A wearable near-infrared brain functional imaging device

Abstract

This application provides a wearable near-infrared brain functional imaging device. The wearable near-infrared brain functional imaging device includes a headgear, a main unit, and at least one detection module. The headgear is worn on the head and is used to mount a transmitting probe that emits near-infrared light towards the head and a receiving probe that receives light signals scattered by brain tissue and reflected back. The detection module is adapted to be mounted on the headgear and includes at least a housing, an avalanche photodiode disposed within the housing, and an optical fiber extending from the housing. The optical fiber is used to connect to the receiving probe to transmit light signals from the receiving probe to the avalanche photodiode, which converts the light signals into electrical signals. The main unit is configured to be mounted on the headgear and is wiredly connected to the detection module. The aforementioned wearable near-infrared brain functional imaging device improves the sensitivity and accuracy of signal detection by converting light signals from the receiving probe into electrical signals using the avalanche photodiode disposed in the detection module.

Description

Technical Field

[0001] This application relates to the field of near-infrared brain function technology, and in particular to a wearable near-infrared brain function imaging device. Background Technology

[0002] With the rapid development of near-infrared technology, wearable near-infrared devices have become one of the most promising products and will be a hot field in the future, meeting people's needs for portable, efficient, and diversified applications. Near-infrared brain imaging devices generally include a transmitting probe and a receiving probe. The transmitting probe sends near-infrared light to the wearer's head, and the receiving probe receives the light signal scattered by the wearer's brain tissue and returned. Currently, wearable near-infrared brain imaging devices typically place a photodiode (PD) inside the receiving probe. The PD converts the received light signal into an electrical signal, which is then processed and sent to the host to obtain information about the subject's brain oxygenation level. However, the PD has low sensitivity and can only detect strong light signals, which can be difficult to detect in people with dark hair, such as Asians. Furthermore, because the internal space of the receiving probe is limited, the signal processing device cannot be placed inside the receiving probe. This necessitates a long cable connection between the PD and the signal processing device. The electrical signal converted by the PD suffers significant signal loss during transmission through the cable to the signal processing device, resulting in low signal detection accuracy. Utility Model Content

[0003] To address the aforementioned technical problems in the existing technology, this application provides a wearable near-infrared brain functional imaging device, which converts the optical signal from the receiving probe into an electrical signal through an avalanche photodiode disposed in a detection module separate from the receiving probe, thereby improving the sensitivity and accuracy of signal detection.

[0004] This application provides a wearable near-infrared brain functional imaging device. The wearable near-infrared brain functional imaging device includes a headgear, a main unit, and at least one detection module. The headgear is worn on the head and is used to mount an emitting probe that emits near-infrared light towards the head and a receiving probe that receives light signals scattered by brain tissue and reflected back. The detection module is adapted to be mounted on the headgear and includes at least a housing, an avalanche photodiode disposed within the housing, and an optical fiber extending from the housing. The optical fiber is used to connect to the receiving probe to transmit light signals from the receiving probe to the avalanche photodiode, which converts the light signals into electrical signals. The main unit is configured to be mounted on the headgear and wiredly connected to the detection module.

[0005] In some embodiments, the housing of the detection module further includes an amplifier electrically connected to the avalanche photodiode for amplifying and processing the electrical signal from the avalanche photodiode.

[0006] In some embodiments, at least one of the detection module and the host is detachably mounted on the headgear.

[0007] In some embodiments, when the headgear is worn on a user's head for detection, the detection module is adapted to be mounted on the area of ​​the headgear corresponding to the top of the head; and / or, the host is adapted to be mounted on the area of ​​the headgear corresponding to the occipital bone.

[0008] In some embodiments, the detection module further includes a mounting bracket disposed within the housing, the mounting bracket having mounting holes, the avalanche photodiode being embedded in the mounting holes, and the optical fiber being mounted on the mounting bracket in a one-to-one correspondence with the avalanche photodiode.

[0009] In some embodiments, the detection module further includes a temperature sensor disposed close to the avalanche photodiode to detect temperature information.

