High-density tin-plated steel mesh with surface oxidation resistance
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-05
- Publication Date
- 2026-08-11
AI Technical Summary
[0003]本实用新型的目的在于提供表面抗氧化的高密度植锡钢网,以解决上述背景技术中提出现有植锡钢网抗氧化效果不佳的问题
本表面抗氧化的高密度植锡钢网中,通过设置的基板作为主体承载结构,其正中心的高密度植锡区及与之位置对应的抗氧化防护网格膜上的植锡孔,满足高密度植锡作业需求,四周边缘的金属包边条增强了钢网的整体强度和稳定性,金属包边条与基板接触面之间的密封硅胶层起到密封防潮等作用,而基板顶面和底面的抗氧化防护网格膜以及其与基板之间的抗氧化涂层,有效提升了钢网的表面抗氧化性能,使得该高密度植锡钢网在植锡过程中能更好地保证植锡质量,延长使用寿命,减少因氧化等问题导致的植锡不良情况。
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Figure CN224627169U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic manufacturing technology, specifically to a high-density tin-coated steel mesh with surface anti-oxidation. Background Technology
[0002] In the field of electronic chip repair and manufacturing, stencils are core tools for achieving precise soldering of chip pins and ensuring soldering quality. With increasing chip integration, the requirements for soldering precision and stencil durability are becoming increasingly stringent, highlighting the shortcomings of existing stencils in terms of oxidation resistance, deformation resistance, and soldering stability. Chinese Patent No. CN206259341U discloses a heat-dissipating and anti-bulging stencil, including a stencil board with an IC chip soldering area for placing IC chips. The IC chip soldering area has multiple heat dissipation holes around its perimeter and multiple through-hole soldering holes within the area. This invention can better dissipate hot air from a hot air blower and effectively alleviate problems such as stencil bulging due to overheating, increasing soldering success rate and improving repair efficiency. However, regarding oxidation resistance, this prior art does not mention any anti-oxidation protection measures for the substrate surface. In electronic manufacturing processes, stencils are often exposed to high temperatures, high humidity, or corrosive flux environments, making the substrate prone to oxidation. Once oxidation occurs, the dimensional accuracy of the soldering holes is affected, and the fluidity and filling effect of the solder paste in the soldering holes deteriorate, resulting in a decline in soldering quality and soldering defects such as cold solder joints and short circuits. In severe cases, the stencil needs to be replaced frequently, increasing production and time costs. Utility Model Content
[0003] The purpose of this invention is to provide a high-density tin-coated steel mesh with surface anti-oxidation properties, in order to solve the problem of poor anti-oxidation effect of existing tin-coated steel meshes mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: A high-density tin-coated steel mesh with surface anti-oxidation includes a substrate, a high-density tin-coated area is provided at the center of the substrate, metal edging strips are provided around the perimeter of the substrate, and an anti-oxidation protective mesh film is provided on the top and bottom surfaces of the substrate. The high-density tin-planting area and the antioxidant protective mesh film are provided with tin-planting holes with corresponding positions, and a sealing silicone layer is provided between the metal edging strip and the contact surface of the substrate. An antioxidant coating is also provided between the antioxidant protective mesh film and the substrate.
[0005] Preferably, positioning holes are provided at the four top corners of the substrate, which enables precise positioning of the stencil during the soldering operation, ensuring the accuracy of the soldering position and improving the precision and quality of the soldering.
[0006] Preferably, the substrate has a rectangular heat dissipation area around the outside of the tin-planting area, so that the heat generated during tin-planting and subsequent use can be dissipated in time, avoiding adverse effects on the stencil and tin-planting effect due to heat accumulation.
[0007] Preferably, the substrate is provided with several sets of uniformly spaced reinforcing ribs to improve overall rigidity and resistance to deformation, thereby improving the overall rigidity and resistance to deformation of the substrate and making it less prone to deformation during soldering and use, thus ensuring the stability and consistency of soldering.
[0008] Preferably, the thickness of the sealing silicone layer is 0.25-0.5mm, which allows for a good sealing effect between the metal edging strip and the substrate, effectively preventing moisture and dust. At the same time, this thickness range ensures sealing performance without affecting the overall structure due to excessive thickness.
