms of straightening effect. Therefore, how to achieve more precise and stable straightening operations for silicon wafers has become a key challenge that urgently needs to be solved in the industry. Utility Model Content

[0003] The purpose of this invention is to provide a silicon wafer straightening mechanism and a silicon wafer laser processing equipment, which aims to improve the straightening effect on silicon wafers.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0005] This utility model provides a silicon wafer straightening mechanism for straightening silicon wafers conveyed along the conveying direction. The silicon wafer straightening mechanism includes: a fixed base, a transmission component mounted on the fixed base, and a first straightening component and a second straightening component respectively disposed on the fixed base and connected to the transmission component.

[0006] The first straightening component is movable along the width direction perpendicular to the conveying direction and is used to straighten the left and right sides of the silicon wafer; the second straightening component is movable along the conveying direction and the height direction perpendicular to the conveying direction and is used to straighten the front and rear sides of the silicon wafer.

[0007] Furthermore, the transmission assembly includes: a drive motor mounted on a fixed base, an intermediate turntable connected to the drive end of the drive motor, a left moving support and a right moving support that are movable in the width direction and arranged opposite to each other, a left connecting rod that rotatably connects the intermediate turntable and the left moving support, and a right connecting rod that rotatably connects the intermediate turntable and the right moving support; the first alignment assembly includes: a left moving plate connected to the left moving support, a left alignment shaft assembly mounted on the left moving plate and abutting the left side of the silicon wafer, a right moving plate connected to the right moving support, and a right alignment shaft assembly mounted on the right moving support and abutting the right side of the silicon wafer.

[0008] Furthermore, the transmission assembly also includes: a front moving block and a rear moving block that are movable along the conveying direction and arranged opposite to each other; a front connecting rod that rotatably connects the intermediate turntable and the front moving block; a rear connecting rod that rotatably connects the intermediate turntable and the rear moving block; a front pitch guide component located beside the front moving block and having an arc-shaped hole; and a rear pitch guide component located beside the rear moving block and having an arc-shaped hole. The second alignment assembly includes: a front swing component that rotatably connects the front moving block and the front pitch guide component; a front alignment shaft assembly mounted on the front swing component and abutting the front side of the silicon wafer; a rear swing component that rotatably connects the rear moving block and the rear pitch guide component; and a rear alignment shaft assembly mounted on the rear swing component and abutting the rear side of the silicon wafer.

[0009] Furthermore, the left alignment axis group, the right alignment axis group, the front alignment axis group, and the rear alignment axis group together form two alignment regions, which correspond to two half-wafers of silicon wafers, respectively.

[0010] Furthermore, the left moving plate is provided with a left adjustment groove corresponding to each left alignment shaft in the left alignment shaft group, which is used to adjust the installation position of the left alignment shaft on the left moving plate; the right moving plate is provided with a right adjustment groove corresponding to each right alignment shaft in the right alignment shaft group, which is used to adjust the installation position of the right alignment shaft on the right moving plate, thereby meeting the alignment requirements of silicon wafers of different specifications.

[0011] This utility model also provides a silicon wafer laser processing equipment, including: a silicon wafer loading and unloading conveying mechanism and a silicon wafer unloading conveying mechanism for conveying silicon wafers, a laser mold opening mechanism for slotting silicon wafers, and a silicon wafer transporting mechanism for transporting silicon wafers between the silicon wafer loading and unloading conveying mechanism and the laser mold opening mechanism. The silicon wafer loading and / or silicon wafer unloading conveying mechanism are provided with the silicon wafer straightening mechanism as described above.

[0012] Furthermore, the silicon wafer straightening mechanism includes a first silicon wafer loading and straightening mechanism and a second silicon wafer loading and straightening mechanism disposed on the silicon wafer loading and conveying mechanism, as well as a first silicon wafer unloading and straightening mechanism and a second silicon wafer unloading and straightening mechanism disposed on the silicon wafer unloading and conveying mechanism; the silicon wafer loading and conveying mechanism is provided with a first silicon wafer loading and straightening mechanism, a silicon wafer loading and storage mechanism, a silicon wafer loading and detection mechanism, a silicon wafer loading and rejection mechanism and a second silicon wafer loading and straightening mechanism in sequence along the conveying direction; the silicon wafer unloading and conveying mechanism is provided with a silicon wafer unloading and detection mechanism, a silicon wafer unloading and rejection mechanism, a first silicon wafer unloading and straightening mechanism, a silicon wafer unloading and storage mechanism and a second silicon wafer unloading and straightening mechanism in sequence along the conveying direction.

