Wafer lifting mechanism and wafer heating and adsorbing device

Abstract

This utility model discloses a wafer lifting mechanism, including a base plate and a lifting assembly disposed on the base plate. The base plate is provided with a driving part for driving the lifting assembly to rise and fall. The lifting assembly includes a lifting plate and a pin disposed on the lifting plate. The lifting plate is slidably connected to the base plate vertically. The driving part includes a sloping groove plate that is horizontally slidably connected to the base plate. The sloping groove plate is located outside the lifting plate. The sloping groove plate is provided with a guide groove. A follower block is installed on the lifting plate near the guide groove. The follower block is slidably connected in the guide groove. The lifting mechanism of this application arranges the driving unit around the heating adsorption stage, resulting in a small vertical height of the lifting mechanism, which is beneficial for reducing the overall height of the packaging equipment and improving the overall accuracy.

Description

Technical Field

[0001] This utility model relates to the field of wafer-level fan-out packaging technology, specifically a wafer lifting mechanism and a wafer heating and adsorption device. Background Technology

[0002] The target wafer for wafer-level fan-out packaging is located on a wafer carrier. The wafer carrier has two functions: uniform heating and vacuum adsorption, ensuring that the wafer is uniformly preheated to 250°C on the carrier and adsorbed flat without warping. The wafer loading and unloading process is generally achieved by a robot lifting the lower surface of the wafer. Therefore, the wafer heating and adsorption stage is equipped with ejector pin holes, and a lifting mechanism and ejector pins are installed at the bottom of the carrier. The lifting mechanism drives the ejector pins to rise in the ejector pin holes, and the ejector pins lift the wafer from the carrier to a certain height, so that the robot can reach under the wafer to lift and transport it.

[0003] Because the two surfaces of the wafer in contact with the adsorption stage have very high flatness, a vacuum layer is generated between them in a non-vacuum adsorption state. When it is necessary to separate the wafer from the adsorption stage, a large lifting force is required to overcome the adsorption force of the vacuum layer. Therefore, during the wafer lifting process, the instantaneous thrust is easily too large, which can lead to wafer cracking and positional displacement.

[0004] Because the height and size of the lifting mechanism and the wafer heating adsorption stage directly affect the overall height and accuracy of the packaging equipment, in order to ensure the accuracy of the equipment and the yield of the packaged products, the vertical height of the lifting mechanism and the wafer heating adsorption stage module is generally small and the structure is relatively compact. This results in insufficient installation space for the lifting mechanism, and the drive mechanism located below the heating equipment is easily affected by high temperature. Therefore, how to reduce the longitudinal height of the lifting mechanism and ensure stable operation in high-temperature environments, and how to achieve smooth wafer lifting without cracking or positional deviation, are urgent technical problems that need to be solved. Utility Model Content

[0005] The purpose of this invention is to provide a wafer lifting mechanism and a wafer heating and adsorption device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A wafer lifting mechanism includes a base plate and a lifting assembly disposed on the base plate, wherein the base plate is provided with a drive unit for driving the lifting assembly to rise and fall; The lifting assembly includes a lifting plate and a pin disposed on the lifting plate, and the lifting plate is slidably connected to the base plate. The driving unit includes a sloping groove plate that is horizontally slidably connected to the base plate. The sloping groove plate is located outside the lifting plate. A guide groove is provided on the sloping groove plate. A follower block is installed on the lifting plate near the guide groove. The follower block is slidably connected in the guide groove.

[0007] As a further embodiment of this utility model: the lifting plate is provided with a plurality of ejector pins, each ejector pin including an ejector pin rod fixedly connected to the lifting plate and an ejector pin head located at the top of the ejector pin rod.

[0008] As a further embodiment of this utility model: a plurality of guide shafts are provided on the base plate, and a linear bearing is provided at a corresponding position on the lifting plate. The guide shafts are inserted into the linear bearings, and an elastic retaining ring is provided at the top end of the guide shafts.

