A multi-chip frame plastic-encapsulated power device

Abstract

This utility model relates to the field of industrial automation technology, specifically to a multi-chip frame molded power device, including a base plate, four molded bodies, two mounting components, and two connecting components. The four molded bodies are fixedly connected to the base plate. The two mounting components are respectively disposed inside the corresponding molded bodies, and the two connecting components are respectively disposed inside the corresponding molded bodies. Each mounting component includes three rectifier tubes, three first terminals, and a first copper frame. Mounting plates are evenly arranged inside the molded bodies. The three rectifier tubes are fixedly connected to the mounting plates and disposed on the surface of the mounting plates. The three first terminals are fixedly connected to the molded bodies and located on one side of the molded bodies. The three first terminals are connected to the corresponding rectifier tubes. The first copper frame is connected to the mounting plate and located on one side of the mounting plate. Through the above structural design, the problems of existing technologies being unfavorable for customers to automate, and having cumbersome installation and low efficiency are solved.

Description

Technical Field

[0001] This utility model relates to the field of industrial automation technology, and in particular to a multi-chip frame plastic-encapsulated power device. Background Technology

[0002] IGBT power devices are widely used in industrial automation, new energy, photovoltaics, and other fields. From the application perspective, there are increasingly higher requirements for the cost, automation, and ease of installation of IGBT devices. Currently, in industrial control applications, the main inverter circuit often uses multiple IGBT single transistors to form different circuit topologies. The advantage is that IGBT single transistor technology is mature and inexpensive.

[0003] However, with existing technology, single-pin tubes need to be directly inserted into the PCB, then the pins need to be soldered, then the pins need to be bent, then thermal grease needs to be applied, and then the heatsink needs to be installed. The whole process is not conducive to customers' automation, and the installation is cumbersome and inefficient. Utility Model Content

[0004] The purpose of this invention is to provide a multi-chip frame plastic-encapsulated power device, which solves the problems of existing technologies being unfavorable for customers to automate, and having troublesome and inefficient installation.

[0005] To achieve the above objectives, this utility model provides a multi-chip frame molded power device, including a base plate, four molded bodies, two mounting components, and two connecting components. The four molded bodies are fixedly connected to the base plate and located on the surface of the base plate. The two mounting components are respectively disposed inside the corresponding molded bodies, and the two connecting components are respectively disposed inside the corresponding molded bodies. Each mounting component includes three rectifier tubes, three first terminals, and a first copper frame. A mounting plate is uniformly disposed inside each molded body. The three rectifier tubes are fixedly connected to the mounting plate and disposed on the surface of the mounting plate. The three first terminals are fixedly connected to the molded bodies and located on one side of the molded bodies. The three first terminals are connected to the corresponding rectifier tubes. The first copper frame is connected to the mounting plate and located on one side of the mounting plate.

[0006] The multi-chip frame molded power device further includes a first brake FRD, a first brake IGBT, a second copper frame, a third copper frame, and a fourth copper frame. The first brake FRD and the first brake IGBT are fixedly connected to the corresponding mounting plates and are respectively disposed on one side of the corresponding rectifier tubes. The second copper frame and the third copper frame are connected to the first brake IGBT and are located on one side of the first brake IGBT. The fourth copper frame is connected to the first brake FRD and is located on one side of the first brake FRD.

[0007] The multi-chip frame molded power device further includes a fifth copper frame, which is fixedly connected to the corresponding molded body and located on one side of the fourth copper frame.

[0008] The connecting assembly includes three second brake FRDs, three second brake IGBTs, three second terminals, and three sixth copper frames. The three second brake FRDs are fixedly connected to the corresponding mounting plates and are located on one side of the mounting plates. The three second brake IGBTs are fixedly connected to the corresponding mounting plates and are evenly distributed on one side of the corresponding second brake FRDs. The three second terminals and the three sixth copper frames are respectively disposed on both sides of the mounting plates.

[0009] The multi-chip frame molded power device further includes a seventh copper frame, which is fixedly connected to the corresponding mounting plate and located on one side of the mounting plate.

[0010] This utility model discloses a multi-chip frame molded power device. The molded body contains a uniformly arranged mounting plate. Three rectifier tubes are fixedly connected to the mounting plate and disposed on its surface. Three first terminals are fixedly connected to the molded body and located on one side of the molded body. The three first terminals are connected to their corresponding rectifier tubes. A first copper frame is connected to the mounting plate and located on one side of the mounting plate. Multiple rectifier tubes are disposed on the surface of the mounting plate. Compared to a single IGBT tube, this device has high integration, reduces the number of materials, can replace multiple single tubes, and is easy to install. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of the multi-chip frame plastic-encapsulated power device of this utility model.

[0013] Figure 2 This is the utility model Figure 1 A schematic diagram of the structure at point A.

[0014] Figure 3 This is the utility model Figure 1 A schematic diagram of the structure at point B.

[0015] Figure 4 This is the utility model Figure 1A schematic diagram of the structure at point C.

