A multifunctional semiconductor temperature-regulating seat

Abstract

This utility model relates to the field of seating technology. To address the safety risks associated with existing products using electric heating wires, this utility model discloses a multifunctional semiconductor temperature-regulating seat. The seat includes a frame with an internal cushion and a backrest. The main structure of both the cushion and backrest, from the outside in, consists of a liquid circulating water bladder layer, a sponge comfort layer, and a frame support layer. The liquid circulating water bladder layer is positioned to correspond to the sitting and leaning areas of the human body. The frame support layer of the cushion houses a semiconductor cooling unit, which includes a semiconductor cooling chip. One side of the chip is attached to a heat exchange water tank, and the other side is equipped with a heat dissipation component. The heat exchange water tank is connected to the liquid circulating water bladder layer via a circulation pump and a water tank, forming a closed-loop circuit. This structure, using a semiconductor cooling unit in conjunction with a liquid circulating water bladder layer, utilizes liquid as a highly efficient heat transfer medium, replacing the traditional electric heating wire method, thus reducing safety risks and costs.

Description

Technical Field

[0001] This utility model relates to the field of seat technology, and in particular to a multifunctional semiconductor temperature-regulating seat. Background Technology

[0002] With the fast pace of life and changing work styles, prolonged sitting has become the norm in various settings, including offices, driving, medical rehabilitation, and home leisure. However, prolonged sitting not only easily leads to problems such as lumbar muscle strain and poor blood circulation, but also causes local temperature increases and sweat accumulation due to continuous heat exchange between the body and the seat, resulting in discomfort such as stuffiness and stickiness, seriously affecting the user's comfort and health.

[0003] To improve the thermal comfort of seats, various temperature-controlled seat solutions have emerged in the existing technology. Among them, the more common solutions include ventilation cooling and electric heating.

[0004] Ventilated seats typically have fans and air ducts inside the seat cushion or backrest to expel heat and moisture generated when the body is in contact with the seat through forced airflow.

[0005] To achieve heating functionality, many seating products integrate electric heating devices, typically using heating wires or flexible heating films embedded within the foam layer of the seat cushion or backrest. When powered on, the heating element generates heat, raising the seat surface through heat conduction and providing a warm and comfortable experience in cold environments. However, this type of electric heating solution presents significant safety hazards: because the heating wires are embedded in flammable polyurethane foam material for extended periods, the localized temperatures are high during operation. Over time, the insulation layer is prone to aging, cracking, and even damage, easily leading to short circuits and other problems. More seriously, if temperature control fails or localized overheating occurs, it could ignite the internal foam material, posing a fire risk. Summary of the Invention

[0006] The purpose of this invention is to provide a multifunctional semiconductor temperature-regulating seat to solve the technical problem of safety risks associated with heating with electric heating wires in existing products.

[0007] To achieve the above objectives, the specific technical solution of this utility model for a multifunctional semiconductor temperature-regulating seat is as follows: A multifunctional semiconductor temperature-regulating chair includes a seat frame with an internal seat cushion and a backrest. The main structure of both the seat cushion and backrest, from the outside in, consists of a liquid circulating water bladder layer, a sponge comfort layer, and a frame support layer. The liquid circulating water bladder layer is positioned to correspond to the sitting and backrest areas. The frame support layer of the seat cushion houses a semiconductor cooling unit for regulating the temperature of the liquid. The semiconductor cooling unit includes a semiconductor cooling chip, with a heat exchange water tank attached to one side and a heat dissipation component on the other side. The heat exchange water tank is connected to the liquid circulating water bladder layer via a circulation pump and a water tank, forming a closed-loop circulation circuit. The bottom of the seat frame has legs that allow the bottom of the seat frame to form a space greater than 10mm above the ground. The bottom of the frame support layer has an opening for connection to the outside to create a channel for the convection of hot and cold air.

