A clamping and transferring device for diode packaging

Abstract

This utility model discloses a clamping and transferring device for diode packaging, including a base and a vertical rod. The vertical rod is vertically arranged on the rear side of the base, and a horizontal rod is arranged on the outer side of the vertical rod. The clamping and transferring device for diode packaging uses a fourth motor to drive a drive shaft to rotate, which in turn drives a third gear to rotate. This, in turn, drives two sets of racks meshing with the gear to slide synchronously in opposite directions along a third sliding groove and a limiting shaft. The racks are slidably connected to the limiting shaft through connecting plates at both ends, which restricts the racks to move only in a straight line, preventing them from deviating or wobbling, ensuring the accuracy and stability of the clamping plate opening and closing action, improving clamping reliability, and realizing the opening and closing action of the two sets of clamps. The clamping surface of the clamps has elasticity and flexibility, which can buffer the clamping force. Combined with an external pressure sensor, it monitors and feeds back pressure data in real time, avoiding overload damage to the diode chip and ensuring the accuracy and safety of the clamping process. It is suitable for the precise clamping and transferring of chips in diode packaging.

Description

Technical Field

[0001] This utility model relates to the field of diode packaging technology, specifically to a clamping and transferring device for diode packaging. Background Technology

[0002] Diodes are commonly used semiconductor devices in electronic circuits and play a key role in electronic devices. A diode is a semiconductor device consisting of a PN junction, two electrode leads, and a casing. It has two electrodes, positive and negative. The positive electrode is led out from a P-type semiconductor, and the negative electrode is led out from an N-type semiconductor. In the diode packaging production process, the transfer of the diode chip is a key step. However, existing diode package clamping and transfer devices still have certain problems in use: For example, a diode transfer device with application number CN201620997402.8 solves the defects of existing flexible battery diode welding, which uses manual handling, is cumbersome to operate, and has low efficiency. It includes a diode gripping mechanism and a diode gripping mechanism translation guide mechanism. The translation guide mechanism includes a translation support frame with a translation groove. A drive shaft is provided on the translation support frame. A rotating arm is fixed on the drive shaft. A long groove is provided on the rotating arm. A moving shaft is inserted into the long groove. One end of the moving shaft is located in the translation groove, and the other end of the moving shaft is connected to the diode gripping mechanism. Traditional clamping devices struggle to precisely control clamping force during the clamping process. Due to the lack of effective pressure monitoring and buffering mechanisms, when clamping diode chips, excessive clamping force can easily damage the chip, while insufficient clamping force can cause the chip to slip during transfer. This not only increases the chip scrap rate but also reduces production efficiency.

[0003] In view of this, in-depth research was conducted on the above issues, which led to the creation of this case.

[0004] To address the aforementioned issues, an innovative design was developed based on the existing clamping and transfer device used for diode packaging. Utility Model Content

[0005] The purpose of this invention is to provide a clamping and transfer device for diode packaging, in order to solve the problem mentioned in the background art that dough mixers usually require manual pouring of flour, water and other raw materials into the dough mixing bucket. This feeding method is not only inefficient, but also easily causes waste and pollution of raw materials. At the same time, ordinary dough mixers are used to mix dough under normal pressure, which makes it easy for air to be mixed into the dough, affecting the quality and taste of the dough.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A clamping and transferring device for diode packaging includes a base and a vertical post. The vertical post is vertically arranged on the rear side of the base, and a horizontal bar is arranged on the outer side of the vertical post. A mounting base is welded to the top of the horizontal bar. Two sets of third sliding grooves are symmetrically opened on the bottom of the mounting base. A fourth motor is mounted on the upper surface of the mounting base. A drive shaft is fixed to the output end of the fourth motor. A third gear is fixed to the outer surface of the drive shaft. Two sets of racks that mesh with the third gears are obliquely symmetrically arranged inside the mounting base. A clamping plate is fixed to the bottom end of the rack. Two sets of clamping plates are symmetrically arranged along the mounting base and are slidably connected to the third sliding grooves. The clamping surface of the clamping plate has elasticity and flexibility. A pressure sensor is mounted on the outer side of the clamping plate.

