Distillation column

Abstract

This application relates to a distillation column, comprising: a distillation column body having a packing layer forming a mass transfer region for countercurrent gas-liquid contact; a feed inlet at the bottom and a reflux inlet at the top of the distillation column body; a packing support device located below the packing layer, including a bottom plate and multiple vertical cylinders spaced apart on the bottom plate, the bottom plate having a first vent hole, the sidewalls of the vertical cylinders having second vent holes, and at least a portion of the bottom of the vertical cylinders having the first vent hole; the total area of ​​the first and second vent holes being greater than the surface area of ​​the bottom plate; and packing material located within the packing layer; the bottom end of the packing material at least partially contacting the bottom plate or the vertical cylinders. The technical solution of this application can improve gas-liquid mass transfer efficiency and has a simple structure and low cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and in particular to a distillation column. Background Technology

[0002] With the development of the semiconductor industry and the need for domestic substitution, the quality requirements for both upstream and downstream equipment in chip production and the chemicals involved in the chip manufacturing process are becoming increasingly stringent. Cleaning, etching, thin film deposition, and polishing processes in chip production all require large quantities of chemicals, especially high-purity chemicals, which are in high demand. The purity of the main components of high-purity chemicals is required to be above 99.999% (5N).

[0003] Therefore, compared to ordinary chemicals, the distillation columns used for the separation and purification of high-purity chemicals require higher standards. Higher standards also mean higher costs; how to achieve these higher standards while maintaining lower costs is a pressing issue that needs to be addressed. Utility Model Content

[0004] In view of this, this application provides a distillation column to solve at least one problem existing in the prior art.

[0005] To achieve the above objectives, the technical solution of this application is implemented as follows: In a first aspect, embodiments of this application provide a distillation column used in the manufacture of chemicals required for semiconductor production, comprising: The distillation column body is equipped with a packing layer to form a mass transfer zone for countercurrent gas-liquid contact; the bottom of the distillation column body has a feed inlet and the top has a reflux inlet; A packing support device, located below the packing layer, includes a base plate and multiple vertical cylinders spaced apart on the base plate. The base plate has a first vent hole, and the sidewalls of the vertical cylinders have second vent holes. At least a portion of the bottom of the vertical cylinders has the first vent hole. The total area of ​​the first vent hole and the second vent hole is greater than the surface area of ​​the base plate. The packing material is located within the packing layer; the bottom end of the packing material is at least partially in contact with the bottom plate or the vertical cylinder.

[0006] In one alternative embodiment, the first vent is an oblong vent.

[0007] In one alternative embodiment, the ratio of the major axis length to the minor axis length of the waist-shaped hole is between 3:1 and 5:1.

[0008] In one alternative embodiment, the second vent is a rectangular hole.

[0009] In one alternative embodiment, the second vent is a circular hole.

[0010] In one alternative embodiment, the second vent is an inclined hole that is opened at an upward angle of 15°–30° to guide the airflow to deflect upward.

[0011] In one alternative embodiment, the top of the distillation column is provided with an elastic floating pressure ring to prevent packing displacement or bridging.

[0012] In one optional embodiment, both the base plate and the vertical cylinder are provided with an electrochemical plating layer.

[0013] In one alternative embodiment, the filler is a metal spring.

[0014] In an optional embodiment, the distillation column further includes a liquid distribution layer, which includes a reflux liquid phase distributor; the outlet of the reflux liquid phase distributor is above the packing layer.