[0008] By using a semiconductor cooling unit instead of traditional heating wires for temperature regulation, the safety hazards caused by overheating of heating wires are effectively avoided, significantly improving the safety of seat use. Simultaneously, by utilizing a liquid circulation water bladder layer in conjunction with semiconductor cooling chips, a closed-loop liquid circulation system is formed through a heat exchange water tank, circulation pump, and water reservoir. This achieves uniform and rapid cooling or heating of the seat cushion and backrest areas, resulting in high temperature regulation efficiency and a comfortable feel. By raising the seat bottom with support legs and incorporating bottom openings, natural or forced convection ventilation channels are created, effectively guiding the hot air exhausted by the cooling fan to dissipate quickly and preventing heat buildup inside the seat.

[0009] Furthermore, a miniature air pump is installed within the frame support layer, and at least one adjustable pressure airbag is embedded in the backrest corresponding to the lumbar region. The miniature air pump is connected to the adjustable pressure airbag via an air tube. By adjusting the pressure of the lumbar airbag through the miniature air pump, dynamic support for the lumbar spine is achieved, effectively relieving lumbar fatigue caused by prolonged sitting.

[0010] Furthermore, an outer cover is provided to cover the seat cushion and / or backrest.

[0011] Furthermore, a controller is provided for detecting the liquid circulation water bladder layer and water tank shortage, as well as adjusting the current direction; a control panel connected to the controller is installed on the seat cushion. The controller integrates temperature monitoring, water shortage alarm, and current direction switching functions, enabling intelligent switching between cooling / heating modes and preventing dry burning or overheating.

[0012] Furthermore, the liquid circulating water bladder layer is made of elastic material composed of medical-grade PVC (polyvinyl chloride), TPE (thermoplastic elastomer), and non-woven fabric or leather, and has a honeycomb-shaped flow guiding structure inside to improve and reduce temperature uniformity.

[0013] Furthermore, a copper heat-conducting base is provided on the contact surface between the heat exchange water tank and the semiconductor cooling chip, and heat-conducting wing seats extend from the outside of the base to expand the heat exchange area.

[0014] Furthermore, armrests are provided on both sides of the seat frame.

[0015] Furthermore, a headrest is provided at the top of the backrest.

[0016] Furthermore, the liquid circulating water bladder layer is simultaneously set on the seat cushion and the backrest, forming independent seat cushion water bladders and backrest water bladders, or forming a connected integrated water bladder. The water inlet ends of the seat cushion water bladder and the backrest water bladder are respectively connected to the water outlet of the semiconductor cooling host through pipes, and the water outlet ends of the two are respectively connected back to the return port of the semiconductor cooling module through connecting pipes.

[0017] Furthermore, the surface of the liquid circulating water bladder layer is composited with PVC and TPE layers, and the edge of the water bladder layer is sealed to the outer outer layer.

[0018] Furthermore, the heat dissipation component is an aluminum finned heat sink, with a cooling fan positioned on one side of the heat sink, and the fan's exhaust outlet facing the bottom ventilation gap of the seat frame. The aluminum finned heat sink, combined with forced air cooling, efficiently dissipates heat from the hot end of the semiconductor cooling chip; the fan's exhaust direction is aligned with the bottom ventilation gap, forming a directional airflow channel to achieve rapid heat dissipation and prevent heat backflow.

[0019] The multifunctional semiconductor temperature-regulating seat provided by this utility model has the following advantages: This invention employs a semiconductor refrigeration unit combined with a liquid circulating water bladder layer, using liquid as a highly efficient heat transfer medium to replace the traditional flammable and easily aging electric heating wire. This fundamentally eliminates the safety hazards caused by fires due to insulation aging, localized overheating, or short circuits in the heating wire. Simultaneously, utilizing the reversible characteristics of the semiconductor refrigeration chip, it allows for free switching between cooling and heating modes by changing the direction of the current, achieving integrated cooling and heating functions. This effectively overcomes the single-function shortcomings of existing products, as the same set of components can both heat and cool, reducing costs. By raising the seat bottom with legs and creating a bottom opening, a natural or forced convection ventilation channel is formed, effectively guiding the hot air exhausted by the cooling fan to dissipate quickly and preventing heat accumulation inside the seat.

