Heating element module and aerosol generating device

Abstract

This application discloses a heating element module and an aerosol generating device, comprising: a tubular carrier defining a receiving space for receiving aerosol-generated articles; a first conductive carrier surrounding the tubular carrier; a plurality of semiconductor components, each semiconductor component being disposed on the first conductive carrier, each semiconductor component including an N-type semiconductor and a P-type semiconductor; a plurality of second conductive carriers located on the side of the semiconductor components opposite to the first conductive carrier, each second conductive carrier being electrically connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor component; and a heat insulation component surrounding the periphery of the tubular carrier, wherein the heat insulation component and the outer peripheral sidewall of the tubular carrier together define a sealed cavity, the first conductive carrier, the semiconductor components, and the second conductive carriers being located within the sealed cavity. This application can reduce the heat transferred outward by the heating element per unit time and improve energy utilization efficiency.

Description

Technical Field

[0001] This application relates to the field of heated non-combustible aerosol generation technology, and more particularly to a heating element module and an aerosol generation device. Background Technology

[0002] Tobacco products (such as cigarettes, cigars, etc.) produce tobacco smoke by burning tobacco during use. Efforts are being made to replace these tobacco-burning products by creating products that release compounds without combustion.

[0003] Examples of such products are heating devices that release compounds by heating rather than burning materials. For instance, the material could be an aerosol-generating article containing tobacco or other non-tobacco products, which may or may not contain nicotine. Known heating devices include heating elements that transfer a high amount of heat per unit time, thus reducing the amount of heat used to heat the portion of the aerosol-generating article, resulting in heat loss and reduced energy efficiency. Utility Model Content

[0004] This application provides a heating element module and an aerosol generating device, which can reduce the heat transferred outward by the heating element per unit time and improve energy utilization.

[0005] One embodiment of this application provides a heating element module, including: A tubular carrier that defines a containment space for receiving aerosol-generated products; A first conductive carrier is disposed around the tubular carrier; Multiple semiconductor components are disposed on the first conductive carrier, and each semiconductor component includes an N-type semiconductor and a P-type semiconductor. Multiple second conductive carriers are located on the side of the semiconductor component opposite to the first conductive carrier, and each second conductive carrier is electrically connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor component; A heat insulation component surrounds the periphery of the tubular carrier, and the heat insulation component and the outer peripheral sidewall of the tubular carrier together define a sealed cavity, in which the first conductive carrier, the semiconductor component, and the second conductive carrier are located.

[0006] In some embodiments, the thermal insulation assembly includes an upper support structure and a lower support structure, the upper support structure being fixedly connected to one end of the tubular carrier, and the lower support structure being fixedly connected to the other end of both the upper support structure and the tubular carrier. The upper support structure, the lower support structure, and the outer peripheral sidewall of the tubular carrier together define the sealing cavity.

[0007] In some embodiments, both the upper support structure and the lower support structure are made of plastic, and both have a thermal conductivity of less than 0.22 W / (m·K).

[0008] In some embodiments, the thermal insulation assembly further includes a seal disposed at the connection point between the upper support structure and the tubular carrier.

[0009] In some embodiments, the sealed cavity is filled with a heat-insulating medium.

[0010] In some embodiments, the insulating medium includes air or an inert gas.

[0011] In some embodiments, the thermal insulation assembly further includes a partition structure for dividing the sealed cavity into a first sealed cavity and a second sealed cavity.

[0012] In some embodiments, the partition structure is connected between the upper support structure and the lower support structure, or between the upper support structure and the tubular carrier, or between the lower support structure and the tubular carrier.

[0013] In some embodiments, the thermal insulation component is configured as a tube.

[0014] In some embodiments, the thermal insulation component is coaxially arranged with the tubular carrier.

[0015] In some embodiments, the first conductive carrier includes a flexible circuit board, on which a positive electrode connection terminal and a negative electrode connection terminal are disposed, and a plurality of semiconductor components are connected between the positive electrode connection terminal and the negative electrode connection terminal.

[0016] In some embodiments, the heating element module further includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal of the flexible circuit board, and another conductive lead is connected to the negative terminal of the flexible circuit board.

[0017] In some embodiments, the heating element module further includes a fixing member disposed around the second conductive carrier.

