A high-power ultrasonic transducer with constant temperature control

Abstract

This utility model relates to the field of ultrasonic transducer technology and discloses a high-power ultrasonic transducer with constant temperature control. It includes an outer cylinder and an inner cylinder. The top of the inner cylinder has an upper flange, dividing the outer cylinder into a lower cooling chamber and an upper heat dissipation chamber. A semiconductor cooling device is installed inside the heat dissipation chamber, while a high-power ultrasonic transducer, a temperature sensor, and a convection fan are installed inside the cooling chamber. The semiconductor cooling device lowers the temperature inside the cooling chamber, while the convection fan generates airflow to accelerate cooling. The temperature sensor detects the temperature inside the cooling chamber, and the cooling power of the semiconductor cooling device is controlled according to the temperature to achieve constant temperature control. This utility model provides a high-power ultrasonic transducer with controllable temperature, significant cooling effect, simple structure, and ease of mass production and installation. The inner and outer cylinder structure, combined with semiconductor cooling and active convection cooling, achieves efficient and precise closed-loop constant temperature control.

Description

Technical Field

[0001] This utility model belongs to the field of ultrasonic transducer technology, specifically relating to a high-power ultrasonic transducer with constant temperature control. Background Technology

[0002] Ultrasonic technology has been widely applied in various industrial production processes, such as industrial cleaning, metal welding, food production, and scale prevention and removal. An ultrasonic generator converts mains power (e.g., 220V / 380V, 50 / 60Hz) into a high-frequency AC signal that matches the ultrasonic transducer, driving the transducer to operate. The ultrasonic transducer is a key component of the ultrasonic system, and piezoelectric ceramics are the core device for converting electrical energy into mechanical energy. The piezoelectric ceramics convert high-frequency electrical energy into mechanical vibration, which is then transmitted to the workpiece through an amplitude transformer.

[0003] However, high-power ultrasonic transducers present the following problems in use: Due to energy losses during electro-mechanical energy conversion, these losses accumulate as heat on the piezoelectric ceramic. Therefore, the temperature of the piezoelectric ceramic rises during operation, causing frequency drift between the ceramic and the mold, affecting ultrasonic energy transfer efficiency. When the temperature exceeds the Curie temperature of the piezoelectric ceramic material, performance degradation or inability to operate normally for extended periods will occur, potentially even damaging the ceramic. In applications such as descaling and scale prevention, high-power ultrasonic transducers require continuous operation, causing the piezoelectric ceramic to continuously heat up. Since industrial ambient temperatures are generally high, exceeding 40°C in summer, and natural cooling or conventional air cooling is temperature-dependent, it's difficult to effectively control the piezoelectric ceramic temperature at high ambient temperatures, limiting the application scenarios of piezoelectric ceramic transducers.

[0004] Therefore, those skilled in the art are dedicated to developing a high-power ultrasonic transducer with an efficient cooling system. Chinese Patent Application No. 201110226180.1, entitled "High-power ultrasonic transducer with heat pipe cooling device," discloses a high-power ultrasonic transducer with a heat pipe cooling device. It utilizes the high thermal conductivity of the heat pipe element to cool and dissipate heat from the high-power ultrasonic transducer. However, the middle section of this device requires a certain slope, which places high demands on the installation process and makes it unsuitable for large-scale applications.

[0005] Chinese Patent Application No. 201821804364.5, entitled "A Water Circulation Cooling Device for a High-Power Ultrasonic Transducer," discloses a water circulation cooling device for a high-power ultrasonic transducer. This device utilizes a semiconductor cooling chip as the heat dissipation component for the ultrasonic transducer, and then conducts heat to a sealed water tank for cooling. However, this design uses bolts to connect the semiconductor cooling chip and the transducer, only cooling the end of the ultrasonic transducer. The piezoelectric ceramic is not effectively cooled, resulting in uncontrollable cooling performance and unsuitability for high-temperature environments.

