A bone drill bit

Abstract

This application relates to the field of medical device technology and provides a bone drill bit, including a drill rod body with a receiving chamber formed along the axial direction within the drill rod body. A cooling component is disposed on the drill rod body, comprising a thermoelectric cooler, a cooling surface conductor, and a heating surface conductor. The thermoelectric cooler is disposed within the receiving chamber and divides the receiving chamber into a cutting working chamber and a non-cutting working chamber. The cooling surface conductor includes a cooling pipe disposed within the cutting working chamber, with its outer wall tightly attached to the inner wall of the cutting working chamber. One end of the cooling pipe is connected to the cooling surface of the thermoelectric cooler, and the cooling pipe is filled with refrigerant. The heating surface conductor includes a heat-absorbing pipe disposed within the non-cutting working chamber, with one end of the heat-absorbing pipe connected to the heating surface of the thermoelectric cooler. The heat-absorbing pipe is filled with coolant. This bone drill bit can continuously and effectively cool the bone and the drill bit during bone drilling operations without causing damage to the patient's bone.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and more specifically, to a bone drill bit. Background Technology

[0002] The content in this section provides only background information related to this application and may not constitute prior art.

[0003] Bone drilling is one of the most common and widely used surgical procedures in medicine, especially for fracture repair or prosthesis fixation. During bone drilling, heat is generated on the contact surface between the stainless steel medical drill and the bone. Because bone has a low thermal conductivity, the generated heat is difficult to dissipate, and bone is very sensitive to heat; therefore, thermal damage to bone is a major concern. The friction between the drill and bone at the contact surface and the heat generated from the conversion of kinetic energy into heat during bone drilling can cause bone tissue necrosis and oxidation.

[0004] To address the aforementioned issues, Chinese patent document CN213489111U discloses a hollow drill specifically for orthopedics. This hollow drill uses a distance sensor to monitor the distance between the spray head and the drill hole in the patient's bone in real time, transmitting the monitoring data to a microcontroller. The microcontroller analyzes the data and controls the micro-pump and servo motor to start. As the hollow drill bit penetrates the patient's bone, the spray head maintains a close proximity to the drill hole, spraying saline solution onto the drilled area. This achieves real-time automatic spraying of saline solution to cool and moisten the drilled area, eliminating the need for manual spraying. This prevents excessively high temperatures at the drill bit's contact with the bone and excessively low temperatures on the outside of the drill bit, which could lead to uneven heating and breakage. Simultaneously, cooling the drill bit also prevents bone injury due to excessively high temperatures from drilling friction.

[0005] However, the prior art disclosed in the aforementioned patent still has the following defects: 1. The disclosed technical solution actually uses spray cooling, but in reality, most of the sprayed saline solution can only achieve a cooling effect at the borehole opening. As the drilling deepens, very little saline solution reaches the tip of the drill bit, thus the cooling effect is poor. 2. During drilling, the friction between the drill bit and the bone continuously generates heat, causing the temperature to rise, especially at the tip of the drill bit where the frictional resistance is high and the temperature rises rapidly. When saline solution enters the drill bit through the gap between the drill bit and the bone for cooling, the large temperature difference caused by alternating hot and cold temperatures can easily damage the patient's bone. 3. Saline solution only uses liquid cooling, which is a natural cooling method, and its cooling effect needs to be improved. 4. Although saline solution does not harm the patient's bone, it produces some water vapor during the cooling process, which can affect the medical staff performing the drilling. Summary of the Invention

[0006] In order to solve the above-mentioned technical problems, the purpose of this application is to provide a bone drill bit that can continuously and effectively cool the bone and the drill bit during bone drilling operations without causing damage to the patient's bone.

[0007] The objective of this application is achieved through the following technical solution: A bone drill bit includes a drill rod body, a receiving chamber is formed inside the drill rod body along the axial direction, and a cooling component is provided on the drill rod body. The cooling component includes a semiconductor cooling chip, a cooling surface conductor and a heating surface conductor. The semiconductor cooling chip is disposed in the receiving chamber, and the semiconductor cooling chip divides the receiving chamber into a chip working chamber and a non-chip working chamber; The cooling surface conductor includes a cooling tube disposed in the chip working chamber, the outer wall of the cooling tube being in close contact with the inner wall of the chip working chamber, one end face of the cooling tube being connected to the cooling surface of the semiconductor cooling chip, and the cooling tube being filled with refrigerant; The heating surface conductor includes a heat-absorbing tube disposed in the non-chip working chamber, one end of the heat-absorbing tube being connected to the heating surface of the semiconductor cooling chip, and the heat-absorbing tube being filled with coolant.

