Wafer surface shape detection apparatus

Abstract

This invention provides a wafer surface inspection device, comprising: a worktable; a material placement table including a material placement panel with a receiving area extending through it, and multiple support columns evenly distributed circumferentially along the edge of the receiving area; a sliding module including an X-axis sliding module and a Y-axis sliding module; an inspection support mounted on a slide block at the end of the sliding module, including a horizontally arranged and parallel upper rod and a lower rod; and an inspection device including an upper inspection head mounted on the upper rod and facing downwards, and a lower inspection head mounted on the lower rod and facing upwards. The upper and lower inspection heads are located on the same vertical line and have a gap between them, forming an inspection area. The receiving area is located on the movement path of the inspection area. This wafer surface inspection device can easily perform complex inspection tasks, provide accurate results, and has good operational stability and high reliability.

Description

Technical Field

[0001] This utility model relates to a testing device, and more particularly to a wafer surface inspection device. Background Technology

[0002] In the semiconductor manufacturing industry, wafer (also known as silicon wafer) inspection is a crucial step. Traditional wafer inspection methods mainly rely on manual labor or the use of some basic automated equipment. However, these methods often have some significant limitations. First, manual inspection is not only inefficient but also prone to false positives or false negatives due to sensory fatigue. Furthermore, while existing automated equipment has improved inspection speed to some extent, its flexibility and accuracy are limited, failing to meet increasingly complex testing requirements.

[0003] As the semiconductor industry moves towards greater refinement and precision, market demands are placing higher requirements on wafer inspection technology. Currently, there is an urgent need in the market for automated, efficient, and accurate wafer inspection equipment. Summary of the Invention

[0004] The technical problem to be solved by this invention is to provide a wafer surface inspection device that can easily perform complex inspection tasks, provide accurate results, and ensure long-term operational stability and reliability.

[0005] This utility model provides a wafer surface inspection device, which includes:

[0006] Workbench 1;

[0007] The material placement platform 7 is installed on the workbench 1 and includes a horizontally arranged material placement panel 71. The material placement panel 71 has a through circular hole and forms a receiving area 70 for accommodating the wafer 8. The receiving area 70 has a plurality of support columns 732 evenly distributed around its circumferential edge, which can contact the lower surface of the wafer 8 and provide support.

[0008] A sliding module is provided on the worktable 1, including an X-axis sliding module and a Y-axis sliding module;

[0009] The detection support 3 is installed on the slide at the end of the sliding module and includes an upper rod 321 and a lower rod 322 that are horizontally arranged and parallel to each other.

[0010] The detection device 6 is used to detect the surface of the wafer 8. It includes an upper detection head 61 mounted on the upper rod 321 and facing downward, and a lower detection head 62 mounted on the lower rod 322 and facing upward. The upper detection head 61 and the lower detection head 62 are located on the same vertical line and have a gap between them to form a detection area. The receiving area 70 is located on the movement path of the detection area.

[0011] The testing equipment described in this application features a sliding module and two detection heads, significantly increasing testing efficiency. By simultaneously scanning the upper and lower surfaces, double-sided data acquisition can be completed in a single stroke. This eliminates the traditional flipping waiting time; traditional single-sided testing requires manual or robotic wafer flipping, while double-sided testing eliminates the time-consuming flipping, positioning, and calibration processes, resulting in high testing efficiency. It is suitable for high-volume production and testing, significantly improving online testing throughput. Simultaneously, it enhances data correlation and accuracy. The dual-probe design, controlled by the same sliding stage motion system, ensures a strict spatial correspondence between the measurement data of the upper and lower surfaces. This eliminates flipping errors, avoiding wafer position shifts or vibrations caused by flipping, and ensuring absolute spatial synchronization of double-sided topography / thickness data. Furthermore, the dual probes operate synchronously under identical temperature, humidity, and vibration conditions, ensuring consistent impact of system errors (such as thermal drift) on double-sided data, making calibration and compensation easier.

[0012] By precisely controlling the movement of the sliding module, the upper detection head 61 and the lower detection head 62 are ensured to scan the upper and lower surfaces of the wafer 8 synchronously, achieving all-round detection without blind spots, which greatly improves the detection accuracy and efficiency.

