A nano-silver conductive adhesive coating head structure

Abstract

This utility model discloses a nano-silver conductive adhesive coating head structure, including an upper mold, a lower mold on one side of the upper mold, an installation groove inside the lower mold, a material storage cavity inside the installation groove, a positioning post connected to one side of the material storage cavity, a positioning groove on the lower mold, the positioning post matching the positioning groove, a fixing flange on one side of the material storage cavity, the fixing flange being connected to the lower mold by a first bolt, a material inlet channel on one side of the lower mold, a material inlet connected to one side of the material inlet, and a static mixing component connected to one side of the material inlet. This utility model, by setting a detachable material storage cavity, allows the entire material storage cavity to be removed by simply unscrewing the first bolt when the adhesive formula needs to be changed or routine maintenance is required, for offline ultrasonic cleaning or physical scraping. This solves the problems of many dead corners and easy residue curing in traditional integrated flow channel cleaning. Furthermore, multiple material storage cavities can be prepared in advance for nano-silver adhesives of different viscosities or formulas, allowing for direct replacement of the material storage cavity during production changeovers.

Description

Technical Field

[0001] This utility model relates to the field of coating equipment technology, and more specifically, to a nano-silver conductive adhesive coating head structure. Background Technology

[0002] Nano-silver conductive adhesive is widely used in high-tech fields such as printed electronics, touch screens, solar cells, and radio frequency identification (RFID) antennas due to its excellent conductivity, flexibility, and oxidation resistance. Especially in the manufacturing of flexible electronic devices, the uniform coating of nano-silver conductive adhesive onto a substrate to form conductive lines or thin films is one of the key technologies for achieving high-performance, low-cost production. In the coating process of nano-silver conductive adhesive, the coating head (also known as the die head) is its core component. A common coating head structure typically includes an upper die, a lower die, and a gasket sandwiched between them, all three fastened together with bolts. An internal flow channel is formed between the upper and lower dies; one end of this channel connects to the inlet, and the other end leads to the outlet slit formed by the upper die, lower die, and gasket.

[0003] In existing technologies, the material cavity and the lower mold are integrated, and cleaning can only rely on online solvent rinsing. For cured adhesive blocks, the solvent has difficulty penetrating, often requiring long-term soaking or even disassembly of the entire mold head, which is extremely inefficient. Furthermore, the geometry (volume, flow channel shape) of the integrated material storage cavity is fixed and cannot adapt to the optimal rheological requirements of different slurries. Changing the slurry means that the entire mold head needs to be replaced, which is costly and time-consuming. Utility Model Content

[0004] In view of the problems in the related technologies, this utility model proposes a nano-silver conductive adhesive coating head structure to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] Therefore, the specific technical solution adopted by this utility model is as follows: A nano-silver conductive adhesive coating head structure includes an upper mold, a lower mold on one side of the upper mold, an installation groove inside the lower mold, a material storage cavity inside the installation groove, a positioning post connected to one side of the material storage cavity, a positioning groove on the lower mold, the positioning post matching the positioning groove, a fixing flange on one side of the material storage cavity, the fixing flange being connected to the lower mold by a first bolt, a material inlet channel on one side of the lower mold, a material inlet connected to one side of the material inlet, and a static mixing component connected to one side of the material inlet.

[0006] Furthermore, the static mixing assembly includes a mixing sleeve, inside which multiple metal etched sheets are installed, with the flow channel patterns of adjacent metal etched sheets arranged at 90° orthogonal.

[0007] Furthermore, the hybrid sleeve connection has a connection interface.

[0008] Furthermore, a gasket is provided between the upper and lower molds.

[0009] Furthermore, the upper mold and the lower mold are connected by a second bolt.

[0010] Furthermore, a feed hole is provided on one side of the storage chamber, and the feed hole is connected to the feed channel.

[0011] Furthermore, a handle is attached to one side of the fixed flange.

[0012] The beneficial effects of this utility model are as follows: By setting up a detachable storage chamber, when it is necessary to change the adhesive formula or perform routine maintenance, the entire storage chamber can be removed by simply unscrewing the first bolt for offline ultrasonic cleaning or physical scraping. This solves the problems of many dead corners and easy residue solidification in traditional integrated flow channel cleaning. Furthermore, multiple storage chambers can be prepared in advance for nano silver adhesives of different viscosities or formulas. When switching production, the storage chamber can be directly replaced without long-term downtime for cleaning and replacement, which significantly improves production efficiency.