[0020] In addition, the liquid circulation system, combined with the honeycomb flow guide structure and the thermally conductive silicone layer, significantly improves the uniformity of temperature distribution and response speed; the heat exchange water tank, copper thermally conductive base, aluminum fin heat sink and bottom ventilation gap work together to form an efficient heat dissipation channel, ensuring that the heat from the hot end of the semiconductor cooling chip is discharged in time and maintaining the stable and efficient operation of the system. Attached Figure Description

[0021] Figure 1 A three-dimensional structural diagram of the multifunctional semiconductor temperature-regulating seat provided by this utility model; Figure 2Rear view structural diagram of the multifunctional semiconductor temperature-regulating seat provided by this utility model; Figure 3 This utility model provides a structural diagram showing the separation of the seat cushion and the chair frame. Figure 4 This utility model provides a structural diagram showing the separation of the seat cushion body and the back cushion. Figure 5 This is an exploded structural diagram of the back pad provided by this utility model; Figure 6 An exploded view of the seat cushion provided by this utility model; Figure 7 An exploded view of the refrigeration component provided by this utility model; Figure 8 Structural diagram of the seat cushion water bladder and backrest water bladder provided in Embodiment 1 of this utility model; Figure 9 The structural diagram of the seat cushion water bladder and backrest water bladder in Embodiment 2 of this utility model.

[0022] In the diagram: 10. Seat frame; 20. Seat cushion; 30. Backrest; 40. Backrest pad; 50. Headrest; 60. Armrest; 70. Cooling unit; 80. Controller; 21. Seat cushion body; 22. Spacer pad; 23. Control panel; 24. Fan; 25. Seat frame; 41. Sponge comfort layer; 42. Adjustable pressure airbag; 43. Liquid circulating water bladder layer; 71. Front shell; 72. Back shell; 73. Radiator; 74. Water tank; 76. Heat exchange water tank; 77. Semiconductor cooling chip; 78. Circulation pump. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] See Figures 1 to 9This utility model provides a multifunctional semiconductor temperature-regulating seat, including a seat frame 10, an inner seat cushion 20, and a backrest 30. The main structure of the seat cushion 20 and backrest 30, from the outside to the inside, consists of an outer cover, a sponge comfort layer, and a frame support layer. A liquid circulation chamber is provided between the outer cover and the sponge comfort layer, corresponding to the sitting and backing areas. A liquid circulation water bladder layer 43 is located within the liquid circulation chamber. A semiconductor cooling unit for liquid temperature regulation is located inside the frame support layer of the seat cushion 20. The semiconductor cooling unit includes a semiconductor cooling chip 77, with a heat exchange water tank 76 attached to one side and a heat dissipation component on the other side. The heat exchange water tank 76 is connected to a circulation pump 78 and a water tank 74 via pipes. The outlet of the water tank 74 is connected to the inlet of the liquid circulation water bladder layer 43 via a connecting hose, and the return outlet of the liquid circulation water bladder layer 43 is connected to the heat exchange water tank 76. This allows for active temperature regulation in localized areas.

[0025] The seat frame 10 serves as the main support structure for the chair, and a seat cushion 20 is installed inside it, with a backrest 30 fixedly connected to its rear side. The seat cushion 20 and backrest 30 can be integrally fixed to the seat frame 10, or they can be separated (e.g., ...). Figure 3 (As shown); the seat frame 10 is symmetrically provided with height-adjustable armrests 60 on both sides, and the top of the backrest 30 is provided with an adjustable or fixed headrest 50 to improve seating comfort.

[0026] The outer cover is made of breathable, skin-friendly, and wear-resistant fabric or leather; the sponge comfort layer is made of high-resilience polyurethane foam, providing good sitting comfort; the frame support layer is made of high-strength engineering plastic or metal skeleton, used to support the overall structure and integrate internal functional modules.

[0027] See Figure 2 The bottom of the seat frame 10 is equipped with legs, which can be fixed wheels or swivel wheels. The legs are used to create a space at a predetermined height between the bottom of the seat frame 10 and the ground. The bottom opening of the frame support layer is used to connect with the outside to create a channel for the convection of hot and cold air. A ventilation gap of a predetermined height is created between the bottom of the seat and the ground, which can be set to a minimum height of 10mm.