[0015] The distillation column provided in this application includes: a distillation column body with a packing layer forming a mass transfer region for countercurrent gas-liquid contact; a feed inlet at the bottom and a reflux inlet at the top of the distillation column body; a packing support device located below the packing layer, including a bottom plate and multiple vertical cylinders spaced apart on the bottom plate, the bottom plate having a first vent hole, the sidewalls of the vertical cylinders having a second vent hole, and at least a portion of the bottom of the vertical cylinders having the first vent hole; the total area of ​​the first vent hole and the second vent hole is greater than the surface area of ​​the bottom plate; and packing material located within the packing layer; the bottom end of the packing material at least partially contacts the bottom plate or the vertical cylinders. As can be seen, in the distillation column of this application embodiment, multiple spaced vertical cylinders are arranged in the packing support device, and the total area of ​​the first vent and the second vent is greater than the surface area of ​​the bottom plate; this greatly increases the cross-sectional area of ​​the gas phase rising channel, allowing the gas to pass through the packing support device more smoothly, reducing gas flow resistance, avoiding gas accumulation at the support device, thereby significantly improving gas-liquid mass transfer efficiency, effectively reducing the pressure difference of the distillation column, reducing the energy consumption of the distillation column, and having a simple structure and low cost.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 A schematic diagram of a distillation column provided in an embodiment of this application; Figure 2A schematic diagram of the packing support device in the distillation column provided in the embodiments of this application; Figure 3 for Figure 2 A side-view projection diagram; Figure 4 for Figure 2 A top-view projection diagram.

[0018] Explanation of reference numerals in the attached figures: 11. Distillation column body; 12. Liquid distribution column body; 13. Flange; 20. Packing support device; 21. Bottom plate; 211. First vent hole; 22. Vertical cylinder; 221. Second vent hole; 30. Packing; 40. Reflux liquid phase distributor. Detailed Implementation

[0019] To make the technical solutions and beneficial effects of this application more obvious and understandable, the technical solutions in the embodiments of this application are clearly and completely described below by listing specific embodiments. Obviously, the embodiments of this application are not exhaustive, and the described embodiments are only some embodiments of this application, not all embodiments.

[0020] The exemplary embodiments disclosed in this application will now be described in more detail with reference to the accompanying drawings, providing detailed structures and steps to illustrate the technical solution of this application. Note that the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used herein is for the purpose of describing particular embodiments only and should not be construed as limiting the technical solutions of this application.

[0022] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. To clearly define the inventive concept of this application and avoid confusion with its content, technical features well-known in the art and conventionally understood by those skilled in the art are not elaborated upon. Specifically, this document does not fully list all features of actual embodiments, nor does it provide a detailed description of well-known functions and structures.

[0023] To address the technical problems in related technologies, embodiments of this application provide a distillation column used in the manufacture of chemicals required for semiconductor production. (Reference) Figures 1-4 The distillation column includes: The distillation column body 11 is equipped with 30 layers of packing to form a mass transfer region for gas-liquid countercurrent contact; the bottom of the distillation column body 11 is provided with a feed inlet and the top is provided with a reflux inlet; The packing support device 20, located below the packing layer 30, includes a base plate 21 and multiple vertical cylinders 22 spaced apart on the base plate 21. The base plate 21 has a first vent 211, and the sidewalls of the vertical cylinders 22 have second vents 221. At least a portion of the bottom of the vertical cylinders 22 has the first vent 211. The total area of ​​the first vent 211 and the second vent 221 is greater than the surface area of ​​the base plate 21. The packing 30 is located within the packing 30 layer; the bottom end of the packing 30 at least partially contacts the bottom plate 21 or the vertical cylinder 22.

[0024] Understandably, the packing layer 30 can be a circumferentially enclosed area with air passages in the vertical direction for airflow. Packing material 30 can be installed within the packing layer 30. Understandably, the packing layer 30 can achieve highly efficient material separation.

[0025] Understandably, the bottom feed inlet is configured to introduce the material to be distilled, while the top reflux inlet is configured to return a portion of the overhead distillate back into the column, maintaining the stability of the distillation operation and the separation effect.

[0026] Specifically, the distillation column body 11 can be made of a high-strength, corrosion-resistant special alloy material. This alloy material can be optimized for the characteristics of semiconductor chemicals, effectively resisting chemical corrosion and extending the service life of the distillation column. At the same time, its good thermal conductivity helps heat to be evenly distributed in the column, improving distillation efficiency.

[0027] It should be noted that the design of the vent holes is one of the key innovations of this application. The total area of ​​the vent holes is greater than the surface area of ​​the base plate 21. This design allows gas to pass more smoothly through the packing support device 20, reducing gas flow resistance and preventing gas accumulation at the support device, thereby significantly improving gas-liquid mass transfer efficiency. Here, the vent holes refer collectively to the first vent hole 211 and the second vent hole 221.

