Chip heat dissipation structure

Abstract

This utility model discloses a chip heat dissipation structure, relating to the field of chip heat dissipation technology. It includes: a package housing for mounting the chip; a heat sink located inside the package housing and in contact with the chip; a coolant circulation chamber connected to the bottom of the package housing; several first fins, one end connected to the heat sink and the other end entering the coolant circulation chamber; several second fins connected to the ends of the first fins located in the coolant circulation chamber, the second fins being corrugated fins; and an inlet pipe and an outlet pipe, respectively connected to opposite side walls of the coolant circulation chamber. The coolant enters the coolant circulation chamber and contacts the second fins. The corrugated fins increase turbulence, improving heat dissipation efficiency. The coolant absorbs heat from the second fins and exits through the outlet pipe, then recirculates. The continuous circulation of coolant within the coolant circulation chamber keeps it at a low temperature, further improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a chip heat dissipation structure. Background Technology

[0002] Chips (such as central processing unit chips, graphics processing unit chips, and memory chips) generate heat when they are working, especially server chips, which generate even more heat. This can easily reduce the chip's operating efficiency and lifespan.

[0003] Existing chip cooling methods mainly employ air cooling or water cooling. Air cooling uses a fan to blow air onto the chip, which has low heat dissipation efficiency. Water cooling uses a cavity to hold water and dissipates heat from the chip through the cavity. However, after a period of use, the water temperature becomes too high, resulting in low heat dissipation efficiency. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a chip heat dissipation structure, comprising:

[0005] The enclosure is used to mount the chip;

[0006] The heat sink is located inside the package housing and is in contact with the chip;

[0007] A coolant circulation chamber is connected to the bottom of the encapsulation housing;

[0008] Several first fins are connected at one end to the heat sink plate and at the other end to the coolant circulation chamber;

[0009] Several second fins are connected to the end of the first fin located in the coolant circulation chamber, and the second fins are wavy fins;

[0010] The inlet pipe and outlet pipe are respectively connected to the opposite side walls of the coolant circulation chamber.

[0011] Furthermore, the second fin consists of several rows, with several fins in each row, arranged neatly from the inlet pipe to the outlet pipe.

[0012] Furthermore, in the direction from the inlet pipe to the outlet pipe, the spacing between adjacent rows of the second fins gradually decreases.

[0013] Furthermore, the crests and troughs of the second fins in adjacent rows are staggered.

[0014] Furthermore, the second fin is inclined.

[0015] Furthermore, the tilt angle of the second fin is 15 to 30°.

[0016] Furthermore, the surface of the second fin is coated with a graphene or carbon nanotube coating.

[0017] Furthermore, spiral ribs with a height of 1 / 3 of the height of the coolant circulation chamber are arranged at the four corners of the coolant circulation chamber.

[0018] The beneficial effects of the technical solution provided by this utility model are as follows: In this utility model, a coolant circulation chamber is connected to the bottom of the chip's packaging shell, and a heat sink is set inside the packaging shell to contact the chip. A first fin is connected to the heat sink, extending into the coolant circulation chamber and connected to a wavy second fin. The coolant enters the coolant circulation chamber and contacts the second fin. The wavy fin increases turbulence and improves heat dissipation efficiency. The coolant absorbs the heat from the second fin and exits through the outlet pipe for re-cooling and circulation. The wavy second fin and the continuously circulating coolant can cool the chip in a timely manner. The coolant in the coolant circulation chamber can remain at a low temperature while continuously circulating, thus improving heat dissipation efficiency. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a chip heat dissipation structure provided by this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of a second fin provided by this utility model;

[0021] Figure 3 This is a schematic diagram showing the connection of an encapsulation shell, a heat sink, a first fin, and a second fin provided by this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of an inlet pipe provided by this utility model.

[0023] Reference numerals in the attached drawings: 1-Encapsulation housing; 2-Heat sink; 3-Coolant circulation chamber; 4-First fin; 5-Second fin; 6-Inlet pipe; 7-Outer pipe; 8-Connecting pipe; 9-Inner pipe. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0026] It should be noted that in this embodiment, the orientation or positional relationship indicated by terms such as "bottom," "top," "left," and "right" is based on the orientation or positional relationship shown in the accompanying drawings. It is used only for the convenience of describing this application and for simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] It should also be noted that, in this embodiment, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] See Figures 1-4 A chip heat dissipation structure includes: a package housing 1, which may be rectangular in structure, with an opening at the top and an installation cavity inside. The package housing 1 is mainly used to provide a support platform and act as a barrier. The material of the package housing 1 may be FR-4 epoxy resin glass fiber. The chip is encapsulated in the package housing 1 by a package material (either plastic or glass).

[0029] The package housing 1 is also equipped with a heat sink 2, which is located between the bottom of the package housing 1 and the chip. The heat sink 2 can be made of copper. Several first fins 4 are connected to the side wall of the heat sink 2 that contacts the bottom of the package housing 1. The first fins 4 can also be made of copper. The other end of the first fins 4 passes through the bottom of the package housing 1 and is located outside the package housing 1. The first fins 4 are bonded to the bottom of the package housing 1 with thermally conductive adhesive. The end of the first fins 4 located outside the package housing 1 is connected to a second fin 5. The second fin 5 is a corrugated fin and can also be made of copper. A coolant circulation chamber 3 is connected to the bottom of the outer side of the package housing 1. The second fins 5 are all located in the coolant circulation chamber 3. Inlet pipes 6 and outlet pipes are connected to the opposite side walls of the coolant circulation chamber 3. The coolant circulation chamber 3 can be made of titanium alloy.