[0018] In some embodiments, the heating element module further includes the temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

[0019] In some embodiments, the fastener comprises a PI membrane or aerogel.

[0020] In some embodiments, when the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

[0021] In some embodiments, the heating element module further includes an isolation member disposed between the second conductive carrier and the fixing member.

[0022] In some embodiments, the separator includes a PI film.

[0023] One embodiment of this application provides an aerosol generating apparatus, comprising: The heating element module as described in any of the above embodiments; A power supply assembly is connected to the heating element module. The power supply assembly is configured to provide current to the heating element module, so that when current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby increasing the temperature of the first conductive carrier to heat the aerosol-generated product. The housing contains both the heating element module and the power supply assembly.

[0024] The aforementioned heating element module and aerosol generating device are surrounded by a heat insulation component, and the heat insulation component and the outer peripheral wall of the tubular carrier together define a sealed cavity. The first conductive carrier, the semiconductor component, and the second conductive carrier are located in the sealed cavity, thereby reducing the heat transferred outward by the heating element per unit time and improving energy utilization. Attached Figure Description

[0025] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0026] Figure 1 This is a schematic diagram of a heating element module provided in one embodiment; Figure 2 This is a schematic diagram of a heating element module provided in another embodiment; Figure 3 This is a top view of a first conductive carrier unfolded away from the surface of a tubular carrier, with elements omitted, provided in one embodiment. Figure 4 This is a schematic diagram of a first conductive carrier, a plurality of semiconductor components, and a plurality of second conductive carriers provided in one embodiment; Figure 5 This is a schematic diagram of an aerosol generating apparatus provided in one embodiment. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only one regional embodiment of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0028] The terms "first," "second," and "third" used in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number or order of the indicated technical features. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship or movement of the components in a certain posture (as shown in the accompanying drawings). If the posture changes, the directional indication will also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0029] In this document, the term "embodiment" means that a feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be intervening elements. When an element is referred to as being "connected to" another element, it can be directly connected to the other element, or there may be one or more intervening elements. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0031] Reference Figure 1 One embodiment of this application provides a heating element module 100, the heating element module 100 comprising: The tubular carrier 10 defines a containment space 101 for receiving aerosol-generated products.

[0032] As used herein, the term "aerosol-generating article" refers to an article comprising an aerosol-forming matrix that, when heated, releases volatile compounds that can form aerosols. In one embodiment, the aerosol-generating article is removably coupled to the heating element module 100.

[0033] Aerosol forming matrices can include solid aerosol forming matrices. Solid aerosol forming matrices can include tobacco-containing materials containing volatile tobacco flavor compounds that are released from the aerosol forming matrix upon heating. Solid aerosol forming matrices can also include non-tobacco materials. Solid aerosol forming matrices can include both tobacco-containing and non-tobacco-containing materials.

[0034] The aerosol-forming matrix may include a liquid aerosol-forming matrix. A liquid aerosol-forming matrix may contain a liquid containing tobacco-containing substances with volatile tobacco aroma components, or it may contain a liquid containing non-tobacco substances. The liquid aerosol-forming matrix may contain water, solvents, ethanol, plant extracts, fragrances, flavorings, or vitamin mixtures, etc. Fragrances may include, but are not limited to, menthol, peppermint oil, spearmint oil, and various fruit flavoring components. Flavorings may contain ingredients that can provide the user with various aromas or flavors. Vitamin mixtures may be mixtures containing at least one of vitamin A, vitamin B, vitamin C, and vitamin E, but are not limited to these.

[0035] The containment space 101 extends radially along the receiving direction of the aerosol-generated product.

[0036] A first conductive carrier 20 is disposed around the tubular carrier 10. The first conductive carrier 20 is adapted to transfer heat to the tubular carrier 10.

[0037] The first conductive carrier 20 is disposed in close contact with the tubular carrier 10, so the tubular carrier 10 can support the first conductive carrier 20 and maintain the first conductive carrier 20 in a preset shape. Adhesive can be applied to the outer surface of the tubular carrier 10 and / or the surface of the first conductive carrier 20 facing the tubular carrier 10, so that the first conductive carrier 20 can be fixed to the tubular carrier 10 by adhesive.