[0010] In some embodiments, there are multiple avalanche photodiodes, and the multiple avalanche photodiodes are mounted on the mounting bracket in an up-down arrangement, with the number of avalanche photodiodes arranged at the bottom being greater than the number of avalanche photodiodes arranged at the top.

[0011] In some embodiments, the detection module further includes a cable extending from the housing for connection to the transmitting probe, a groove formed on the upper side of the mounting bracket adjacent to the top of the avalanche photodiodes arranged above, and the cable resting within the groove.

[0012] In some embodiments, the detection module further includes a temperature sensor disposed on the mounting bracket, the temperature sensor being located in the area surrounded by the avalanche photodiode and the cable, for detecting the temperature of the mounting bracket.

[0013] In some embodiments, the detection module further includes a control board, through which the host is electrically connected to the temperature sensor and the avalanche photodiode respectively. The control board transmits the temperature signal sent by the temperature sensor to the host. The host receives the temperature signal and, when the temperature value of the temperature signal exceeds a preset threshold, sends an instruction to the control board to lower the operating parameters of the avalanche photodiode.

[0014] Compared with the prior art, the beneficial effects of the embodiments of this application are as follows: This application converts the optical signal from the receiving probe into an electrical signal using an avalanche photodiode, which can improve the sensitivity and accuracy of signal detection. In particular, the use of an avalanche photodiode can meet the detection of weak light signals and reduce the difficulty of detecting dark hair of Asians. Furthermore, the avalanche photodiode is set inside the housing of the detection module carried on the headgear and connected to the receiving probe through an optical fiber, instead of being placed in the receiving probe and requiring a cable connection to the detection module. Since the signal loss caused by the optical fiber is lower than that caused by the cable, the signal transmission loss can be reduced, effectively ensuring the accuracy of signal detection. Moreover, compared with the scheme of placing the PD inside the receiving probe, placing the avalanche photodiode inside the housing of the detection module can reduce the size of the receiving probe, save space inside the receiving probe, and make the structure of the receiving probe more rational and miniaturized. Attached Figure Description

[0015] In drawings that are not necessarily drawn to scale, the same reference numerals may describe similar parts in different views. The drawings generally illustrate various embodiments by way of example rather than limitation and are used, together with the description and claims, to illustrate the disclosed embodiments. Where appropriate, the same reference numerals are used in all drawings to refer to the same or similar parts. Such embodiments are illustrative and not intended to be exhaustive or exclusive embodiments of the apparatus or method.

[0016] Figure 1 This is a schematic diagram of wearing the wearable near-infrared brain functional imaging device according to an embodiment of this application;

[0017] Figure 2 This is a partial structural schematic diagram of the wearable near-infrared brain functional imaging device according to an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the internal structure of the detection module of the wearable near-infrared brain functional imaging device according to an embodiment of this application. Cables are not shown in the figure.

[0019] Figure 4 This is a schematic diagram of the internal structure of the detection module of the wearable near-infrared brain functional imaging device according to an embodiment of this application. Cables are shown in the figure.

[0020] The components indicated by the reference numerals in the figure:

[0021] 1. Headgear; 11. Transmitting probe; 12. Receiving probe; 2. Detection module; 21. Housing; 22. Avalanche photodiode; 23. Fiber optic component; 24. Mounting bracket; 25. Mounting hole; 26. Temperature sensor; 27. Cable; 28. Groove; 29. ​​Control board; 3. Main unit. Detailed Implementation

[0022] To enable those skilled in the art to better understand the technical solutions of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. The embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific examples, but these are not intended to limit the scope of this application.

[0023] The terms "first," "second," and similar words used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "contains" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well. Terms such as "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, this relative positional relationship may also change accordingly.

[0024] In this application, when a specific device is described as being located between a first device and a second device, an intermediary device may or may not be present between the specific device and the first or second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other devices without an intermediary device, or it may not be directly connected to the other devices but may have an intermediary device.