[0028] See Figure 5 The liquid circulating water bladder layer 43 is made of elastic material composed of medical PVC, TPE and non-woven fabric or leather, and has a honeycomb flow guiding structure inside to improve and reduce temperature uniformity.

[0029] See Figure 6 It also includes a controller 80 for detecting the liquid circulation water bladder layer 43 and the water tank 74 (water shortage detection), as well as adjusting the current direction; a control panel 23 is located on the side of the seat cushion 20 or on the armrest 60, and is electrically connected to the controller 80. The controller 80 is electrically connected to the following components: A temperature sensor is installed in the liquid circulation water bladder layer 43 to monitor the surface temperature of the seat cushion / backrest in real time; a water shortage detection sensor is installed in the water tank 74 to issue an alarm or automatically shut down when the liquid level is lower than the safety threshold; the control panel 23 is embedded in the front of the seat cushion 20 or the armrest 60, allowing users to set the target temperature, switch between cooling / heating modes, and adjust the air bladder pressure, etc.

[0030] The power supply circuit of the thermoelectric cooler 77 allows the controller 80 to switch the current direction and control the hot and cold ends of the thermoelectric cooler 77 to reverse, thereby enabling free switching between cooling and heating modes.

[0031] See Figure 7 To improve heat transfer efficiency, a copper thermally conductive base is provided on the contact surface between the heat exchange water tank 76 and the semiconductor cooling chip 77. Thermally conductive wing seats extend from the outside of the base to expand the heat exchange area. The base has excellent thermal conductivity.

[0032] See Figure 8 A liquid circulating water bladder layer 43 is simultaneously disposed on both the seat cushion 20 and the backrest 30. In one embodiment, this forms independent seat cushion water bladders and backrest water bladders. The water inlets of the seat cushion water bladder and the backrest water bladder are respectively connected to the water outlet of the semiconductor cooling unit via pipes, and their water outlets are respectively connected back to the return port of the semiconductor cooling module via connecting pipes. The seat cushion water bladder and the backrest water bladder are two independent circulation units, each with its own independent inlet / outlet. They can also be connected to the water outlet and return port of the semiconductor cooling unit respectively by adding a three-way valve or dual pipes.

[0033] See Figure 9 The liquid circulating water bladder layer 43 is simultaneously disposed on the seat cushion 20 and the backrest 30, forming an integrated water bladder that is interconnected in one embodiment.

[0034] Furthermore, a miniature air pump is installed within the frame support layer, and at least one adjustable airbag 42 is embedded in the backrest 30 corresponding to the waist position of the user. The miniature air pump is connected to the adjustable airbag 42 via an air tube. The user can adjust the inflation and deflation of the airbag through the control panel 23 to achieve personalized adjustment of the lumbar support strength.

[0035] Furthermore, an outer cover is provided to cover the liquid circulating water bladder layer. The surface of the liquid circulating water bladder layer 43 is composite with PVC (polyvinyl chloride) and TPE (thermoplastic elastomer) layers, and the edge of the water bladder layer is sealed to the outer cover.

[0036] Furthermore, the heat dissipation component is an aluminum finned heat sink 73, and a cooling fan 24 is provided on one side of the heat sink 73, with the air outlet of the cooling fan 24 facing the bottom ventilation gap of the seat frame 10. A ventilation opening is provided at the bottom of the frame support layer, aligned with the air outlet of the cooling fan 24, forming a top-to-bottom convection channel for hot and cold air, effectively dissipating the heat generated by the semiconductor cooling unit and preventing heat accumulation from affecting cooling efficiency.

[0037] Work process example When the user activates the cooling mode, the controller 80 drives the semiconductor cooling chip 77 to operate, cooling the liquid in the heat exchange water tank 76. The circulation pump 78 pumps the low-temperature liquid into the water bladders of the seat cushion 20 and backrest 30, achieving cooling through contact with the human body via the thermally conductive silicone layer. Simultaneously, the heat from the hot end is forcibly exhausted to the ventilation gap at the bottom of the seat by the aluminum finned heat sink 73 and the cooling fan 24, forming efficient thermal management. The heating mode is achieved by reversing the direction of the current.