[0006] Chinese Patent Application No. 201320080184.8, entitled "Water-cooled High-Power Ultrasonic Transducer," discloses a high-power water-cooled ultrasonic transducer. In this device, a piezoelectric ceramic is installed inside a sealed inner cylinder filled with a thermally conductive agent. Cooling water is used to dissipate heat from the outside of the inner cylinder, thus indirectly cooling the piezoelectric ceramic. This device requires filling the inner cylinder with a liquid thermally conductive agent and also needs to install an external water-cooling heat dissipation component, making its structure relatively complex and unsuitable for large-scale mass production and installation. Utility Model Content

[0007] The technical problem to be solved by this utility model is to provide a high-power ultrasonic transducer with constant temperature control that is simple in structure and easy to use.

[0008] To solve the above-mentioned technical problems, this utility model provides a high-power ultrasonic transducer with constant temperature control, including: an outer cylinder and an inner cylinder. The lower part of the inner wall of the outer cylinder is provided with a retaining spring, the lower end of the inner cylinder abuts against the retaining spring, and the top of the inner cylinder is provided with an upper flange. The small end of the lower part of the upper flange is clamped to the inner cylinder, and the large end of the upper part is clamped to the outer cylinder, dividing the inner cavity of the outer cylinder into a lower cooling chamber and an upper heat dissipation chamber.

[0009] The heat dissipation chamber is equipped with a semiconductor cooling device and a control circuit board. The semiconductor cooling device includes a semiconductor cooling chip, heat dissipation fins and a heat dissipation fan arranged sequentially from bottom to top. The semiconductor cooling chip is fixedly connected to the upper flange, with the cold side in contact with the upper surface of the upper flange and the hot side in contact with the heat dissipation fins. The control circuit board is fixedly connected to the upper flange.

[0010] The cooling chamber is equipped with a high-power ultrasonic transducer, a temperature sensor and a convection fan. The convection fan is fixedly connected to the lower surface of the upper flange, and the high-power ultrasonic transducer is connected to the outer cylinder through the lower flange.

[0011] A control chip is mounted on the control circuit board, and the control chip is connected to the convection fan, the semiconductor cooling chip, the heat dissipation fan, and the temperature sensor respectively.

[0012] As an improvement to the present invention, a high-power ultrasonic transducer with constant temperature control:

[0013] The high-power ultrasonic transducer includes, from top to bottom, a pre-tightening nut, a rear cover plate, a piezoelectric ceramic sheet, a front cover plate, and an amplitude transformer. Electrode plates are provided between the piezoelectric ceramic sheets. The rear cover plate and the pre-tightening nut, as well as the front cover plate and the amplitude transformer, are connected by pre-tightening bolts to clamp and compress the piezoelectric ceramic sheets.

[0014] As a further improvement to the present invention, a high-power ultrasonic transducer with constant temperature control:

[0015] The amplitude transformer is spindle-shaped, with a raised ring in the middle forming a flange edge; the lower flange is fitted over the flange edge, and the flange edge and the lower flange are sealed by an upper rubber gasket and a lower rubber gasket.

[0016] As a further improvement to the present invention, a high-power ultrasonic transducer with constant temperature control:

[0017] The lower end of the outer cylinder is connected to the lower flange by a thread;

[0018] The outer cylinder has a top cover at the upper opening, which is connected to the outer cylinder by threads. The top cover has an air inlet. The outer cylinder has a heat dissipation outlet on its side wall, which is close to the top of the outer cylinder.

[0019] As a further improvement to the present invention, a high-power ultrasonic transducer with constant temperature control:

[0020] The temperature sensor is attached to the side of the piezoelectric ceramic sheet;

[0021] The cooling fan is installed above the cooling fins and is fixedly connected to the top cover.

[0022] As a further improvement to the present invention, a high-power ultrasonic transducer with constant temperature control:

[0023] An aviation plug is provided on the upper side wall of the outer cylinder, and the aviation plug is fixedly connected to the outer cylinder. The electrode plate is electrically connected to the aviation plug.

[0024] The beneficial effects of this utility model are mainly reflected in:

[0025] This utility model provides a high-power ultrasonic transducer with controllable temperature, significant cooling effect, simple structure, and easy mass production and installation. The inner and outer cylinder structure combines semiconductor cooling chips and active convection air cooling to achieve efficient and precise closed constant temperature control, avoiding the problems of existing high-power ultrasonic transducers that rely on natural heat dissipation or external air cooling, resulting in low heat dissipation efficiency and inaccurate thermal control.