[0038] The first conductive carrier 20 is bendable. In one embodiment, the first conductive carrier 20 is bent close to the outer surface of the tubular carrier 10. Preferably, the first conductive carrier 20 is closed around the tubular carrier 10. In this case, ignoring the thickness of the first conductive carrier 20, the area of ​​the side surface of the first conductive carrier 20 where the semiconductor component 30 is disposed is equal to the area of ​​the outer surface of the tubular carrier 10. The temperature field of the side surface of the first conductive carrier 20 where the semiconductor component 30 is disposed can be correspondingly conducted to the inner surface of the tubular carrier 10, and heat is transferred through the contact between the inner surface of the tubular carrier 10 and the aerosol generating article. Alternatively, the gap between the inner surface of the tubular carrier 10 and the aerosol generating article is used to heat the air flowing through the gap through the heat of the inner surface of the tubular carrier 10, thereby heating the aerosol generating article through the heated air. As an example, the gap is no greater than 0.5 mm, preferably no greater than 0.15 mm. In one embodiment, after the first conductive carrier 20 is bent close to the outer surface of the tubular carrier 10, its two ends are not closed.

[0039] Please refer to the following: Figure 2 The first conductive carrier 20 includes a flexible circuit board with a positive terminal 21 and a negative terminal 22. Multiple semiconductor components 30 are connected between the positive terminal 21 and the negative terminal 22.

[0040] The flexible circuit board includes a body 23, with a positive terminal 21 and / or a negative terminal 22 contacting the surface of the body 23 or embedded in the body 23.

[0041] The flexible circuit board also includes a conductive element 24, which is disposed on the surface of the body 23. Preferably, the N-type semiconductor 31 and the P-type semiconductor 32 are connected in series between the positive terminal 21 and the negative terminal 22 via the conductive element 24.

[0042] In one embodiment, the conductive element 24 is a copper foil, which is a thin, continuous metal foil deposited on the substrate layer of the flexible circuit board, serving as a conductor of the flexible circuit board.

[0043] When the aerosol-generating article is received, the aerosol-generating article placed in the receiving space 101 is at least in contact with the tubular carrier 10. The tubular carrier 10 is a heat conductor, which can absorb heat from the first conductive carrier 20 and transfer at least a portion of the absorbed heat to the aerosol-generating article.

[0044] The tubular carrier 10 has a thermal conductivity greater than or equal to 10 W / (m•K). Suitable tubular carriers 10 include, but are not limited to, at least one or more of the following: metal, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers. The metals include, but are not limited to, one or more of the following: silver, copper, gold, aluminum, tungsten, zinc, molybdenum, nickel, iron, platinum, ferrite, alloys, or stainless steel. The thermally conductive polymers include, but are not limited to, thermally conductive silicone or thermally conductive grease. By giving the tubular carrier 10 a high thermal conductivity, the efficiency of heat transfer from the heat pipe to the aerosol-generating product is improved.

[0045] The heating element module 100 may further include a temperature detector. The probe of the temperature detector is connected to the tubular carrier 10 to detect the temperature of the tubular carrier 10. Simultaneously, the temperature detector is electrically connected to a controller on a circuit board to transmit the detected temperature information of the tubular carrier 10 to the controller. The controller can adjust the current or voltage supplied to the heating element module 100 by the power supply component based on this temperature information, thereby regulating the temperature of the tubular carrier 10 to ensure sufficient heating of the aerosol-generated product and prevent the aerosol-generated product from burning. The temperature detector can be a thermocouple or a thermistor; no limitation is made to the temperature detector used here.

[0046] The thickness of the tubular carrier 10 can be less than or equal to 0.2 mm to reduce the heat consumption of the tubular carrier 10 itself, so that more of the heat transferred from the first conductive carrier 20 to the tubular carrier 10 can be transferred to the aerosol generating product by the tubular carrier 10, thereby improving the heat utilization rate.

[0047] In some embodiments, the tubular carrier 10 may be omitted. In this case, the inner wall surface of the first conductive carrier 20 defines at least a portion of the boundary of the receiving space 101. Alternatively, at least a portion of the first conductive carrier 20 may be configured as tubular, such that when receiving an aerosol-generating article, at least a portion of the aerosol-generating article is surrounded by the tubular first conductive carrier 20.

