A multi-stage punching die
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-25
- Publication Date
- 2026-08-14
AI Technical Summary
[0003]而目前使用的是一个冲子仅对成型产品进行一次冲压，这种方式需要设置多个冲子分别使成型产品产生造型，并逐步使得成型产品的多个边缘与基板脱离，因此需要设置多个冲子，进而导致经济性差
[0018]本申请实施例提供的多级冲孔模具通过设置沿第一方向间隔设置的至少两个冲子，多个冲子分别进行多次冲压，并且一个冲子也能分别对成型产品沿第一方向的相对两端进行多次冲压，而不是一次冲压得到成型产品，这样设置能够使得冲子在冲压过程中的冲压的力量更加分散，进而实现减少冲压过程中模具冲子的磨损，提高冲子的使用寿命。并且，使得其中的至少一个冲子能够在两次冲压过程中分别对成型产品沿第一方向的相对两端进行冲压，还能够减少冲子设置的数量，进而提高设备整体的经济性。
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Figure CN224629706U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of stamping die technology, specifically to a multi-stage punching die. Background Technology
[0002] In the substrate stamping process, to reduce wear on the die punch, multiple stamping operations are performed to obtain a shaped product. In this multi-stamping method, a single stamp can either shape the product or detach at least one edge of the product from the substrate. After multiple stamping operations, the product achieves its specific shape and completely detaches from the substrate at its outer periphery. Using a multi-stamping method allows the stamping force to be more dispersed, thereby reducing wear on the die punch.
[0003] Currently, a single punch is used to stamp the product once. This method requires multiple punches to shape the product and gradually separate the multiple edges of the product from the substrate. Therefore, multiple punches are needed, which leads to poor economic efficiency. Utility Model Content
[0004] This application provides a multi-stage punching die that can reduce wear on the mold punches and reduce the number of punches required, thereby improving the overall economy of the equipment.
[0005] The specific technical solutions of the embodiments in this application are as follows:
[0006] This application provides a multi-stage punching die for punching a substrate to obtain a shaped product, including:
[0007] First base;
[0008] At least two punches are spaced apart along a first direction, and at least two punches are movably connected to the first base along a second direction relative to the first base; one of the at least two punches is configured to punch the molded product at opposite ends along the first direction in two punches, and the other punch is configured to cause the molded product to detach from the substrate, wherein the second direction is perpendicular to the first direction.
[0009] The second base is disposed opposite to the first base along the second direction, and the second base is provided with cavities corresponding to at least two punches.
[0010] In some embodiments, at least two punches include a first punch, a second punch, and a third punch that are spaced apart and arranged sequentially along a first direction. The first punch is configured to perform two punches to shape the molded product at opposite ends along the first direction. The second punch is configured to perform two punches to create a separation gap between the molded product and the substrate at opposite ends along the first direction. The third punch is configured to detach the molded product from the substrate.
[0011] In some embodiments, the third punch is configured to create a separation gap between the molded product and the substrate at opposite ends along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.
[0012] In some embodiments, the orthographic projection of the third punch along the second direction overlaps with the orthographic projection of the formed product along the second direction.
[0013] In some embodiments, the multi-stage punching die further includes a pushing mechanism configured to move the substrate along a first direction and cause the first punch to preferentially punch the substrate.
[0014] In some embodiments, the multi-stage punching die further includes a stamping plate connected to a first base, and at least two punches are connected to the stamping plate.
[0015] In some embodiments, the multi-stage punching die further includes a stripper plate, which is movably connected to the first base in a second direction relative to the first base. The stripper plate is located on the side of the stamping plate away from the first base, and the stripper plate is provided with through holes for at least two punches to move in the first direction.
[0016] In some embodiments, the multi-stage punching die also includes a backing plate located between the stamping plate and the first base, and connected to the stamping plate and the first base.
