Single-crystal silicon wafer surface cleaning device

Abstract

This utility model relates to the field of cleaning device technology, and more particularly to a surface cleaning device for monocrystalline silicon wafers, comprising: a cleaning chamber; a storage tank fixedly connected to the outer wall of the cleaning chamber; a mounting frame fixedly connected to the top of one side of the cleaning chamber; a linear motor fixedly connected to the mounting frame; two connecting blocks, respectively fixedly mounted on the stator end of the linear motor and slidably mounted on the top of the other side of the cleaning chamber; a spray pipe fixedly connected between the two connecting blocks; a connecting pipe fixedly connected and communicating with the storage tank and the spray pipe; a placement plate provided inside the cleaning chamber; and a material tray detachably fixedly connected to the placement plate. This utility model uses a linear motor to drive the spray pipe in reciprocating motion, combined with a rotary motor to drive the silicon wafer in reciprocating oscillation, to achieve dynamic changes in the cleaning liquid spray angle and the silicon wafer's orientation, thereby solving the blind spot problem caused by fixed-angle cleaning and improving the cleaning uniformity and contaminant removal rate of this utility model.

Description

Technical Field

[0001] This utility model relates to the field of cleaning device technology, and in particular to a device for cleaning the surface of monocrystalline silicon wafers. Background Technology

[0002] After the manufacturing processes of single-crystal silicon wafers, such as cutting, grinding, and polishing, various contaminants remain on their surface, including fine particles, metal ions, and organic residues. If these contaminants are not thoroughly removed, they can lead to problems such as short circuits, increased leakage current, and oxide layer defects, reducing the reliability and yield of electronic devices. Therefore, silicon wafer cleaning is a critical step in the processing of single-crystal silicon wafers.

[0003] Currently, mainstream wet cleaning technologies typically use a cleaning solution composed of various chemical agents to treat the surface of silicon wafers, followed by rinsing with deionized water to remove chemical residues and contaminants that have been dissolved or stripped away.

[0004] Most existing cleaning devices use fixed-angle nozzle arrays, which limits the impact force and coverage of water flow on the silicon wafer surface, resulting in rinsing blind spots and uneven and incomplete cleaning effects. Furthermore, the rinsing efficiency of the silicon wafer edge area is often lower than that of the central area due to water splashing and scattering, and the fixed rinsing angle is difficult to compensate for and optimize. Utility Model Content

[0005] This invention addresses the shortcomings of the prior art by providing a single-crystal silicon wafer surface cleaning device that can optimize the rinsing flow field, thereby achieving more comprehensive and efficient cleaning.

[0006] The technical solution of this utility model is: a single-crystal silicon wafer surface cleaning device, comprising: a cleaning chamber with a drain outlet at the bottom; a storage tank for storing cleaning liquid, fixedly connected to the outer wall of the cleaning chamber; a mounting frame, fixedly connected to the top of one side of the cleaning chamber; a linear motor, fixedly connected to the mounting frame; two connecting blocks, respectively fixedly installed on the stator end of the linear motor and slidably installed on the top of the other side of the cleaning chamber; a spray pipe, fixedly connected between the two connecting blocks, with its nozzle facing downwards, and a pump body inside for conveying the cleaning liquid in the storage tank to the spray pipe for spraying out from the nozzle; a connecting pipe, fixedly connected and communicating between the storage tank and the spray pipe, which can adaptively change with the displacement of the spray pipe; a placement plate, provided inside the cleaning chamber; and a tray, with a tray for holding silicon wafers to be cleaned detachably fixedly connected to the placement plate.

[0007] Preferably, the placement plate is rotatably connected to the cleaning chamber, and the device further includes a rotary motor, which is fixedly connected to the cleaning chamber, and the output end of the rotary motor is coaxially fixed with the rotation shaft of the placement plate.

[0008] Preferably, the device further includes: a fixing frame, which is fixedly connected to the top of the side wall of the cleaning chamber, and the fixing frame is on the same side as the storage tank; and a limiting block, which is slidably connected to the fixing frame, and the connecting pipe is fixed thereto.

