A dual-temperature-controlled fermentation food processor

Abstract

This utility model provides a dual-temperature-controlled fermentation food processor, relating to the field of kitchen appliance technology. The dual-temperature-controlled fermentation food processor includes a body and a bowl, and further includes a heating element, a first temperature sensor, a second temperature sensor, and a controller. The heating element heats the bowl to create a fermentation environment; the first temperature sensor monitors the temperature of the fermentation environment; the second temperature sensor monitors the ambient temperature; and the controller is electrically connected to the heating element, the first temperature sensor, and the second temperature sensor. By incorporating a first temperature sensor for monitoring the fermentation environment and a second temperature sensor for monitoring the ambient temperature, and with the controller coordinating the operation of the heating element, the problem of unstable heating behavior and poor repeatability of fermentation results caused by the neglect of external ambient temperature in existing single-temperature-controlled designs is overcome.

Description

Technical Field

[0001] This utility model relates to the field of kitchen appliance technology, and in particular to a dual-temperature-controlled fermentation food processor. Background Technology

[0002] Stand mixers, as kitchen appliances that integrate mixing, kneading, and whipping functions, have been widely used in home baking. Dough fermentation is a crucial step in the baking process; the temperature of the fermentation environment directly determines the activity of yeast, thus affecting the degree of dough rise, texture, and the final product's taste and flavor.

[0003] The traditional method involves kneading the dough in a stand mixer and then allowing it to ferment naturally in a bowl. The drawback of this method is its complete dependence on uncontrollable external conditions. Room temperature fluctuates greatly due to seasonal changes and diurnal temperature variations. Low temperatures in winter can lead to excessively long fermentation times or even failure; high temperatures in summer can easily cause over-fermentation, resulting in a sour taste in the dough. Therefore, the fermentation results of this method are extremely unstable, have poor repeatability, and heavily rely on the operator's personal experience.

[0004] To address these issues, some stand mixers with integrated heating functions have emerged on the market. These devices typically have a heating element and a single temperature sensor located near the bowl. Their operating logic is as follows: heating begins when the sensor detects a temperature below the set value; heating stops when the set value is reached.

[0005] However, this single-temperature-control design suffers from a fundamental, unresolved technical flaw. It passively monitors and responds to the temperature of only one point within the device, completely ignoring the influence of the external ambient temperature. For example, in winter (5°C) and summer (30°C), even if the user sets the exact same target fermentation temperature (e.g., 38°C), the actual operating modes of the heating components (such as heating frequency, duration of each heating cycle, and power) will differ drastically due to the completely different "base temperature" of the equipment and the rate of heat dissipation to the environment. In cold environments, the equipment requires frequent, high-power heating to combat significant heat loss, which can easily lead to drastic temperature fluctuations or localized overheating at the bottom of the container; while in hot environments, even slight heating can cause temperature overshoot.

[0006] Therefore, it is necessary to improve the existing fermentation technology of food processors to overcome the shortcomings of the existing technology. Utility Model Content

[0007] To overcome the problems existing in related technologies, the purpose of this utility model is to provide a dual-temperature-controlled fermentation food processor. This dual-temperature-controlled fermentation food processor is equipped with a first temperature sensor for monitoring the fermentation environment and a second temperature sensor for monitoring the temperature of the fermentation process.

[0008] The second temperature sensor in the 1PCN environment is used to coordinate the operation of the heating components with the controller, so as to overcome the problem that the single temperature control design in the prior art ignores the influence of the external ambient temperature, resulting in unstable heating behavior and poor repeatability of fermentation results.

[0009] A dual-temperature-controlled fermentation food processor includes a main body and a bowl, and also includes:

[0010] A heating element is used to heat the basin to create a fermentation environment;

[0011] A first temperature sensor is used to monitor the temperature of the fermentation environment;

[0012] The second temperature sensor is used to monitor the temperature of the surrounding environment;

[0013] The controller is electrically connected to the heating component, the first temperature sensor, and the second temperature sensor, respectively.

[0014] Furthermore, the first temperature sensor is configured to monitor the temperature of the basin area adjacent to the heating assembly, as the temperature of the fermentation environment.

[0015] Furthermore, the controller includes:

[0016] The signal input module is used to receive a first temperature signal from the first temperature sensor and a second temperature signal from the second temperature sensor.

[0017] The temperature difference calculation module is electrically connected to the signal input module and is used to calculate the target temperature difference based on the preset target fermentation temperature and the second temperature signal.