[0030] It should be noted that this also includes the existing cooling circulation system's circulating pump (magnetic drive centrifugal pump), plate heat exchanger, liquid storage tank, and filter. The coolant in the liquid storage tank can be an aqueous solution of ethylene glycol with a thermal conductivity (W / m·K) of 0.38 (50% concentration), viscosity (cP) of 4.2, and boiling point (°C) of 107.

[0031] The inlet of the circulating pump is connected to the storage tank. The circulating pump delivers the coolant from the storage tank to the plate heat exchanger for cooling. A filter is connected between the circulating pump and the plate heat exchanger to filter impurities. The plate heat exchanger is connected to the inlet pipe 6. The cooled coolant enters the coolant circulation chamber 3. The heat generated by the chip is transferred to the first fin 4 and the second fin 5 through the heat sink 2. The coolant comes into contact with the second fin 5. The wavy fin increases turbulence and improves heat dissipation efficiency. The coolant absorbs the heat from the second fin 5 and returns to the storage tank through the outlet pipe, circulating in sequence. The wavy second fin 5 and the continuously circulating coolant can cool the chip in time. The coolant in the coolant circulation chamber 3 can be kept at a low temperature through continuous circulation, improving heat dissipation efficiency.

[0032] Furthermore, the second fin 5 consists of several rows, with several units in each row, see [reference needed]. Figure 2 In this embodiment, six rows are used as an example, with ten second fins 5 in each row. They are arranged neatly from the liquid inlet pipe 6 to the liquid outlet pipe, and the spacing between adjacent rows of second fins 5 gradually decreases from the liquid inlet pipe 6 to the liquid outlet pipe. For example, the distance between the first and second rows can be 2 mm, the distance between the second and third rows can be 1.6 mm, and so on, so that the second fins 5 are sparse in the front and dense in the back, which reduces the pressure drop and improves the heat dissipation capacity of the rear.

[0033] Furthermore, the staggered arrangement of the crests and troughs of the adjacent two rows of second fins 5 can increase the turbulence intensity and improve the heat dissipation efficiency.

[0034] Furthermore, the second fin 5 is inclined at an angle of 15–30°. Due to this angle, the coolant encounters resistance and is guided as it flows through, which alters the flow path and increases turbulence, thereby improving heat exchange efficiency. The 15–30° inclination angle is a reasonable setting that does not significantly increase coolant flow resistance while ensuring good heat transfer performance.

[0035] Furthermore, the surface of the second fin 5 is coated with a graphene or carbon nanotube coating to improve thermal conductivity.

[0036] Furthermore, spiral fins (with a pitch angle of 25°) with a height of 1 / 3 of the height of the coolant circulation chamber 3 are arranged at the four corners to eliminate more than 90% of the dead zone.

[0037] It should be noted that, see Figure 4The inlet pipe 6 includes an outer pipe 7, a connecting pipe 8, and an inner pipe 9. The connecting pipe 8 is located in the inner wall of the coolant circulation chamber 3. The outer pipe 7 is perpendicularly connected to the connecting pipe 8 and is located outside the coolant circulation chamber 3. The number of inner pipes 9 corresponds to the number of second fins 5 in each row. The inner pipes 9 are perpendicularly connected to the connecting pipe 8 and are located inside the coolant circulation chamber. The position of the inner pipes 9 corresponds to the position of the second fins 5 in the first row. The coolant enters the connecting pipe 8 through the outer pipe 7 and is then sprayed out to the multiple second fins 5 through the multiple inner pipes 9.

[0038] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip heat dissipation structure, characterized in that, include: The package housing (1) is used to mount the chip; The heat sink (2) is located inside the package housing (1) and is in contact with the chip; Coolant circulation chamber (3) is connected to the bottom of the encapsulation housing (1); Several first fins (4) are connected at one end to the heat sink (2) and at the other end to the coolant circulation chamber (3); Several second fins (5) are connected to the first fin (4) at the end of the coolant circulation chamber (3), and the second fins (5) are wavy fins; The inlet pipe (6) and the outlet pipe are respectively connected to the opposite side walls of the coolant circulation chamber (3).

2. The chip heat dissipation structure according to claim 1, characterized in that, The second fin (5) consists of several rows, each row containing several fins, arranged neatly from the inlet pipe (6) to the outlet pipe.

3. The chip heat dissipation structure according to claim 2, characterized in that, From the inlet pipe (6) to the outlet pipe, the spacing between adjacent rows of the second fins (5) gradually decreases.

4. The chip heat dissipation structure according to claim 3, characterized in that, The crests and troughs of the second fins (5) in two adjacent rows are staggered.

5. The chip heat dissipation structure according to claim 4, characterized in that, The second fin (5) is set at an angle.

6. The chip heat dissipation structure according to claim 5, characterized in that, The tilt angle of the second fin (5) is 15 to 30°.

7. The chip heat dissipation structure according to claim 1, characterized in that, The surface of the second fin (5) is coated with graphene or carbon nanotube coating.

8. The chip heat dissipation structure according to claim 1, characterized in that, Spiral ribs with a height of 1 / 3 of the height of the coolant circulation chamber (3) are arranged at the four corners of the coolant circulation chamber (3).

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