[0009] As a further embodiment of this utility model: the base plate is provided with two parallel guide rails, which are located on both sides of the lifting plate, and inclined groove plates are slidably connected to both guide rails.

[0010] As a further embodiment of this utility model: a motor base is provided on the base plate, a motor is installed on the motor base, a fixing plate is connected to one end of the two inclined slot plates near the motor, a threaded hole is provided on the fixing plate, a lead screw is connected to the output shaft of the motor, and the lead screw is threaded into the threaded hole on the fixing plate to form a lead screw drive unit.

[0011] As a further embodiment of this utility model: a limiting seat is provided on the base plate, and a limiting block is provided on the side of the limiting seat near the inclined plate.

[0012] As a further embodiment of this utility model: a sensor sensing sheet is fixedly connected to the outer side of the inclined groove plate, and a photoelectric sensor is provided on the base plate, with the sensor sensing sheet located above the photoelectric sensor.

[0013] As a further embodiment of this utility model: a plurality of follower blocks are provided on the side of the lifting plate, and a guide wheel is rotatably connected to the follower block. The guide wheel is rolled in the guide groove. The guide groove is divided into an initial stage, an intermediate stage, and an end stage from bottom to top. The length of the initial stage and the end stage does not exceed one-third of the length of the guide groove. The inclination angle between the initial stage and the end stage and the plane where the lifting plate is located is not greater than °.

[0014] A wafer heating and adsorption device includes a heating and adsorption section, the heating and adsorption section including a stage base plate fixedly connected to a base plate, the stage base plate being located above a lifting plate, the stage base plate being provided with a heating plate and an adsorption plate, the heating plate and the adsorption plate being provided with avoidance holes for avoiding the ejector pin.

[0015] As a further embodiment of this utility model: the platform base plate is fixedly connected to the base plate via a connecting seat, the connecting seat is provided with bolt holes, the connecting seat is fixedly connected to the base plate via connecting bolts, a heat insulation plate is provided between the platform base plate and the heating plate, a heating wire is provided inside the heating plate, and a vacuum adsorption interface is provided on the side of the adsorption plate.

[0016] Compared with the prior art, the beneficial effects of this utility model are: 1. The lifting mechanism of this application has a small longitudinal height by arranging the drive unit around the heating adsorption stage, which is beneficial to reducing the overall height of the packaging equipment and improving the overall accuracy. 2. The drive unit of this application is installed on the periphery of the wafer heating adsorption stage, which can reduce the impact of high temperature on the motor and enable the lifting mechanism to operate stably in a high temperature environment; 3. The lifting mechanism of this application is driven by an electric motor, and the lifting process can achieve smooth acceleration / deceleration settings; in addition, the initial stage of the guide groove is relatively gentle, and thus there is a slow acceleration process in the early stage of the lifting stroke, which will not cause instantaneous impact on the wafer and cause wafer cracking; the smooth deceleration and stopping process after lifting achieves smooth wafer lifting without position deviation, while ensuring stopping accuracy. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the lifting mechanism structure in this embodiment; Figure 2 This is a cross-sectional view of the lifting mechanism in this embodiment; Figure 3 This is a schematic diagram of the heating and adsorption device in this embodiment; Figure 4 This is a schematic diagram of a local structure of heating and adsorption in this embodiment.

[0018] In the diagram: 1-Base plate, 2-Inclined groove plate, 3-Guide rail, 4-Motor, 5-Motor base, 6-Screw rod, 7-Lifting plate, 8-Ejector rod, 9-Ejector head, 10-Elastic retaining ring, 11-Linear bearing, 12-Guide shaft, 13-Limit seat, 14-Limit block, 15-Guide wheel, 16-Sensor sensing plate, 17-Photoelectric sensor, 18-Guide groove, 19-Heating adsorption part, 20-Connecting bolt, 21-Connecting seat, 22-Adsorption plate, 23-Vacuum adsorption interface, 24-Heating plate, 25-Heating wire, 26-Heat insulation plate, 27-Platform base plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-2 In this embodiment of the present invention, a wafer lifting mechanism includes a base plate 1 and a lifting assembly disposed on the base plate 1. The base plate 1 is provided with a driving part for driving the lifting assembly to rise and fall.