[0018] The heating control module is electrically connected to the temperature difference calculation module and the signal input module, and is used to control the heating component to work according to the target temperature difference, so that the temperature rise of the first temperature signal from the initial value reaches the target temperature difference.

[0019] Furthermore, the temperature difference calculation module is specifically a subtraction operation unit, used to subtract the ambient temperature from the preset target fermentation temperature to output the target temperature difference that needs to be compensated.

[0020] Furthermore, the second temperature sensor is disposed inside the body, and the distance between it and the heating component is greater than or equal to a predetermined heat insulation distance.

[0021] Furthermore, the body includes a housing, the second temperature sensor is disposed inside the housing, and the heating component is disposed outside the housing.

[0022] Furthermore, the heating assembly includes a base and a heating element disposed within the base, the base being able to contact the basin; the first temperature sensor is disposed within the base.

[0023] Furthermore, the heating assembly also includes a mounting base disposed within the base, the mounting base having a first slot for mounting the heating element.

[0024] Furthermore, the mounting base is also provided with a second slot;

[0025] The first temperature sensor is installed in the second slot.

[0026] Furthermore, the heating element is arranged in a loop-like meandering path within the base, and has an outer ring portion and an inner ring portion;

[0027] The first temperature sensor is located between the outer ring and the inner ring.

[0028] The beneficial effects of this utility model are as follows:

[0029] This invention provides a dual-temperature-controlled fermentation food processor, comprising a heating element, a first temperature sensor for monitoring the fermentation environment, a second temperature sensor for monitoring the external environment, and a controller. By simultaneously acquiring both the internal fermentation environment temperature and the external environment temperature—two key data dimensions—the controller gains the foundation for intelligent judgment and compensation. It is no longer a reactive system that passively responds to internal temperature, but possesses the hardware prerequisites to become an intelligent adaptive system capable of predicting and adjusting based on external conditions. This overcomes the shortcomings of existing technologies that either cannot actively control temperature or can only blindly control it. By introducing the second temperature sensor, the food processor establishes the ability to perceive both internal and external environments, providing the necessary hardware foundation for achieving environmental temperature compensation and precise constant-temperature fermentation, making it possible to eliminate environmental influences during the fermentation process. Attached Figure Description

[0030] Figure 1 This is a cross-sectional schematic diagram of the dual-temperature-controlled fermentation food processor provided in this application at the second temperature sensor;

[0031] Figure 2 for Figure 1 Enlarged schematic diagram of the first and second temperature sensors;

[0032] Figure 3 This is a schematic diagram of the interior of the heating assembly after the casing has been removed, as provided in this application.

[0033] Figure 4 This is a schematic diagram of the base and mounting bracket provided in this application.

[0034] Figure label:

[0035] 100. Body; 110. Housing; 200. Basin; 300. Heating component; 310. Base; 320. Heating element; 321. Outer ring; 322. Inner ring; 330. Mounting base; 331. First slot; 332. Second slot; 400. First temperature sensor; 500. Second temperature sensor. Detailed Implementation

[0036] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0037] Example 1

[0038] Reference Figures 1 to 4 The dual-temperature-controlled fermentation food processor of this embodiment includes a body 100 and a bowl 200 placed on the body 100. It also includes:

[0039] The heating element 300 is used to heat the basin 200, thereby creating a controlled fermentation environment inside the basin 200.

[0040] The first temperature sensor 400 is used to monitor the temperature of the fermentation environment.

[0041] The second temperature sensor 500 is used to monitor the temperature of the environment in which the food processor is located.

[0042] The controller is electrically connected to the heating component 300, the first temperature sensor 400, and the second temperature sensor 500, respectively, and serves as the control center of the entire temperature control system.

[0043] Specifically, the heating component 300 can be implemented using various technologies. For example, the heating component 300 can be a resistance heating wire, a PTC heating element, or an electric heating film disposed at the bottom of the basin 200; or it can be a flexible heating strip surrounding the side wall of the basin 200; in other embodiments, it can also be an electromagnetic induction heating coil that directly heats the metal basin 200 using the principle of electromagnetic induction.

[0044] Specifically, the first temperature sensor 400 and the second temperature sensor 500 can be temperature sensing elements commonly used in the art. For example, they can be NTC (negative temperature coefficient) thermistors with low cost and moderate sensitivity, or PTC (positive temperature coefficient) thermistors, thermocouples, or platinum resistance thermometers with higher accuracy.