[0028] The surface area of ​​the base plate 21 can be the projected area of ​​the base plate 21 in the vertical direction. The total area of ​​the vents is greater than the surface area of ​​the base plate 21, which can also be described as a porosity > 100%. Porosity is the ratio of the total area of ​​the vents to the surface area of ​​the base plate 21. This structurally breaks through the limitations of traditional support plates that are "mainly solid with vents as secondary".

[0029] Packing material 30 is the core component in the distillation column that enables efficient gas-liquid two-phase contact and mass transfer. Its role is involved in key aspects of the distillation process, such as separation, heat transfer, and operational stability.

[0030] In this embodiment of the distillation column, a plurality of spaced vertical cylinders 22 are provided in the packing support device 20. The total area of ​​the first vent 211 and the second vent 221 is greater than the surface area of ​​the bottom plate 21. This greatly increases the cross-sectional area of ​​the gas phase rising channel, allowing the gas to pass through the packing support device 20 more smoothly, reducing gas flow resistance, and preventing gas accumulation at the support device. This significantly improves the gas-liquid mass transfer efficiency, effectively reduces the pressure difference of the distillation column, and reduces the energy consumption of the distillation column.

[0031] In some embodiments of this application, the first vent 211 is an oblong vent.

[0032] Understandably, this shape not only increases the ventilation area but also guides the gas to flow upwards evenly, promoting full gas-liquid contact. Furthermore, the foam or bubbles are compressed as they pass through the waist-shaped holes, effectively removing the foam.

[0033] In some embodiments of this application, the ratio of the major axis length to the minor axis length of the waist-shaped hole is between 3:1 and 5:1.

[0034] This further guides the gas to flow upwards evenly, promoting full contact between gas and liquid. It also improves the foam removal effect.

[0035] In some embodiments of this application, the second vent 221 is a rectangular hole.

[0036] It is easier to process, lower in cost, and can also serve a similar function to the waist-shaped hole.

[0037] In some embodiments of this application, the second vent 221 is a circular hole.

[0038] This complements the oblong holes on the base plate 21, resulting in better foam removal. Furthermore, the circular vent holes on different vertical cylinders 22 are staggered along the height of the vertical cylinder 22, further enhancing the uniformity of gas distribution.

[0039] In some embodiments of this application, the second vent 221 is an inclined hole opened at an upward angle of 15°–30° to guide the airflow to deflect upward.

[0040] This enhances the lateral diffusion of airflow at the bottom of the 30-layer packing and reduces the "airflow dead zone" formed directly above the vertical cylinder 22.

[0041] In some embodiments of this application, the top of the distillation column 11 is provided with an elastic floating pressure ring (not shown in the figure) to prevent the packing 30 from shifting or bridging.

[0042] In this way, the position of filler 30 is more stable, and it can play a more stable role.

[0043] In some embodiments of this application, the surfaces of the base plate 21 and the vertical cylinder 22 are both provided with an electrochemical plating layer.

[0044] By setting an electrochemical plating layer, a dense protective layer is formed on the surface of the base plate 21 and the vertical cylinder 22, preventing the metal ions inside from precipitating out and entering the distilled chemicals, thereby improving the purity of the chemicals.

[0045] In some embodiments of this application, the packing 30 is a metal spring.

[0046] Using a metal spring as filler 30 has the following beneficial effects: 1) Enhance mass and heat transfer performance: High specific surface area: The metal spring packing 30 is made of fine metal wire spirally wound, providing a larger gas-liquid contact area per unit volume. For example, the height of equal plate (HETP) of the stainless steel spring packing 30 can be as low as 25-58 mm, and the theoretical number of plates per meter can reach 45, which is significantly higher than that of the traditional packing 30.

[0047] Optimized porosity: The spring-like structure forms a uniform void network, promoting turbulent mixing of the gas and liquid phases and reducing mass transfer resistance. Experimental data show that its mass transfer efficiency is 30%-50% higher than that of conventional packing material 30.

[0048] Uniform liquid film distribution: The capillary action of the metal wire disperses the liquid into an extremely thin liquid film, enhancing heat transfer efficiency and avoiding local overheating or "dry zone" phenomena, making it especially suitable for the separation of heat-sensitive materials.