[0009] Preferably, the metal edging strip is made of titanium alloy, and the surface of the metal edging strip and the anti-oxidation protective mesh film are at the same horizontal level. By using a titanium alloy edging strip and ensuring that the metal edging strip and the surface of the anti-oxidation protective mesh film are at the same horizontal level, the high strength and good corrosion resistance of titanium alloy are enhanced, thereby improving the edge strength and durability of the steel mesh. The consistent surface level ensures the stability of the steel mesh during placement and use.
[0010] Preferably, the antioxidant protective mesh film is made of polytetrafluoroethylene (PTFE) mesh film, and the antioxidant coating is made of ceramic coating with a thickness of 0.1-0.3 mm. PTFE has good antioxidant and corrosion resistance properties, and the ceramic coating further enhances the antioxidant capacity. This thickness range can ensure the antioxidant effect without adversely affecting the overall performance of the steel mesh and the tinning operation.
[0011] Compared with existing technologies, the beneficial effects of this utility model are: In this high-density tin-coated stencil with an anti-oxidation surface, the substrate serves as the main supporting structure. The high-density tin-coating area at its center and the tin-coating holes on the corresponding anti-oxidation protective mesh film meet the requirements of high-density tin-coating operations. The metal edging strips around the perimeter enhance the overall strength and stability of the stencil. The sealing silicone layer between the metal edging strips and the substrate contact surface serves to seal and prevent moisture. The anti-oxidation protective mesh film on the top and bottom surfaces of the substrate, as well as the anti-oxidation coating between the mesh and the substrate, effectively improve the surface anti-oxidation performance of the stencil. This allows the high-density tin-coated stencil to better ensure tin-coating quality during the tin-coating process, extend its service life, and reduce tin-coating defects caused by oxidation and other problems.
[0012] In this high-density, anti-oxidation stencil for soldering, several sets of uniformly spaced reinforcing ribs are installed within the substrate to enhance overall rigidity and resistance to deformation, forming a stable support structure within the substrate. During the soldering process, the stencil is subjected to pressure, such as the pressure of a squeegee scraping solder paste onto the stencil surface. The reinforcing ribs effectively enhance the overall rigidity of the substrate, making it less prone to bending or deformation under these pressures. This ensures the flatness of the soldering area, allowing the solder paste to pass evenly through the soldering holes, improving the consistency and stability of the soldering process, and ensuring that the size and shape of the solder dots on each soldered product meet the standards.
[0013] In this high-density tin-coated steel mesh with surface anti-oxidation properties, the anti-oxidation protective mesh film is made of polytetrafluoroethylene (PTFE), and the anti-oxidation coating is a ceramic coating. PTFE has excellent chemical stability and anti-oxidation properties, enabling it to resist oxidation in harsh environments and protect the substrate surface from oxidative corrosion. The ceramic coating also has good anti-oxidation, high-temperature resistance, and corrosion resistance, further enhancing the anti-oxidation protection effect. Attached Figure Description
[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are explained in detail together with the embodiments of the present invention, but do not constitute a limitation thereof.
[0015] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the present invention; Figure 3 This is an enlarged structural diagram of the cross-section of this utility model; 10. Substrate; 11. Positioning holes; 12. Heat dissipation area; 13. Reinforcing inner ribs; 20. Tin-reinforcing area; 21. Tin-reinforcing hole; 30. Metal edging strip; 31. Sealing silicone layer; 40. Antioxidant protective mesh film; 41. Antioxidant coating. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0017] In the description of this utility model, it should be understood that the terms "center", "vertical", "horizontal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used to facilitate the description of this utility model and to simplify the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0018] High-density tin-reinforced steel mesh with surface oxidation resistance, such as Figures 1-3 As shown, the system includes a substrate 10, a high-density solder padding area 20 at its center, metal edging strips 30 around the perimeter of the substrate 10, and an anti-oxidation protective mesh film 40 on its top and bottom surfaces. Corresponding solder padding holes 21 are formed on the high-density solder padding area 20 and the anti-oxidation protective mesh film 40. A sealing silicone layer 31 is provided between the metal edging strips 30 and the substrate 10. An anti-oxidation coating 41 is also provided between the anti-oxidation protective mesh film 40 and the substrate 10. The substrate 10 serves as the main supporting structure, with the high-density solder padding area 20 at its center and the surrounding area... The corresponding anti-oxidation protective mesh film 40 has tin-planting holes 21 to meet the requirements of high-density tin-planting operations. The metal edging strips 30 around the edges enhance the overall strength and stability of the steel mesh. The sealing silicone layer 31 between the metal edging strips 30 and the substrate 10 plays a role in sealing and moisture prevention. The anti-oxidation protective mesh film 40 on the top and bottom surfaces of the substrate 10 and the anti-oxidation coating 41 between them and the substrate 10 effectively improve the surface anti-oxidation performance of the steel mesh, so that the high-density tin-planting steel mesh can better ensure the tin-planting quality during the tin-planting process, extend its service life, and reduce tin-planting defects caused by oxidation and other problems.