[0007] Using the above technical solution, the third gear is driven to rotate by the fourth motor, which drives the two sets of racks meshing with it to slide synchronously in opposite directions along the third slide groove. This controls the synchronous opening and closing of the two sets of clamping plates to achieve the clamping action. The clamping surface of the clamping plate has elasticity and flexibility to protect the chip. The pressure sensor monitors the clamping force in real time to ensure stable clamping and avoid chip damage. This method is suitable for the precise clamping and transfer of chips in diode packaging.

[0008] Preferably, two sets of fixing brackets are symmetrically welded inside the mounting base. A limiting shaft is fixed in the middle of the fixing bracket, and connecting plates are fixed at both ends of the rack, with the connecting plates and the limiting shaft being slidably connected.

[0009] By adopting the above technical solution, a fixed frame is symmetrically set inside the mounting base and a limiting shaft is installed. The connecting plates at both ends of the rack are slidably connected to the limiting shaft, so that the rack slides stably along the direction of the limiting shaft under the drive of the gear. The limiting shaft restricts the rack to move only in a straight line, preventing it from deviating or shaking, ensuring the accuracy and stability of the opening and closing action of the clamping plate, and improving the clamping reliability.

[0010] Preferably, a first sliding groove is provided on the rear side of the base, a first motor is installed on one side of the base, a first lead screw is fixed to the output end of the first motor, a first slider is threadedly connected to the outer surface of the first lead screw, and a support seat is welded to the outer side of the first slider.

[0011] Using the above technical solution, the first motor drives the first lead screw to rotate, and the first slider moves in a direction along the first slide groove through the thread transmission, thereby driving the support seat to slide horizontally on the base, realizing the position adjustment of the support seat, providing horizontal displacement capability for the clamping device, adapting to the needs of different workstations, and improving the flexibility and automation of the packaging process.

[0012] Preferably, a second motor is installed on one side of the support base, a first gear is fixed to the output end of the second motor, a second gear is rotatably connected to the top of the support base, and the second gear is fixedly connected to the bottom end of the upright.

[0013] Using the above technical solution, the second motor drives the first gear to rotate, and through gear meshing, drives the second gear to rotate, thereby driving the upright fixedly connected to the second gear to rotate around the vertical axis, realizing 360° rotation adjustment of the upright and clamping device, flexibly adjusting the chip clamping direction, meeting the needs of multi-angle packaging operations, and improving the applicability and process compatibility of the device.

[0014] Preferably, the outer surface of the upright has a second sliding groove, the bottom end of the upright is equipped with a third motor, the output end of the third motor is fixed with a second lead screw, the outer surface of the second lead screw is threaded with a second slider, and the second slider is fixedly connected to the crossbar.

[0015] Using the above technical solution, the third motor drives the second lead screw to rotate, and through the threaded transmission, the second slider moves vertically along the second slide groove of the upright, thereby driving the crossbar and clamping device to rise and fall, realizing the vertical height adjustment of the clamping device, adapting to different packaging height requirements, improving operational flexibility, and ensuring accurate chip positioning and transfer.

[0016] Preferably, a controller is installed on one side of the base, and a placement platform is provided on the upper surface of the base, with a plurality of positioning slots adapted to the diode chip on the outer surface of the placement platform.

[0017] By adopting the above technical solution, the controller coordinates the actions of each motor through a preset program, controls the movement, rotation and clamping operation of the clamping device, realizes the automated control of the clamping and transfer process, and improves efficiency and accuracy; the positioning slot on the placement stage fixes the diode chip through a physical limiting structure, ensuring that the chip maintains a stable position before packaging, avoiding displacement or shaking, and ensuring the reliability and consistency of the packaging process.

