An IGBT module packaging structure

Abstract

This utility model discloses an IGBT module packaging structure, including an IGBT module. The top of the IGBT module is closed by an end cap, and both ends of the IGBT module are provided with terminals. Several PCB board mounting holes and internally threaded posts are machined on the edge of the end face of the IGBT module. The PCB board is mounted on top of the IGBT module and fixed by mounting bolts that engage with the mounting holes and internally threaded posts. Control pins are embedded in the sidewall of the IGBT module and connected to its interior. The tops of the control pins extend out of the IGBT module and connect to the PCB board. The IGBT module and PCB board are connected together by the threaded posts, ensuring a seamless fit between the PCB and the end face of the IGBT module, significantly reducing the bending and shear stresses borne by the pins.

Description

Technical Field

[0001] This utility model relates to the field of electronic technology, specifically to an IGBT module packaging structure. Background Technology

[0002] IGBT modules, as core components of power electronic devices, are widely used in electric vehicles, rail transportation, industrial frequency converters, and other applications requiring high reliability and durability. In traditional designs, the IGBT module is first fixed to the circuit board (PCB) via threaded holes at the four corners of the module housing, and then the PCB is soldered to the module pins. However, in high-vibration and high-impact operating environments, the pins are prone to fatigue fracture due to long-term mechanical stress, and under impact conditions, the four corners of the module housing may detach, leading to module failure. This problem is particularly prominent in automotive or industrial equipment, not only affecting equipment lifespan but also potentially causing safety hazards. Existing technologies mostly mitigate the risk of fracture by optimizing pin materials or layout, but they do not fundamentally solve the weak fixing between the PCB and the housing, allowing vibration energy to be directly transmitted to the pins. Summary of the Invention

[0003] The purpose of this invention is to provide a drying device to address the problem of water leakage in cables inside the test box. The hydraulic monitoring cables are filtered by this device before entering the test box.

[0004] The technical solution of this utility model: An IGBT module packaging structure includes an IGBT module; the top of the IGBT module is closed by an end cap, and the two ends of the IGBT module are provided with terminals. The edge of the end face of the IGBT module is machined with a plurality of PCB board mounting holes and internal threaded posts. The PCB board is mounted on the top of the IGBT module and is fixed by mounting bolts in cooperation with the PCB board mounting holes and internal threaded posts. The side wall of the IGBT module is provided with control pins that are connected to its interior, and the top of the control pins extends out of the IGBT module and connects to the PCB board.

[0005] The four corner sidewalls of the IGBT module are recessed inward, and there is a mounting plate at the bottom of the recess, with mounting holes machined on the mounting plate.

[0006] The plurality of internally threaded posts are staggered among the plurality of PCB board mounting holes and are located in the middle of the IGBT module.

[0007] The opening of the internal threaded post is also provided with a reinforcement platform on the IGBT module, and the opening of the PCB board mounting hole is provided with an annular protrusion with the same height as the reinforcement platform.

[0008] The reinforcement platform is trapezoidal.

[0009] The outer wall of the control pin is machined with knurled bevels, and the bottom is machined with a slot.

[0010] The beneficial effects of this utility model are: By connecting the IGBT module to the PCB board with threaded posts, the end faces of the PCB and IGBT module fit together as a whole, which significantly reduces the bending and shear stress on the pins. Attached Figure Description

[0011] Figure 1 This is a structural diagram of an IGBT module.

[0012] Figure 2 This is a schematic diagram of the assembly structure of the IGBT module and the PCB board.

[0013] Figure 3 This is a structural diagram of an internally threaded column.