[0048] In other embodiments, at least a portion of the first conductive carrier 20 contacts the side surface of the aerosol-generating article to increase the heat transfer efficiency between the first conductive carrier 20 and the side surface of the aerosol-generating article through direct contact, thereby helping to reduce losses.

[0049] Multiple semiconductor components 30 are disposed on the first conductive carrier 20, and each semiconductor component 30 includes an N-type semiconductor 31 and a P-type semiconductor 32.

[0050] One end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 in the semiconductor component 30 are both electrically connected to the first conductive carrier 20. Optionally, the N-type semiconductor 31 and the P-type semiconductor 32 of the semiconductor component 30 are fixed to the first conductive carrier 20 with an interval between them by welding.

[0051] In one embodiment, the flexible circuit board further includes pads, which are metal contact points on the flexible circuit board used for soldering N-type semiconductor 31 and P-type semiconductor 32, also known as solder pads. One end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 in the semiconductor assembly 30 are respectively soldered to the corresponding pads.

[0052] In a preferred embodiment, N-type semiconductor 31 and P-type semiconductor 32 are uniformly distributed on at least a portion of the surface of the first conductive carrier 20, thereby forming a uniform temperature field in at least a portion of the tubular carrier 10 when current is passed between the positive terminal 21 and the negative terminal 22.

[0053] Multiple second conductive carriers 40 are located on the side of the semiconductor component 30 opposite to the first conductive carrier 20, and each second conductive carrier 40 is electrically connected to the N-type semiconductor 31 and the P-type semiconductor 32 of the semiconductor component 30.

[0054] Please see Figure 3 In semiconductor component 30, one end of the N-type semiconductor 31 and one end of the P-type semiconductor 32 are electrically connected to the first conductive carrier 20, and the other ends of the N-type semiconductor 31 and the P-type semiconductor 32 are electrically connected through a second conductive carrier 40. In one embodiment, the second conductive carrier 40 includes a copper sheet. The N-type semiconductor 31 and the P-type semiconductor 32 in semiconductor component 30 are electrically connected through the copper sheet.

[0055] When the heating element module 100 is working, current flows through the semiconductor component 30. Heat generated based on the Boltzmann effect is transferred from the second conductive carrier 40 to the first conductive carrier 20, creating a temperature difference between the first conductive carrier 20 and the second conductive carrier 40. The more heat is lost from the second conductive carrier 40, the more heat is gained from the first conductive carrier 20. Therefore, the second conductive carrier 40 is the heat supply end of the heating element module 100, and the first conductive carrier 20 is the heat receiving end of the heating element module 100.

[0056] The heat insulation component 50 surrounds the outer periphery of the tubular carrier 10, and the heat insulation component 50 and the outer peripheral sidewall of the tubular carrier 10 together define a sealed cavity 501, in which the first conductive carrier 20, the semiconductor component 30 and the second conductive carrier 40 are located.

[0057] In one embodiment, the thermal insulation component 50 is configured as a tube. The thermal insulation component 50 is coaxially disposed with the tubular carrier 10.

[0058] according to Figure 1 As shown, the thermal insulation component 50 includes an upper support structure 51 and a lower support structure 52. The upper support structure 51 is fixedly connected to one end of the tubular carrier 10, and the lower support structure 52 is fixedly connected to the other end of both the upper support structure 51 and the tubular carrier 10. The upper support structure 51, the lower support structure 52, and the outer peripheral sidewall of the tubular carrier 10 together define a sealing cavity 501.

[0059] In one embodiment, the upper support structure 51 includes a first upper support fixing member 511, and the lower support structure 52 includes a first lower support structure 521. The lower support structure 52 is fixed to the upper support structure 51 by the first upper support fixing member 511, and the lower support structure 52 is fixed to the other end of the tubular carrier 10 by the first lower support structure 521.

[0060] In some embodiments, the thermal insulation component 50 is integrally formed.

[0061] It is understood that the shape of the sealing cavity 501 is defined by the shapes of the tubular carrier 10 and the heat insulation component 50. For example, if the tubular carrier 10 and the heat insulation component 50 are constructed into a cylindrical shape, and the heat insulation component 50 is coaxially arranged with the tubular carrier 10, then the upper support structure 51, the lower support structure 52, and the outer peripheral sidewall of the tubular carrier 10 together define the cross-section of the sealing cavity 501 as a concentric annulus.