[0018] Compared with the prior art, the beneficial effects of this utility model are: the clamping and transferring device for diode packaging, 1. The third gear is driven to rotate by the fourth motor, which drives the two sets of racks meshing with it to slide synchronously in opposite directions along the third slide groove, thereby controlling the two sets of clamping plates to open and close synchronously to achieve the clamping action. The clamping surface of the clamping plate has elasticity and flexibility to protect the chip. The pressure sensor monitors the clamping force in real time to ensure stable clamping and avoid chip damage. It is suitable for precise clamping and transfer of chips in diode packaging. 2. By symmetrically setting a fixing frame and installing a limiting shaft inside the mounting base, the connecting plates at both ends of the rack are slidably connected to the limiting shaft, so that the rack slides stably along the direction of the limiting shaft under the drive of the gear. The limiting shaft restricts the rack to move only in a straight line, preventing it from deviating or shaking, ensuring the accuracy and stability of the opening and closing action of the clamping plate, and improving the clamping reliability. 3. The first motor drives the first lead screw to rotate, and through the threaded transmission, the first slider moves in a direction along the first slide groove, thereby driving the support to slide horizontally on the base, realizing the position adjustment of the support, providing horizontal displacement capability for the clamping device, adapting to different workstation requirements, and improving the flexibility and automation of the packaging process. 4. The second motor drives the first gear to rotate, and through gear meshing, drives the second gear to rotate, which in turn drives the upright fixedly connected to the second gear to rotate around the vertical axis, realizing 360° rotation adjustment of the upright and clamping device, flexibly adjusting the chip clamping direction, meeting the needs of multi-angle packaging operations, and improving the applicability and process compatibility of the device. 5. The third motor drives the second lead screw to rotate, and through the threaded transmission, the second slider moves vertically along the second slide groove of the upright, thereby driving the crossbar and clamping device to rise and fall, realizing the vertical height adjustment of the clamping device, adapting to different packaging height requirements, improving operational flexibility, and ensuring accurate chip positioning and transfer. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the external structure of the main body of this utility model; Figure 2 This is a schematic diagram of the rear structure of the main body of this utility model; Figure 3 This is a schematic diagram of the pole rotation and horizontal adjustment structure of this utility model; Figure 4 This is a schematic diagram of the crossbar adjustment structure of this utility model; Figure 5 This is a schematic diagram of the internal clamping and adjustment structure of the mounting base of this utility model; Figure 6 This is a schematic diagram of the clamping and adjusting structure of this utility model.

[0020] In the diagram: 1. Base; 2. Controller; 3. Placement platform; 4. First slide rail; 5. First motor; 6. First lead screw; 7. First slider; 8. Support base; 9. Second motor; 10. First gear; 11. Second gear; 12. Upright pole; 13. Second slide rail; 14. Third motor; 15. Second lead screw; 16. Second slider; 17. Crossbar; 18. Mounting base; 19. Third slide rail; 20. Fourth motor; 21. Drive shaft; 22. Second gear; 23. Rack; 24. Fixing frame; 25. Limiting shaft; 26. Connecting plate; 27. Clamping plate; 28. Pressure sensor. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1 Please see Figure 1 , Figure 4 , Figure 5 , Figure 6 This utility model provides a technical solution: A clamping and transferring device for diode packaging includes a base 1 and a vertical rod 12. The vertical rod 12 is vertically arranged on the rear side of the base 1, and a horizontal bar 17 is arranged on the outer side of the vertical rod 12. A mounting base 18 is welded to the top of the horizontal bar 17. Two sets of third sliding grooves 19 are symmetrically opened on the bottom of the mounting base 18. A fourth motor 20 is mounted on the upper end surface of the mounting base 18. A drive shaft 21 is fixed to the output end of the fourth motor 20. A third gear 22 is fixed to the outer surface of the drive shaft 21. Two sets of racks 23 that mesh with the third gears 22 are obliquely symmetrically arranged inside the mounting base 18. A clamping plate 27 is fixed to the bottom end of the rack 23. Two sets of clamping plates 27 are symmetrically arranged along the mounting base 18. The clamping plates 27 are slidably connected to the third sliding grooves 19. The clamping surface of the clamping plate 27 has elasticity and flexibility. A pressure sensor 28 is mounted on the outer side of the clamping plate 27. The mounting base 18 has two sets of fixing brackets 24 symmetrically welded inside. The middle of the fixing bracket 24 is fixed with a limit shaft 25, and the two ends of the rack 23 are fixed with connecting plates 26, and the connecting plates 26 are slidably connected to the limit shaft 25.