[0008] In some possible embodiments, the drill pipe body includes a cutting working section and a non-cutting working section, the cutting working section and the non-cutting working section being detachably connected, the cutting working cavity being formed within the cutting working section, and the non-cutting working cavity being formed within the non-cutting working section.

[0009] In some possible embodiments, a plurality of heat dissipation holes are evenly spaced on the outer wall of the non-chip working section, and any one of the heat dissipation holes is in communication with the non-chip working cavity.

[0010] In some possible embodiments, a plurality of heat dissipation fins are evenly spaced on the outer wall of the non-chipping working section.

[0011] In some possible embodiments, a rotor wiring assembly is provided on the drill pipe body. The rotor wiring assembly includes a fixing ring and two conductive rings. The fixing ring is sleeved on the drill pipe body and can rotate freely around the drill pipe body. Two sliding grooves are circumferentially formed on the outer side wall of the fixing ring. The two conductive rings are respectively circumferentially disposed in the two sliding grooves. A conductive slider is provided in each sliding groove. The conductive slider can slide freely along the sliding groove, and can be electrically connected to the corresponding conductive ring at any position. The conductive slider can be connected to the terminal of the semiconductor cooling chip.

[0012] In some possible embodiments, any of the conductive sliders is connected to the terminals of the thermoelectric cooler via a connecting cable, the connecting cable having a detachable connector connected in series.

[0013] In some possible embodiments, the refrigeration pipe includes a pipe body and end caps disposed at both ends of the pipe body. An auxiliary heat conduction component is disposed on the refrigeration pipe. The auxiliary heat conduction component includes a plurality of heat conduction columns. The plurality of heat conduction columns are evenly spaced along the axial direction inside the refrigeration pipe. The two ends of any heat conduction column are respectively connected to the end caps of the refrigeration pipe.

[0014] In some possible embodiments, the heat absorption tube structure is the same as the cooling tube structure, and the heat absorption tube is provided with the same auxiliary heat conduction components as the cooling tube.

[0015] In summary, the technical solutions of this application have at least the following advantages and beneficial effects: 1. Compared to the spray cooling methods disclosed in the prior art, the semiconductor cooling chip and cooling tube in this application work together to achieve a better cooling effect through the active heat absorption of the semiconductor cooling chip and the heat absorption of the cooling tube itself. At the same time, by using the cooling tube to closely adhere to the inner wall of the corresponding chip working chamber, it can also ensure that each drilling position can be cooled evenly, avoiding the problem of uneven cooling as the drilling depth increases.

[0016] 2. During the cooling process, the cooling pipe of this application absorbs the heat generated by the bone and the side wall of the drill rod body in a timely manner through heat conduction and indirect heat exchange, so that there will be no problem of excessive temperature difference damaging the patient's bone during bone drilling.

[0017] 3. This application uses a combination of semiconductor cooling chips and cooling pipes for cooling. The refrigerant will not come into direct contact with the bone and the drill rod body, and it is also in a sealed state, so it effectively avoids the problem of water vapor affecting the operation of medical staff. Attached Figure Description

[0018] Figure 1 This is a three-dimensional sectional view of an embodiment of this application; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a planar sectional view of an embodiment of this application; Figure 4 for Figure 3 Enlarged view of point B in the middle; Figure 5 for Figure 4 Enlarged view of point C in the middle; Figure 6 for Figure 4 Enlarged view at point D; Figure 7 This is a schematic diagram of the installation structure of the heat sink fins in an embodiment of this application; Figure 8 This is a three-dimensional structural diagram of an embodiment of this application; Figure 9 for Figure 8 Enlarged view of point E in the middle.

[0019] Icons: 1-Drill pipe body; 101-Chip working section; 102-Non-chip working section; 3-Semiconductor cooling chip; 4-Chip working chamber; 5-Non-chip working chamber; 6-Refrigeration pipe; 7-Heat absorption pipe; 8-Heat dissipation hole; 9-Heat dissipation fins; 10-Fixing ring; 11-Conductive ring; 12-Slide groove; 13-Conductive slider; 14-Connecting cable; 15-Separable connector; 16-Heat conduction column; 17-Connecting ear. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Example

[0021] The following is for reference Figures 1 to 9 This application will be described in further detail.