[0038] In summary, this utility model provides a multifunctional semiconductor temperature-regulating seat. This invention employs a semiconductor refrigeration unit combined with a liquid circulating water bladder layer, using liquid as a highly efficient heat transfer medium to replace the traditional flammable and easily aging electric heating wire. This fundamentally eliminates the safety hazards caused by fires due to insulation aging, localized overheating, or short circuits in the heating wire. Simultaneously, utilizing the reversible characteristics of the semiconductor refrigeration unit, the system can freely switch between cooling and heating modes by changing the direction of the current, achieving integrated cooling and heating functions and effectively overcoming the single-function shortcomings of existing products. By raising the seat bottom with legs and creating a bottom opening, a natural or forced convection ventilation channel is formed, effectively guiding the hot air exhausted by the cooling fan to dissipate quickly and preventing heat accumulation inside the seat. The liquid circulation system, combined with a honeycomb-shaped flow guide structure and a thermally conductive silicone layer, significantly improves the uniformity of temperature distribution and response speed. Furthermore, the heat exchange water tank, copper thermally conductive base, aluminum finned heat sink, and bottom ventilation gap work together to form a highly efficient heat dissipation channel, ensuring timely heat dissipation from the hot end of the semiconductor refrigeration unit and maintaining stable and efficient system operation.

[0039] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multifunctional semiconductor temperature-regulating seat, comprising a seat frame (10), an inner part of which is provided with a seat cushion (20), and a backrest (30) arranged at the rear side of the seat frame, characterized in that, The main structure of the seat cushion (20) and backrest (30) consists of a liquid circulating water bladder layer (22, 43), a sponge comfort layer, and a frame support layer from the outside to the inside. The liquid circulating water bladder layer (22, 43) is set in the area where the human body sits and leans. The frame support layer (25) of the cushion (20) is provided with a semiconductor cooling host (70) for regulating the temperature of the liquid; the semiconductor cooling host (70) includes a semiconductor cooling chip (77), one side of the semiconductor cooling chip (77) is attached to a heat exchange water tank (76), and the other side is provided with a heat dissipation component (73); the heat exchange water tank (76) is connected to the liquid circulation water bag layer (22, 43) through a circulation pump (78) and a water tank (74) to form a closed circulation loop; The bottom of the chair frame (10) is provided with a support leg, which is used to make the bottom of the chair frame (10) form a space with a predetermined height greater than 10mm with the ground. The bottom opening of the frame support layer is used to communicate with the outside to construct a channel for the convection of hot and cold air.

2. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The frame support layer is also equipped with a micro air pump, and the backrest is embedded with at least one adjustable pressure airbag (42) at the waist position of the human body. The micro air pump is connected to the adjustable pressure airbag (42) through an air tube.

3. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein It is also provided with an outer cover covering the seat cushion (20) and / or backrest (30).

4. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The heat exchange water tank (76) and the semiconductor cooling chip (77) are fitted with a copper heat-conducting base, and a heat-conducting wing extends outward from the base to expand the heat exchange area.

5. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The chair frame (10) is provided with armrests (60) on both sides.

6. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The top of the backrest (30) is provided with a headrest (50).

7. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The liquid circulating water bladder layers (22, 43) form independent seat cushion water bladders and backrest water bladders on the seat cushion (20) and backrest (30), respectively, or form interconnected integrated water bladders.

8. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein It is also equipped with a controller (80) for detecting the liquid circulation water bladder layer (22, 43) and the water tank (74) for water shortage detection and adjusting the current direction; the seat cushion (20) is equipped with a control panel (23) connected to the controller (80).

9. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The liquid circulating water bladder layer (22, 43) is made of elastic material composed of medical PVC, TPE and non-woven fabric or leather, and has a honeycomb flow guiding structure inside to improve and reduce temperature uniformity.

10. The multi-functional semiconductor temperature-controlled seat according to claim 1, wherein The heat dissipation component (73) is an aluminum finned heat sink, and a cooling fan is provided on one side of the heat sink, with the air outlet of the cooling fan facing the bottom ventilation gap of the chair seat frame (10).

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