An endoscope probe

CN224628080UActive Publication Date: 2026-08-14KUNSHAN RUIQI INFORMATION TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-09
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

然而,光纤传导效率受限,高功率照明需求下仍可能因光纤端面发热或局部光能损耗导致镜体末端温度升高,尤其在长时间手术中,仍存在黏膜组织热损伤的潜在风险

Benefits of technology

[0020] Furthermore, the heat insulation layer structure is located on the outer wall of the probe body and close to the heating unit. The heat insulation layer structure can be a cavity structure with the same or different cavities. The heat insulation layer structure can be independently designed according to the temperature requirements or settings of each part of the probe, including the size and shape of the internal cavity of the heat insulation layer, and the auxiliary structures already existing inside, such as the support member. Its shape can be a rod-shaped or sheet-shaped structure connecting the inner wall. The support member can be a straight structure connecting the inner wall or a curved structure connecting the inner wall at both ends.

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Abstract

This utility model discloses an endoscope probe, including a probe body, an installation chamber for mounting a vision chip and an illumination chip, a cooling channel around the installation chamber, and a self-circulating medium in the cooling channel to control the temperature of the probe body. The probe body also includes a heat insulation layer, which works together with the cooling channel to control the temperature. This utility model, through 3D printing, not only ensures temperature control of each part but also achieves a smaller volume and a more complex internal structure design.
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Description

Technical Field

[0001] This utility model belongs to the field of endoscopic instruments, specifically relating to an endoscope probe. Background Technology

[0002] The light source and vision system of an endoscope are core components ensuring intracavitary visualization, but their thermal effects have always been a key issue restricting the safety of the equipment. Early endoscopes used incandescent or halogen lamps as illumination sources. Although these lamps were bright, they generated a great deal of heat, requiring physical isolation or air cooling to reduce heat conduction. However, the risk of tissue burns due to increased temperature at the endoscope tip remained. In the 1970s, the introduction of cold light source technology (such as the combination of xenon lamps and fiber optic light guides) partially alleviated the thermal damage problem. By placing the light source externally and conducting light through optical fibers, heat accumulation inside the endoscope was reduced. However, the transmission efficiency of optical fibers is limited. Under high-power illumination requirements, the endoscope tip temperature may still rise due to heating of the fiber end face or localized light energy loss, especially during prolonged surgeries, posing a potential risk of mucosal tissue thermal damage.

[0003] Since the beginning of the 21st century, LED light sources have gradually replaced traditional xenon lamps due to their advantages of low power consumption, miniaturization, and controllability. However, to meet the brightness requirements of high-definition endoscopic imaging, high-density LED arrays or short-pulse high-intensity light modes are often used, and their instantaneous heat load may still be conducted to human tissue through the endoscope. In addition, some special endoscopic technologies (such as laser-assisted therapy or fluorescence imaging) require the integration of high-energy lasers or specific wavelength light sources, further exacerbating the complexity of thermal management. In existing technologies, although attempts have been made to reduce the endoscope temperature through heat dissipation coatings, thermoelectric cooling, or liquid cooling circulation systems, such solutions often result in bulky endoscope structures, increased costs, and difficulty in achieving effective heat dissipation in ultra-fine diameter endoscopes (diameter <3mm).

[0004] More importantly, current endoscopic thermal safety standards mainly rely on external temperature monitoring and empirical operation time control, lacking the ability to perceive and dynamically adjust the actual heat distribution within the body in real time. For example, in narrow cavities (such as bile ducts or cerebral blood vessels), the endoscope is in close contact with tissues, significantly reducing heat dissipation efficiency, and traditional temperature control strategies are prone to failure. Therefore, developing an endoscopic heat dissipation system that can achieve effective thermal management without increasing the original size has become an urgent need to improve the safety of minimally invasive surgery and expand its clinical applications. Utility Model Content

[0005] In view of this, to overcome at least one of the aforementioned defects in the prior art, this utility model provides an endoscope probe formed by 3D printing, which can effectively solve the related problems, comprising: The endoscope probe includes a probe body, on which a mounting chamber for installing a vision chip and an illumination chip is provided, and a cooling channel is provided around the mounting chamber. The medium in the cooling channel can self-circulate to control the temperature of the probe body.

[0006] According to the prior art described in the background section of this utility model, existing endoscope probes use external cooling and cleaning water channels to clean and cool the probe. This results in high temperatures inside the body, making it difficult to keep the probe inside for extended periods. Furthermore, the cooling water cannot be recycled and can only be cooled externally, making it difficult to maintain a low temperature for the endoscope and requiring significant water consumption, further hindering its long-term use inside the body. In contrast, the 3D-printed endoscope probe disclosed in this utility model solves the heat dissipation problem by placing the cooling pipes inside the probe and close to the heat-generating components. Simultaneously, due to the cooling... Water only needs to circulate in the cooling pipes, thus achieving recycling and reuse without entering the human body, avoiding further discomfort for patients. At the same time, this structure can keep the probe temperature at around 30 degrees Celsius, allowing it to remain inside the human body for an extended period. In addition, the probe also includes a heat insulation layer. The heat insulation layer has a specific structure set according to the temperature requirements of various parts of the probe body, including the size and position of cavities and internal support components. The support components can also be formed in a specific number and shape according to the temperature requirements or settings of various parts of the probe. They can work together through the cooling channels or be set independently to meet the temperature control of specific parts of the probe.