[0049] 2) Improve operational stability and adaptability Deformation resistance and pressure resistance: The elastic design of the spring can effectively buffer external stress under high pressure or variable load conditions, prevent the 30 layers of packing from collapsing or deforming, and ensure long-term stable operation.

[0050] Self-cleaning capability: The large gaps between the spiral structures make it less prone to clogging by solid particles or impurities. When impurities are present in the tower, the packing 30 can achieve self-cleaning through vibration or fluid flushing, reducing the frequency of downtime maintenance.

[0051] Corrosion and high temperature resistance: Made of corrosion-resistant metals such as stainless steel (e.g., 304, 316L) or titanium, it can be used for a long time in acidic, alkaline, or high-temperature environments. For example, titanium triangular spiral packing 30 performs excellently in isotope separation in the nuclear industry.

[0052] 3) Reduce energy consumption and operating costs Low pressure drop design: The spring-like structure optimizes the fluid flow path, reducing the pressure drop of gas and liquid as they pass through the 30-layer packing. Compared to conventional packing 30, its pressure drop can be reduced by 20%-30%, thereby reducing the operating pressure at the top of the column and reducing energy consumption.

[0053] Long lifespan and low maintenance: The metal material is wear-resistant and anti-aging, and the filler has a lifespan of over 10 years. Meanwhile, its self-cleaning properties reduce the need for manual cleaning, further lowering maintenance costs.

[0054] Specifically, the metal spring in this embodiment is made of 316L stainless steel.

[0055] In some embodiments of this application, the distillation column further includes a liquid distribution layer, which includes a reflux liquid phase distributor 40; the outlet of the reflux liquid phase distributor 40 is above the packing layer 30.

[0056] The liquid distribution layer is a key component for efficient gas-liquid two-phase contact and mass transfer. Its core function is to improve separation efficiency, operational stability and product quality by uniformly distributing the liquid and avoiding undesirable phenomena such as "channeling" and "wall flow".

[0057] Specifically, the liquid distribution layer and the packing layer 30 can be set in different cavities. For example, the packing layer 30 can be set in the distillation column 11, and the liquid distribution layer can be set in the liquid distribution column 12. The two columns are connected by a flange 13.

[0058] It should be noted that the various embodiments or implementation methods in this document can be described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. It should be understood that in the various embodiments of this application, the embodiment numbers are merely for descriptive purposes and do not represent the superiority or inferiority of the embodiments.

[0059] Understandably, without conflict, the technical features in the technical solutions described in each embodiment can be arbitrarily combined to form new embodiments. For example, each structure in each embodiment can be implemented as an independent embodiment, and the structures can be arbitrarily combined; some or all of the structures in different embodiments can be arbitrarily combined. Each step in each embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined; the order of the steps can be arbitrarily interchanged; some or all of the steps in different embodiments can be arbitrarily combined. Furthermore, regarding the table in the embodiments, each element, each row, or each column in the table can be implemented as an independent embodiment.

[0060] In this document, when the terms "embodiment," "implementation," or "example" are used, it means that the specific features described in connection with these implementations or examples are included in at least one implementation, embodiment, or example of this application. It should be noted that the illustrative expressions of the above terms do not necessarily refer to the same implementation, embodiment, or example. Furthermore, the specific features described, such as structures or steps, can be appropriately combined in any one or more implementations, embodiments, or examples.

[0061] In some embodiments, prefixes such as "first" and "second" are used merely to distinguish different descriptive objects and do not impose restrictions on the position, order, priority, or value of the descriptive objects. The description of the descriptive objects is based on the context of the claims or embodiments, and the use of prefixes does not constitute unnecessary limitations. For example, the numerical value of the descriptive object is not limited by ordinal numbers and can be one or more. For instance, in "first device," the numerical value of "device" can be one or more. Furthermore, objects modified by different prefixes can be the same or different. For example, if the descriptive object is "device," then "first device" and "second device" can be the same device or different devices, and their types can be the same or different. Describing "first" does not necessarily imply the existence of "second," and discussing "second" does not necessarily imply the existence of "first."

