A tray structure for wafer proton irradiation

Abstract

This utility model discloses a tray structure for wafer proton irradiation, belonging to the fields of nuclear technology applications and semiconductor manufacturing. It includes a bent tray base made of 5051 aluminum alloy. The left and right ends of the bent tray base are bent into standard angle aluminum with a thickness of 2mm. High-temperature resistant Teflon tape is adhered to the surface of the standard angle aluminum. Several semi-circular wafer positioning holes are formed at the top of the bent tray base. The wafer positioning holes and the bent tray base are integrally formed. Design improvements have been made to address element contamination and wear. First, compared to existing bent tray bases with large-area friction, this utility model uses a 2mm surface friction of standard angle aluminum. Simultaneously, the surface of the standard angle aluminum is adhered with high-temperature resistant Teflon tape, further reducing the surface friction coefficient and thus reducing the problem of element contamination of the wafer caused by wear.

Description

Technical Field

[0001] This utility model belongs to the field of nuclear technology application and semiconductor manufacturing, and specifically relates to a tray structure for wafer proton irradiation. Background Technology

[0002] Wafer proton irradiation trays are key components in semiconductor manufacturing that support wafers for proton irradiation processing. They must meet requirements for high precision, high temperature resistance, stability, and compatibility.

[0003] Currently, wafers used for proton irradiation are confined to a process terminal within a high-vacuum environment. This presents certain technical challenges for supporting the irradiated wafers. Firstly, the wafer support tray needs to reciprocate within the process terminal, which places certain demands on the tray's wear resistance. However, existing tray technologies rely on the entire flat surface of the tray for wear resistance (as shown below). Figure 1 Although it is rolling friction, the tray will still wear out after high-frequency reciprocating motion. Utility Model Content

[0004] In view of this, the purpose of this utility model is to provide a tray structure for wafer proton irradiation, to solve the problem that the working environment of wafers used for proton irradiation is currently confined within a process terminal and in a high vacuum environment. This poses certain technical challenges to the irradiation of the wafers. First, the tray supporting the wafer needs to move back and forth within the process terminal, which places certain requirements on the wear resistance of the tray. However, the wear resistance of existing trays is achieved through the contact of the entire flat surface of the tray (as follows). Figure 1 Although it is rolling friction, the pallet will still experience wear after high-frequency reciprocating motion.

[0005] To achieve the above objectives, this utility model employs the following technical solution: A tray structure for wafer proton irradiation includes a bent tray base, the bent tray base being made of 5051 aluminum alloy, the left and right ends of the bent tray base being bent into standard angle aluminum with a right angle structure, the thickness of the standard angle aluminum being 2mm, and high-temperature resistant Teflon tape being pasted on the surface of the standard angle aluminum.

[0006] As a preferred technical solution of this utility model, the top of the bending tray seat is provided with a plurality of semi-circular wafer positioning holes.

[0007] As a preferred embodiment of this utility model, the wafer positioning hole and the bending tray seat are integrally formed.

[0008] As a preferred embodiment of this utility model, a wafer support ring is placed inside the wafer positioning hole.

[0009] As a preferred technical solution of this utility model, the bending tray seat raises the bottom surface of the bending tray seat by bending a standard angle aluminum into a right angle structure, and the bending tray seat contacts the stainless steel roller through the 2mm thickness of the bottom surface of the standard angle aluminum.

[0010] This utility model has been improved: by reducing the contact area (below) Figure 2 (.) And by using high-temperature Teflon tape, the coefficient of friction and friction area can be reduced as much as possible.

[0011] In terms of precision and operation, firstly, the overall pallet processing method has been improved, eliminating more bending steps from the structural design and reducing the impact of bending on the overall flatness of the pallet. Secondly, structural deformation caused by welding can be corrected using standard angle aluminum, further improving the overall processing precision of the pallet.

[0012] In actual irradiation, the wafer positioning holes added to the bent tray base to increase yield will bring processing steps to the entire tray assembly. To address this, raising the bent tray base structure can eliminate the need for deburring, grinding and polishing the entire tray.

[0013] Regarding element contamination and wear, design improvements were made. First, compared to existing bending tray seats with large-area friction, this invention uses a 2mm surface friction of standard angle aluminum. At the same time, high-temperature resistant Teflon tape is adhered to the surface of the standard angle aluminum to further reduce the surface friction coefficient, thereby reducing the problem of element contamination of the wafer caused by wear.

[0014] This invention improves the pallet processing method by structurally reducing the number of bends and adding corrective aluminum angles to precisely control processing accuracy.

[0015] This utility model improves the pallet processing method, optimizes pallet weight and wear, adds standard angle aluminum to the structure to facilitate procurement and processing, and adds high-temperature Teflon tape to reduce wear and element contamination.