[0007] In addition, the 3D-printed endoscope probe disclosed in this utility model also has the following additional technical features: Furthermore, the cooling channel has an inlet and an outlet on the probe body. The inlet and outlet can be located on the upper and lower surfaces, sides, or other desired locations of the probe body, depending on specific requirements.

[0008] Furthermore, the outer wall of the probe body is provided with a heat insulation interlayer.

[0009] Furthermore, the probe body is a 3D printed structure.

[0010] Furthermore, the cooling channel is arranged in the space between the chip mounting chamber and the probe body, and the minimum wall thickness between the cooling channel and the chip mounting chamber is 0.1 mm.

[0011] Furthermore, the diameter of the cooling channel outlet and inlet is 1mm-3mm.

[0012] Furthermore, the width of the cooling channel is 0.1mm-6mm, and the cross-section of the cooling channel is a closed curve, with the width here being its maximum width.

[0013] Furthermore, the cooling pipe is equipped with a support structure inside.

[0014] Furthermore, the supporting structure is a rod-shaped or sheet-shaped structure connecting the inner wall, and the structure is a straight structure with both ends connecting to the inner wall or a curved structure with both ends connecting to the inner wall.

[0015] Furthermore, the cooling channel flows around the chip mounting chamber from the inlet to the outlet. Furthermore, the heat insulation interlayer is a 3D printed integral structure, and the narrowest section of the cavity thickness is less than 1mm.

[0016] Furthermore, a support member is provided inside the heat insulation interlayer.

[0017] Furthermore, the supporting member is a rod-shaped or sheet-shaped structure connecting the inner wall, and the member is a straight structure with both ends connecting to the inner wall or a curved structure with both ends connecting to the inner wall.

[0018] This invention also provides a method for using an endoscope probe, wherein temperature is controlled by controlling the cooling medium in the cooling channel of the endoscope probe.

[0019] Furthermore, temperature control is achieved by controlling the heat insulation layer structure in the endoscope.

[0020] Furthermore, the heat insulation layer structure is located on the outer wall of the probe body and close to the heating unit. The heat insulation layer structure can be a cavity structure with the same or different cavities. The heat insulation layer structure can be independently designed according to the temperature requirements or settings of each part of the probe, including the size and shape of the internal cavity of the heat insulation layer, and the auxiliary structures already existing inside, such as the support member. Its shape can be a rod-shaped or sheet-shaped structure connecting the inner wall. The support member can be a straight structure connecting the inner wall or a curved structure connecting the inner wall at both ends.

[0021] This invention places the cooling water channel inside the probe and close to the CMOS mounting chamber, allowing the cooling water to come into close contact with the heat source. The minimum distance or minimum wall thickness between the cooling water circulation and the heat source can be designed to make heat transfer more rapid. This ensures that the probe remains at a suitable temperature for the human body for a long time, thus avoiding patient discomfort. At the same time, the temperature of various parts of the probe body can be controlled by the heat insulation layer and the fluid in the cooling channel.

[0022] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which: Figure 1 This is a top view schematic diagram of an embodiment of the present utility model; Figure 2 This is a side view schematic diagram of an embodiment of the present utility model; Figure 3 yes Figure 2 A schematic diagram of the AA cross-section; Figure 4 yes Figure 2 BB cross-sectional diagram; Figure 5 yes Figure 2 A schematic diagram of the CC cross-section; Figure 6 This is a schematic cross-sectional view of the heat insulation layer according to an embodiment of the present invention; Figure 7 yes Figure 6 Schematic diagram of longitudinal section of the insulation layer; The components include: 1. Water inlet, 2. Installation chamber (chamber for installing heating elements), 3. Water outlet, 4. Cooling channel, and 5. Insulation layer. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0025] In the description of this utility model, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "horizontal", "vertical", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connection," "connection," "linking," "fitting," and "cooperation" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium; "fitting" can refer to the fit between surfaces, the fit between a point and a surface or a line and a surface, and also includes the fit between a hole and a shaft. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0027] The 3D-printed endoscope probe of this invention will now be described with reference to the accompanying drawings. Figure 1 This is a top view schematic diagram of an embodiment of the present utility model; Figure 2-5 These are side view and cross-sectional view of an embodiment of this utility model; Figure 6 , 7 This is a schematic diagram of the cross-section and longitudinal section of the insulation layer according to an embodiment of the present invention.

[0028] According to embodiments of the present invention, such as Figure 1-7 The endoscope probe includes a probe body, on which a mounting chamber for a vision chip and an illumination chip is disposed, and a cooling channel is disposed around the mounting chamber. The medium in the cooling channel can self-circulate to control the temperature of the probe body.

[0029] According to an embodiment of this utility model, the cooling channel has an inlet and an outlet on the probe body. The inlet and outlet can be positioned on the upper and lower surfaces, sides, or other required locations of the probe body, depending on specific requirements.