[0013] Furthermore, the silicon wafer handling mechanism includes a loading and unloading handling arm, and the laser mold opening mechanism includes a turntable assembly and dual lasers. The turntable assembly has a loading position corresponding to the loading and unloading handling arm, an unloading position corresponding to the unloading handling arm, and two laser processing positions corresponding to the dual lasers. Positioning cameras are provided above the loading position, the unloading position, and the two laser processing positions.

[0014] Furthermore, the silicon wafer laser processing equipment also includes a dust removal mechanism to remove dust from the laser working area inside the laser mold opening mechanism.

[0015] Furthermore, the silicon wafer laser processing equipment also includes a basket loading and unloading conveying mechanism that docks with the transport vehicle and conveys the baskets respectively, a basket lifting mechanism for transferring silicon wafers in the baskets to the silicon wafer loading and unloading conveying mechanism and loading silicon wafers from the silicon wafer unloading conveying mechanism into the baskets, and a basket traversing mechanism for transferring the baskets between the basket loading and unloading conveying mechanism and the basket lifting mechanism.

[0016] Compared with existing technologies, the beneficial effects of the silicon wafer straightening mechanism and silicon wafer laser processing equipment provided by this utility model are as follows: The silicon wafer straightening mechanism of this utility model includes a first straightening component and a second straightening component. The first straightening component moves along the width direction and abuts against the left and right sides of the silicon wafer; the second straightening component moves along the conveying direction and the height direction and abuts against the front and rear sides of the silicon wafer. In this way, the four sides of the silicon wafer are straightened simultaneously, significantly improving the straightening effect. This silicon wafer straightening mechanism can straighten the four sides of the silicon wafer simultaneously, ensuring the uniformity of the silicon wafer placement position, thereby ensuring the stability of the silicon wafer laser processing quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the silicon wafer straightening mechanism of this utility model when it is placed on the transmission mechanism;

[0019] Figure 2 This is a top view of the silicon wafer straightening mechanism of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the silicon wafer straightening mechanism of this utility model before and after straightening;

[0021] Figure 4This is a three-dimensional structural diagram of the silicon wafer straightening mechanism of this utility model during straightening;

[0022] Figure 5 This is a schematic diagram of the silicon segment structure in the silicon wafer laser processing equipment of this utility model;

[0023] Figure 6 This is a schematic diagram of the structure of the silicon wafer laser processing equipment of this utility model, including the basket segment and the silicon segment;

[0024] The main markings in the attached figures are as follows:

[0025] 1. Silicon wafer loading and conveying mechanism; 11. First silicon wafer loading and straightening mechanism; 12. Silicon wafer loading and storage mechanism; 13. Silicon wafer loading and inspection mechanism; 14. Rejection box assembly; 15. Second silicon wafer loading and straightening mechanism; 2. Silicon wafer unloading and conveying mechanism; 21. Silicon wafer unloading and inspection mechanism; 22. Silicon wafer unloading and rejection mechanism; 23. First silicon wafer unloading and straightening mechanism; 24. Silicon wafer unloading and storage mechanism; 25. Second silicon wafer unloading and straightening mechanism; 3. Silicon wafer handling mechanism; 31. Loading and handling swing arm; 32. Unloading and handling swing arm; 4. Laser mold opening mechanism; 41. Turntable assembly; 42. Dual lasers; 5. Dust removal mechanism; 6. Flower basket loading and conveying mechanism; 7. Flower basket unloading and conveying mechanism; 8. Flower basket lifting mechanism; 9. Flower basket lateral movement mechanism;

[0026] 101. Fixed base; 102. Transmission assembly; 1021. Intermediate turntable; 1022. Left moving support; 1023. Right moving support; 1024. Left connecting rod; 1025. Right connecting rod; 1026. Front moving block; 1027. Rear moving block; 1028. Front connecting rod; 1029. Rear connecting rod; 1121. Front pitch guide component; 1122. Rear pitch guide component; 103. First alignment assembly; 1031. Left moving plate; 1032. Right moving plate; 1033. Left alignment shaft; 1034. Right alignment shaft; 1035. Left adjusting groove; 1036. Right adjusting groove; 104. Second alignment assembly; 1041. Front swing component; 1042. Front alignment shaft; 1043. Rear swing component; 1044. Rear alignment shaft. Detailed Implementation