[0013] Furthermore, the upper detection head 61 and the lower detection head 62 are dispersive confocal sensors, which have high detection accuracy, reaching nanometer-level precision, meeting the stringent requirements of semiconductor manufacturing; at the same time, they can achieve non-contact detection, protecting the wafer; they have high-speed point / line scanning capability, high detection efficiency; and they have good anti-interference capability, such as vibration, good stable operation, and high reliability; they can quickly and accurately detect the surface morphology and roughness of the wafer.

[0014] Furthermore, the upper detection head 61 and the lower detection head 62 are respectively installed at the ends of the upper rod 321 and the lower rod 322 through a fine-tuning mechanism, and their height and tilt can be adjusted. It can dynamically adapt to wafer deformation. After high-temperature processing, wafer warping can reach hundreds of micrometers. Traditional rigid probes are prone to defocusing or collision. With the above solution, the height and tilt of the probe can be adjusted, solving the hard limitations such as defocusing and collision risks. At the same time, the upper and lower probes can be adjusted independently to adapt to asymmetric warping.

[0015] Furthermore, the fine-tuning mechanism includes a first adjustment component 4 for adjusting the height and a second adjustment component 5 mounted on the first adjustment component 4 for adjusting the tilt. The dual adjustment component setup is simple in structure, easy to operate, and can avoid mutual interference during the adjustment process.

[0016] Furthermore, the first adjustment assembly 4 includes a fixed seat 41 installed at the end of the upper rod 321 or the lower rod 322 and a vertical slide block 42 slidably mounted on the fixed seat 41. A rack 412 is vertically arranged on the fixed seat 41, and a rotating shaft 43 is rotatably mounted on the vertical slide block 42. The side wall of the rotating shaft 43 is provided with a gear 431 that meshes with the rack 412. The vertical slide block 42 is provided with a locking nut 44 for pressing the fixed seat 41 and fixing it. The adjustment is convenient and labor-saving.

[0017] Furthermore, the side wall of the fixed base 41 is vertically provided with a strip-shaped protrusion 411 with a trapezoidal cross-section, and the rack 412 is disposed on the side wall of the strip-shaped protrusion 411; the vertical slide 42 is provided with a guide groove 420 for inserting the strip-shaped protrusion 411 and achieving sliding fit, and the gear 431 is disposed in the guide groove 420.

[0018] Furthermore, the side walls of the fixed base 41 and the vertical slide 42 are provided with scale markings; this allows for a direct understanding of the relative position of the vertical slide 42 to the fixed base 41, facilitating precise control and adjustment of the height.

[0019] Furthermore, the second adjustment component 5 includes a fixed support 52 mounted on the first adjustment component 4 and a movable support 51 mounted on the lower or upper end of the fixed support 52. Multiple tension springs are provided between the movable support 51 and the fixed support 52, causing the movable support 51 and the fixed support 52 to tend to move closer to each other. The fixed support 52 is provided with three adjusting bolts 53 arranged in a triangular pattern. The ends of the adjusting bolts 53 pass through the fixed support 52 and contact the movable support 51, thus adjusting the distance between the movable support 51 and the fixed support. The upper detection head 61 or the lower detection head 62 is mounted on the movable support 51. During adjustment, by controlling the adjusting bolts 53, they are made to press against the movable support 51, overcome the spring force, and move away from the fixed support 52, achieving precise adjustment of the tilt in any direction. The adjustment is convenient, labor-saving, and has a self-locking function.

[0020] Furthermore, the movable support 51 is provided with a positioning groove 510 that is coaxial with the adjusting bolt 53 and allows the end of the adjusting bolt 53 to be inserted; this ensures that the end of the adjusting bolt is located in the positioning groove, preventing slippage and horizontal offset, and improving adjustment stability and accuracy.

[0021] Furthermore, the fixed support 52 and / or the movable support 51 are provided with a tension spring mounting hole 520 for mounting a tension spring, and the end of the tension spring mounting hole is provided with a strip groove 521 for mounting a pin to fix the tension spring; this enables the tension spring to be installed in a concealed manner, improves the overall structural compactness and aesthetics, and reduces the overall volume, especially in the height direction, thus achieving a miniaturized design.