[0025] All terms used in this application (including technical or scientific terms) have the same meaning as understood by one of ordinary skill in the art to which this application pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0026] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0027] This application provides a wearable near-infrared brain functional imaging device. For example... Figures 1 to 4 As shown, the wearable near-infrared brain functional imaging device includes a headgear 1, a main unit 3, and at least one detection module 2. The headgear 1 is worn on the head and is used to mount a transmitting probe 11 that emits near-infrared light towards the head and a receiving probe 12 that receives the light signals scattered and reflected back by brain tissue. Figures 1 to 4As shown, the detection module 2 is adapted to be mounted on the headgear 1. The detection module 2 includes at least a housing 21, an avalanche photodiode 22 disposed within the housing 21, and an optical fiber 23 extending from the housing 21. The optical fiber 23 is used to connect to the receiving probe 12 to transmit optical signals from the receiving probe 12 to the avalanche photodiode 22, which is used to convert the optical signals into electrical signals. The host 3 is configured to be mounted on the headgear 1 and wiredly connected to the detection module 2.

[0028] The aforementioned avalanche photodiode (APD) is a high-sensitivity semiconductor photodetector. Its working principle is based on the photoelectric effect and avalanche multiplication effect to achieve the purpose of detecting weak light signals.

[0029] The aforementioned detection module 2 can be multiple. Increasing the number of detection modules 2 increases the number of transmitting probes 11 and receiving probes 12, thereby increasing the number of detection channels. For example, Figure 1 The number of detection modules 2 shown is 2. Figure 2 The number of detection modules 2 shown is 3.

[0030] The receiving end of the aforementioned optical fiber component 23 can be connected to the receiving probe 12, and the emitting end of the optical fiber component 23 can be configured to correspond to the avalanche photodiode 22. Specifically, there can be a gap between the emitting end of the optical fiber component 23 and the avalanche photodiode 22, and a filter can be provided in the gap between them.

[0031] The aforementioned fiber optic component 23 can be detachably installed inside the housing 21 to facilitate maintenance of the fiber optic component 23, such as replacement of the fiber optic component 23.

[0032] The aforementioned host 3 can be electrically connected to the avalanche photodiode 22 to control the operation of the avalanche photodiode 22.

[0033] This application uses an avalanche photodiode 22 to convert the optical signal from the receiving probe 12 into an electrical signal, which can improve the sensitivity and accuracy of signal detection. In particular, the avalanche photodiode 22 can meet the detection of weak light signals and reduce the difficulty of detecting dark hair of Asians. Furthermore, the avalanche photodiode 22 is set inside the housing 21 of the detection module 2 carried on the headgear 1 and is connected to the receiving probe through an optical fiber, instead of being set in the receiving probe and requiring a cable to connect to the detection module 2. Since the signal loss caused by the optical fiber is lower than that caused by the cable, the signal transmission loss can be reduced. Moreover, compared with the solution of setting the PD inside the receiving probe 12, setting the avalanche photodiode 22 inside the housing 21 can reduce the size of the receiving probe 12, save space inside the receiving probe 12, and make the structure of the receiving probe 12 more rational and miniaturized.

[0034] In some embodiments, the housing 21 of the detection module 2 also includes an amplifier (not shown) electrically connected to the avalanche photodiode 22, used to amplify the electrical signal from the avalanche photodiode 22. Thus, the electrical signal generated by the avalanche photodiode 22 can be amplified and sent to the host 3, enhancing the signal performance received by the host 3. Since the amplifier is relatively large and not suitable for placement in the receiving probe 12, placing both the avalanche photodiode 22 and the amplifier in the detection module 2 effectively reduces the size of the receiving probe 12. Furthermore, the closer distance between the avalanche photodiode 22 and the amplifier further reduces signal loss during their electrical connection, effectively ensuring the accuracy of signal detection.

[0035] The amplifier described above can be constructed as a standalone electronic device or as a circuit that can be integrated on a circuit board. This application does not limit the specific form of the amplifier, as long as it can amplify and process the electrical signal from the avalanche photodiode 22.

[0036] In some embodiments, at least one of the detection module 2 and the main unit 3 is detachably mounted on the headgear 1. This facilitates the installation and replacement of the detection module 2 and / or the main unit 3 mounted on the headgear 1.