[0021] The lifting assembly includes a lifting plate 7 and ejector pins disposed on the lifting plate 7. The lifting plate 7 has multiple ejector pins, each including an ejector pin rod 8 fixedly connected to the lifting plate 7 and an ejector pin head 9 located at the top of the ejector pin rod 8. The lifting plate 7 is slidably connected to the base plate 1. The base plate 1 has multiple guide shafts 12, and linear bearings 11 are disposed at corresponding positions on the lifting plate 7. The guide shafts 12 are inserted into the linear bearings 11, and elastic retaining rings 10 are disposed at the top of the guide shafts 12. The elastic retaining rings 10 limit the lifting of the lifting plate 7. In this embodiment, three pins are generally evenly distributed in a triangular pattern to provide stable support for the wafer. The ejector pin rod 8 is equipped with ejector pin heads 9, which are connected to the ejector pin rod 8 by threads. The ejector pin heads 9 have flat openings that can be used to adjust the flatness of the three ejector pin heads 9. When the ejector pin head 9 is in the raised position, it is higher than the upper surface of the heating and adsorption device, which facilitates disassembly, installation and flatness adjustment. The ejector pin head 9 is made of high-temperature resistant and anti-static engineering plastic polyether ether ketone (PEEK). The end face of the ejector pin head 9 is flat, and the ejector pin head 9 and the wafer are in surface contact. Compared with the point contact between the dome-shaped end face of the traditional metal ejector pin and the wafer, this reduces the possibility of excessive instantaneous thrust during wafer lifting, which could lead to wafer cracking.

[0022] The drive unit includes a sloping groove plate 2 that is horizontally slidably connected to the base plate 1. The sloping groove plate 2 is located on the outside of the lifting plate 7. In this embodiment, the base plate 1 is provided with two parallel guide rails 3, which are located on both sides of the lifting plate 7. Sloping groove plates 2 are slidably connected to both guide rails 3. The base plate 1 is provided with a motor base 5, and a motor 4 is installed on the motor base 5. A fixing plate is connected to one end of the two sloping groove plates 2 near the motor 4. The fixing plate is provided with a threaded hole. The output shaft of the motor 4 is connected to a lead screw 6. The lead screw 6 is threaded into the threaded hole on the fixing plate to form a lead screw drive unit. A limit seat 13 is provided on the base plate 1, and a limit block 14 is provided on the side of the limit seat 13 near the sloping groove plate 2.

[0023] Furthermore, in this embodiment, the guide rail 3 adopts a crossed roller guide rail, which is internally divided into a fixed guide rail and a sliding guide rail. The fixed guide rail is fixedly connected to the base plate 1, and the sliding guide rail is fixedly connected to the inclined groove plate 2. The sliding guide rail can slide horizontally relative to the fixed guide rail. Compared with the traditional guide rail slider mechanism, the crossed roller guide rail has no slider and a smaller longitudinal height, which can further reduce the longitudinal height of the lifting mechanism, thus helping to reduce the overall height of the packaging equipment and improve the overall accuracy.