[0009] Preferably, the placement plate has a built-in magnetic surface, and the tray is magnetically attracted to the magnetic surface.

[0010] Preferably, the edge of the placement plate has a water filter for guiding the cleaning fluid.

[0011] Preferably, the edge of the placement plate is provided with grooves to provide space for removing the tray.

[0012] The beneficial effects of this invention are as follows: This invention uses a linear motor to drive the spray pipe in reciprocating motion, combined with a rotary motor to drive the silicon wafer in reciprocating oscillation, to achieve dynamic changes in the cleaning fluid spray angle and the silicon wafer's orientation. This solves the blind spot problem caused by fixed-angle cleaning, thereby improving the cleaning uniformity and dirt removal rate of this invention. This invention uses a soft connecting pipe and a limiting block to ensure the freedom of movement of the spray pipe while avoiding pipe interference. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram showing the position and structure of the spray pipe and material tray of this utility model.

[0015] Figure 3 This is a structural separation diagram of the placement plate, magnetic surface, and material tray of this utility model.

[0016] Explanation of reference numerals in the attached drawings: 1_cleaning chamber, 2_storage box, 3_mounting bracket, 4_linear motor, 5_connecting block, 6_spray pipe, 7_connecting pipe, 8_placement plate, 9_rotary motor, 10_material tray, 11_fixed bracket, 12_limiting block, 13_magnetic surface, 14_water filter, 15_groove. Detailed Implementation

[0017] The following description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention.

[0018] Example: A single-crystal silicon wafer surface cleaning device, such as... Figures 1-3As shown, it includes: a cleaning chamber 1, in which silicon wafers undergo a cleaning process, and a drain outlet at the bottom for draining liquid, which can be controlled to be closed; a storage tank 2, which is fixedly installed on the outer wall of the cleaning chamber 1 to store cleaning liquid; a mounting frame 3, which is fixedly installed on the top of one side of the cleaning chamber 1; a linear motor 4, which is fixedly installed on the mounting frame 3; two connecting blocks 5, which are respectively fixedly installed on the stator end of the linear motor 4 and slidably installed on the top of the other side of the cleaning chamber 1; and a spray pipe 6, which is fixedly installed between the two connecting blocks 5, with its nozzle facing... The cleaning chamber 1 is equipped with a pump body inside, which is used to transport the cleaning solution in the storage tank 2 to the spray pipe 6 and spray it out from the nozzle; a connecting pipe 7 is fixedly installed and connected between the storage tank 2 and the spray pipe 6, and the connecting pipe 7 is made of soft pipe material, which can adapt to the displacement of the spray pipe 6; a placement plate 8 is rotatably installed on the inner bottom of the cleaning chamber 1; a material tray 10 is detachably fixedly installed on the placement plate 8 for holding silicon wafers to be cleaned; a rotary motor 9 is fixedly installed on the outer bottom of the cleaning chamber 1, and the output end of the rotary motor 9 is coaxially fixed with the rotating shaft of the placement plate 8 using a coupling.

[0019] The silicon wafer is placed in the material tray 10, and the pump on the spray pipe 6 is started to spray the cleaning solution from the spray pipe 6. At the same time, the linear motor 4 drives the spray pipe 6 to move back and forth, so that the cleaning solution evenly covers the surface of the silicon wafer, greatly improving the comprehensiveness and consistency of the cleaning of the silicon wafer. After the cleaning solution removes the impurities from the silicon wafer, it will flow off the surface of the silicon wafer and be discharged from the outlet at the bottom of the cleaning chamber 1.

[0020] During the cleaning process of silicon wafers, the rotary motor 9 drives the placement plate 8 and the silicon wafer to swing back and forth, constantly changing the tilt angle of the silicon wafer, further reducing the cleaning blind area and enhancing the flushing effect of the cleaning fluid on contaminants. At the same time, it promotes the rapid removal of waste liquid and reduces the residue of cleaning fluid on the surface of the silicon wafer.