[0027] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0028] Please refer to the following: Figures 1 to 4The silicon wafer straightening mechanism proposed in this utility model is used to straighten silicon wafers conveyed along the conveying direction. The silicon wafer straightening mechanism includes: a fixed base 101, a transmission assembly 102 mounted on the fixed base 101, and a first straightening assembly 103 and a second straightening assembly 104 respectively disposed on the fixed base 101 and connected to the transmission assembly 102. The first straightening assembly 103 is movable along the width direction perpendicular to the conveying direction and is used to straighten the left and right sides of the silicon wafer; the second straightening assembly 104 is movable along the conveying direction and in the height direction perpendicular to the conveying direction and is used to straighten the front and rear sides of the silicon wafer.

[0029] In the silicon wafer straightening process of this invention, the first straightening component 103 moves along the width direction to abut the left and right sides of the silicon wafer, while the second straightening component 104 moves along the conveying direction and height direction to abut the front and rear sides of the silicon wafer, thereby achieving simultaneous straightening of the four sides of the silicon wafer and effectively improving the straightening effect. After the straightening operation is completed, the first straightening component 103 moves away from the silicon wafer along the width direction; the second straightening component 104 moves along the height direction to a position lower than the silicon wafer, ensuring that the smooth conveying of the silicon wafer along the conveying direction is not hindered. It should be noted that the second straightening component 104 can move in both the conveying direction and the height direction. In a preferred embodiment, the second straightening component 104 can not only move in the conveying direction, but also rotate up and down, thereby achieving adjustment in the height direction.

[0030] like Figure 2 , Figure 3 As shown, in a preferred embodiment of this utility model, the transmission assembly 102 includes: a drive motor mounted on a fixed base 101; an intermediate turntable 1021 connected to the drive end of the drive motor; a left moving support 1022 and a right moving support 1023 that are movable in the width direction and arranged opposite to each other; a left connecting rod 1024 that rotatably connects the intermediate turntable 1021 and the left moving support 1022; and a right connecting rod 1025 that rotatably connects the intermediate turntable 1021 and the right moving support 1023. The first alignment assembly 103 includes: a left moving plate 1031 connected to the left moving support 1022; a left alignment shaft assembly mounted on the left moving plate 1031 and abutting the left side of the silicon wafer; a right moving plate 1032 connected to the right moving support 1023; and a right alignment shaft assembly mounted on the right moving support 1023 and abutting the right side of the silicon wafer.

[0031] In this invention, during the silicon wafer straightening process, a drive motor rotates the intermediate turntable 1021, which in turn drives the left movable support 1022 to move along its bottom guide rail via the left connecting rod 1024. This achieves synchronous movement of the left movable plate 1031 and its upper left straightening shaft assembly, causing the left straightening shaft assembly to abut against the left side of the silicon wafer. Simultaneously, the right connecting rod 1025 drives the right movable support 1023 to move along its bottom guide rail, achieving synchronous movement of the right movable plate 1032 and its upper right straightening shaft assembly, causing the right straightening shaft assembly to abut against the right side of the silicon wafer. This design enables a single drive motor to drive the first straightening component 103 to straighten the silicon wafer, resulting in a simple structure that is easy to implement.

[0032] like Figure 2 , Figure 3 , Figure 4 As shown, in a preferred embodiment of this utility model, the transmission assembly 102 further includes: a front moving block 1026 and a rear moving block 1027 that are movable along the conveying direction and arranged opposite to each other; a front connecting rod 1028 that rotatably connects the intermediate turntable 1021 and the front moving block 1026; a rear connecting rod 1029 that rotatably connects the intermediate turntable 1021 and the rear moving block 1027; a front pitch guide component 1121 located beside the front moving block 1026 and having an arc-shaped hole; and a rear moving block 1027 located beside the rear moving block 1026. The second alignment assembly 104 includes: a front swing component 1041 rotatably connected to the front moving block 1026 and the front pitch guide assembly; a front alignment shaft assembly mounted on the front swing component 1041 and abutting the front side of the silicon wafer; and a rear swing component 1043 rotatably connected to the rear moving block 1027 and the rear pitch guide assembly; and a rear alignment shaft assembly mounted on the rear swing component 1043 and abutting the rear side of the silicon wafer.