[0037] The detection module 2 and / or the host 3 can be connected to the head cap 1 by means of snap-fit ​​connection, threaded connection, plug-in connection, adhesive connection, etc.

[0038] The aforementioned headgear 1 may have a placement area corresponding to the back of the head, where both the detection module 2 and the host 3 are located. Specifically, the detection module 2 may be positioned relatively close to the top of the head relative to the host 3, making the placement of the detection module 2 and the host 3 more reasonable. The optical fiber 23 extending from the housing 21 of the detection module 2 can be connected to the receiving probe 12 with a shorter length, thereby reducing signal transmission loss.

[0039] In some embodiments, such as Figure 1 As shown, when the headgear 1 is worn on the user's head for detection, the detection module 2 is adapted to be mounted on the area of ​​the headgear 1 corresponding to the top of the head; and / or, the main unit 3 is adapted to be mounted on the area of ​​the headgear 1 corresponding to the occipital bone. This arrangement of the detection module 2 and the main unit 3 is reasonable, as the detection module 2 can be closer to the transmitting probe 11 and the receiving probe 12 on the headgear 1, and the optical fiber 23 extending from the housing 21 of the detection module 2 can be connected to the receiving probe 12 with a shorter length, thereby reducing signal transmission loss.

[0040] The housing 21 of the detection module 2 may be provided with a first engaging structure, and the area of ​​the head cap 1 corresponding to the top of the head may be provided with several second engaging structures. The first engaging structure and one of the second engaging structures are engaged with each other, so that the detection module 2 can be stably installed on the area of ​​the head cap 1 corresponding to the top of the head.

[0041] The aforementioned host 3 may include a housing, which can be snapped into the area of ​​the headgear 1 corresponding to the occipital bone. Specifically, the housing may be provided with a third snap-fit ​​structure, and the area of ​​the headgear 1 corresponding to the occipital bone may be provided with a fourth snap-fit ​​structure. The third and fourth snap-fit ​​structures are snapped together, so that the host 3 can be stably installed on the area of ​​the headgear 1 corresponding to the occipital bone.

[0042] In some embodiments, such as Figure 3 and Figure 4 As shown, the detection module 2 also includes a mounting bracket 24 disposed in the housing 21. The mounting bracket 24 is provided with mounting holes 25. The avalanche photodiode 22 is embedded in the mounting hole 25. The fiber optic component 23 is mounted on the mounting bracket 24 in a one-to-one correspondence with the avalanche photodiode 22.

[0043] Thus, the avalanche photodiode 22 and the fiber optic component 23 can be stably mounted by the mounting bracket 24, so that the avalanche photodiode 22 and the fiber optic component 23 can maintain a relatively stable positional relationship. Furthermore, the avalanche photodiode 22 is embedded in the mounting hole 25, which can achieve the purpose of compact internal structure design of the detection module 2, making more reasonable use of the space inside the housing 21 of the detection module 2.

[0044] The mounting bracket 24 described above can be constructed as a plate, with mounting holes 25 provided thereon that correspond one-to-one with avalanche photodiodes 22. For example, as shown... Figure 3 As shown in the figure, there are six mounting holes 25 and six avalanche photodiodes 22.

[0045] Since the avalanche photodiode 22 generates heat during operation, and this heat is conducted to the mounting bracket 24, the material of the mounting bracket 24 needs to be a material with good thermal conductivity, specifically a metal material with good thermal conductivity, such as aluminum alloy or titanium alloy.

[0046] The plate surface of the mounting bracket 24 can be perpendicular to the axial direction of the optical fiber component 23.

[0047] The wall of the mounting hole 25 can protrude outward to form a limiting groove. The avalanche photodiode 22 can have a limiting block embedded in the limiting groove, so that after the avalanche photodiode 22 is installed in the mounting hole 25, the limiting block is locked in the limiting groove, which can prevent the avalanche photodiode 22 from rotating relative to the mounting hole 25 and improve the installation stability of the avalanche photodiode 22.