[0021] like Figure 1 and Figure 2 As shown, the device also includes: a fixing frame 11, which is fixedly installed on the top of the side wall of the cleaning chamber 1, and the fixing frame 11 is on the same side as the storage tank 2; and a limiting block 12, which is slidably installed on the fixing frame 11, and the connecting pipe 7 is fixed thereto.

[0022] During the displacement of the spray pipe 6 and the following displacement of the limiting block 12, the movable section of the connecting pipe 7 will be constrained between the storage tank 2 and the limiting block 12, so as to prevent the connecting pipe 7 from swinging excessively and intruding into the cleaning chamber 1 and affecting the movement of the spray pipe 6, thereby improving the stability and ease of operation of the device.

[0023] like Figure 3As shown, the device also includes: a magnetic suction surface 13, the placement plate 8 has a built-in magnetic suction surface 13, and the tray 10 is magnetically attached to the placement plate 8 to achieve a detachable fixed structure, which is convenient to disassemble and assemble and easy to use; the edge of the placement plate 8 has a water filter port 14 for effectively guiding the cleaning liquid and preventing liquid accumulation; the edge of the placement plate 8 is provided with a groove 15 to provide space for the removal of the tray 10 and facilitate the loading and unloading of the tray 10.

[0024] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. All equivalent substitutions made within the principles of this utility model should be included within the protection scope of this utility model. Contents not described in detail in this utility model are existing technologies known to those skilled in the art.

Claims

1. A device for cleaning the surface of a single crystal silicon wafer, characterized by: include: A cleaning chamber (1) with a drain outlet at its bottom; a storage tank (2) for storing cleaning fluid is fixedly connected to the outer wall of the cleaning chamber (1); a mounting frame (3) is fixedly connected to the top of one side of the cleaning chamber (1); a linear motor (4) is fixedly connected to the mounting frame (3); two connecting blocks (5) are fixedly installed on the stator end of the linear motor (4) and slidably installed on the top of the other side of the cleaning chamber (1); and a spray pipe (6) with two connecting blocks. (5) A spray pipe (6) is fixedly connected between them, with its nozzle facing downwards. A pump body is installed inside the pipe to transport the cleaning liquid in the storage tank (2) to the spray pipe (6) and spray it out from the nozzle. A connecting pipe (7) is fixedly connected between the storage tank (2) and the spray pipe (6) and can adapt to the displacement of the spray pipe (6). A placement plate (8) is installed inside the cleaning chamber (1). A tray (10) is detachably fixedly connected to the placement plate (8) for holding the silicon wafers to be cleaned.

2. The apparatus for cleaning the surface of a single crystal silicon wafer as set forth in claim 1, wherein: The placement plate (8) is rotatably connected to the cleaning chamber (1). The device also includes a rotary motor (9). The rotary motor (9) is fixedly connected to the cleaning chamber (1). The output end of the rotary motor (9) is coaxially fixed with the rotating shaft of the placement plate (8).

3. The single-crystal silicon wafer surface cleaning device as described in claim 2, characterized in that: The device further includes: a fixed frame (11), which is fixedly connected to the top of the side wall of the cleaning chamber (1), and the fixed frame (11) is on the same side as the storage box (2); a limiting block (12), which is slidably connected to the fixed frame (11), and the connecting pipe (7) is fixed thereto.

4. The apparatus for cleaning the surface of a single crystal silicon wafer as set forth in claim 3, wherein: The placement plate (8) has a built-in magnetic surface (13), and the tray (10) is magnetically attracted to the magnetic surface (13).

5. The apparatus for cleaning the surface of a single crystal silicon wafer as set forth in claim 4, wherein: The edge of the placement plate (8) has a filter port (14) for guiding the cleaning fluid.

6. The apparatus for cleaning the surface of a single crystal silicon slice as set forth in claim 5, wherein: The edge of the placement plate (8) is provided with a groove (15) to provide space for the removal of the tray (10).

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