[0026] This invention places key heat-generating components such as the amplitude transformer and piezoelectric ceramic sheet in a closed cooling chamber, and achieves airtight packaging through upper and lower flanges and rubber gaskets to prevent moisture and dust from entering and improve system stability.

[0027] This invention employs a multi-level thermal management system, utilizing the coordinated management of semiconductor refrigeration, heat dissipation fins, and dual fans. It features fast temperature control response, high cooling efficiency, and is suitable for long-term high-power operating environments. Attached Figure Description

[0028] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0029] Figure 1 This is a schematic diagram of the external structure of a high-power ultrasonic transducer with constant temperature control according to this utility model.

[0030] Figure 2 This is a schematic diagram of a high-power ultrasonic transducer.

[0031] Figure 3 for Figure 1 A schematic diagram of its vertical cross-section;

[0032] Figure 4 for Figure 1 Top view of the top cover. Detailed Implementation

[0033] The present invention will be further described below with reference to specific embodiments, but the scope of protection of the present invention is not limited thereto:

[0034] Example 1: A high-power ultrasonic transducer with constant temperature control, such as... Figure 1-4 As shown, a closed cooling chamber is constructed for the heat-generating device of the transducer. A semiconductor refrigeration device is used to reduce the temperature inside the cooling chamber. At the same time, a convection fan generates airflow to accelerate the cooling of the heat-generating device. A temperature sensor detects the temperature inside the cooling chamber, and the cooling power of the semiconductor refrigeration device is controlled according to the temperature to achieve constant temperature control.

[0035] A high-power ultrasonic transducer with constant temperature control mainly consists of a high-power ultrasonic transducer 1 and a constant temperature control component 2. In this embodiment, the high-power ultrasonic transducer 1 has a typical resonant frequency of 20kHz and a maximum power of 2600W. It is a commercially available finished product with customized dimensions, such as... Figure 2 As shown, the high-power ultrasonic transducer 1 includes a pre-tightening nut 108, a rear cover plate 101, a piezoelectric ceramic plate 102, a front cover plate 103, and an amplitude transformer 104 arranged sequentially from top to bottom.

[0036] There are six piezoelectric ceramic sheets 102 in total, stacked tightly one on top of the other. Electrode sheets 105 are placed between adjacent piezoelectric ceramic sheets. Temperature sensors 209 are also attached to the sides of the piezoelectric ceramic sheets 102 to detect their temperature. The temperature sensor 209 is made of PTC material, which has the characteristic that its resistance increases sharply when the temperature rises, enabling it to effectively detect and control the temperature, especially in applications requiring fast response and high-precision measurement.

[0037] The rear cover plate 101 is above the piezoelectric ceramic sheet 102, and the front cover plate 103 is below the piezoelectric ceramic sheet 102. They cooperate to clamp and press the piezoelectric ceramic sheet 102. The rear cover plate 101 and the pre-tightening nut 108, and the front cover plate 103 and the amplitude rod 104 are connected by pre-tightening bolts 106. The piezoelectric ceramic sheet 102 is pressed by adjusting the tightness of the pre-tightening nut 108.

[0038] The amplitude transformer 104 is spindle-shaped, thicker in the middle and slightly thinner at both ends, and is used to change the amplitude and transmit ultrasonic energy. A flange 107 with a boss in the middle of the amplitude transformer 104 (the flange 107 and the amplitude transformer 104 are a whole) is provided for connection with the constant temperature control component 2.

[0039] The temperature control assembly 2 includes an outer cylinder 201 of the outer shell and an inner cylinder 202 of the inner shell. The inner cylinder 202 is fitted over the high-power ultrasonic generator 1. The outer cylinder 201 is fitted over the inner shell 202. Both the outer cylinder 201 and the inner cylinder 202 are open at their top and bottom ends, and the length of the inner cylinder 202 is shorter than that of the outer cylinder 201. A top cover 212 is provided at the top opening of the outer cylinder 201. The top cover 212 is threaded to the outer cylinder 201 and is used to seal the outer cylinder 201 after being screwed into the top opening. An air inlet 215 is provided on the top cover 212. Figure 4 As shown, it is used for intake control. A heat dissipation vent 216 is opened on the side wall of the outer cylinder 201, and the heat dissipation vent 216 is close to the top of the outer cylinder 201. An aviation plug 217 is provided on the upper side wall of the outer cylinder 201, and the aviation plug 217 is fixedly connected to the outer cylinder 201.