[0062] In some embodiments, both the upper support structure 51 and the lower support structure 52 are made of plastic, and both have a thermal conductivity of less than 0.22 W / (m·K).

[0063] The tubular carrier 10 serves as a thermal energy storage carrier. The thermal conductivity of the upper support structure 51 is less than 0.22 W / (m·K), and the contact area between the upper support structure 51 and the tubular carrier 10 is small, which can effectively reduce the heat transferred from the tubular carrier 10 to the outside of the sealed cavity 501 through the upper support structure 51. Similarly, the thermal conductivity of the lower support structure 52 is less than 0.22 W / (m·K), and the contact area between the lower support structure 52 and the tubular carrier 10 is small, which can effectively reduce the heat transferred from the tubular carrier 10 to the outside of the sealed cavity 501 through the lower support structure 52.

[0064] according to Figure 1 As shown, the thermal insulation assembly 50 also includes a sealing element 53, which is disposed at the connection position between the upper support structure 51 and the tubular carrier 10.

[0065] The seal 53 can be used to fix the upper support structure 51 and the tubular carrier 10. The seal 53 can also be used to seal the connection between the upper support structure 51 and the tubular carrier 10 to ensure the sealing performance of the sealing cavity 501.

[0066] As an example, seal 53 includes sealing silicone.

[0067] The sealed cavity 501 is filled with an insulating medium. The insulating medium may include air or an inert gas.

[0068] In a preferred embodiment, the sealed cavity 501 is filled with air.

[0069] The sealed cavity 501 is a closed space, completely isolated from the external environment. There is no airflow exchange between the air inside the sealed cavity 501 and the external air. Without considering the heat transferred outwards by the upper support structure 51 and the lower support structure 52, the heat from the first conductive carrier 20 and the second conductive carrier 40 is transferred outwards only through the air inside the sealed cavity 501. Because air has a low specific heat capacity, the heat transferred outwards by the first conductive carrier 20 and the second conductive carrier 40 per unit time is relatively low. The sealed cavity 501 acts as an insulation system, preventing heat transfer outwards, ensuring that most of the heat stored in the heating element module 100 is used to heat the aerosol-generated product, thereby improving energy utilization. Additionally, it effectively reduces the temperature of the aerosol generating device's casing, preventing it from becoming too hot to handle.

[0070] Please see Figure 4 The thermal insulation assembly 50 also includes a partition structure 54 for dividing the sealing cavity 501 into a first sealing cavity 5011 and a second sealing cavity 5012.

[0071] In one embodiment, the partition structure 54 is parallel to the axial direction of the tubular carrier 10, dividing the sealing cavity 501 vertically into a first sealing cavity 5011 and a second sealing cavity 5012.

[0072] Dividing the sealing cavity 501 into a first sealing cavity 5011 and a second sealing cavity 5012 is equivalent to the effect of two cascaded sealing cavities, which further reduces the heat transferred outward by the first conductive carrier 20 and the second conductive carrier 40 per unit time.

[0073] It is understood that the division of the sealing cavity 501 is not limited to the number and method of the first sealing cavity 5011 and the second sealing cavity 5012 provided in this embodiment. For example, the sealing cavity 501 can be divided into three sealing cavities by two dividing structure members 54; or, for example, one end of the dividing structure member 54 is connected to the tubular carrier 10 and the other end is connected to the lower support structure member 52, which divides the sealing cavity 501 laterally into two sealing cavities.

[0074] In a preferred embodiment, the first sealing cavity 5011 and the second sealing cavity 5012 are filled with the same insulating medium. For example, both the first sealing cavity 5011 and the second sealing cavity 5012 are filled with air.

[0075] The partition structure 54 is connected between the upper support structure 51 and the lower support structure 52, or between the upper support structure 51 and the tubular carrier 10, or between the lower support structure 52 and the tubular carrier 10.