[0022] like Figure 1 , Figure 3 and Figure 8 As shown, this embodiment provides a bone drill bit, including a drill rod body 1. The drill rod body 1 has a receiving chamber formed along its axial direction, and a cooling component is also provided on the drill rod body 1. The drill rod body 1 is the main component for drilling into bone, while the cooling component can cool the drill bit during drilling. Specifically, the cooling component includes a semiconductor cooling chip 3, a cooling surface conductor, and a heating surface conductor. The semiconductor cooling chip 3 is a solid-state cooling device based on the Peltier effect. It utilizes the properties of semiconductor materials to transfer heat from one side to the other when energized, thereby achieving a cooling or heating effect. Therefore, one side of the semiconductor cooling chip 3 can provide a cooling effect (hereinafter referred to as the "cooling surface"), and the other side can provide a heating effect (hereinafter referred to as the "heating surface"). The cooling surface absorbs heat on the side receiving the cooling surface conductor, causing the temperature of the cooling surface conductor to drop rapidly. Conversely, the heating surface generates heat, and the heating surface conductor absorbs and stores this heat, preventing excessively high temperatures that could degrade the performance of the drill rod body 1.

[0023] For details, please refer to Figures 1-4 In this embodiment, the aforementioned semiconductor cooling chip 3 is disposed within the receiving chamber, and the semiconductor cooling chip 3 divides the receiving chamber into a chip working chamber 4 and a non-chip working chamber 5. The aforementioned cooling surface conductor includes a cooling pipe 6 disposed within the chip working chamber 4. The outer wall of the cooling pipe 6 is tightly attached to the inner wall of the chip working chamber 4, and one end face of the cooling pipe 6 is bonded to the cooling surface of the semiconductor cooling chip 3. The cooling pipe 6 is filled with refrigerant (not shown in the figure). The aforementioned heating surface conductor includes a heat-absorbing pipe 7 disposed within the non-chip working chamber 5. One end face of the heat-absorbing pipe 7 is bonded to the heating surface of the semiconductor cooling chip 3, and the heat-absorbing pipe 7 is filled with coolant (not shown in the figure). The aforementioned chip working chamber 4 is mainly used to accommodate the cooling pipe 6. Since the cooling pipe 6 is disposed on the cooling surface side, the cooling surface can absorb heat and cool it down. Since the cutting working chamber 4 actually corresponds to the part of the drill rod body 1 that can extend into the bone to drill, and the outer wall of the aforementioned cooling pipe 6 is in close contact with the inner wall of the cutting working chamber 4, the aforementioned cooling pipe 6 will indirectly absorb the heat generated by friction on the bone and the side wall of the drill rod body 1 during the drilling process by utilizing the heat transfer effect after cooling.

[0024] In this embodiment, the non-chipping working cavity 5 is mainly used to accommodate the heat absorption tube 7. By placing the heat absorption tube 7 on one side of the heating surface, it absorbs the heat generated by the heating surface, preventing the temperature of the non-chipping working cavity 5 from becoming too high. In fact, the non-chipping working cavity 5 corresponds to the part of the drill rod body 1 that does not extend into the bone. Therefore, the heat absorption tube 7 absorbs and stores the heat generated by the heating surface, preventing this part of the drill rod body 1 from becoming too hot. It should be noted that even if a small amount of heat is transferred, causing the temperature of the drill rod body 1 to rise in this part, it will not affect the drilling process or cause damage to the bone, nor will it affect the performance of the drill rod body 1.

[0025] It is worth noting that the refrigerant mentioned above is mainly used for heat absorption and release, thereby achieving the purpose of lowering the temperature. Therefore, the semiconductor refrigeration chip 3 on the cooling side mainly absorbs the heat from the refrigerant, rapidly and stably cooling the refrigerant and the cooling pipe 6. Similarly, the coolant mentioned above is mainly used to absorb the heat generated by the heating surface.