[0022] Furthermore, the fixed support 52 has an L-shaped cross-section, and three adjusting bolts are respectively set at both ends and the corner of the L-shaped fixed support, which improves the structural compactness. At the same time, it can reduce the interference with the installation of the detection head, provide more installation space for the moving support, and facilitate the installation and fixation of the detection head.

[0023] Furthermore, the upper surface of the material placement panel 71 is evenly distributed with strip-shaped mounting grooves 710 in the circumferential direction. The length direction of the mounting grooves 710 is parallel to the radial direction of the receiving area 70. A support rod 72 is installed in the mounting groove 710. One or more strip-shaped holes 720 are provided on the support rod 72 along its length direction. One or more bolts pass through the strip-shaped holes 720 and are connected to the material placement panel 71 to fix the support rod 72. The support column 732 is located at the head of the support rod 72. It can adjust the position of the support rod according to the needs, so that the support column 732 moves inward (closer to the center) or outward (away from the center), adapting to wafers of different specifications, with high flexibility and wide applicability.

[0024] Furthermore, an L-shaped material placement seat 73 is fixed to the head of the support rod 72. The material placement seat 73 has an upward-facing material placement surface 731, and the support column 732 is disposed on the material placement surface 731. It can radially limit the wafer, improve the placement stability and reliability of the wafer, and facilitate the improvement of detection efficiency.

[0025] This novel wafer surface profile inspection equipment significantly increases inspection efficiency. Through simultaneous scanning of the upper and lower surfaces, double-sided data acquisition can be completed in a single pass. It eliminates the traditional flipping waiting time; traditional single-sided inspection requires manual or robotic wafer flipping, while double-sided inspection saves time on flipping, positioning, and calibration, resulting in high inspection efficiency. It is suitable for high-volume production and inspection, significantly improving online inspection throughput. Simultaneously, it enhances data correlation and accuracy. The dual-probe design, controlled by the same slide motion system, ensures a strict spatial correspondence between the measurement data of the upper and lower surfaces. It eliminates flipping errors, avoiding wafer position shifts or vibrations caused by flipping, ensuring absolute spatial synchronization of double-sided topography / thickness data. Furthermore, the dual probes operate synchronously under identical temperature, humidity, and vibration environments, ensuring consistent impact of system errors (such as thermal drift) on double-sided data, facilitating calibration and compensation. This novel wafer surface profile inspection equipment can easily perform complex inspection tasks, providing accurate results with good operational stability and high reliability. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the wafer surface inspection equipment of this utility model;

[0027] Figure 2 This is a cross-sectional view of the wafer surface inspection equipment of this utility model;

[0028] Figure 3 This is a schematic diagram of the installation of the testing device in the wafer surface inspection equipment of this utility model;

[0029] Figure 4 This is a schematic diagram of the fine-tuning mechanism of the wafer surface inspection equipment of this utility model;

[0030] Figure 5 This is a schematic diagram of the structure of the second adjustment component of the wafer surface inspection equipment of this utility model;

[0031] Figure 6 This is a schematic diagram of the second adjustment component of the wafer surface inspection equipment of this utility model from another angle.

[0032] Figure 7 This is a cross-sectional view of the second adjustment component of the wafer surface inspection equipment of this utility model;

[0033] Figure 8 This is a schematic diagram of the structure of the fixing base of the wafer surface inspection equipment of this utility model;

[0034] Figure 9 This is an exploded structural diagram of the material placement stage of the wafer surface inspection equipment of this utility model.

[0035] Figure 10 This is a schematic diagram of the support rod of the wafer surface inspection equipment of this utility model. Detailed Implementation

[0036] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0037] See Figures 1-10 This utility model provides a wafer surface inspection device for detecting the thickness, flatness (roughness) and defects of the wafer surface, including a worktable 1, a material placement table 7, a sliding module and an inspection device 6.

[0038] The workbench 1 serves as the installation carrier, and the sliding module and the material placement platform 7 are installed on the workbench 1.