[0076] according to Figure 4 As shown, the partition structure 54 is connected between the upper support structure 51 and the lower support structure 52. In one specific embodiment, the upper support structure 51 further includes a second upper support fixing member 512, and the lower support structure 52 further includes a second lower support fixing member 522. The partition structure 54 is engaged between the upper support structure 51 and the lower support structure 52 via the second upper support fixing member 512 and the second lower support fixing member 522.

[0077] Please refer to it again. Figure 1 and Figure 4 The heating element module 100 also includes: Conductive leads 60 extend along the length of the tubular carrier 10, one of which is connected to the positive terminal of the flexible circuit board, and the other is connected to the negative terminal of the flexible circuit board.

[0078] In one embodiment, the other end of the conductive lead 60 extends along the axial direction of the tubular carrier 10 for connecting the positive (+) and negative (-) terminals of the power supply assembly.

[0079] The fastener 70 is arranged around the second conductive carrier 40.

[0080] In one embodiment, the fastener 70 comprises a PI membrane or aerogel.

[0081] Temperature sensor 80, the sensing head 81 of temperature sensor 80 is disposed between the second conductive carrier 40 and the fixing member 70.

[0082] The fixing member 70 is used to fix the temperature sensor 80 at the corresponding position on the second conductive carrier 40, so that the temperature sensor 80 detects the temperature of the heat supply end of the heating element module 100. It is understood that the fixing member 70 is not limited to the manner provided in this embodiment.

[0083] The temperature sensor 80 also includes a lead 82, which is electrically connected to the sensing head 81. The lead 82 is also electrically connected to the main control board, and is used to output the data collected by the sensing head 81 to the main control board for processing.

[0084] Preferably, when the fixing member 70 includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor 80 and less than or equal to the axial length of the tubular carrier 10.

[0085] The axial length of the PI film is greater than or equal to the axial length of the temperature sensor 80, which can fix the temperature sensor 80. In addition, the axial length of the PI film is less than or equal to the axial length of the tubular carrier 10, which can reduce the heat absorbed by the PI film and improve the accuracy of the detection results of the temperature sensor 80.

[0086] The isolator 90 is disposed between the second conductive carrier 40 and the fixing member 70.

[0087] In one embodiment, the separator 90 includes a PI film.

[0088] The PI film provides electrical isolation, effectively preventing short circuits between the second conductive carrier 40 and the temperature sensor 80, thus improving the safety of the heating element module 100. It is understood that the insulating element 90 is not limited to the configuration provided in this embodiment.

[0089] Please see Figure 5 One embodiment of this application provides an aerosol generating apparatus 1, comprising: Heating element module 100 as described in any of the above embodiments.

[0090] The power supply component 200 is connected to the heating element module 100. The power supply component 200 is configured to provide current to the heating element module 100, so that when the semiconductor component 30 passes current, heat generated based on the Boltzmann effect is transferred from the second conductive carrier 40 to the first conductive carrier 20. Joule heating is generated at both ends of the first conductive carrier 20 and the second conductive carrier 40, and the Joule heating generated by the second conductive carrier 40 is also transferred to the first conductive carrier 20, thereby raising the temperature of the first conductive carrier 20 to heat the aerosol to form the article.

[0091] The heat generated by the Bolter effect can be calculated using the Bolter formula: Q = |Πn – Πp|*I, where Q is the heat, Πn and Πp are the Bolter coefficients of the N-type semiconductor 31 and the P-type semiconductor 32, respectively, and I is the magnitude of the current supplied by the power supply component 200 to the heating element module 100, which is equal to the magnitude of the current flowing through the N-type semiconductor 31 and the P-type semiconductor 32 of the semiconductor component 30.

[0092] When thermal equilibrium is reached, a constant temperature difference exists between the first conductive carrier 20 and the second conductive carrier 40. The tubular carrier 10 also serves to store the energy generated by the temperature rise of the first conductive carrier 20.

[0093] The housing 300, the heating element module 100 and the power supply assembly 200 are all housed within the housing 300.

[0094] The heating element module provided in this application embodiment is surrounded by a heat insulation component, and the heat insulation component and the outer peripheral sidewall of the tubular carrier together define a sealed cavity. The first conductive carrier, the semiconductor component and the second conductive carrier are located in the sealed cavity, thereby reducing the heat transferred outward by the heating element per unit time and improving energy utilization.