[0016] 1-Base plate, 2-Encapsulated body, 3-First terminal, 4-First brake FRD, 5-First brake IGBT, 6-First copper frame, 7-Second copper frame, 8-Third copper frame, 9-Fourth copper frame, 10-Fifth copper frame, 11-Second brake FRD, 12-Second brake IGBT, 13-Second terminal, 14-Sixth copper frame, 15-Seventh copper frame, 16-Rectifier tube, 17-Mounting plate. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0018] Please see Figures 1 to 4 This utility model provides a multi-chip frame molded power device, including a base plate 1, four molded bodies 2, two mounting components, and two connecting components. The four molded bodies 2 are fixedly connected to the base plate 1 and located on the surface of the base plate 1. The two mounting components are respectively disposed inside the corresponding molded bodies 2, and the two connecting components are respectively disposed inside the corresponding molded bodies 2. Each mounting component includes three rectifier tubes 16, three first terminals 3, and a first copper frame 6. Mounting plates 17 are uniformly disposed inside the molded bodies 2. The three rectifier tubes 16 are fixedly connected to the mounting plates 17 and disposed on the surface of the mounting plates 17. The three first terminals 3 are fixedly connected to the molded bodies and located on one side of the molded bodies. The three first terminals 3 are connected to the corresponding rectifier tubes 16. The first copper frame is connected to the mounting plates 17 and located on one side of the mounting plates 17.

[0019] In this embodiment, the surface of the mounting plate 17 is provided with a plurality of rectifier tubes 16. Compared with a single IGBT tube, it has a high degree of integration, a reduced number of materials, can replace multiple single tubes, and is easy to install.

[0020] Furthermore, the multi-chip frame molded power device also includes a first brake FRD4, a first brake IGBT5, a second copper frame 7, a third copper frame 8, and a fourth copper frame 9. The first brake FRD4 and the first brake IGBT5 are fixedly connected to the corresponding mounting plate 17 and are respectively disposed on one side of the corresponding rectifier tube 16. The second copper frame 7 and the third copper frame 8 are connected to the first brake IGBT5 and are located on one side of the first brake IGBT5. The fourth copper frame 9 is connected to the first brake FRD4 and is located on one side of the first brake FRD4.

[0021] In this embodiment, the first brake IGBT5 and the first brake FRD4 are integrated inside the molding compound 2. The pins of the upper and lower bridge of the inverter molding compound 2 have the same external dimensions, and the first brake IGBT5 and the first brake FRD4 adopt a design with opposite polarities on the top and bottom.

[0022] Furthermore, the multi-chip frame molded power device also includes a fifth copper frame 10, which is fixedly connected to the corresponding molded body 2 and located on one side of the fourth copper frame.

[0023] In this embodiment, the fifth copper frame 10 is designed to facilitate installation and connection with other components.

[0024] Furthermore, the connecting assembly includes three second brake FRDs, three second brake IGBTs 12, three second terminals 13, and three sixth copper frames 14. The three second brake FRDs are fixedly connected to the corresponding mounting plates 17 and are located on one side of the mounting plates 17. The three second brake IGBTs 12 are fixedly connected to the corresponding mounting plates 17 and are evenly arranged on one side of the corresponding second brake FRDs. The three second terminals 13 and the three sixth copper frames 14 are respectively arranged on both sides of the mounting plates 17.

[0025] In this embodiment, the pins of the molded body 2 have the same external dimensions, and the second brake frd and the second brake igbt12 in the inverter lower bridge are designed with opposite polarities on the top and bottom.

[0026] Furthermore, the multi-chip frame molded power device also includes a seventh copper frame 15, which is fixedly connected to the corresponding mounting plate 17 and located on one side of the mounting plate 17.

[0027] In this embodiment, the seventh copper tube frame is designed for easy installation.

[0028] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A multi-chip frame-encapsulated power device, comprising a base plate, characterized in that, It also includes four encapsulated bodies, two mounting components, and two connecting components. The four encapsulated bodies are fixedly connected to the base plate and located on the surface of the base plate. The two mounting components are respectively disposed inside the corresponding encapsulated bodies, and the two connecting components are respectively disposed inside the corresponding encapsulated bodies. The mounting assembly includes three rectifier tubes, three first terminals, and a first copper frame. A mounting plate is uniformly arranged inside the molding compound. The three rectifier tubes are fixedly connected to the mounting plate and disposed on the surface of the mounting plate. The three first terminals are fixedly connected to the molding compound and located on one side of the molding compound. The three first terminals are connected to the corresponding rectifier tubes. The first copper frame is connected to the mounting plate and located on one side of the mounting plate.

2. The multi-chip frame plastic-encapsulated power device as described in claim 1, characterized in that, The multi-chip frame molded power device further includes a first brake FRD, a first brake IGBT, a second copper frame, a third copper frame, and a fourth copper frame. The first brake FRD and the first brake IGBT are fixedly connected to the corresponding mounting plates and are respectively disposed on one side of the corresponding rectifier tubes. The second copper frame and the third copper frame are connected to the first brake IGBT and are located on one side of the first brake IGBT. The fourth copper frame is connected to the first brake FRD and is located on one side of the first brake FRD.

3. The multi-chip frame plastic-encapsulated power device as described in claim 2, characterized in that, The multi-chip frame molded power device also includes a fifth copper frame, which is fixedly connected to the corresponding molded body and located on one side of the fourth copper frame.

4. The multi-chip frame plastic-encapsulated power device as described in claim 3, characterized in that, The connecting assembly includes three second brake FRDs, three second brake IGBTs, three second terminals, and three sixth copper frames. The three second brake FRDs are fixedly connected to the corresponding mounting plates and are located on one side of the mounting plates. The three second brake IGBTs are fixedly connected to the corresponding mounting plates and are evenly arranged on one side of the corresponding second brake FRDs. The three second terminals and the three sixth copper frames are respectively arranged on both sides of the mounting plates.

5. The multi-chip frame plastic-encapsulated power device as described in claim 4, characterized in that, The multi-chip frame molded power device also includes a seventh copper frame, which is fixedly connected to the corresponding mounting plate and located on one side of the mounting plate.

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