[0019] Furthermore, positioning holes 11 are provided at the four corners of the substrate 10. These positioning holes 11 allow for precise engagement with external positioning devices (such as positioning pins) during the soldering operation. This enables the stencil to be quickly and accurately positioned when placed on the soldering worktable, preventing soldering errors caused by stencil misalignment. For example, in mass soldering production, the positioning holes 11 ensure that the placement height of each stencil is consistent, thereby ensuring that the solder points on each soldered product meet design requirements, significantly improving soldering accuracy and quality, and reducing scrap rates due to poor soldering.
[0020] It is worth noting that a rectangular heat dissipation area 12 is provided around the outer perimeter of the soldering area 20 on the substrate 10. During the soldering process, the soldering area 20 generates heat due to the heating of the solder paste. The presence of the heat dissipation area 12 increases the heat dissipation area of the substrate 10, enabling the generated heat to be dissipated in a timely manner. This helps maintain the temperature stability of the soldering area 20, preventing changes in solder paste performance due to excessively high local temperatures, such as accelerated solder paste oxidation and changes in fluidity, thereby ensuring the quality and stability of the soldering. At the same time, during the subsequent use and storage of the stencil, the heat dissipation area 12 also prevents heat accumulation from damaging the stencil material itself, extending the service life of the stencil.
[0021] The substrate 10 contains several sets of uniformly spaced reinforcing ribs 13, which enhance overall rigidity and resistance to deformation, forming a stable support structure within the substrate 10. During the soldering process, the stencil is subjected to pressure, such as the pressure exerted by a squeegee scraping solder paste onto its surface. The reinforcing ribs 13 effectively enhance the overall rigidity of the substrate 10, preventing it from bending or deforming under these pressures. This ensures the flatness of the soldering area 20, allowing the solder paste to pass evenly through the soldering holes 21, improving the consistency and stability of the soldering process, and ensuring that the size and shape of the solder dots on each soldered product meet the standards.
[0022] It is worth noting that the thickness of the sealing silicone layer 31 is 0.25-0.5mm. Within this thickness range, the sealing silicone layer 31 can fully fill the tiny gap between the metal edging strip 30 and the substrate 10. It can form an effective sealing barrier between the metal edging strip 30 and the substrate 10, preventing external moisture, dust, and other impurities from entering the steel mesh. At the same time, this thickness ensures good sealing performance without increasing the overall thickness of the steel mesh due to excessive thickness, which would affect its compatibility with other equipment. It also prevents the sealing silicone layer 31 itself from cracking due to excessive thickness, thus ensuring the durability of the sealing effect.
[0023] Specifically, the metal edging strip 30 is made of titanium alloy. The surface of the metal edging strip 30 and the anti-oxidation protective mesh film 40 are at the same horizontal level. Titanium alloy has advantages such as high strength, good corrosion resistance, and oxidation resistance. The metal edging strip 30 made of titanium alloy significantly enhances the strength and durability of the steel mesh edge. During the use of the steel mesh, the edges are easily damaged by collisions and friction. The titanium alloy edging strip can effectively protect the edges of the substrate 10 and extend the service life of the steel mesh. Furthermore, the fact that the surface of the metal edging strip 30 and the anti-oxidation protective mesh film 40 are at the same horizontal level ensures that the steel mesh can make stable contact when placed on the workbench or other equipment, avoiding tilting or shaking of the steel mesh due to inconsistent height, thereby ensuring the stability and accuracy of the soldering operation.