[0040] A lower flange 211 is installed on the amplitude rod 104 of the ultrasonic transducer 1. The outer cylinder 201 is connected to the amplitude rod 104 through the lower flange 211 to achieve fixation and sealing. Specifically, a rubber gasket is fitted on the upper and lower protrusions of the flange edge 107, namely the upper rubber gasket 213 and the lower rubber gasket 214. The lower flange 211 is inverted "T" shaped (i.e., the lower part is the large end and the upper part is the flange). The inner wall of the large end has a groove that matches the flange edge 107. The flange 211 is fitted under the flange edge 107 of the amplitude transformer 104 through the groove, and the lower flange 211 and the flange edge 107 are sealed by the upper rubber gasket 213 and the lower rubber gasket 214. The flange of the lower flange 211 is provided with external threads, and the lower opening of the outer cylinder 201 is provided with internal threads (the threads are located below the snap ring 218). After the outer cylinder 201 is fitted over the high-power ultrasonic generator 1, the lower end is fixed and sealed to the lower flange 211 by threaded connection. Thus, the rear cover plate 101, piezoelectric ceramic plate 102, front cover plate 103 and the upper part of the amplitude transformer 104 of the high-power ultrasonic generator 1 are all sealed in the inner cavity of the outer cylinder 201.

[0041] A retaining spring 218 is provided at the lower part of the inner wall of the outer cylinder 201. The retaining spring 218 abuts against the lower end of the inner cylinder 202 to limit the bottom of the inner cylinder 202. An upper flange 207 is provided at the top of the inner cylinder 202. The upper flange 207 is T-shaped, with the lower small end diameter having a negative tolerance fit with the inner diameter of the inner cylinder 202, and the upper large end diameter having a negative tolerance fit with the inner diameter of the outer cylinder 201. The lower part of the upper flange 207 is clamped to the inner cylinder 202, and the upper part is clamped to the outer cylinder 201, thus combining the ultrasonic transducer 1, lower flange 211, outer cylinder 201, inner cylinder 202, and upper flange 207 into a single unit. Simultaneously, the upper flange 207 secures the outer cylinder 201. The inner cavity is divided into two independent chambers, upper and lower. The lower chamber is a closed cooling chamber formed by the upper flange 207, inner cylinder 201, amplitude rod 104 and lower flange 211. The upper part of amplitude rod 104, six piezoelectric ceramic plates 102 and other key heat-generating components are placed in the closed cooling chamber. The upper flange 207, lower flange 211 and rubber gaskets achieve an airtight seal to prevent moisture and dust from entering. The upper chamber is a heat dissipation chamber formed by the upper flange 207, outer cylinder 201 and top cover 212.

[0042] The outer cylinder 201 is made of stainless steel, while the inner cylinder 202, upper flange 207, and lower flange 211 are made of aluminum. The amplitude transformer 104 is made of titanium alloy. Thermal insulation material is filled between the outer cylinder 201 and the inner cylinder 202.

[0043] This utility model employs a semiconductor cooling device installed inside the heat dissipation chamber to cool and reduce the temperature inside the chamber. Specifically, a semiconductor cooling chip 205 and a convection fan 206 are respectively installed on the upper and lower sides of the upper flange 207. The cold side of the semiconductor cooling chip 205 is attached to the upper surface of the upper flange 207 and fixedly connected to the upper flange 207. Thermal grease is applied in the middle (i.e., the semiconductor cooling chip 205 is inside the heat dissipation chamber).

[0044] After the thermoelectric cooler 205 is powered on, it cools the cooling chamber through direct heat conduction to the upper flange 207. The convection fan 206 is installed on the lower surface of the upper flange 207 (i.e., inside the cooling chamber) and is fixedly connected to the upper flange 207 by screws or other means. The convection fan 206 is a radial fan; after being powered on, it creates convection disturbances in the air within the cooling chamber, accelerating the temperature rise towards equilibrium.