[0026] For further details, please refer to Figure 1 , Figure 3 and Figure 9 In this embodiment, the drill pipe body 1 includes a chip-cutting working section 101 and a non-chip-cutting working section 102. The chip-cutting working section 101 and the non-chip-cutting working section 102 are detachably connected. The chip-cutting working cavity 4 is located within the chip-cutting working section 101, and the non-chip-cutting working cavity 5 is located within the non-chip-cutting working section 102. The chip-cutting working section 101 corresponds to the chip-cutting working cavity 4, and the non-chip-cutting working section 102 corresponds to the non-chip-cutting working cavity 5. This detachable connection facilitates the removal and extraction of the cooling pipe 6 and the heat-absorbing pipe 7. In actual use, to achieve a better cooling effect, the drill pipe body 1 can be placed in a refrigerator or other refrigeration equipment to cool the heat-absorbing pipe 7, coolant, cooling pipe 6, and refrigerant. During use, it can be removed, installed on the rotary head, and then used for drilling, thus achieving a better cooling effect during drilling. However, freezing the drill pipe body 1 together with the drill pipe can cause many negative effects. For example, the frozen drill pipe body 1 may become more brittle (referring to its physical brittleness), especially at extremely low temperatures, which may cause the drill pipe body 1 to break more easily during drilling. Therefore, by using a detachable connection between the chip-cutting section 101 and the non-chip-cutting section 102, the above-mentioned problems can be avoided by simply removing the cooling pipe 6 and the heat-absorbing pipe 7 before freezing.

[0027] Specifically, in this embodiment, the cutting section 101 and the non-cutting section 102 are connected by a threaded connection. The direction of this threaded connection is opposite to the direction of the drill rod body 1, meaning that the threaded connection tends to tighten when the drill rod body 1 is drilling. For the specific connection structure of the cutting section 101 and the non-cutting section 102, please refer to... Figure 2 and Figure 4 Of course, other existing connection methods can also be used in other embodiments, which will not be described further here.

[0028] For further details, please refer to... Figure 3 and Figure 4 In this embodiment, a plurality of heat dissipation holes 8 are evenly spaced on the outer wall of the non-chip-cutting working section 102, and each heat dissipation hole 8 is connected to the non-chip-cutting working cavity 5. The heat dissipation holes 8 mainly play a part in heat dissipation, specifically, the heat from the heat pipe 7 is naturally dissipated through the heat dissipation holes 8.

[0029] Please refer to Figure 7 In other embodiments, a plurality of heat dissipation fins 9 are evenly spaced on the outer wall of the non-chipping working section 102. These heat dissipation fins 9 also serve a heat dissipation function. They mainly dissipate heat from the heat absorption tube 7 by increasing the contact area with the outside, thereby increasing the heat transfer effect.

[0030] Please refer to Figure 4 , Figure 6 , Figure 8 and Figure 9In some embodiments of this example, a rotor wiring assembly is provided on the drill rod body 1. Since the thermoelectric cooler 3 is directly installed inside the drill rod body 1, although it can achieve a faster cooling effect, the cables connecting the thermoelectric cooler 3 and the corresponding power supply (the device supplying power to the thermoelectric cooler) (hereinafter referred to as external cables) will become entangled during drilling. Therefore, the rotor wiring assembly is mainly used to electrically connect the thermoelectric cooler 3 and the power supply while avoiding the aforementioned entanglement problem. Specifically, the rotor wiring assembly includes a fixing ring 10 and two conductive rings 11. The fixing ring 10 is sleeved on the drill rod body 1 and can rotate freely around the drill rod body 1. Two circumferential grooves 12 are formed on the outer wall of the fixing ring 10, and the two conductive rings 11 are respectively circumferentially arranged in the two grooves 12. A conductive slider 13 is provided in each groove 12. The conductive slider 13 can slide freely along the groove 12, and can be electrically connected to its corresponding conductive ring 11 at any position. The aforementioned conductive slider 13 can be connected to the terminals of the aforementioned thermoelectric cooler 3 via a cable (hereinafter referred to as the internal cable). Both the conductive slider 13 and the conductive ring 11 are conductive. The terminals of the thermoelectric cooler 3 are divided into positive and negative terminals. The two conductive sliders 13 in the two grooves 12 are respectively connected to the positive and negative terminals via internal cables. The two conductive rings 11 are respectively connected to the positive and negative terminals of the power supply (via external cables), thus ensuring that the thermoelectric cooler 3 is correctly connected to the power supply. When the drill rod body 1 rotates to drill, the conductive ring 11, connected to the power supply, will not rotate because it is connected to the power supply. At the same time, the rotating drill rod body 1 will drive the thermoelectric cooler 3 to rotate, thereby causing the conductive slider 13 connected to the thermoelectric cooler 3 to slide. This avoids the problem of internal cable entanglement and also avoids the problem of external cable entanglement. Meanwhile, the conductive slider 13 and the conductive ring 11 can always maintain electrical connection, thus ensuring that the thermoelectric cooler 3 is electrically connected to the power supply.