[0024] A guide groove 18 is provided on the inclined plate 2. A follower block is installed on the lifting plate 7 near the guide groove 18. The follower block is slidably connected in the guide groove 18. In this embodiment, multiple follower blocks are provided on the side of the lifting plate 7. A guide wheel 15 is rotatably connected to the follower block. The guide wheel 15 is tumbled in the guide groove 18. The guide groove 18 is divided into an initial stage, an intermediate stage, and an end stage from bottom to top. The length of the initial stage and the end stage does not exceed one-third of the length of the guide groove 18. The initial stage and the end stage are perpendicular to the plane of the lifting plate 7. With an inclination angle not exceeding 45°, the inclined slot plate 2 converts the horizontal driving force provided by the motor 4 into the vertical driving force for the lifting plate 7 to rise and fall in the vertical direction. Compared with the vertical installation of the drive mechanism, this greatly reduces the longitudinal height of the lifting mechanism, which is beneficial to reducing the overall height of the packaging equipment and improving the overall accuracy. At the same time, in the initial and final stages of lifting, the inclined slot plate 2 moves the same horizontal distance, and the lifting distance of the lifting plate 7 is small, making the initial and final stages of lifting relatively smooth, avoiding damage to the wafer caused by excessive speed changes.

[0025] In addition, a sensor plate 16 is fixedly connected to the outer side of the inclined slot plate 2, and a photoelectric sensor 17 is provided on the base plate 1. The sensor plate 16 is located above the photoelectric sensor 17. The distance of horizontal movement of the inclined slot plate 2 can be monitored through the photoelectric sensor 17 and the sensor plate 16. As a high-position and low-position detection of the lifting mechanism, the sensor plate 16 is installed on the inclined slot plate 2. When the inclined slot plate 2 drives the lifting module to move to the high position, the sensor plate 16 triggers the high-position sensor motor to stop moving. When the inclined slot plate 2 drives the lifting module to move to the low position, the sensor plate 16 triggers the low-position sensor motor to stop moving. If the sensor malfunctions and the motor does not stop moving, it will drive the inclined slot plate 2 to continue moving horizontally until it contacts the limit block 14 and stops. The limit block 14 is made of a material with a buffer function to avoid impact vibration caused by abnormal situations, which could damage the wafer.

[0026] Please see Figures 3-4In this embodiment, a wafer heating and adsorption device includes a heating and adsorption section 19. The heating and adsorption section 19 includes a platform base plate 27 fixedly connected to a base plate 1. The platform base plate 27 is fixedly connected to the base plate 1 via a connecting seat 21. The connecting seat 21 is provided with bolt holes and is fixedly connected to the base plate 1 via connecting bolts 20. The platform base plate 27 is located above a lifting plate 7. A heating plate 24 and an adsorption plate 22 are provided on the platform base plate 27. A heat insulation plate 26 is provided between the platform base plate 27 and the heating plate 24. A heating wire 25 is provided inside the heating plate 24. A vacuum adsorption interface 23 is provided on the side of the adsorption plate 22. Avoidance holes for avoiding ejector pins are provided on the heating plate 24, the heat insulation plate 26, and the adsorption plate 22.

[0027] In this embodiment, the motor mount is installed on the base plate 1 and arranged around the heating adsorption part 19. Since the motor is arranged around the heating adsorption part 19 and away from the central heat source area, the impact of high temperature heat radiation on the motor's accuracy and lifespan is reduced.

[0028] In this embodiment, the wafer is located at the upper end of the heating and adsorption section 19. When it is necessary to lift the wafer, the motor 4 is started. The motor 4 drives the lead screw 6 to rotate. The lead screw 6 drives the inclined slot plate 2 to move horizontally. When the inclined slot plate 2 moves horizontally, since the rotating shaft of the guide wheel 15 located in the guide groove 18 is fixedly connected to the lifting plate 7, and the lifting plate 7 can only slide vertically connected to the base plate 1 through the limit of the guide shaft 12, the horizontal movement of the inclined slot plate 2 can be converted into the vertical movement of the lifting plate 7 through the inclined guide groove 18. When the lifting plate 7 moves upward, it will drive the ejector pin to move upward and lift the wafer at the upper end of the heating plate 24, thereby completing the lifting of the wafer.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer lifting mechanism, comprising a base plate (1) and a lifting assembly disposed on the base plate (1), characterized in that, The base plate (1) is provided with a drive unit for driving the lifting assembly to rise and fall; The lifting assembly includes a lifting plate (7) and a pin disposed on the lifting plate (7), and the lifting plate (7) is slidably connected to the base plate (1) vertically; The driving unit includes a sloping groove plate (2) that is horizontally slidably connected to the base plate (1). The sloping groove plate (2) is located outside the lifting plate (7). A guide groove (18) is provided on the sloping groove plate (2). A follower block is installed on the lifting plate (7) near the guide groove (18). The follower block is slidably connected in the guide groove (18).