[0030] According to an embodiment of the present invention, the outer wall of the probe body is provided with a heat insulation layer.

[0031] According to an embodiment of this utility model, the probe body is a 3D printed structure.

[0032] According to an embodiment of the present invention, the cooling channel is arranged in the space between the chip mounting chamber and the probe body, and the minimum wall thickness between the cooling channel and the chip mounting chamber is 0.1 mm.

[0033] According to an embodiment of this utility model, the diameter of the cooling channel outlet and inlet is 1mm-3mm.

[0034] Furthermore, the width of the cooling channel is 0.1mm-6mm, and the cross-section of the cooling channel is a closed curve, with the width here being its maximum width.

[0035] According to an embodiment of the present invention, the cooling pipe is provided with a support structure inside.

[0036] According to an embodiment of the present invention, the supporting structure is a rod-shaped or sheet-shaped structure connecting the inner wall, and the structure is a straight structure with both ends connecting the inner wall or a curved structure with both ends connecting the inner wall.

[0037] According to an embodiment of the present invention, the cooling channel flows from the inlet to the outlet, circling the chip mounting chamber. According to an embodiment of the present invention, the heat insulation interlayer is a 3D printed integral structure, and the narrowest section of the cavity thickness is less than 1 mm.

[0038] According to an embodiment of the present invention, a supporting member is provided inside the heat insulation interlayer.

[0039] According to an embodiment of the present invention, the supporting member is a rod-shaped or sheet-shaped structure connecting the inner wall, and the member is a straight structure with both ends connecting to the inner wall or a curved structure with both ends connecting to the inner wall.

[0040] This invention also provides a method for using an endoscope probe, wherein temperature is controlled by controlling the cooling medium in the cooling channel of the endoscope probe.

[0041] According to an embodiment of this utility model, temperature control is achieved by controlling the heat insulation layer structure in the endoscope.

[0042] According to an embodiment of this utility model, the heat insulation layer structure is located on the outer wall of the probe body and close to the heating unit. The heat insulation layer structure can be a structure with the same or different cavities. The heat insulation layer structure can be independently designed according to the temperature requirements or settings of each part of the probe, including the size and shape of the internal cavity of the heat insulation layer, and the auxiliary structures already existing inside, such as the establishment of a support member. The shape of the support member can be a rod-shaped or sheet-shaped structure connecting the inner wall. The support member can be a straight structure connecting the inner wall or a curved structure connecting the inner wall at both ends.

[0043] Any reference to "an embodiment," "embodiment," "illustrative embodiment," etc., means that the specific component, structure, or feature described in connection with that embodiment is included in at least one embodiment of this utility model. Such illustrative expressions throughout this specification do not necessarily refer to the same embodiment. Furthermore, when a specific component, structure, or feature is described in connection with any embodiment, it is claimed that implementing such a component, structure, or feature in connection with other embodiments falls within the scope of those skilled in the art.

[0044] Although the specific embodiments of this utility model have been described in detail with reference to several illustrative examples, it should be understood that those skilled in the art can devise various other modifications and embodiments that fall within the spirit and scope of the principles of this utility model. Specifically, reasonable variations and modifications can be made to the arrangement of components and / or dependent combinations within the scope of the foregoing disclosure, drawings, and claims without departing from the spirit of this utility model. The scope of these variations and modifications, except for those concerning components and / or layout, is defined by the appended claims and their equivalents.

Claims

1. An endoscope probe, characterized by ,include: The endoscope probe includes a probe body, on which a mounting chamber for mounting a vision chip and an illumination chip is provided, and a cooling channel is provided around the mounting chamber; The cooling channel has an inlet and an outlet on the probe body; the outer wall of the probe body is provided with a heat insulation layer; the cooling channel is arranged in the space between the chip mounting chamber and the probe body, and the minimum wall thickness between the cooling channel and the chip mounting chamber is 0.1 mm; the heat insulation layer is a 3D printed integral structure, and the narrowest section of the cavity thickness is less than 1 mm; a support member is provided inside the heat insulation layer; the endoscope probe is a 3D printed endoscope probe, and the cooling channel is located inside the probe and close to the heat-generating component.

2. The endoscopic probe of claim 1, wherein, The probe body is a 3D printed structure.

3. The endoscopic probe of claim 1, wherein, The diameter of the cooling channel outlet and inlet is 1mm-3mm.

4. The endoscopic probe of claim 1, wherein, The width of the cooling channel is 0.1mm-6mm.

5. The endoscopic probe of claim 1, wherein, The cooling channel is equipped with a support structure inside.

6. The endoscope probe according to claim 5, characterized in that, The supporting structure is a rod-shaped or sheet-shaped structure connecting the inner wall, and the supporting structure is a straight structure connecting the inner wall or a curved structure connecting the inner wall.

7. The endoscopic probe of claim 1, wherein, The cooling channel flows from the inlet to the outlet, circling the chip mounting chamber.

8. The endoscopic probe of claim 1, wherein, The supporting member is a rod-shaped or sheet-shaped structure connecting the inner wall, and the supporting member is a straight structure connecting the inner wall or a curved structure connecting the inner wall.