[0031] Please refer to the reference. Figure 4 , Figure 6 , Figure 8 and Figure 9 In this embodiment, the drill rod is provided with a corresponding annular groove for mounting the fixing ring 10, allowing the fixing ring 10 to rotate freely around the annular groove, and also limiting the fixing ring 10 to prevent it from moving in the axial direction. It should also be noted that the conductive slider 13 in this embodiment is also in a limiting fit with the aforementioned groove 12 (this limiting fit is an existing structure and will not be further described here, nor is it shown in the figure). Its main function is to limit the radial movement of the conductive slider 13, preventing it from falling off the groove 12.

[0032] Please refer to Figure 4 In certain application scenarios, any conductive slider 13 in this embodiment is connected to the terminal of the semiconductor cooling chip 3 via a connecting cable 14 (which is the aforementioned internal cable), and a detachable connector 15 is connected in series on the connecting cable 14. The detachable connector 15 is an electrical connection device that enables the quick connection and disconnection of the connecting cable 14, allowing the connecting cable 14 to be quickly separated or connected by plugging and unplugging.

[0033] Please refer to Figure 2 and Figure 4 In some embodiments of this example, the thermoelectric cooler 3 is actually disposed at one end of the non-chipping working section 102, while the retaining ring 10 is disposed on the chipping working section 101. When separating the chipping working section 101 and the non-chipping working section 102, the aforementioned connecting cable 14 needs to be separated. The detachable connector 15 allows the connecting cable 14 to be separated along with the chipping working section 101 and the non-chipping working section 102 when separating the chipping working section 101 and the non-chipping working section 102.

[0034] Please refer to Figure 5 In this embodiment, the bottom of the fixing ring 10 is provided with two connecting ears 17, which are electrically connected to the two conductive coils respectively. Thus, the positive and negative terminals of the power supply can be connected to the two connecting ears 17 respectively. Positioning the connecting ears 17 at the bottom of the fixing ring 10 prevents the external cable (not shown in the figure) used for connecting the power supply to the connecting ears 17 from becoming entangled with the connecting cable 14.

[0035] In addition, please refer to Figures 1-4 In this embodiment, the refrigeration pipe 6 includes a pipe body and end caps disposed at both ends of the pipe body. An auxiliary heat conduction component is provided on the refrigeration pipe 6. This auxiliary heat conduction component includes multiple heat conduction columns 16, which are evenly spaced along the axial direction of the refrigeration pipe 6 within the refrigeration pipe 6. Both ends of any heat conduction column 16 are connected to the two end caps of the refrigeration pipe 6. The heat conduction columns 16 can achieve heat transfer and increase the contact area with the refrigerant. Increasing the contact area with the refrigerant makes it easier for the semiconductor refrigeration chip 3 to quickly and effectively absorb heat from the refrigerant, thereby indirectly increasing the cooling rate.

[0036] In some cases, the structure of the heat absorber 7 in this embodiment is the same as that of the cooling pipe 6, and the heat absorber 7 is provided with the same auxiliary heat conduction component as the cooling pipe 6. The heat absorber 7 adopts the same structure and is also equipped with the same auxiliary heat conduction component inside, and the effect it can achieve is the same as that achieved by the cooling pipe 6 using the same structure.

[0037] In other embodiments, the auxiliary heat conduction component can also adopt other structures, such as installing multiple baffles inside the corresponding cooling pipe 6 or heat absorption pipe 7, all of which can achieve the same effect as the heat conduction column 16. In practical applications, the cooling pipe 6, heat absorption pipe 7, and auxiliary heat conduction component in this application can be made of copper or silver materials, both of which have excellent thermal conductivity and can significantly increase cooling or heat absorption efficiency.