[0013] By incorporating a static mixing component with multiple layers of etched metal sheets, the nano-silver conductive adhesive undergoes repeated segmentation, rotation, and recombination as it flows through, generating a strong shearing effect. This design effectively breaks up the agglomeration of nano-silver particles, ensuring extremely high microscopic uniformity of the adhesive before it enters the coating lip. This significantly improves the conductivity consistency of the coated film and avoids quality defects such as broken lines, short circuits, or resistance fluctuations caused by particle agglomeration. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a front view of a nano-silver conductive adhesive coating head structure according to an embodiment of the present utility model; Figure 2 This is a split view of a nano-silver conductive adhesive coating head structure according to an embodiment of the present invention; Figure 3 This is a diagram of the lower mold structure of a nano-silver conductive adhesive coating head according to an embodiment of the present invention; Figure 4 This is a structural diagram of a nano-silver conductive adhesive coating head structure and a storage cavity according to an embodiment of the present invention; Figure 5This is a static mixing component structure diagram of a nano-silver conductive adhesive coating head structure according to an embodiment of the present utility model.

[0016] In the picture: 1. Upper mold; 2. Lower mold; 3. Mounting groove; 4. Storage cavity; 5. Positioning pin; 6. Positioning groove; 7. Fixing flange; 8. First bolt; 9. Feed channel; 10. Feed port; 11. Static mixing component; 1101. Mixing sleeve; 1102. Metal etched sheet; 12. Connection interface; 13. Gasket; 14. Second bolt; 15. Feed hole; 16. Handle. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] According to an embodiment of the present invention, a nano-silver conductive adhesive coating head structure is provided.

[0019] Example 1 like Figures 1-4 As shown, the nano-silver conductive adhesive coating head structure according to an embodiment of this utility model includes an upper mold 1, a lower mold 2 on one side of the upper mold 1, a gasket 13 between the upper mold 1 and the lower mold 2, and the upper mold 1 and the lower mold 2 are axially locked together by multiple sets of evenly distributed second bolts 14. The gasket 13 has through holes, the position, diameter and number of which strictly correspond to the bolt mounting holes on the mold body. The lower mold 2 has an installation groove 3 inside, and a material storage cavity 4 is installed inside the installation groove 3. A positioning post 5 is connected to one side of the material storage cavity 4. The lower mold 2 has a positioning groove 6, and the positioning post 5 matches the positioning groove 6. When the storage cavity 4 is pushed into the mounting groove 3, the positioning column 5 automatically slides into the positioning groove 6. Utilizing the radial constraint generated by the column-groove fit, the coaxial alignment of the storage cavity 4 and the material inlet channel of the lower mold 2 is instantly completed, eliminating the angular deviation of manual assembly and ensuring the smoothness of the flow channel connection. A fixed flange 7 is provided on one side of the storage cavity 4. The fixed flange 7 is connected to the lower mold 2 by the first bolt 8. A handle 16 is connected to one side of the fixed flange 7. By setting the handle 16, the operator can easily grasp and lift the storage cavity 4 without the need for additional tools when cleaning or changing the type of adhesive.

[0020] like Figures 1-5As shown, a feeding channel 9 is provided on one side of the lower mold 2, and a feeding port 10 is connected to one side of the feeding channel 9. A feeding hole 15 is provided on one side of the storage cavity 4, and the feeding hole 15 is connected to the feeding channel 9. When the storage cavity 4 is installed in place, the feeding hole 15 is precisely connected to the feeding channel 9 of the lower mold 2, forming a continuous fluid path. A static mixing component 11 is connected to one side of the feeding port 10. The static mixing component 11 includes a mixing sleeve 1101, and multiple metal etched sheets 1102 are installed inside the mixing sleeve 1101. The flow channel patterns of two adjacent metal etched sheets 1102 are orthogonally arranged at 90°. The outer circumference is integrally formed with radial positioning lugs. The inner wall of the mixing sleeve 1101 is provided with a limiting groove along the axial direction that matches the positioning lugs, so that each layer of metal etched sheet 1102 is automatically locked at a preset angle after being inserted. An axial clamping cap is screwed to the feed end of the mixing sleeve 1101. The bottom surface of the axial clamping cap abuts against the upper surface of the uppermost metal etched sheet 1102, and an axial pre-tightening force is generated by rotating and tightening, so that each layer of metal etched sheet 1102 fits tightly to eliminate interlayer gaps. A connection interface 12 is connected to one side of the mixing sleeve 1101 to facilitate a quick and sealed connection with the upstream feeding pipeline.