[0045] Specifically, to ensure that the second temperature sensor 500 accurately reflects the ambient temperature, the installation location of the second temperature sensor 500 can be arranged in various ways. For example, the second temperature sensor 500 can be placed on the outer surface of the casing 100; or placed near the ventilation opening of the base 310 of the casing 100 to sense the temperature of the flowing ambient air; or it can be placed in a specific area inside the casing 100 that has been structurally designed to have good thermal insulation from heat-generating components (such as motors and heating components 300).

[0046] In this embodiment, through the organic combination of the above-mentioned hardware structures, and particularly by creatively integrating a second temperature sensor 500 into the food processor, and linking it with the controller and the first temperature sensor 400, the controller can simultaneously acquire temperature data from both the "internal fermentation environment" and the "external environment," thus providing a complete and necessary hardware foundation for executing advanced temperature compensation algorithms.

[0047] It's worth noting that the control strategy of using dual temperature sensors (one monitoring the target, and one monitoring the environment) to achieve precise temperature compensation has similar applications in other technological fields, such as high-precision industrial incubators or precision ovens in semiconductor manufacturing, to overcome the influence of environmental temperature differences. However, the application scenarios, technical objectives, cost requirements, and specific hardware structures of these devices are vastly different from those of food processors in the home kitchen appliance sector.

[0048] For example, in biological, chemical, and pharmaceutical experiments, high-end equipment employs a dual-temperature control system to ensure absolute stability of culture or reaction conditions. Such equipment typically has a main temperature sensor inside the working chamber and an ambient temperature sensor located outside the equipment or in a non-heated area. The control system's algorithm predicts the rate of heat loss based on changes in the external temperature, dynamically adjusting the heating power and frequency to achieve temperature stability an order of magnitude higher than traditional single-temperature control equipment. Some Chinese patents, such as CN104238592B, also explicitly disclose an adaptive control system for a rapid constant temperature chamber, which includes internal and external temperature detection modules for adaptive control based on the temperature difference between the internal and external environments.

[0049] Example 2

[0050] This embodiment, based on the hardware structure of Embodiment 1, elaborates in detail on a specific, non-programmable analog circuit implementation of the controller. Physically, the controller consists of a series of analog circuit components, and logically, its overall circuit is divided into three core parts: a signal input module, a temperature difference calculation module, and a heating control module.

[0051] The signal input module in a specific circuit includes:

[0052] The target temperature setting circuit consists of an adjustable potentiometer connected to a stable DC power supply. The user adjusts the potentiometer using a physical knob on the unit 100, and its sliding end outputs a voltage that is linearly proportional to the user's desired "target fermentation temperature" (e.g., 40°C), which is called the "target temperature setting voltage".

[0053] The ambient temperature detection circuit consists of a voltage divider and linearization circuit composed of a second temperature sensor 500 (a thermistor) and several fixed resistors. The function of this circuit is to convert the non-linear "ambient temperature" (e.g., 15°C) sensed by the second temperature sensor 500 into a voltage that is linearly proportional to it, called the "ambient temperature voltage".

[0054] The pelvic floor temperature detection circuit is similar in structure to the ambient temperature detection circuit. It consists of a first temperature sensor 400, which is used to convert the real-time "pelvic floor temperature" into a voltage that is linearly proportional to it, called the "pelvic floor actual temperature voltage".

[0055] The overall function of this signal input module is to convert all control-related physical quantities (user-set values, external environmental values, and internal feedback values) into standardized analog voltage signals, providing input for subsequent calculations and control.

[0056] Secondly, the temperature difference calculation module is mainly a first differential amplifier circuit in the specific circuit, which is configured as a subtractor.

[0057] The module receives the "target temperature setting voltage" and "ambient temperature voltage" from the signal input module, respectively. The differential amplifier circuit subtracts these two voltages in real time and outputs a voltage proportional to their difference. This output voltage is called the "temperature rise command voltage".

[0058] The physical meaning of "heating command voltage" is that in order to reach the final target temperature, the basin 200 needs to increase the temperature by an additional amount from the current ambient temperature.

[0059] Assuming the user sets the "target fermentation temperature" to 40℃, the signal input module outputs a corresponding "target temperature setting voltage" of 4.0 volts. The current kitchen "ambient temperature" is 15℃, and the signal input module outputs a corresponding "ambient temperature voltage" of 1.5 volts. At this point, the temperature difference calculation module will immediately calculate and output: 4.0 volts - 1.5 volts = 2.5 volts. This 2.5-volt "heating command voltage" represents a clear physical instruction: the temperature needs to be increased by 25℃.