[0045] A heat dissipation fin 203 and a cooling fan 204 are provided above the thermoelectric cooler 205. The heat dissipation fin 203 is attached to the hot side of the thermoelectric cooler 205 and fixedly connected to it, with thermal grease applied between them. The heat dissipation fin 203 conducts heat from the thermoelectric cooler 205 to the fin surface, increasing the heat dissipation area and facilitating further heat dissipation. The cooling fan 204 is installed above the heat dissipation fin 203 and fixedly connected to the top cover 212. It is a high-speed axial flow fan. After the cooling fan 204 is powered on, it draws in cool air from the outside through the air inlet 215 and simultaneously exhausts the hot air generated by the heat dissipation fin 203 to the outside through the heat dissipation outlet 216, thus accelerating the cooling of the surface of the heat dissipation fin 203. After the top cover 212 is tightened, the cooling fan 204, heat dissipation fin 203, and thermoelectric cooler 205 are in close contact in the height direction and are held in place by the upper flange 207, enhancing the heat conduction effect.

[0046] Inside the heat dissipation chamber, a control circuit board 208 and a terminal block 210 are also provided on the upper flange 207. The aviation plug 217, electrode plate 105, and control circuit board 208 are all electrically connected to the terminal block 210. The wiring of electrode plate 105 and control circuit board 208 is all connected to the terminal block 210, and then transferred from the terminal block 210 to the aviation plug 217. The aviation plug 217 is connected to the external ultrasonic generator equipment.

[0047] The control circuit board 208 and the terminal block 210 are located on both sides of the thermoelectric cooler 205, close to the outer cylinder 201, and are fixedly connected to the upper flange 207. A control chip is mounted on the control circuit board 208. For example, the control chip can be an STM32 microcontroller. The STM32 microcontroller is connected to the convection fan 206, the thermoelectric cooler 205, the cooling fan 204, and the temperature sensor 209 respectively, and is used to control the start and stop of the convection fan 206, the thermoelectric cooler 205, and the cooling fan 204, and to receive real-time temperature data from the temperature sensor 209. The control of the motor by the STM32 microcontroller is an existing technology, for example, "Sang Yong, Li Fengtao, Dai Yuebang, Duan Fuhai, Wang Yajie. Design of STM32 microcontroller control system for servo motors [J]. Mechanical and Electrical Engineering Technology, 2015, 44(11):65-72". The STM32 microcontroller controls the working state of the thermoelectric cooler 205 based on the temperature detected by the temperature sensor 209, and finally controls the temperature within the preset range to achieve constant temperature control.

[0048] In this embodiment, the working process of a high-power ultrasonic transducer with constant temperature control is as follows:

[0049] Aviation connector 217 connects to an external ultrasonic generator, inputting a high-frequency AC signal generated by the generator. After the high-power ultrasonic transducer 1 starts operating, the piezoelectric ceramic plate 102 begins to vibrate, and its temperature rises. Temperature sensor 209 detects the temperature of the piezoelectric ceramic plate 102 and sends the temperature signal to the STM32 microcontroller. The STM32 microcontroller performs the following control based on the temperature signal:

[0050] When the detected temperature is higher than the set temperature, the operating current of the control thermoelectric cooler 205 increases, thereby increasing the power of the thermoelectric cooler 205. The temperature of the cold surface of the thermoelectric cooler 205 decreases, and consequently, the temperatures of the upper flange 207 and the inner cylinder 202 decrease, leading to a drop in the air temperature inside the cooling chamber. The convection fan 206 starts working, accelerating the heat exchange between the piezoelectric ceramic plate 102 and the low-temperature air, further reducing the temperature of the piezoelectric ceramic plate 102. When the detected temperature is lower than the set temperature, the operating current of the control thermoelectric cooler 205 decreases, thereby decreasing the power of the thermoelectric cooler 205. The temperature of the cold surface of the thermoelectric cooler 205 rises, and consequently, the temperatures of the upper flange 207 and the inner cylinder 202 rise, leading to an increase in the air temperature inside the cooling chamber. Ultimately, the temperature of the piezoelectric ceramic plate 102 is maintained within a constant temperature range. In this embodiment, the constant temperature range of the piezoelectric ceramic plate 102 is 27±3℃.