[0016] Other advantages, objectives, and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination and study, or may be learned from practice of this invention. The objectives and other advantages of this invention can be realized and obtained through the following description. Attached Figure Description

[0017] Figure 1 This invention compares the existing pallet contact method with the improved pallet contact method proposed in this application. Figure 1 ; Figure 2This invention compares the existing pallet contact method with the improved pallet contact method proposed in this application. Figure 2 ; Figure 3 This is a top view schematic diagram of the tray structure for wafer proton irradiation according to this utility model; Figure 4 These are top and front view schematic diagrams of the tray structure for wafer proton irradiation according to this utility model. In the diagram: 1. Bending tray seat; 2. Wafer positioning hole; 3. Standard angle aluminum; 4. Angle aluminum contact surface; 5. Bottom contact surface; 6. Stainless steel roller. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the above description of this utility model, it should be noted that the terms "one side," "the other side," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "identical" do not imply that components must be absolutely identical; minor differences are permissible. The term "perpendicular" simply means that the positional relationship between components is more perpendicular than "parallel," not that the structure must be perfectly perpendicular; a slight tilt is acceptable. Example

[0023] Please see Figure 1-4 The present invention provides a technical solution: a tray structure for wafer proton irradiation, including a bent tray base 1, the bent tray base 1 is made of 5051 aluminum alloy, the bent tray base 1 has a cuboid structure, the four edges of the bent tray base 1 are bent into standard angle aluminum 3 with right angle structure, the thickness of the standard angle aluminum 3 is 2mm, and the surface of the standard angle aluminum 3 is pasted with high temperature resistant Teflon tape.

[0024] Specifically, in this embodiment, design improvements were made to address element contamination and wear. First, instead of the existing large-area friction bending tray, this invention uses a 2mm surface friction of standard angle aluminum. The angle aluminum contact surface 4 formed by the 2mm surface friction supports the edge of the bending tray 1, maintaining a certain distance between the bottom contact surface 5 of the bending tray 1 and the surface of the stainless steel roller 6. Simultaneously, high-temperature resistant Teflon tape is adhered to the surface of the standard angle aluminum 2 to further reduce the surface friction coefficient, thereby reducing the problem of element contamination of the wafer caused by wear.

[0025] The top of the bending tray 1 has several semi-circular wafer positioning holes 2. The wafer positioning holes 2 and the bending tray 1 are integrally formed. A wafer support ring is placed inside the wafer positioning holes 2.

[0026] The bending pallet seat 1 raises the bottom surface of the bending pallet seat 1 by bending the standard angle aluminum 3 into a right angle structure, and the bending pallet seat 1 contacts the stainless steel roller through the 2mm thickness of the bottom surface of the standard angle aluminum 3.

[0027] Specifically, in this embodiment, the present invention has made improvements: by reducing the contact area (below) Figure 2 In addition, high-temperature Teflon tape is used to minimize the coefficient of friction and friction area.

[0028] Specifically, in this embodiment, regarding accuracy and operation, firstly, the overall processing method of the pallet is improved, eliminating more bending steps structurally and reducing the impact of bending on the overall flatness of the pallet. Secondly, structural deformation caused by welding can be corrected using standard angle aluminum, further improving the overall processing accuracy of the pallet.

[0029] In actual irradiation, the wafer positioning holes added to the bent tray base to increase yield will bring processing steps to the entire tray assembly. To address this, raising the bent tray base structure can eliminate the need for deburring, grinding and polishing the entire tray.

[0030] Specifically, in this embodiment, the present invention improves the pallet processing method by structurally reducing the number of bending operations and adding corrective aluminum angles to precisely control processing accuracy.

[0031] Specifically, in this embodiment, the present invention improves the pallet processing method, optimizes pallet weight and wear, adds standard angle aluminum to the structure to facilitate procurement and processing, and adds high-temperature Teflon tape to reduce wear and element contamination.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A tray structure for wafer proton irradiation, comprising a bent tray base (1), characterized in that: The bending tray seat (1) is made of 5051 aluminum alloy. The bending tray seat (1) has a cuboid structure. The four edges of the bending tray seat (1) are bent into standard angle aluminum (3) with right angle structure. The thickness of the standard angle aluminum (3) is 2mm. The surface of the standard angle aluminum (3) is pasted with high temperature resistant Teflon tape.

2. The tray structure for wafer proton irradiation according to claim 1, characterized in that: The top of the bending tray base (1) is provided with several semi-circular wafer positioning holes (2).

3. The tray structure for wafer proton irradiation according to claim 2, characterized in that: The wafer positioning hole (2) and the bending tray seat (1) are integrally formed.

4. The tray structure for wafer proton irradiation according to claim 3, characterized in that: A wafer support ring is placed inside the wafer positioning hole (2).

5. The tray structure for wafer proton irradiation according to claim 1, characterized in that: The bending tray seat (1) is raised by a standard angle aluminum (3) bent into a right angle structure. The bending tray seat (1) contacts the stainless steel roller through the 2mm thickness of the bottom surface of the standard angle aluminum (3).

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