[0095] It should be noted that the preferred embodiments of this application are given in the specification and accompanying drawings, but are not limited to the embodiments described in this specification. Furthermore, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heating element module, characterized in that, include: A tubular carrier that defines a containment space for receiving aerosol-generated products; A first conductive carrier is disposed around the tubular carrier; Multiple semiconductor components are disposed on the first conductive carrier, and each semiconductor component includes an N-type semiconductor and a P-type semiconductor. Multiple second conductive carriers are located on the side of the semiconductor component opposite to the first conductive carrier, and each second conductive carrier is electrically connected to the N-type semiconductor and the P-type semiconductor of the corresponding semiconductor component; A heat insulation component surrounds the periphery of the tubular carrier, and the heat insulation component and the outer peripheral sidewall of the tubular carrier together define a sealed cavity, in which the first conductive carrier, the semiconductor component, and the second conductive carrier are located.

2. The heat generating body module according to claim 1, wherein The thermal insulation component includes an upper support structure and a lower support structure. The upper support structure is fixedly connected to one end of the tubular carrier, and the lower support structure is fixedly connected to the other end of both the upper support structure and the tubular carrier. The upper support structure, the lower support structure, and the outer peripheral sidewall of the tubular carrier together define the sealing cavity.

3. The heat generating body module according to claim 2, wherein Both the upper support structure and the lower support structure are made of plastic, and their thermal conductivity is less than 0.22 W / (m·K).

4. The heat generating body module according to claim 2, wherein The thermal insulation component also includes a sealing element disposed at the connection position between the upper support structure and the tubular carrier.

5. The heat generating body module according to claim 1, wherein The sealed cavity is filled with a heat-insulating medium.

6. The heat generating body module according to claim 5, wherein The heat insulation medium includes air or an inert gas.

7. The heat generating body module according to claim 2, wherein The thermal insulation assembly also includes a partition structure for dividing the sealed cavity into a first sealed cavity and a second sealed cavity.

8. The heat generating body module according to claim 7, wherein The partition structure is connected between the upper support structure and the lower support structure, or between the upper support structure and the tubular carrier, or between the lower support structure and the tubular carrier.

9. The heat generating body module according to claim 1, wherein The thermal insulation component is constructed in a tubular shape.

10. The heat generating body module according to claim 9, wherein The heat insulation component is coaxially arranged with the tubular carrier.

11. The heating element module as described in claim 1, characterized in that, The first conductive carrier includes a flexible circuit board, on which a positive electrode connection terminal and a negative electrode connection terminal are provided, and a plurality of semiconductor components are connected between the positive electrode connection terminal and the negative electrode connection terminal.

12. The heat generating body module according to claim 11, wherein The heating element module also includes conductive leads extending along the length of the tubular carrier, wherein one conductive lead is connected to the positive terminal of the flexible circuit board and the other conductive lead is connected to the negative terminal of the flexible circuit board.

13. The heat generating body module according to claim 1, wherein The heating element module also includes a fixing member arranged around the second conductive carrier.

14. The heat generating body module according to claim 13, wherein The heating element module also includes a temperature sensor, the sensing head of which is disposed between the second conductive carrier and the fixing member.

15. The heat-generating body module according to claim 13, wherein The fastener includes a PI membrane or aerogel.

16. The heat-generating body module according to claim 14, wherein When the fixture includes a PI film, the axial length of the PI film is greater than or equal to the axial length of the temperature sensor and less than or equal to the axial length of the tubular carrier.

17. The heat generator module according to claim 13, wherein The heating element module also includes an isolation component, which is disposed between the second conductive carrier and the fixing component.

18. The heat generating body module according to claim 17, wherein The insulating element includes a PI film.

19. An aerosol-generating device comprising, include: The heating element module as described in any one of claims 1-18; A power supply assembly is connected to the heating element module. The power supply assembly is configured to provide current to the heating element module, so that when current flows through the semiconductor component, heat generated based on the Boltzmann effect is transferred from the second conductive carrier to the first conductive carrier, generating Joule heating at both ends of the first and second conductive carriers. The Joule heating generated by the second conductive carrier is also transferred to the first conductive carrier, thereby increasing the temperature of the first conductive carrier to heat the aerosol-generated product. The housing contains both the heating element module and the power supply assembly.

Images