[0060] The heating control module specifically includes:

[0061] The actual temperature rise calculation unit is another second differential amplifier circuit in the circuit. Its two input terminals receive the real-time "actual temperature voltage at the bottom of the basin" and "ambient temperature voltage" from the signal input module, respectively. It also performs a subtraction operation, outputting a voltage representing "how much the current temperature at the bottom of the basin has increased compared to the starting point (ambient temperature)". We call this the "actual temperature rise voltage".

[0062] The comparison and drive unit consists of a voltage comparator and a drive circuit (such as a relay drive circuit). The positive input of the voltage comparator receives the "heating command voltage" from the temperature difference calculation module, while the negative input receives the "actual heating voltage" (i.e., the current progress) from this module.

[0063] The complete workflow of this heating control module is as follows:

[0064] In the initial stage of heating, the "actual heating voltage" is zero or very small, far lower than the "heating command voltage". The voltage comparator outputs a high level, the drive circuit is closed, and the heating component 300 starts to work at full power.

[0065] As heating progresses, the "actual temperature voltage at the bottom of the basin" continuously increases, and the "actual heating voltage" also increases accordingly. The voltage comparator continuously compares these two voltages. Once the magnitude of the "actual heating voltage" catches up with and equals the "heating command voltage," it indicates that the actual temperature rise of the basin 200 has reached the desired target value. The voltage comparator will immediately flip to output a low level, disconnecting the drive circuit and thus cutting off the power supply to the heating component 300, stopping heating.

[0066] Referring to the example above:

[0067] The heating target is to raise the temperature by 25°C (corresponding to a "heating command voltage" of 2.5 volts).

[0068] When the temperature at the bottom of the basin is heated from 15℃ to 40℃, the actual temperature rise is 40℃ - 15℃ = 25℃. At this point, the "actual heating voltage" also reaches exactly 2.5 volts.

[0069] At this moment, the "actual heating voltage" equals the "heating command voltage", and the heating control module immediately stops heating.

[0070] Through the clear division of labor and collaborative work of the three analog circuit modules mentioned above, the controller in this embodiment accurately implements the temperature control logic: using the ambient temperature as a dynamic reference, it precisely controls the "temperature rise" that the basin 200 needs to achieve, so that the fermentation environment can stably and reliably reach the final target temperature set by the user under any external environment.

[0071] Example 3

[0072] This embodiment, based on embodiment 1, elaborates on the internal structure and working logic of the controller.

[0073] In this embodiment, the controller can physically be a microcontroller (MCU) or an embedded system circuit board, logically divided into multiple functional modules to achieve precise temperature difference compensation control. Specifically, the controller is constructed as follows:

[0074] The signal input module is responsible for receiving electrical signals from external sensors. Specifically, it receives a first temperature signal from the first temperature sensor 400 and a second temperature signal from the second temperature sensor 500, and transmits these analog or digital signals to the arithmetic module.

[0075] The temperature difference calculation module is electrically connected to the signal input module. Its core function is to perform algorithm calculations. Specifically, it internally stores a user-defined or program-defined target fermentation temperature (e.g., 38°C). After receiving the second temperature signal (i.e., ambient temperature), the module performs a subtraction operation, subtracting the ambient temperature from the target fermentation temperature, thereby calculating a target temperature difference that needs to be compensated. For example, if the target is 38°C and the ambient temperature is 10°C, the module will calculate and output a target temperature difference of 28°C. Therefore, structurally, this temperature difference calculation module is a subtraction operation unit.

[0076] The heating control module is electrically connected to the temperature difference calculation module and the signal input module. It controls the operation of the heating element 300 based on the target temperature difference output by the temperature difference calculation module. Its control logic is as follows: The heating element 300 is started, and simultaneously, the signal input module monitors the change in the first temperature signal in real time. Heating continues until the temperature rise from its initial value reaches the target temperature difference calculated by the temperature difference calculation module. Then, heating is adjusted or stopped, and the system enters the heat preservation stage.

[0077] In this embodiment, the controller pre-stores a fixed temperature control model, which exists in the form of a data list or functional relationship. This model defines the required heating increment, or target temperature difference, for any ambient temperature within the range of 0°C to 45°C. The ultimate goal of this model is to ensure that the fermentation environment always reaches a constant, preset target fermentation temperature. The user-set target fermentation temperature is 45°C.