[0023] This clamping and transfer device for diode packaging uses a fourth motor 20 to drive the drive shaft 21 to rotate, which in turn drives the third gear 22 to rotate. This, in turn, drives two sets of racks 23 meshing with the gear to slide synchronously in opposite directions along the third slide groove 19 and the limiting shaft 25. The racks 23 are slidably connected to the limiting shaft 25 through connecting plates 26 at both ends, which restricts the racks 23 to move only in a straight line, preventing them from deviating or wobbling. This ensures the accuracy and stability of the opening and closing action of the clamping plates 27, improves clamping reliability, and enables the opening and closing action of the two sets of clamping plates 27. The clamping surfaces of the clamping plates 27 are elastic and flexible, which can buffer the clamping force. In conjunction with the external pressure sensor 28, the pressure data is monitored and fed back in real time, avoiding overload damage to the diode chip and ensuring the accuracy and safety of the clamping process. This device is suitable for the precise clamping and transfer of chips in diode packaging.

[0024] Example 2 Please see Figure 2 , Figure 3 This utility model provides a technical solution: A first sliding groove 4 is provided on the rear side of the base 1. A first motor 5 is installed on one side of the base 1. A first lead screw 6 is fixed to the output end of the first motor 5. A first slider 7 is threadedly connected to the outer surface of the first lead screw 6. A support seat 8 is welded to the outer side of the first slider 7. A second motor 9 is installed on one side of the support seat 8. A first gear 10 is fixed to the output end of the second motor 9. A second gear 11 is rotatably connected to the top of the support seat 8, and the second gear 11 is fixedly connected to the bottom end of the upright 12. A second sliding groove 13 is provided on the outer surface of the upright 12. A third motor 14 is installed at the bottom end of the upright 12. A second lead screw 15 is fixed to the output end of the third motor 14. A second slider 16 is threadedly connected to the outer surface of the second lead screw 15, and the second slider 16 is fixedly connected to the crossbar 17.

[0025] This clamping and transfer device for diode packaging comprises three motors: a first motor 5 drives a first lead screw 6 to rotate, which in turn causes a first slider 7 to move horizontally along a first groove 4 via threaded transmission. This movement drives a support base 8 to shift laterally, adjusting the horizontal position of the clamping device to suit different workstation requirements and enhance the flexibility and automation of the packaging process. A second motor 9 drives a first gear 10 to rotate, which in turn drives a second gear 11 and a vertical rod 12 to rotate around a vertical axis. This enables 360° rotation adjustment of the vertical rod 12 and the clamping device, flexibly adjusting the chip clamping direction to meet the needs of multi-angle packaging operations and improve the applicability and process compatibility of the device. A third motor 14 drives a second lead screw 15 to rotate, which in turn causes a second slider 16 to move vertically up and down along a second groove 13 of the vertical rod 12 via threaded transmission. This movement drives a crossbar 17 and the clamping mechanism to move up and down. The coordinated action of these three motors enables precise positioning and flexible transfer of the clamping device in three-dimensional space, meeting the needs of multi-station and multi-angle automated operations in the diode packaging process and improving packaging efficiency and accuracy.

[0026] Example 3 Please see Figure 1 This utility model provides a technical solution: A controller 2 is installed on one side of the base 1, and a placement platform 3 is provided on the upper surface of the base 1. The outer surface of the placement platform 3 is provided with several positioning slots that are compatible with the diode chip.

[0027] In this clamping and transfer device for diode packaging, the controller 2 coordinates the actions of each motor through a preset program to control the movement, rotation and clamping operation of the clamping device, thereby achieving automated control of the clamping and transfer process and improving efficiency and accuracy. The positioning slot on the placement stage 3 fixes the diode chip through a physical limiting structure, ensuring that the chip maintains a stable position before packaging, avoiding displacement or shaking, and ensuring the reliability and consistency of the packaging process.