[0039] The placement stage 7 is installed on the workbench 1 and is used to place the wafer 8 to be inspected. It includes a horizontally arranged placement panel 71 with a circular through hole through the placement panel 71 to form a receiving area 70 for receiving the wafer 8. Multiple support pillars 732 are evenly distributed around the edge of the receiving area 70. The support pillars 732 can contact the lower surface of the edge of the wafer 8 to support the wafer 8.

[0040] In this application, multiple strip-shaped mounting grooves 710 are evenly distributed circumferentially on the upper surface of the material placement panel 71, preferably three. The length direction of the mounting grooves 710 is parallel to the radial direction of the receiving area 70, and the grooves are internally connected to the receiving area 70. A support rod 72 is installed in the mounting groove 710. One or more strip-shaped holes 720 are provided on the support rod 72 along its length direction for mounting bolts. One or more bolts pass through the strip-shaped holes 720 and are threadedly connected to the material placement panel 71 to fix the support rod 72. A support column 732 is located at the head of the support rod 72. The support rod can slide within the mounting groove 710, thereby adjusting the position of the support column 732. It can be adjusted according to needs. The position of the support rod allows the support column 732 to move inward (near the center) or outward (away from the center), adapting to wafers of different specifications, offering high flexibility and wide applicability. In this embodiment, a material placement seat 73 is fixed to the head of the support rod 72. The material placement seat 73 is L-shaped, with an upward-facing material placement surface 731 on it. The outer side of the material placement surface 731 is bent upward to form a limiting part, forming an overall L-shaped structure. This limiting part is used to limit the edge of the wafer, facilitating rapid positioning and placement of the wafer. The support column 732 is set on the material placement surface 731; it can radially limit the wafer, improving the placement stability and reliability of the wafer, and contributing to improved testing efficiency.

[0041] A sliding module is mounted on the worktable 1 to drive the inspection device to move horizontally, thereby inspecting the wafers on the loading stage. This sliding module includes an X-axis sliding module and a Y-axis sliding module, both of which can move horizontally, and their sliding directions are perpendicular. (See reference...) Figure 1The X-axis sliding module includes a first guide rail 21 mounted on a worktable 1. Two first guide rails 21 are horizontally arranged and parallel to each other. A first slide block 22 is horizontally mounted between the two first guide rails 21. A second guide rail 23 is mounted on the first slide block 22. The second guide rail 23 is horizontally arranged and perpendicular to the first guide rail 21. A second slide block 24 is slidably mounted on the second guide rail 23. The second slide block 24 can slide horizontally, with the sliding direction perpendicular to the first slide block 22. The second slide block 24 serves as the end slide block of the sliding module, and a detection device 6 is mounted on the second slide block 24. Additionally, a first drive mechanism for driving the first slide block 22 to slide and a second drive mechanism for driving the second slide block 24 to slide are provided. The first and second drive mechanisms can be lead screw assemblies with servo motors or linear motors.

[0042] A detection support 3 is installed on the slide block at the end of the sliding module, i.e., on the second slide block 24, for installing the detection device 6. The detection support 3 includes a fixing plate 31 fixed on the second slide block 24. An upper rod 321 and a lower rod 322 are fixed on the fixing plate 31. The upper rod 321 and the lower rod 322 are horizontally arranged and parallel to each other. The upper rod 321 is located directly above the lower rod 322. It serves as the mounting carrier for the detection device and is used to install two detection heads, corresponding to the upper and lower surfaces of the wafer, respectively. In this embodiment, the upper rod 321 and the lower rod 322 are profiles.

[0043] The inspection device 6 is used to inspect the surface features of the wafer 8, including curvature, flatness, roughness, and defects. The inspection device 6 includes an upper inspection head 61 and a lower inspection head 62. The upper inspection head 61 is mounted on the upper rod 321 and faces downward, while the lower inspection head 62 is mounted on the lower rod 322 and faces upward. They are used to inspect the upper and lower surfaces of the wafer, respectively. The upper inspection head 61 and the lower inspection head 62 are located on the same vertical line, and there is a gap between the two (upper and lower inspection heads) to form an inspection area. The receiving area 70 is located on the movement path of the inspection area. Therefore, the wafer surface within the receiving area 70 can be inspected.