[0078] The internal functional modules of the controller and their workflow are as follows:

[0079] The signal input module collects the temperature of the basin 200 area from the first temperature sensor 400 and the kitchen ambient temperature from the second temperature sensor 500 in real time.

[0080] The temperature difference calculation module performs calculations based on an internally stored temperature control model with a fixed target value of 45℃. The target temperature difference equals 45℃ minus the ambient temperature.

[0081] To illustrate how this module works, the following lists several key data points in the temperature control model and explains the controller's decision-making process:

[0082] When the ambient temperature detected by the second temperature sensor 500 is 0℃, the temperature difference calculation module calculates the target temperature difference as 45℃ (i.e., 45℃-0℃) based on the preset model.

[0083] When the ambient temperature is 10℃, the module calculates a target temperature difference of 35℃ (i.e., 45℃-10℃).

[0084] When the ambient temperature is 20℃, the target temperature difference calculated by the module is reduced to 25℃ (i.e., 45℃-20℃).

[0085] When the ambient temperature is 35℃, the target temperature difference calculated by the module is further reduced to 10℃ (i.e., 45℃-35℃).

[0086] When the ambient temperature is 40℃, the module calculates a target temperature difference of only 5℃ (i.e., 45℃-40℃).

[0087] When the ambient temperature reaches or exceeds 45℃, the module calculates a target temperature difference of 0℃.

[0088] The heating control module receives the specific target temperature difference value output from the temperature difference calculation module and directly converts it into precise control of the heating time and heating power of the heating component 300.

[0089] When the received target temperature difference is a large value such as 45℃ or 35℃, the heating control module will instruct the heating component 300 to continuously heat for a long time at maximum or high power to ensure a sufficiently strong heat input.

[0090] When the received target temperature difference is 25°C, the module will adopt a medium-intensity heating strategy.

[0091] When the received target temperature difference is a small value such as 10℃ or 5℃, the module will switch to a low-power, short-term or intermittent heating mode to perform fine temperature adjustment.

[0092] When the received target temperature difference is 0℃, the heating control module will not start the heating component 300.

[0093] Throughout the heating process, the module continuously monitors the temperature changes in the basin 200 area via the first temperature sensor 400. When the cumulative increase in temperature in this area from its initial value (approximately equal to the ambient temperature) equals the target temperature difference calculated by the temperature difference calculation module, heating is stopped or reduced, and the module enters a heat preservation phase. In this way, the final temperature of the basin 200 area is ensured to be precisely stabilized at 45°C.

[0094] Example 4

[0095] Based on Example 1, this embodiment elaborates in detail on the preferred location layout of the first and second temperature sensors.

[0096] In this preferred embodiment, the physical layout of the sensors is crucial for achieving optimal control.

[0097] The layout of the first temperature sensor 400 is referenced. Figures 1 to 4 The heating element 300 is the source of heat. To obtain heating feedback as quickly and accurately as possible, a first temperature sensor 400 is disposed in the region of the basin 200 adjacent to the heating element 300. In this embodiment, it is disposed directly within the internal structure of the heating element 300, in close contact with the surface in contact with the basin 200. In this way, the temperature it measures can most accurately reflect the heat transferred to the basin 200, and thus be used by the controller as a precise characterization of the fermentation environment temperature.

[0098] The layout of the second temperature sensor 500, in order to ensure that the second temperature sensor 500 can accurately measure the ambient temperature, must avoid interference from the heat generated by the device itself (mainly from the heating element 300 and the motor inside the body 100). Therefore, this embodiment provides a preferred isolation structure: [Refer to...] Figure 1 and Figure 2The body 100 includes a housing 110. The second temperature sensor 500 is located inside the housing 110 at a position away from the motor, while the heating element 300 is located outside the housing 110 as a relatively independent component (as an independent base 310 supporting the basin 200). In this way, the housing 110 itself constitutes a physical barrier, effectively isolating the heating element 300 from heat conduction and heat radiation to the interior of the body 100, ensuring the accuracy of the measurement by the second temperature sensor 500.

[0099] Example 5

[0100] Based on Embodiment 1, this embodiment elaborates in detail on the preferred internal structure of the heating component 300.

[0101] Reference Figures 1 to 4 To achieve uniform heating, precise installation, and reliable monitoring, the heating component 300 in this embodiment includes:

[0102] The base 310 has its upper surface fitted to the bottom of the basin 200, allowing for good contact with the bottom of the basin 200 to achieve efficient heat conduction.