[0033] In the silicon wafer straightening process of this invention, a drive motor drives the intermediate turntable 1021 to rotate, which in turn drives the front moving block 1026 to move along its bottom guide rail via the front connecting rod 1028. As the front swing component 1041 moves with the front moving block 1026, its internal rotating shaft rotates upward along the arc-shaped hole of the front pitch guide component 1121, thereby raising the front swing component 1041 and its upper front straightening shaft assembly, so that the front straightening shaft assembly abuts against the front side of the silicon wafer. Simultaneously, the rear connecting rod 1029 drives the rear moving block 1027 to move along its bottom guide rail. As the rear swing component 1043 moves with the rear moving block 1027, its internal rotating shaft rotates upward along the arc-shaped hole of the rear pitch guide component 1122, thereby raising the rear swing component 1043 and its upper rear straightening shaft assembly, so that the rear straightening shaft assembly abuts against the rear side of the silicon wafer. At this time, the first straightening assembly 103 and the second straightening assembly 104 share a single drive motor. This design can drive both the first straightening component 103 and the second straightening component 104 using a single drive motor, thereby straightening the silicon wafer. Its structure is simple and easy to implement.

[0034] After the alignment operation is completed, under the reverse drive of the drive motor, the rotating shaft inside the front swing component 1041 rotates downward along the arc-shaped hole of the front pitch guide component 1121 and falls, causing the front alignment shaft assembly to descend below the silicon wafer. Simultaneously, the rotating shaft inside the rear swing component 1043 rotates downward along the arc-shaped hole of the rear pitch guide component 1122, causing the rear alignment shaft assembly to also descend below the silicon wafer, thus ensuring that the front and rear alignment shafts 1044 do not affect the smooth transport of the silicon wafer along the conveying direction. Clearly, the arc-shaped holes on the front pitch guide component 1121 and the rear pitch guide component 1122 are designed to limit the movement path of the front and rear alignment shafts, thereby adapting to the silicon wafer transport requirements.

[0035] Furthermore, the silicon wafer straightening mechanism proposed in this invention does not rely on linear modules or other transport modules and can be directly placed on the silicon wafer transport line for use, saving space and reducing costs.

[0036] like Figure 1 , Figure 3 As shown, in a preferred embodiment of this utility model, the left alignment axis group, the right alignment axis group, the front alignment axis group, and the rear alignment axis group together form two alignment regions, each corresponding to one half of a silicon wafer. Specifically, the two silicon wafers are transported synchronously along the conveying direction. The left alignment axis group consists of four left alignment axes 1033, two of which abut against the left side of one half of the silicon wafer, and the other two abut against the left side of the other half of the silicon wafer. Similarly, the right alignment axis group consists of four right alignment axes 1034, two of which abut against the right side of one half of the silicon wafer, and the other two abut against the right side of the other half of the silicon wafer. Similarly, the front alignment axis group consists of four front alignment axes 1042, two of which abut against the front side of one half-wafer, and the other two abut against the front side of the other half-wafer. Likewise, the rear alignment axis group consists of four rear alignment axes 1044, two of which abut against the rear side of one half-wafer, and the other two abut against the rear side of the other half-wafer. Therefore, the silicon wafer alignment mechanism proposed in this invention can simultaneously align the four sides of two half-wafers.

[0037] like Figure 3As shown, in a preferred embodiment of this utility model, the left moving plate 1031 is provided with a left adjusting groove 1035 corresponding one-to-one with each left aligning shaft 1033 in the left aligning shaft group, for adjusting the installation position of the left aligning shaft 1033 on the left moving plate 1031; the right moving plate 1032 is provided with a right adjusting groove 1036 corresponding one-to-one with each right aligning shaft 1034 in the right aligning shaft group, for adjusting the installation position of the right aligning shaft 1034 on the right moving plate 1032, thereby meeting the alignment requirements of silicon wafers of different specifications. Therefore, the silicon wafer alignment mechanism proposed in this utility model can be compatible with silicon wafers of various specifications.