[0044] The testing equipment described in this application features a sliding module and two detection heads, significantly increasing testing efficiency. By simultaneously scanning the upper and lower surfaces, double-sided data acquisition can be completed in a single stroke. This eliminates the traditional flipping waiting time; traditional single-sided testing requires manual or robotic wafer flipping, while double-sided testing eliminates the time-consuming flipping, positioning, and calibration processes, resulting in high testing efficiency. It is suitable for high-volume production and testing, significantly improving online testing throughput. Simultaneously, it enhances data correlation and accuracy. The dual-probe design, controlled by the same sliding stage motion system, ensures a strict spatial correspondence between the measurement data of the upper and lower surfaces. This eliminates flipping errors, avoiding wafer position shifts or vibrations caused by flipping, and ensuring absolute spatial synchronization of double-sided topography / thickness data. Furthermore, the dual probes operate synchronously under identical temperature, humidity, and vibration conditions, ensuring consistent impact of system errors (such as thermal drift) on double-sided data, making calibration and compensation easier.

[0045] By precisely controlling the movement of the sliding module, the upper detection head 61 and the lower detection head 62 are ensured to scan the upper and lower surfaces of the wafer 8 synchronously, achieving all-round detection without blind spots, which greatly improves the detection accuracy and efficiency.

[0046] The upper detection head 61 and lower detection head 62 in this application are dispersive confocal sensors, which have high detection accuracy, reaching nanometer-level precision, meeting the stringent requirements of semiconductor manufacturing; at the same time, they can realize non-contact detection, protecting the wafer; they have high-speed point / line scanning capability, high detection efficiency; and they have good anti-interference capability, such as vibration, good stable operation, and high reliability; they can quickly and accurately detect the surface morphology and roughness of the wafer.

[0047] To achieve better adaptability and detection results, in this application, the upper detection head 61 and the lower detection head 62 are respectively installed at the ends of the upper rod 321 and the lower rod 322 through a fine-tuning mechanism, which can adjust the height and tilt of the detection head; it can dynamically adapt to wafer deformation. After high-temperature processing, wafer warping can reach hundreds of micrometers, and traditional rigid probes are prone to defocusing or collisions; after adopting the above solution, the height and tilt of the probe can be adjusted, solving the rigid limitations such as defocusing and collision risks. At the same time, the upper and lower probes can be adjusted independently to adapt to asymmetric warping.

[0048] The fine-tuning mechanism includes a first adjustment component 4 and a second adjustment component 5. The first adjustment component 4 is installed at the end of the upper or lower rod and is used to adjust the height. The second adjustment component 5 is installed on the first adjustment component 4 and is used to adjust the tilt. The dual adjustment component setup is simple in structure and easy to operate, and can avoid mutual interference during the adjustment process. In this application, the fine-tuning mechanisms on the upper rod 321 and the lower rod 322 are symmetrically arranged and coaxially arranged.

[0049] Specifically, the first adjusting component 4 includes a fixed base 41 and a vertical slide 42. The fixed base 41 is installed at the end of the upper rod 321 or the lower rod 322, and the vertical slide 42 is vertically slidably fitted onto the fixed base 41, thus enabling vertical movement up and down. A rack 412 is provided on the fixed base 41, which is vertically arranged and faces the vertical slide 42. A rotating shaft 43 is rotatably mounted on the vertical slide 42, which is horizontally arranged. Gear teeth are provided on the side wall of the rotating shaft 43, forming a gear 431. The gear 431 meshes with the rack 412. A handwheel 432 is provided at the end of the rotating shaft 43. By rotating the handwheel 432, the gear 431 can be driven to rotate. This drives the vertical slide to move up and down; at the same time, a locking nut 44 is provided on the vertical slide 42, the end of which is used to press the fixed seat 41 to achieve locking and fixing; in this application, a strip-shaped protrusion 411 is provided on the side wall of the fixed seat 41. The strip-shaped protrusion 411 is vertically arranged, that is, its length direction is vertical, and its cross-section is trapezoidal to form a guide rail. The rack 412 is provided on the side wall of the strip-shaped protrusion 411; correspondingly, a guide groove 420 is vertically arranged on the vertical slide 42. The cross-section of the guide groove 420 is the same as the cross-section of the strip-shaped protrusion, which can just accommodate the strip-shaped protrusion 411 to be inserted and achieve sliding fit; the gear 431 is provided in the guide groove 420. To prevent overtravel, a limiting component is provided between the fixed seat and the vertical slide 42 to limit the vertical travel of the vertical slide. Specifically, hexagonal socket screws 413 are provided at the upper and lower ends of the fixed seat 41, respectively, and these hexagonal socket screws 413 are respectively located at the upper and lower ends of the rack 412. Correspondingly, a limiting groove 4201 is provided on the inner wall of the guide groove 420. There are two limiting grooves 4201, located at the upper and lower ends of the gear 431, respectively. The upper end of the limiting groove 4201 is open and can accommodate the head of the upper hexagonal socket screw 413, and the lower end of the limiting groove 4201 is open and can accommodate the head of the lower hexagonal socket screw 413, thus forming upper and lower limits.