[0028] Working principle: In use, the controller 2 coordinates the actions of the first motor 5, the second motor 9, the third motor 14, and the fourth motor 20 through a preset program. The first motor 5 drives the first lead screw 6 to rotate, causing the first slider 7 to move horizontally along the first slide groove 4, thereby driving the support seat 8 to shift laterally and adjust the horizontal position of the clamping device. The second motor 9 drives the first gear 10 to rotate, causing the second gear 11 and the upright rod 12 to rotate around the vertical axis, realizing the 360° rotation adjustment of the clamping device. The third motor 14 drives the second lead screw 15 to rotate, causing the second slider 16 to rise vertically along the second slide groove 13 of the upright rod 12. The lowering mechanism moves the crossbar 17 and the clamping mechanism up and down, and the three work together to achieve precise positioning of the clamping device in three-dimensional space. The fourth motor 20 drives the drive shaft 21 to rotate, which in turn drives the third gear 22 to rotate, thereby driving the two sets of racks 23 meshing with it to slide synchronously in opposite directions along the third slide groove 19 and the limiting shaft 25, realizing the opening and closing action of the two sets of clamping plates 27. This allows for precise clamping and transfer of the diode chip fixed in the positioning groove on the placement stage 3. Furthermore, the elasticity and flexibility of the clamping surface of the clamping plate 27, combined with the pressure sensor 28, can prevent overload damage to the chip, ensuring the efficiency, accuracy and safety of the packaging process.

[0029] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A clamping and transferring device for diode packaging, comprising a base (1) and a support (12), characterized in that: A vertical support rod (12) is vertically arranged on the rear side of the base (1), and a horizontal crossbar (17) is arranged on the outer side of the support rod (12). A mounting base (18) is welded to the top of the crossbar (17). Two sets of third sliding grooves (19) are symmetrically opened on the bottom of the mounting base (18). A fourth motor (20) is installed on the upper end surface of the mounting base (18). A drive shaft (21) is fixed to the output end of the fourth motor (20). The outer surface of the drive shaft (21) is fixed. There is a third gear (22). The mounting base (18) has two sets of racks (23) that mesh with the third gear (22) arranged obliquely and symmetrically inside. The bottom end of the rack (23) is fixed with a clamp (27). The clamps (27) are arranged symmetrically along the mounting base (18). The clamps (27) are slidably connected to the third slide groove (19). The clamping surface of the clamps (27) is elastic and flexible. A pressure sensor (28) is installed on the outside of the clamps (27).

2. The clamping and transferring device for diode packaging according to claim 1, characterized in that: The mounting base (18) has two sets of fixing brackets (24) symmetrically welded inside. The middle part of the fixing bracket (24) is fixed with a limiting shaft (25). The two ends of the rack (23) are fixed with connecting plates (26), and the connecting plates (26) are slidably connected to the limiting shaft (25).

3. The clamping and transferring device for diode packaging according to claim 1, characterized in that: The base (1) has a first sliding groove (4) on its rear side. A first motor (5) is installed on one side of the base (1). A first lead screw (6) is fixed to the output end of the first motor (5). A first slider (7) is threaded onto the outer surface of the first lead screw (6). A support seat (8) is welded to the outer side of the first slider (7).

4. The clamping and transferring device for diode packaging according to claim 3, characterized in that: A second motor (9) is installed on one side of the support base (8). A first gear (10) is fixed at the output end of the second motor (9). A second gear (11) is rotatably connected above the support base (8), and the second gear (11) is fixedly connected to the bottom end of the upright (12).

5. The clamping and transferring device for diode packaging according to claim 1, characterized in that: The outer surface of the upright (12) is provided with a second sliding groove (13), and a third motor (14) is installed at the bottom end of the upright (12). A second lead screw (15) is fixed at the output end of the third motor (14). A second slider (16) is threadedly connected to the outer surface of the second lead screw (15), and the second slider (16) is fixedly connected to the crossbar (17).

6. The clamping and transferring device for diode packaging according to claim 1, characterized in that: A controller (2) is installed on one side of the base (1), and a placement platform (3) is provided on the upper surface of the base (1), and a number of positioning slots adapted to the diode chip are opened on the outer surface of the placement platform (3).

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