[0038] Please refer to the following: Figure 5 , Figure 6 The silicon wafer laser processing equipment proposed in this utility model includes at least: a silicon wafer loading and unloading conveying mechanism 1 and a silicon wafer unloading conveying mechanism 2 for conveying silicon wafers, a laser mold-opening mechanism 4 for slotting silicon wafers, and a silicon wafer transporting mechanism 3 for transporting silicon wafers between the silicon wafer loading and unloading conveying mechanism 1, the silicon wafer unloading conveying mechanism 2, and the laser mold-opening mechanism 4. A silicon wafer straightening mechanism is provided on the silicon wafer loading and unloading conveying mechanism 1 and / or the silicon wafer unloading conveying mechanism 2. The structure of this silicon wafer straightening mechanism has been described in detail above and will not be repeated here. This silicon wafer straightening mechanism can simultaneously straighten all four sides of the silicon wafer, ensuring the uniformity of the silicon wafer placement position, thereby guaranteeing the stability of the silicon wafer laser processing quality.

[0039] like Figure 5 As shown, the silicon wafer straightening mechanism includes a first silicon wafer loading and straightening mechanism 11 and a second silicon wafer loading and straightening mechanism 15 disposed on the silicon wafer loading and conveying mechanism 1, and a first silicon wafer unloading and straightening mechanism 23 and a second silicon wafer unloading and straightening mechanism 25 disposed on the silicon wafer unloading and conveying mechanism 2. The silicon wafer loading and conveying mechanism 1 is provided with the first silicon wafer loading and straightening mechanism 11, the silicon wafer loading and storage mechanism 12, the silicon wafer loading and detection mechanism 13, the silicon wafer loading and rejection mechanism and the second silicon wafer loading and straightening mechanism 15 in sequence along the conveying direction. The silicon wafer unloading and conveying mechanism 2 is provided with the silicon wafer unloading and detection mechanism 21, the silicon wafer unloading and rejection mechanism 22, the first silicon wafer unloading and straightening mechanism 23, the silicon wafer unloading and storage mechanism 24 and the second silicon wafer unloading and straightening mechanism 25 in sequence along the conveying direction.

[0040] In addition, the silicon wafer handling mechanism 3 includes a loading and unloading handling arm 31 and an unloading handling arm 32, and the laser mold opening mechanism 4 includes a turntable assembly 41 and dual lasers 42. The turntable assembly 41 is provided with a loading position corresponding to the loading and unloading handling arm 31, an unloading position corresponding to the unloading handling arm 32, and two laser processing positions corresponding to the dual lasers 42 respectively. A positioning camera is provided above the loading position, the unloading position and the two laser processing positions.

[0041] This invention preferably involves the synchronous transport of two half-wafers of silicon. The two half-wafers enter the first silicon wafer loading and straightening mechanism 11 via the silicon wafer loading and conveying mechanism 1. After straightening, they can be stored in the silicon wafer loading and storage mechanism 12 or directly fed onto the conveyor belt. The silicon wafer loading and storage mechanism 12 is used to store silicon wafers in case of equipment malfunction, ensuring uninterrupted operation of upstream equipment. A silicon wafer loading detection mechanism 13 is installed on the conveyor belt to detect whether the silicon wafers are damaged. Damaged silicon wafers enter the rejection box assembly 14 of the silicon wafer loading rejection mechanism via the second silicon wafer loading and straightening mechanism 15, while undamaged silicon wafers are further straightened in the second silicon wafer loading and straightening mechanism 15 and moved to the turntable assembly 41 via the loading and transporting swing arm 31.

[0042] The turntable assembly 41 rotates in a specific direction and is equipped with suction cups to hold the silicon wafers. Dual lasers 42 are mounted above it for grooving the silicon wafers. The turntable assembly 41 has two laser processing positions, one loading position, and one unloading position. The two laser processing positions can operate simultaneously, improving production efficiency. Positioning cameras (not shown in the figure) are mounted above each of the four positions of the turntable assembly 41 to detect the position of the silicon wafers and adjust the dual lasers 42 accordingly, improving processing accuracy.

[0043] After the silicon wafers are processed, they are moved to the silicon wafer unloading conveyor mechanism 2 via the unloading transport arm 32. The silicon wafer unloading inspection mechanism 21 inspects the processed silicon wafers. Unqualified wafers are directly removed by the silicon wafer unloading rejection mechanism 22, while qualified wafers are sequentially processed by the first silicon wafer unloading straightening mechanism 23 and the second silicon wafer unloading straightening mechanism 25 and then sent into the empty basket. The unloading process also includes a silicon wafer unloading storage mechanism 24, which serves the same function as the loading point.