[0050] To provide a clear understanding of the lifting height, this application provides scale markings on the side walls of the fixed base 41 and the vertical slide 42; this allows for a clear understanding of the relative position of the vertical slide 42 to the fixed base 41, facilitating precise control and adjustment of the height.

[0051] The second adjusting component 5 is used to adjust the tilt of the upper and lower detection heads. It includes a fixed support 52 and a movable support 51. The fixed support 52 is mounted on the vertical slide 42 of the first adjusting component 4. The movable support 51 is mounted on the lower or upper end of the fixed support 52. Multiple tension springs are provided between the movable support 51 and the fixed support 52, which cause the movable support 51 and the fixed support 52 to tend to move closer to each other. At the same time, three adjusting bolts 53 are threaded onto the fixed support 52. The three adjusting bolts 53 are arranged in a triangular pattern. In this application, the cross-section of the fixed support 52 is L-shaped. The three adjusting bolts are respectively located at both ends and the corner of the L-shaped fixed support, which improves the structural compactness and reduces the impact on the detection head. The device is designed to minimize interference and provide more installation space for the movable support, facilitating the installation and fixation of the detection head. The end of the adjusting bolt 53 passes through the fixed support 52 and contacts the movable support 51. By rotating the adjusting bolt, the movable support can be moved. In turn, the distance between the movable support 51 and the fixed support can be adjusted through the combined action of the adjusting bolt and the tension spring. The three adjusting bolts can achieve the adjustment of the tilt in any direction. The upper detection head 61 or the lower detection head 62 is installed on the movable support 51. During adjustment, by controlling the adjusting bolt 53, it is made to press against the movable support 51 and overcome the spring force to move away from the fixed support 52, so as to achieve precise adjustment of the tilt in any direction. The adjustment is convenient, labor-saving, and has a self-locking function.

[0052] To facilitate the installation of the tension spring, a tension spring mounting hole 520 is provided on the fixed support 52 and / or the movable support 51. The axis of the tension spring mounting hole 520 is located on the horizontal plane and is used to install (accommodate) the tension spring. A strip groove 521 is provided at the end of the tension spring mounting hole for installing a pin, thereby fixing the end of the tension spring. This enables the tension spring to be installed in a concealed manner, improves the overall structural compactness and aesthetics, and reduces the overall volume, especially in the height direction, achieving a miniaturized design.

[0053] To improve the reliability and stability of adjustment, a positioning groove 510 coaxial with the adjusting bolt 53 is provided on the moving support 51. The diameter of the positioning groove 510 is larger than the diameter of the adjusting bolt, which allows the end of the adjusting bolt 53 to be inserted. This ensures that the end of the adjusting bolt is located in the positioning groove, preventing slippage and horizontal offset, thus improving the stability and accuracy of adjustment.