[0021] To facilitate understanding of the above-mentioned technical solutions of this utility model, the working principle or operation method of this utility model in actual process will be described in detail below.

[0022] In summary, with the help of the above-mentioned technical solution of this utility model, after the feed pump is started, the nano-silver conductive adhesive enters the connection interface 12 through the external pipeline and then flows into the static mixing component 11. When the adhesive flows through the mixing sleeve 1101, it is forced to pass through the stacked metal etched sheets 1102. This process can effectively break the physical agglomeration of nano-silver particles, so that the adhesive can achieve a high degree of uniformity at the microscopic level within a very short stroke, thus solving the coating defects caused by uneven dispersion from the source. The fully homogenized adhesive enters the storage chamber 4 through the feed channel 9 for buffering and pressure stabilization, and is then distributed into the precision flow channel formed by the closed upper mold 1 and lower mold 2. Finally, it is uniformly extruded from the coating lip and coated on the surface of the substrate.

[0023] When a new batch of production is required or a different formulation of nano-silver conductive adhesive needs to be changed, the operator first loosens the first bolt 8 that secures the storage cavity 4. Holding the handle 16, the old storage cavity 4 can be easily lifted vertically from the mounting groove 3 of the lower mold 2. Then, the pre-cleaned or newly filled storage cavity 4 is pushed into the mounting groove 3. During this process, the positioning pins 5 on the side wall of the storage cavity 4 slide into the corresponding positioning grooves 6 of the lower mold 2, instantly achieving high-precision coaxial alignment between the inlet hole 15 of the storage cavity 4 and the inlet channel 9 of the lower mold 2. This self-aligning design completely eliminates angular deviations that may occur with manual visual alignment, ensuring seamless fluid path connection. After confirming the position is correct, tightening the first bolt 8 completes the fixing of the storage cavity 4.

[0024] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A nano-silver conductive adhesive coating head structure, characterized in that, The upper mold (1) is provided with a lower mold (2) on one side. The lower mold (2) is provided with an installation groove (3) inside. A storage cavity (4) is installed inside the installation groove (3). A positioning column (5) is connected to one side of the storage cavity (4). A positioning groove (6) is provided on the lower mold (2). The positioning column (5) matches the positioning groove (6). A fixing flange (7) is provided on one side of the storage cavity (4). The fixing flange (7) is connected to the lower mold (2) by a first bolt (8). A feeding channel (9) is provided on one side of the lower mold (2). A feeding port (10) is connected to one side of the feeding channel (9). A static mixing component (11) is connected to one side of the feeding port (10).

2. The silver nanowire conductive adhesive coating head structure of claim 1, wherein, The static mixing assembly (11) includes a mixing sleeve (1101), and a plurality of metal etched sheets (1102) are installed inside the mixing sleeve (1101). The flow channel patterns of two adjacent metal etched sheets (1102) are orthogonally arranged at 90°.

3. The silver nanowire conductive adhesive coating head structure of claim 2, wherein, The mixing sleeve (1101) is connected to a connection interface (12).

4. The silver nanowire conductive adhesive coating head structure of claim 1, wherein, A gasket (13) is provided between the upper mold (1) and the lower mold (2).

5. The silver nanowire conductive adhesive coating head structure of claim 1, wherein, The upper mold (1) and the lower mold (2) are connected by a second bolt (14).

6. The silver nanowire conductive adhesive coating head structure of claim 1, wherein, The storage chamber (4) has an inlet hole (15) on one side, and the inlet hole (15) is connected to the inlet channel (9).

7. The silver nanowire conductive adhesive coating head structure of claim 1, wherein, A handle (16) is connected to one side of the fixed flange (7).

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