[0103] The heating element 320 is disposed in the internal cavity of the base 310. In this preferred embodiment, in order to ensure uniform heating of the bottom of the basin, the heating element 320 is arranged in a loop-like meandering path, forming a heating area with an outer ring portion 321 and an inner ring portion 322.

[0104] Mounting bracket 330: To precisely and securely mount the heating element 320 and the first temperature sensor 400 in their designed positions, the base 310 also includes a mounting bracket 330. The mounting bracket 330 has a first slot 331 and a second slot 332. The heating element 320 is securely mounted in the first slot 331, while the first temperature sensor 400 is mounted in the second slot 332. This slot structure greatly improves the precision and consistency of production assembly.

[0105] In this embodiment, the second slot 332 is positioned between the outer ring 321 and the inner ring 322 of the heating element 320. This position is crucial for reflecting the average temperature of the entire heating surface. Placing the first temperature sensor 400 here avoids control misjudgments caused by detecting local extreme temperatures, making the feedback data obtained by the controller more representative, thereby further improving the stability and accuracy of temperature control.

[0106] More specifically, such as Figure 2As shown, the base 310 is circular, and the heating element 320 enters from the same side at both ends. It wraps around the outer part of the base 310 in two directions, and at the intersection of the other ends, it bends inward and meanders around the inner ring 322 before finally connecting. This forms the inner ring 322 and the outer ring 321.

[0107] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of this application. Any specific values ​​in all examples shown and discussed herein should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0108] Furthermore, it should be noted that the use of terms such as "first" and "second" is merely for ease of distinction, and unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application.

[0109] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A dual temperature control fermentation chef machine, comprising a machine body (100) and a basin body (200), characterized in that, Also includes: A heating component (300) is used to heat the basin (200) to create a fermentation environment; A first temperature sensor (400) is used to monitor the temperature of the fermentation environment; The second temperature sensor (500) is used to monitor the temperature of the surrounding environment; The controller is electrically connected to the heating component (300), the first temperature sensor (400), and the second temperature sensor (500), respectively.

2. The dual-temperature-controlled fermentation food processor according to claim 1, characterized in that: The first temperature sensor (400) is configured to monitor the temperature of the area of ​​the basin (200) adjacent to the heating assembly (300) as the temperature of the fermentation environment.

3. The dual-temperature-controlled fermentation food processor according to claim 1 or 2, characterized in that: The controller includes: The signal input module is used to receive a first temperature signal from the first temperature sensor (400) and a second temperature signal from the second temperature sensor (500); The temperature difference calculation module is electrically connected to the signal input module and is used to calculate the target temperature difference based on the preset target fermentation temperature and the second temperature signal. The heating control module is electrically connected to the temperature difference calculation module and the signal input module, and is used to control the heating component (300) to work according to the target temperature difference, so that the temperature rise of the first temperature signal from the initial value reaches the target temperature difference.

4. The dual-temperature-controlled fermentation food processor according to claim 3, characterized in that: The temperature difference calculation module is specifically a subtraction operation unit, which is used to subtract the ambient temperature from the preset target fermentation temperature to output the target temperature difference that needs to be compensated.

5. The dual-temperature-controlled fermentation food processor according to claim 1, characterized in that: The second temperature sensor (500) is disposed inside the body (100) and the distance between it and the heating component (300) is greater than or equal to a predetermined heat insulation distance.

6. The dual-temperature-controlled fermentation food processor according to claim 5, characterized in that: The body (100) includes a housing (110), the second temperature sensor (500) is disposed inside the housing (110), and the heating component (300) is disposed outside the housing (110).

7. The dual-temperature-controlled fermentation food processor according to claim 1, characterized in that: The heating assembly (300) includes a base (310) and a heating element (320) disposed in the base (310). The base (310) can contact the basin (200). The first temperature sensor (400) is disposed in the base (310).

8. The dual-temperature-controlled fermentation food processor according to claim 7, characterized in that: The heating assembly (300) further includes a mounting base (330) disposed in the base (310), and the mounting base (330) is provided with a first slot (331) for mounting the heating tube (320).

9. The dual-temperature-controlled fermentation food processor according to claim 8, characterized in that: The mounting base (330) is also provided with a second slot (332); The first temperature sensor (400) is installed in the second slot (332).

10. The dual-temperature-controlled fermentation food processor according to claim 9, characterized in that: The heating element (320) is arranged in a loop-shaped meandering path within the base (310), and has an outer ring (321) and an inner ring (322); The first temperature sensor (400) is located between the outer ring portion (321) and the inner ring portion (322).

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