[0054] This novel wafer surface profile inspection equipment significantly increases inspection efficiency. Through simultaneous scanning of the upper and lower surfaces, double-sided data acquisition can be completed in a single pass. It eliminates the traditional flipping waiting time; traditional single-sided inspection requires manual or robotic wafer flipping, while double-sided inspection saves time on flipping, positioning, and calibration, resulting in high inspection efficiency. It is suitable for high-volume production and inspection, significantly improving online inspection throughput. Simultaneously, it enhances data correlation and accuracy. The dual-probe design, controlled by the same slide motion system, ensures a strict spatial correspondence between the measurement data of the upper and lower surfaces. It eliminates flipping errors, avoiding wafer position shifts or vibrations caused by flipping, ensuring absolute spatial synchronization of double-sided topography / thickness data. Furthermore, the dual probes operate synchronously under identical temperature, humidity, and vibration environments, ensuring consistent impact of system errors (such as thermal drift) on double-sided data, facilitating calibration and compensation. This novel wafer surface profile inspection equipment can easily perform complex inspection tasks, providing accurate results with good operational stability and high reliability.

[0055] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer surface profile inspection device, characterized in that, include: Workbench; A material placement platform is installed on the workbench and includes a horizontally arranged material placement panel. The material placement panel has a circular through hole and forms a receiving area for accommodating wafers. Multiple support columns that can contact the lower surface of the wafer and provide support are evenly distributed around the edge of the receiving area. A sliding module is provided on the worktable, including an X-axis sliding module and a Y-axis sliding module; The detection support is installed on the slide at the end of the sliding module and includes an upper rod and a lower rod that are horizontally arranged and parallel to each other. An inspection device for inspecting the surface of a wafer includes an upper inspection head mounted on the upper rod and facing downwards, and a lower inspection head mounted on the lower rod and facing upwards. The upper inspection head and the lower inspection head are located on the same vertical line and have a gap between them to form an inspection area. The receiving area is located on the movement path of the inspection area.

2. The wafer surface inspection equipment as described in claim 1, characterized in that: The upper detection head and the lower detection head are dispersive confocal sensors.

3. The wafer surface inspection equipment as described in claim 1, characterized in that: The upper detection head and the lower detection head are respectively installed at the ends of the upper rod and the lower rod through a fine-tuning mechanism, and their height and tilt can be adjusted.

4. The wafer surface inspection equipment as described in claim 3, characterized in that: The fine-tuning mechanism includes a first adjustment component for adjusting height and a second adjustment component mounted on the first adjustment component for adjusting tilt.

5. The wafer surface inspection equipment as described in claim 4, characterized in that: The first adjustment assembly includes a fixed seat installed at the end of the upper rod or the lower rod and a vertical slide seat slidably mounted on the fixed seat. A rack is vertically arranged on the fixed seat, and a rotating shaft is rotatably mounted on the vertical slide seat. The side wall of the rotating shaft is provided with a gear that meshes with the rack. The vertical slide seat is provided with a locking nut for pressing the fixed seat and fixing it.

6. The wafer surface inspection equipment as described in claim 5, characterized in that: The side walls of the fixed base and the vertical slide are marked with scale markings.

7. The wafer surface inspection equipment as described in claim 4, characterized in that: The second adjustment assembly includes a fixed support mounted on the first adjustment assembly and a movable support mounted on the lower or upper end of the fixed support. Multiple tension springs are provided between the movable support and the fixed support, causing the movable support and the fixed support to tend to move closer to each other. The fixed support is provided with three adjusting bolts arranged in a triangle. The ends of the adjusting bolts pass through the fixed support and contact the movable support, and can adjust the distance between the movable support and the fixed support. The upper detection head or the lower detection head is mounted on the movable support.

8. The wafer surface inspection equipment as described in claim 7, characterized in that: The movable support has a positioning groove that is coaxial with the adjusting bolt and allows the end of the adjusting bolt to be inserted.

9. The wafer surface inspection equipment as described in claim 7, characterized in that: The fixed support and / or the movable support are provided with spring mounting holes for mounting springs, and the end of the spring mounting hole is provided with a strip groove for mounting a pin to fix the spring.

10. The wafer surface inspection equipment as described in claim 1, characterized in that: The upper surface of the material placement panel is evenly distributed with strip-shaped mounting grooves in the circumferential direction. The length direction of the mounting grooves is parallel to the radial direction of the receiving area. A support rod is installed in the mounting groove. One or more strip-shaped holes are provided on the support rod along its length direction. One or more bolts pass through the strip-shaped holes and are connected to the material placement panel to fix the support rod. The support column is located at the head of the support rod.

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