[0048] The aforementioned optical fiber component 23 can be detachably connected to the mounting bracket 24, specifically through snap-fit ​​connection, threaded connection, plug-in connection, or other connection methods. For example, the light-emitting end of the optical fiber component 23 can be fitted with a threaded component, which can be threadedly connected to the mounting bracket 24, allowing the optical fiber component 23 to be installed onto the mounting bracket 24 via the threaded component.

[0049] In some embodiments, such as Figure 3 As shown, the detection module 2 also includes a temperature sensor 26 disposed close to the avalanche photodiode 22 to detect temperature information. The temperature sensor 26 accurately detects the temperature information related to the avalanche photodiode 22, thereby monitoring the temperature of the avalanche photodiode 22 and preventing the avalanche photodiode 22 from being damaged due to overheating.

[0050] The temperature sensor 26 can be installed on or under the mounting bracket 24, or on other brackets located inside the housing 21, so as to be close to the avalanche photodiode 22 and achieve accurate detection of temperature information related to the avalanche photodiode 22.

[0051] The temperature sensor 26 described above can directly or indirectly detect the temperature of the avalanche photodiode 22. For example, the temperature sensor 26 can be in direct contact with the avalanche photodiode 22 to directly detect its temperature. Alternatively, the temperature sensor 26 can be in contact with other structural components that are in contact with the avalanche photodiode 22 to indirectly detect its temperature. The following explanation uses the example of the temperature sensor 26 indirectly detecting the temperature of the avalanche photodiode 22, and will not be elaborated further.

[0052] In some embodiments, such as Figure 3 and Figure 4As shown, there are multiple avalanche photodiodes 22, which are mounted on the mounting bracket 24 in a vertical arrangement, with the number of avalanche photodiodes 22 arranged at the bottom being greater than the number arranged at the top. This arrangement of avalanche photodiodes 22 minimizes their occupation of the internal space of the housing 21. In particular, compared to a flat arrangement of avalanche photodiodes 22, the vertical arrangement minimizes the lateral dimension of the housing 21, making the size of the housing 21 more rational and thus improving the wearing comfort.

[0053] For example, such as Figure 3 As shown, the number of avalanche photodiodes 22 can be six, with four avalanche photodiodes 22 arranged at the bottom and two avalanche photodiodes 22 arranged at the top. In this way, the space on the mounting bracket 24 can be utilized as rationally as possible, so that there are empty spaces between the avalanche photodiodes 22 at the top for the installation or placement of other components.

[0054] In some embodiments, the avalanche photodiodes 22 arranged below can be staggered with the avalanche photodiodes 22 arranged above. For example, the avalanche photodiodes 22 arranged above can be spaced apart from the two adjacent avalanche photodiodes 22 arranged below. This can greatly improve the space utilization on the mounting bracket 24, minimize the space occupied inside the housing 21, and make the size of the housing 21 more reasonable, thereby improving the comfort of the wearer.

[0055] In some embodiments, such as Figure 2 and Figure 4 As shown, the detection module 2 also includes a cable 27 extending from the housing 21. The cable 27 is used to connect to the transmitting probe 11. A groove 28 is formed on the upper side of the mounting bracket 24. The groove 28 is adjacent to the top of the avalanche photodiodes 22 arranged above. The cable 27 is placed in the groove 28.

[0056] In this way, the cable 27 can be stably supported by the groove 28 on the mounting bracket 24, and there is space at the top of the avalanche photodiode 22. The cable 27 and the avalanche photodiode 22 are arranged compactly, which can make full use of the space inside the housing 21 of the detection module 2, making the structural design of the detection module 2 more reasonable.

[0057] The bottom of the groove 28 can be constructed as a support surface. The support surface can be a plane or an arc surface that matches the outer contour of the cable 27. This application does not specifically limit the structure of the groove 28, as long as it can stably support the cable 27.

[0058] The aforementioned housing 21 also contains a first circuit board for connecting the cable 27. The circuit board is connected to the cable 27 via a terminal and is electrically connected to the host 3.