[0014] Reference numerals: 1-IGBT module, 2-end cap, 3-terminal block, 4-PCB board mounting hole, 5-control pin, 6-internal threaded post, 7-reinforcing platform, 8-mounting hole, 9-PCB board, 10-mounting bolt, 11-slot, 12-knurled bevel. Detailed Implementation

[0015] Example 1: Metal threaded holes are added to the middle area on both sides of the module housing, and the PCB is rigidly connected to the housing with bolts to form a multi-point fixing structure. This design changes the contact surface between the PCB and the housing from partial welding to overall bonding. During vibration, the housing and PCB are stressed synchronously, significantly reducing the bending and shear stress on the pins. At the same time, the threaded holes are located in the middle of both sides of the housing, optimizing the distribution of mechanical loads, avoiding stress concentration, and further improving the overall structural rigidity of the module.

[0016] Direct mechanical connections between the four corners of the PCB and the four corners of the housing resulted in the middle area being suspended. This design, for the first time, enhances the rigid connection between the PCB and the housing by adding additional threaded metal holes near the center of the housing. This overcomes the limitations of traditional methods relying on pin force transmission and mechanical connections at the four corners, representing a structural innovation. Furthermore, the placement of the threaded holes in the middle of both sides ensures uniform fixing strength without affecting the IGBT module wiring, while also preventing a decrease in the housing's heat dissipation or insulation performance due to the openings, demonstrating optimized layout design.

[0017] like Figure 3As shown, the metal threaded hole is of a standard style (thread diameter 2mm~2.5mm), and a beveled knurling is set around the metal threaded hole to ensure that the threaded hole can be completely fixed inside the plastic shell. At the same time, a 1.5mm~2mm buckle is set at its bottom to further strengthen the connection between the metal threaded hole and the plastic shell.

[0018] like Figure 1 As shown, the thickness of the outer shell frame in the area of ​​the metal threaded hole is widened and set as a trapezoid to enhance the connectivity of the area, and the height of its trapezoidal boss is consistent with the four-legged fixed threaded hole; during the injection molding of the outer shell, the metal threaded hole is placed in it and integrally molded with the plastic outer shell.

[0019] like Figure 2 As shown, holes are set at fixed positions on the PCB board, and then bolts are used to fix it to the module shell.

[0020] The module was installed on a vibration device under the following conditions: frequency 10-2000Hz, acceleration 12g, and vibration time of 40 hours in each of the X, Y, and Z directions. Practical verification showed that under these conditions, the invention can ensure that the IGBT module's pins will not break under prolonged vibration, giving the module sufficient vibration resistance. The optimized module significantly outperforms the IGBT module without added metal threaded pins under vibration conditions.

Claims

1. An IGBT module packaging structure, comprising an IGBT module (1), characterized in that: The top of the IGBT module (1) is closed by an end cap (2). The two ends of the IGBT module (1) are provided with terminals (3). The edge of the end face of the IGBT module (1) is machined with several PCB board mounting holes (4) and internal threaded posts (6). The PCB board (9) is installed on the top of the IGBT module (1) and is fixed by mounting bolts (10) in cooperation with the PCB board mounting holes (4) and internal threaded posts (6). The side wall of the IGBT module (1) is embedded with control pins (5) which are connected to its interior. The top of the control pins (5) extends out of the IGBT module (1) and is connected to the PCB board (9).

2. The IGBT module packaging structure according to claim 1, characterized in that: The four corner sidewalls of the IGBT module (1) are recessed inward, and there is a mounting plate at the bottom of the recess. Mounting holes (8) are machined on the mounting plate.

3. The IGBT module packaging structure according to claim 1, characterized in that: The plurality of internally threaded posts (6) are staggered between the plurality of PCB board mounting holes (4) and located in the middle of the IGBT module (1).

4. The IGBT module packaging structure according to claim 3, characterized in that: The opening of the internal threaded column (6) is provided with a reinforcement platform (7) on the IGBT module (1), and the opening of the PCB board mounting hole (4) is provided with an annular protrusion with the same height as the reinforcement platform (7).

5. The IGBT module packaging structure according to claim 4, characterized in that: The reinforcement platform (7) is trapezoidal.

6. The IGBT module packaging structure according to claim 1, characterized in that: The outer wall of the control pin (5) is machined with knurled bevel (12), and the bottom is machined with a slot (11).

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