[0051] The cooling fan 204 dissipates heat from the heat sink 203. The speed of the cooling fan 204 is controlled by an STM32 microcontroller. The control logic is: low speed when the temperature is low and high speed when the temperature is high.

[0052] Finally, it should be noted that the above examples are merely a few specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments and many variations are possible. All variations that can be directly derived or conceived by those skilled in the art from the disclosure of this utility model should be considered within the protection scope of this utility model.

Claims

1. A thermostatically controlled high power ultrasonic transducer, characterized by: It includes an outer cylinder (201) and an inner cylinder (202). The lower part of the inner wall of the outer cylinder (201) is provided with a retaining ring (218). The lower end of the inner cylinder (202) abuts against the retaining ring (218). The top of the inner cylinder (202) is provided with an upper flange (207). The small end of the lower part of the upper flange (207) is clamped to the inner cylinder (202), and the large end of the upper part is clamped to the outer cylinder (201), dividing the inner cavity of the outer cylinder (201) into a lower cooling chamber and an upper heat dissipation chamber. The heat dissipation chamber is equipped with a semiconductor cooling device and a control circuit board (208). The semiconductor cooling device includes a semiconductor cooling chip (205), heat dissipation fins (203), and a heat dissipation fan (204) arranged sequentially from bottom to top. The semiconductor cooling chip (205) is fixedly connected to the upper flange (207), with the cold side in contact with the upper surface of the upper flange (207) and the hot side in contact with the heat dissipation fins (203). The control circuit board (208) is fixedly connected to the upper flange (207). The cooling chamber is equipped with a high-power ultrasonic transducer (1), a temperature sensor (209) and a convection fan (206). The convection fan (206) is fixedly connected to the lower surface of the upper flange (207). The high-power ultrasonic transducer (1) is connected to the outer cylinder (201) through the lower flange (211). A control chip is mounted on the control circuit board (208), and the control chip is connected to the convection fan (206), the semiconductor cooling chip (205), the heat dissipation fan (204), and the temperature sensor (209) respectively.

2. The high-power ultrasonic transducer with constant temperature control according to claim 1, characterized in that: The high-power ultrasonic transducer (1) includes a pre-tightening nut (108), a rear cover plate (101), a piezoelectric ceramic sheet (102), a front cover plate (103), and an amplitude transformer (104) arranged sequentially from top to bottom. Electrode plates (105) are provided between the piezoelectric ceramic sheets. The rear cover plate (101) and the pre-tightening nut (108), and the front cover plate (103) and the amplitude transformer (104) are connected by pre-tightening bolts (106) to clamp and press the piezoelectric ceramic sheet (102).

3. A high-power ultrasonic transducer with constant temperature control according to claim 2, characterized in that: The amplitude rod (104) is spindle-shaped, and a flange edge (107) is provided in the middle of the spindle shape; the lower flange (211) is fitted outside the flange edge (107), and the flange edge (107) and the lower flange (211) are sealed by the upper rubber gasket (213) and the lower rubber gasket (214).

4. A high-power ultrasonic transducer with constant temperature control according to claim 3, characterized in that: The lower end of the outer cylinder (201) is connected to the lower flange (211) by a thread; The outer cylinder (201) has a top cover (212) at the upper opening. The top cover (212) is connected to the outer cylinder (201) by a thread. The top cover (212) has an air inlet (215). The outer cylinder (201) has a heat dissipation outlet (216) on its side wall. The heat dissipation outlet (216) is close to the top of the outer cylinder (201).

5. A high-power ultrasonic transducer with constant temperature control according to claim 4, characterized in that: The temperature sensor (209) is attached to the side of the piezoelectric ceramic sheet (102); The cooling fan (204) is installed above the cooling fins (203) and is fixedly connected to the top cover (212).

6. A high-power ultrasonic transducer with constant temperature control according to claim 5, characterized in that: An aviation plug (217) is provided on the upper side wall of the outer cylinder (201). The aviation plug (217) is fixedly connected to the outer cylinder (201), and the electrode plate (105) is electrically connected to the aviation plug (217).

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