2. The wafer lifting mechanism according to claim 1, characterized in that, The lifting plate (7) is provided with a plurality of ejector pins, the ejector pins including ejector pin rods (8) fixedly connected to the lifting plate (7) and ejector pin heads (9) located at the top of the ejector pin rods (8).

3. The wafer lifting mechanism according to claim 1, characterized in that, The base plate (1) is provided with a plurality of guide shafts (12), and the lifting plate (7) is provided with a linear bearing (11) at a corresponding position. The guide shaft (12) is inserted into the linear bearing (11), and an elastic retaining ring (10) is provided at the top of the guide shaft (12).

4. A wafer lifting mechanism according to claim 1, characterized in that, The base plate (1) is provided with two parallel guide rails (3), which are located on both sides of the lifting plate (7). Inclined groove plates (2) are slidably connected to both guide rails (3).

5. A wafer lifting mechanism according to claim 4, characterized in that, A motor mount (5) is provided on the base plate (1), and a motor (4) is installed on the motor mount (5). A fixing plate is connected to one end of the two inclined slot plates (2) near the motor (4). A threaded hole is provided on the fixing plate. A lead screw (6) is connected to the output shaft of the motor (4). The lead screw (6) is threaded into the threaded hole on the fixing plate to form a lead screw drive unit.

6. A wafer lifting mechanism according to claim 5, characterized in that, A limiting seat (13) is provided on the base plate (1), and a limiting block (14) is provided on the side of the limiting seat (13) near the inclined plate (2).

7. A wafer lifting mechanism according to claim 1, characterized in that, A sensor plate (16) is fixedly connected to the outside of the inclined plate (2), and a photoelectric sensor (17) is provided on the base plate (1). The sensor plate (16) is located above the photoelectric sensor (17).

8. A wafer lifting mechanism according to claim 1, characterized in that, The lifting plate (7) is provided with a plurality of follower blocks on its side. A guide wheel (15) is rotatably connected to the follower block. The guide wheel (15) is rolled in the guide groove (18). The guide groove (18) is divided into an initial stage, an intermediate stage and an end stage from bottom to top. The length of the initial stage and the end stage does not exceed one-third of the length of the guide groove (18). The inclination angle between the initial stage and the end stage and the plane where the lifting plate (7) is located is not greater than (45)°.

9. A wafer heating and adsorption device using a wafer lifting mechanism according to any one of claims 1-8, characterized in that, The device includes a heating and adsorption unit (19), which includes a platform base plate (27) fixedly connected to the base plate (1). The platform base plate (27) is located above the lifting plate (7). The platform base plate (27) is provided with a heating plate (24) and an adsorption plate (22). The heating plate (24) and the adsorption plate (22) are provided with avoidance holes for avoiding the ejector pin.

10. A wafer heating and adsorption device according to claim 9, characterized in that, The platform base plate (27) is fixedly connected to the base plate (1) via a connecting seat (21). The connecting seat (21) is provided with bolt holes and is fixedly connected to the base plate (1) via connecting bolts (20). A heat insulation plate (26) is provided between the platform base plate (27) and the heating plate (24). A heating wire (25) is provided inside the heating plate (24). A vacuum adsorption interface (23) is provided on the side of the adsorption plate (22).

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