[0059] There may be multiple cables 27, with each cable 27 corresponding to a transmitting probe 11. Furthermore, a cable bundle structure may be fitted over the cable 27 to ensure it is placed more stably on the mounting bracket 24.

[0060] In some embodiments, such as Figure 3 and Figure 4 As shown, the detection module 2 also includes a temperature sensor 26 mounted on the mounting bracket 24. The temperature sensor 26 is located in the area surrounded by the avalanche photodiode 22 and the cable 27, and is used to detect the temperature of the mounting bracket 24.

[0061] Thus, the temperature sensor 26 is embedded in the mounting hole 25 of the mounting bracket 24. By detecting the temperature of the mounting bracket 24, temperature information related to the temperature of the avalanche photodiode 22 can be detected. The above structural design is relatively compact, and the layout of the temperature sensor 26, the avalanche photodiode 22, and the cable 27 is reasonable, making full use of the space layout within the housing 21 of the detection module 2.

[0062] The mounting bracket 24 can be made of a material with good thermal conductivity, specifically a metal material with good thermal conductivity, such as aluminum alloy or titanium alloy, so that the mounting bracket 24 in contact with the avalanche photodiode 22 can better characterize the temperature of the avalanche photodiode 22, and the temperature sensor 26 can accurately detect the temperature of the avalanche photodiode 22 by detecting the temperature of the mounting bracket 24.

[0063] The temperature sensor 26 can be located between two adjacent avalanche photodiodes 22 arranged above, and the temperature sensor 26 is located directly below the cable 27. In this way, the temperature sensor 26, the avalanche photodiodes 22 and the cable 27 are arranged in a compact and reasonable manner.

[0064] The mounting bracket 24 may be provided with a through hole, and the temperature sensor 26 may be embedded in the through hole to reduce the space occupied by the temperature sensor 26 in the housing 21.

[0065] In some embodiments, such as Figure 3 and Figure 4 As shown, the detection module 2 also includes a control board 29. The host 3 is electrically connected to the temperature sensor 26 and the avalanche photodiode 22 through the control board 29. The control board 29 transmits the temperature signal sent by the temperature sensor 26 to the host 3. The host 3 receives the temperature signal and sends an instruction to the control board 29 to lower the operating parameters of the avalanche photodiode 22 when the temperature value of the detected temperature signal exceeds a preset threshold.

[0066] In this way, when the temperature value of the temperature signal related to the temperature of the avalanche photodiode 22 exceeds the preset threshold, the host 3 can control the avalanche photodiode 22 in a timely manner through the control board 29 to avoid the problem of the avalanche photodiode 22 being damaged due to excessive temperature.

[0067] Temperature sensor 26 and avalanche photodiode 22 can be connected to the second circuit board via terminals. Control board 29 is connected to the second circuit board. Host 3 is electrically connected to control board 29, so that host 3 can obtain the temperature signal sent by temperature sensor 26 through control board 29, and send instructions to lower the operating parameters of avalanche photodiode 22 through control board 29.

[0068] The operating parameters of the avalanche photodiode 22 may include at least voltage to ensure that the avalanche photodiode 22 can maintain normal operation.

[0069] The control board 29 described above can be separately disposed from both the first circuit board and the second circuit board, or it can be integrated into one of the first and second circuit boards, or it can be integrated into one of the first and second circuit boards. This application does not specifically limit the configuration of the control board 29, as long as it can be electrically connected to the host 3 and can transmit signals between them. For example, as... Figure 4 As shown, the control board 29 is separately configured from both the first and second circuit boards. Figure 4 The control board 29 shown is located below the first circuit board, and the second circuit board is located close to the side of the mounting bracket 24. The control board 29 is perpendicular to the second circuit board.

[0070] Furthermore, although exemplary embodiments have been described herein, their scope includes any and all embodiments based on this application that have equivalent elements, modifications, omissions, combinations (e.g., schemes involving intersections of various embodiments), adaptations, or alterations. Elements in the claims will be interpreted broadly based on the language used in the claims and are not limited to the examples described in this specification or during the implementation of this application, and such examples will be interpreted as non-exclusive.