[0062] In some embodiments, unless otherwise stated, elements expressed in the singular form, such as "a," "the," "the," "the," "the," "the," etc., can mean "one and only one," or "one or more," "at least one," etc. For example, when using articles such as "a," "an," "the," etc. in translation, the noun following the article can be understood as either a singular or a plural expression. In some embodiments, "multiple" refers to two or more.

[0063] In some embodiments, the terms “at least one of”, “one or more”, “a plurality of”, “multiple”, etc., may be used interchangeably.

[0064] In some embodiments, the notation "at least one of A and B", "A and / or B", "A in one case, B in another", "A in one case, B in another", etc., may include the following technical solutions depending on the situation: in some embodiments, A (A is executed regardless of B); in some embodiments, B (B is executed regardless of A); in some embodiments, execution is selected from A and B (A and B are selectively executed); in some embodiments, both A and B are executed. The same applies when there are more branches such as A, B, C, etc.

[0065] In some embodiments, the notation "A or B" may include the following technical solutions, depending on the situation: in some embodiments, A (execution of A regardless of B); in some embodiments, B (execution of B regardless of A); in some embodiments, selective execution from A and B (A and B are selectively executed). The same applies when there are more branches such as A, B, and C.

[0066] In some embodiments, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment according to the specific circumstances.

[0067] In some embodiments, the terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “height,” “up,” “down,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” and “counterclockwise” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. That is, they should not be construed as limitations on this application.

[0068] In some embodiments, unless otherwise expressly defined, "above" or "below" the second feature can mean that the first and second features are in direct contact, or indirect contact via an intermediate medium, or that they are not in contact, but simply indicate that the horizontal level of the first feature is higher than that of the second feature. Furthermore, "above" or "below" the second feature can mean that the first feature is directly above or diagonally above, directly below, or diagonally below the second feature.

[0069] In some embodiments, spatial relation terms such as “upper” and “lower” may be used for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, the description of an element or feature “below” other elements or features will change it to “upper” other elements or features. Therefore, the exemplary terms “upper” and “lower” can include both upper and lower orientations. The device may also be otherwise oriented (rotated 90 degrees or otherwise), and the spatial descriptive terms used herein will be interpreted accordingly.

[0070] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the technical solutions of this application. Various modifications and changes can be made to the above embodiments without departing from the scope of this application. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

Claims

1. A rectifying column applied to the production of chemicals required for semiconductor production, characterized by, include: The distillation column body is equipped with a packing layer to form a mass transfer zone for countercurrent gas-liquid contact; the bottom of the distillation column body has a feed inlet and the top has a reflux inlet; A packing support device, located below the packing layer, includes a base plate and multiple vertical cylinders spaced apart on the base plate. The base plate has a first vent hole, and the sidewalls of the vertical cylinders have second vent holes. At least a portion of the bottom of the vertical cylinders has the first vent hole. The total area of ​​the first vent hole and the second vent hole is greater than the surface area of ​​the base plate. The packing material is located within the packing layer; the bottom end of the packing material is at least partially in contact with the bottom plate or the vertical cylinder.

2. The rectification column according to claim 1, characterized in that The first vent is a waist-shaped vent.

3. The rectification column according to claim 2, characterized in that The ratio of the major axis length to the minor axis length of the waist-shaped hole is between 3:1 and 5:

1.

4. The rectification column of claim 1, wherein The second vent is a rectangular hole.

5. The rectification column of claim 1, wherein The second vent is a circular hole.

6. The rectification column of claim 1, wherein The second vent is an inclined hole that is opened at an upward angle of 15°–30° to guide the airflow upward.

7. The rectification column of claim 1, wherein The top of the distillation column is equipped with an elastic floating pressure ring to prevent packing displacement or bridging.

8. Distillation column according to any one of claims 1 to 7, characterized in that Both the base plate and the vertical cylinder have an electrochemical plating layer on their surfaces.

9. The distillation column according to any one of claims 1-7, characterized in that, The filler is a metal spring.

10. Distillation column according to any one of claims 1 to 7, characterized in that The distillation column further includes a liquid distribution layer, which includes a reflux liquid phase distributor; the outlet of the reflux liquid phase distributor is above the packing layer.

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