[0044] The silicon wafer laser processing equipment proposed in this invention adopts a lightweight, integral wafer structure design. Each silicon wafer alignment mechanism can achieve four-sided positioning through a single drive motor, which not only effectively reduces costs but also saves machine space. Secondly, the loading and unloading transport arm 32 uses a unique suction and orientation mechanism to ensure that the orientation of the silicon wafer remains unchanged during the unloading process, eliminating the need for an additional steering mechanism. In addition, the loading and unloading inspection mechanism has the ability to detect defects in the raw silicon wafers (such as microcracks, edge chipping, and corner defects) as well as the processing effect of the finished silicon wafers.

[0045] like Figure 6 As shown, the silicon wafer laser processing equipment also includes a dust removal mechanism 5, which is used to remove dust from the laser working area inside the laser mold opening mechanism 4 to ensure that no dust accumulates.

[0046] like Figure 6As shown, the silicon wafer laser processing equipment also includes a basket loading and unloading conveying mechanism 6 and a basket unloading conveying mechanism 7, which are respectively docked with the transport vehicle and convey the baskets. A basket lifting mechanism 8 is used to transfer the silicon wafers in the basket to the silicon wafer loading and conveying mechanism 1 and load the silicon wafers from the silicon wafer unloading conveying mechanism 2 into the basket. A basket traversing mechanism 9 is used to transfer the baskets between the basket loading and conveying mechanism 6, the basket unloading conveying mechanism 7 and the basket lifting mechanism 8.

[0047] The silicon wafer laser processing equipment proposed in this utility model integrates multiple functions. This equipment can also interface with AGV (Automated Guided Vehicle) carts to achieve automatic loading and unloading of raw silicon wafers and finished silicon wafers. Specifically, the silicon wafer laser processing equipment consists of two sections: a basket section and a silicon segment section. The basket section is responsible for the flow of raw material baskets and finished product baskets, while the silicon segment section is responsible for the flow, shaping, inspection, and laser processing of raw and finished silicon wafers. The entire workflow is divided into a raw silicon wafer loading process and a finished silicon wafer unloading process.

[0048] The raw silicon wafer loading process is as follows: AGV trolley transports a full basket of raw silicon wafers → basket loading and transfer mechanism 6 → basket horizontal movement mechanism 9 → basket lifting mechanism 8 → silicon wafer loading and transfer mechanism 1 → silicon wafer handling mechanism 3 → laser mold opening mechanism 4.

[0049] The finished silicon wafer unloading process is as follows: laser mold opening mechanism 4 → silicon wafer handling mechanism 3 → silicon wafer unloading and transmission mechanism 2 → basket lifting mechanism 8 → basket horizontal movement mechanism 9 → basket unloading and transmission mechanism 7 → AGV trolley transports the full basket of finished silicon wafers away.

[0050] It is evident that this silicon wafer laser processing equipment integrates multiple functions, significantly improving production capacity. Furthermore, the equipment can interface with AGV (Automated Guided Vehicle) carts to achieve automated loading and unloading, effectively freeing up labor.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A silicon wafer straightening mechanism for straightening silicon wafers conveyed along a conveying direction, characterized in that, The silicon wafer straightening mechanism includes: a fixed base, a transmission component mounted on the fixed base, and a first straightening component and a second straightening component respectively disposed on the fixed base and connected to the transmission component; The first straightening component is movable along the width direction perpendicular to the conveying direction and is used to straighten the left and right sides of the silicon wafer; the second straightening component is movable along the conveying direction and the height direction perpendicular to the conveying direction and is used to straighten the front and rear sides of the silicon wafer.

2. The silicon wafer straightening mechanism as described in claim 1, characterized in that, The transmission assembly includes: a drive motor mounted on the fixed base, an intermediate turntable connected to the drive end of the drive motor, a left moving support and a right moving support that are movable along the width direction and arranged opposite to each other, a left connecting rod rotatably connecting the intermediate turntable and the left moving support, and a right connecting rod rotatably connecting the intermediate turntable and the right moving support; the first alignment assembly includes: a left moving plate connected to the left moving support, a left alignment shaft assembly mounted on the left moving plate and abutting the left side of the silicon wafer, a right moving plate connected to the right moving support, and a right alignment shaft assembly mounted on the right moving support and abutting the right side of the silicon wafer.