[0071] The above description is intended to be illustrative and not restrictive. For example, the above examples (or one or more of them) can be used in combination with each other. Other embodiments may be used by those skilled in the art upon reading the above description. Furthermore, in the above detailed description, various features may be grouped together to simplify the application. This should not be construed as an intention that a disclosed feature not claimed is necessary for any claim. Rather, the subject matter of the application may be less than all the features of a particular disclosed embodiment. Thus, the claims are incorporated herein by reference as examples or embodiments, wherein each claim is an independent, separate embodiment, and these embodiments are contemplated as being combined with each other in various combinations or arrangements. The scope of this application should be determined by reference to the appended claims and the full scope of their equivalents.

[0072] The above embodiments are merely exemplary embodiments of this application and are not intended to limit this application. The scope of protection of this application is defined by the claims. Those skilled in the art can make various modifications or equivalent substitutions to this application within its substance and scope of protection, and such modifications or equivalent substitutions should also be considered to fall within the scope of protection of this application.

Claims

1. A wearable near-infrared brain function imaging device, characterized by, include: A headgear, worn on the head, is equipped with a transmitting probe that emits near-infrared light toward the head and a receiving probe that receives light signals scattered by brain tissue and returned. At least one detection module adapted to be mounted on the headgear, the detection module comprising at least a housing, an avalanche photodiode disposed within the housing, and an optical fiber extending from the housing, the optical fiber being configured to connect to the receiving probe to transmit an optical signal from the receiving probe to the avalanche photodiode, the avalanche photodiode being configured to convert the optical signal into an electrical signal; as well as The host is configured to be mounted on the headgear and wired to the detection module. 2.The wearable near-infrared brain function imaging device according to claim 1, wherein, The housing of the detection module also includes an amplifier electrically connected to the avalanche photodiode, used to amplify and process the electrical signal from the avalanche photodiode. 3.The wearable near-infrared brain function imaging device according to claim 1, wherein, At least one of the detection module and the host is detachably mounted on the headgear. 4.The wearable near-infrared brain function imaging device according to any one of claims 1-3, characterized in that, When the headgear is worn on a user's head for detection, the detection module is adapted to be mounted on the area of ​​the head corresponding to the top of the head; and / or, the host is adapted to be mounted on the area of ​​the headgear corresponding to the occipital bone.

5. The wearable near-infrared brain function imaging device according to any one of claims 1-3, wherein, The detection module also includes a mounting bracket disposed within the housing, the mounting bracket having mounting holes, the avalanche photodiode being embedded in the mounting holes, and the optical fiber component being mounted on the mounting bracket in a one-to-one correspondence with the avalanche photodiode. 6.The wearable near-infrared brain function imaging device according to claim 5, wherein, The detection module also includes a temperature sensor positioned close to the avalanche photodiode to detect temperature information. 7.The wearable near-infrared brain function imaging device according to claim 5, wherein, There are multiple avalanche photodiodes, and the multiple avalanche photodiodes are mounted on the mounting bracket in an up-down arrangement, with the number of avalanche photodiodes arranged at the bottom being greater than the number of avalanche photodiodes arranged at the top. 8.The wearable near-infrared brain function imaging device according to claim 7, wherein, The detection module also includes a cable extending from the housing for connecting to the transmitting probe. A groove is formed on the upper side of the mounting bracket, adjacent to the top of the avalanche photodiodes arranged above, and the cable is laid within the groove. 9.The wearable near-infrared brain function imaging device of claim 8, wherein, The detection module also includes a temperature sensor mounted on the mounting bracket. The temperature sensor is located in the area surrounded by the avalanche photodiode and the cable, and is used to detect the temperature of the mounting bracket. 10.The wearable near-infrared brain function imaging device according to claim 6 or 9, characterized in that, The detection module also includes a control board. The host is electrically connected to the temperature sensor and the avalanche photodiode through the control board. The control board transmits the temperature signal sent by the temperature sensor to the host. The host receives the temperature signal and, when the temperature value of the temperature signal exceeds a preset threshold, sends an instruction to the control board to lower the operating parameters of the avalanche photodiode.

Images