[0024] Furthermore, the anti-oxidation protective mesh film 40 is made of polytetrafluoroethylene (PTFE), and the anti-oxidation coating 41 is a ceramic coating with a thickness of 0.1-0.3 mm. PTFE has excellent chemical stability and anti-oxidation properties, enabling it to resist oxidation in harsh environments and protect the surface of the substrate 10 from oxidative corrosion. The ceramic coating also has good anti-oxidation, high-temperature resistance, and corrosion resistance, further enhancing the anti-oxidation protection effect. The thickness range of 0.1-0.3 mm ensures that the anti-oxidation coating 41 forms a uniform and dense protective layer on the surface of the substrate 10, effectively isolating oxygen and corrosive substances, without increasing the weight of the steel mesh or affecting its flexibility due to excessive thickness. It also ensures the bonding strength between the anti-oxidation coating 41 and the substrate 10 and the anti-oxidation protective mesh film 40, making the entire anti-oxidation protection system more stable and reliable, extending the service life of the steel mesh, and ensuring the quality of tin plating.
[0025] The working principle of this high-density tin-coated steel mesh with surface anti-oxidation: First, place the stencil on the soldering workbench. With the help of the positioning holes 11 at the four corners of the substrate 10, the stencil is precisely positioned to ensure the accuracy of the subsequent soldering. Next, because the substrate 10 has reinforcing inner ribs 13 to improve rigidity, the stencil can remain flat and stable. At this time, solder paste is applied to the high-density soldering area 20 in the center of the substrate 10 and scraped evenly with a scraper. The solder paste passes through the soldering holes 21 on the high-density soldering area 20 and the anti-oxidation protective mesh film 40 and falls precisely at the corresponding position below. During the tinning process, the rectangular frame-shaped heat dissipation area 12 around the outside of the tinning area 20 can dissipate heat in time, avoiding local overheating that could affect the tinning effect; the sealing silicone layer 31 between the metal edging strip 30 and the substrate 10 can effectively prevent moisture and dust, protecting the inside of the stencil; the anti-oxidation protective mesh film 40 and the anti-oxidation coating 41 can resist oxidation and ensure the quality of tinning. After the tinning is completed, the steel mesh is removed from the workbench. Because the metal edging strip 30 is made of titanium alloy, it has high strength and is not easy to damage the edge of the steel mesh during the handling process.
[0026] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A high-density, tin-plated steel mesh that is resistant to surface oxidation, comprising a substrate (10), characterized in that: The high-density tin planting area (20) is arranged at the center of the substrate (10), the metal edge band (30) is arranged at the four edges of the substrate (10), and the oxidation-resistant protective grid film (40) is arranged on the top surface and the bottom surface of the substrate (10); The high-density tin planting area (20) and the oxidation-resistant protective grid film (40) are provided with corresponding tin planting holes (21), and the metal edge band (30) is provided with a sealing silica gel layer (31) between the contact surface and the substrate (10); The oxidation-resistant protective grid film (40) and the substrate (10) are further provided with an oxidation-resistant coating (41).
2. The high-density, tin-plated steel mesh of claim 1, wherein: The substrate (10) is provided with positioning holes (11) at the four corners.
3. The high-density, tin-plated steel mesh of claim 1, wherein: The substrate (10) is provided with a rectangular frame-shaped heat dissipation area (12) outside the tin planting area (20).
4. The high-density, tin-plated steel mesh of claim 1, wherein: The substrate (10) is provided with several groups of reinforcing inner ribs (13) arranged uniformly and equidistantly and used for improving the overall rigidity and anti-deformation ability.
5. The high density, tin-plated steel mesh of claim 1, wherein: The thickness of the sealing silica gel layer (31) is 0.25-0.5mm.
6. The high density, tin-plated steel mesh of claim 1, wherein: The metal edge band (30) is made of titanium alloy, and the surface of the metal edge band (30) and the oxidation-resistant protective grid film (40) are at the same horizontal height.
7. The high-density, tin-plated steel mesh of claim 1, wherein: The oxidation-resistant protective grid film (40) is made of polytetrafluoroethylene grid film, and the oxidation-resistant coating (41) is made of ceramic coating with a thickness of 0.1-0.3mm.
Citation Information
Patent Citations
Heat dissipation is prevented drum and is planted tin net
CN206259341U