3. The silicon wafer straightening mechanism as described in claim 2, characterized in that, The transmission assembly further includes: a front moving block and a rear moving block that are movable along the conveying direction and arranged opposite to each other; a front connecting rod that rotatably connects the intermediate turntable and the front moving block; a rear connecting rod that rotatably connects the intermediate turntable and the rear moving block; a front pitch guide component located beside the front moving block and having an arc-shaped hole; and a rear pitch guide component located beside the rear moving block and having an arc-shaped hole. The second alignment assembly includes: a front swing component that rotatably connects the front moving block and the front pitch guide component; a front alignment shaft assembly mounted on the front swing component and abutting against the front side of the silicon wafer; a rear swing component that rotatably connects the rear moving block and the rear pitch guide component; and a rear alignment shaft assembly mounted on the rear swing component and abutting against the rear side of the silicon wafer.

4. The silicon wafer straightening mechanism as described in claim 3, characterized in that, The left alignment axis group, the right alignment axis group, the front alignment axis group, and the rear alignment axis group together form two alignment regions, which correspond to two half-wafers of silicon wafers respectively.

5. The silicon wafer straightening mechanism as described in any one of claims 2-4, characterized in that, The left moving plate is provided with a left adjustment groove corresponding to each left alignment shaft in the left alignment shaft group, for adjusting the installation position of the left alignment shaft on the left moving plate; the right moving plate is provided with a right adjustment groove corresponding to each right alignment shaft in the right alignment shaft group, for adjusting the installation position of the right alignment shaft on the right moving plate, thereby meeting the alignment requirements of silicon wafers of different specifications.

6. A silicon wafer laser processing device, comprising: A silicon wafer loading and unloading conveying mechanism and a silicon wafer unloading conveying mechanism respectively for conveying silicon wafers, a laser mold-making mechanism for slotting silicon wafers, and a silicon wafer transporting mechanism for transporting silicon wafers between the silicon wafer loading and unloading conveying mechanism and the laser mold-making mechanism, characterized in that the silicon wafer loading and / or the silicon wafer unloading conveying mechanism are provided with a silicon wafer straightening mechanism as described in any one of claims 1 to 5.

7. The silicon wafer laser processing equipment as described in claim 6, characterized in that, The silicon wafer straightening mechanism includes a first silicon wafer loading and straightening mechanism and a second silicon wafer loading and straightening mechanism disposed on the silicon wafer loading and conveying mechanism, and a first silicon wafer unloading and straightening mechanism and a second silicon wafer unloading and straightening mechanism disposed on the silicon wafer unloading and conveying mechanism; the silicon wafer loading and conveying mechanism is provided with the first silicon wafer loading and straightening mechanism, a silicon wafer loading and storage mechanism, a silicon wafer loading and detection mechanism, a silicon wafer loading and rejection mechanism and the second silicon wafer loading and straightening mechanism in sequence along the conveying direction; the silicon wafer unloading and conveying mechanism is provided with the silicon wafer unloading and detection mechanism, the silicon wafer unloading and rejection mechanism, the first silicon wafer unloading and straightening mechanism, the silicon wafer unloading and storage mechanism and the second silicon wafer unloading and straightening mechanism in sequence along the conveying direction.

8. The silicon wafer laser processing equipment as described in claim 6, characterized in that, The silicon wafer handling mechanism includes a loading and unloading handling arm, and the laser mold opening mechanism includes a turntable assembly and dual lasers. The turntable assembly has a loading position corresponding to the loading and unloading handling arm, an unloading position corresponding to the unloading and unloading handling arm, and two laser processing positions corresponding to the dual lasers. A positioning camera is provided above the loading position, the unloading position, and the two laser processing positions.

9. The silicon wafer laser processing equipment as described in claim 8, characterized in that, The silicon wafer laser processing equipment also includes a dust removal mechanism for removing dust from the laser working area inside the laser mold opening mechanism.

10. The silicon wafer laser processing equipment as described in any one of claims 6-9, characterized in that, The silicon wafer laser processing equipment also includes a basket loading and unloading conveying mechanism and a basket unloading conveying mechanism that are respectively docked with the transport vehicle and convey the baskets, a basket lifting mechanism for transferring silicon wafers in the baskets to the silicon wafer loading and unloading conveying mechanism and loading silicon wafers from the silicon wafer unloading conveying mechanism into the baskets, and a basket traversing mechanism for transferring the baskets between the basket loading and unloading conveying mechanism and the basket lifting mechanism.

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