[0038] It should be noted that, in other embodiments, a controller (not shown in the figure) is also provided between the power supply and the thermoelectric cooler 3 to control the power output. This controller is mainly used to adjust the working efficiency of the thermoelectric cooler 3 within a controllable range. Thus, the cooling effect can be adjusted as needed during some drilling operations. To further meet the control requirements of the controller, in other embodiments, multiple temperature sensors (not shown in the figure) are also provided on the inner wall of the drill rod body 1. These multiple temperature sensors can be connected to corresponding industrial control and display (not shown in the figure) to display drill rod temperature changes in a timely manner and to calculate temperature changes at the bone site. This information provides a reference for medical personnel to adjust the drilling rate and to use the controller to adjust the thermoelectric cooler 3 to achieve the corresponding cooling effect. The controller, display, and industrial control components, as well as their connection methods, are all existing structures and will not be further described here. If anything is unclear, please refer to the prior art.

[0039] Before use, separate the cutting section 101 and the non-cutting section 102, and simultaneously detach the connecting cable 14 using the detachable connector 15. Remove the cooling pipe 6 and the heat absorption pipe 7, and freeze both. When drilling is required, remove the cooling pipe 6 and the heat absorption pipe 7 and reinstall them into the corresponding cutting chamber 4 and non-cutting chamber 5, respectively. Then, connect the semiconductor cooling chip 3 to the power supply using the detachable connector 14. Drilling can then proceed. During drilling, the cooling surface of the semiconductor cooling chip 3 continuously absorbs heat from the cooling pipe 6, keeping the cooling pipe 6 and its internal refrigerant at a low temperature. The cooling pipe 6 can also indirectly absorb heat generated by the side wall and bone of the drill rod body 1, achieving a cooling effect.

[0040] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A bone drill bit, comprising a drill rod body, characterized in that, The drill pipe body has a receiving chamber opened along the axial direction, and a cooling component is provided on the drill pipe body. The cooling component includes a semiconductor cooling chip, a cooling surface conductor and a heating surface conductor. The semiconductor cooling chip is disposed in the receiving chamber, and the semiconductor cooling chip divides the receiving chamber into a chip working chamber and a non-chip working chamber; The cooling surface conductor includes a cooling tube disposed in the chip working chamber, the outer wall of the cooling tube being in close contact with the inner wall of the chip working chamber, one end face of the cooling tube being connected to the cooling surface of the semiconductor cooling chip, and the cooling tube being filled with refrigerant; The heating surface conductor includes a heat-absorbing tube disposed in the non-chip working chamber, one end of the heat-absorbing tube being connected to the heating surface of the semiconductor cooling chip, and the heat-absorbing tube being filled with coolant.

2. The bone drill bit of claim 1, wherein, The drill pipe body includes a cutting working section and a non-cutting working section, which are detachably connected. The cutting working section is located within the cutting working section, and the non-cutting working section is located within the non-cutting working section.

3. The bone drill bit of claim 2, wherein, Multiple heat dissipation holes are evenly spaced on the outer wall of the non-chip working section, and each heat dissipation hole is connected to the non-chip working cavity.

4. The bone drill bit of claim 2, wherein, Multiple heat dissipation fins are evenly spaced on the outer wall of the non-chipping working section.

5. The bone drill bit of claim 1 wherein, The drill pipe body is provided with a rotor wiring assembly, which includes a fixing ring and two conductive rings. The fixing ring is sleeved on the drill pipe body and can rotate freely around the drill pipe body. Two sliding grooves are circumferentially formed on the outer side wall of the fixing ring. The two conductive rings are respectively circumferentially arranged in the two sliding grooves. Each sliding groove is provided with a conductive slider. The conductive slider can slide freely along the sliding groove, and can be electrically connected to the corresponding conductive ring at any position. The conductive slider can be connected to the terminal of the semiconductor cooling chip.

6. The bone drill bit of claim 5, wherein, Any of the conductive sliders is connected to the terminals of the semiconductor cooling chip via a connecting cable, and a detachable connector is connected in series on the connecting cable.

7. The bone drill bit of claim 1 wherein, The refrigeration pipe includes a pipe body and end caps disposed at both ends of the pipe body. An auxiliary heat conduction component is provided on the refrigeration pipe. The auxiliary heat conduction component includes multiple heat conduction columns, which are evenly spaced along the axial direction inside the refrigeration pipe. The two ends of any heat conduction column are respectively connected to the end caps of the refrigeration pipe.

8. The bone drill bit of claim 7, wherein, The heat absorption tube has the same structure as the refrigeration tube, and the heat absorption tube is equipped with the same auxiliary heat conduction component as the refrigeration tube.

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