[0017] Compared with the prior art, the embodiments of this application have the following beneficial effects:
[0018] The multi-stage punching die provided in this application embodiment features at least two punches spaced apart along a first direction. Multiple punches perform multiple punching operations, and a single punch can also punch the opposite ends of the product along the first direction multiple times, rather than producing the product in a single punch. This arrangement allows for more dispersed punching force during the punching process, thereby reducing wear on the punches and extending their service life. Furthermore, enabling at least one punch to punch the opposite ends of the product along the first direction in two separate punching operations reduces the number of punches required, thus improving the overall economic efficiency of the equipment. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a structural schematic diagram of a multi-stage punching die provided in some embodiments of this application;
[0021] Figure 2 This is a structural schematic diagram of a multi-stage punching die provided in some embodiments of this application, showing the first usage state of the die.
[0022] Figure 3 This is a structural schematic diagram of a multi-stage punching die provided in some embodiments of this application, and a structural schematic diagram of its second usage state.
[0023] Figure 4 This is a structural schematic diagram of a multi-stage punching die provided in some embodiments of this application, showing the third usage state.
[0024] Figure 5 This is a structural schematic diagram of the multi-stage punching die provided in some embodiments of this application, showing the fourth usage state.
[0025] Figure 6 This is a structural schematic diagram of a multi-stage punching die provided in some embodiments of this application, showing the fifth usage state.
[0026] in:
[0027] 1. Substrate; 2. Molded product; 10. First base; 20. Punch; 201. First punch; 202. Second punch; 203. Third punch; 30. Second base; 40. Stamping plate; 50. Stripping plate; 60. Backing plate; X, First direction; Y, Second direction; Z, Third direction. Detailed Implementation
[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0030] The use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values may in practice be based on additional conditions or values beyond those stated.
[0031] In this application, the term "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use this application. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be made without using these specific details. In other instances, well-known structures and processes are not described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.
[0032] This application provides a multi-stage punching die for punching a substrate 1 to obtain a shaped product 2. The multi-stage punching die includes a first base 10, punches 20, and a second base 30. At least two punches 20 are provided, spaced apart along a first direction X, which is the direction in which the substrate 1 moves. Each punch 20 is movably connected to the first base 10 along a second direction Y, allowing the punch 20 to move relative to the first base 10 and thus complete the punching process. One of the punches 20 is configured to punch the shaped product 2 at opposite ends along the first direction X in two separate punches. The other punch 20 of the at least two punches is configured to detach the shaped product 2 from the substrate 1. The second direction Y is perpendicular to the first direction X. The second base 30 is positioned opposite the first base 10 along the second direction Y, and the second base 30 has cavities corresponding to the at least two punches 20.
[0033] The molded product 2 is the final product that is detached from the substrate 1 after stamping. It is possible to obtain one molded product 2 from one substrate 1 after the stamping operation, or to obtain multiple molded products 2 from one substrate 1 after the stamping operation.
[0034] One of the punches 20 is configured to perform two punches on opposite ends of the molded product 2 along the first direction X. This can be done in two consecutive punches or in two discontinuous punches. The punch 20 can be used for stamping, such as punching holes in the substrate 1 to obtain the desired shape of the molded product 2, or it can cause at least one edge of the molded product 2 to detach from the substrate 1. In a specific example, the molded product 2 typically needs to detach from the substrate 1 along its outer perimeter, which can be divided into opposite ends along the first direction X and opposite ends along a third direction Z. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other.
[0035] At least two punches 20 include two or more punches 20, which can be two, three, four or even more. Among the multiple punches 20, there may be punches 20 that cause the edge of a portion of the molded product 2 to separate from the substrate 1, or punches 20 that shape the molded product 2.
[0036] It is possible that at least two punches 20 each use a drive mechanism to achieve independent driving of one punch 20 by one drive mechanism; or it is possible that at least two punches 20 both use a drive mechanism to achieve simultaneous driving of multiple punches 20 by one drive mechanism.
[0037] The second base 30 is provided with at least two cavities, the number of which corresponds to the number of punches 20, to accommodate the parts of the punches 20 that protrude during the stamping process.
[0038] In the above embodiment, by setting at least two punches 20 spaced apart along the first direction X, multiple punches 20 perform multiple stamping operations, and a single punch 20 can also stamp the opposite ends of the molded product 2 along the first direction X multiple times, instead of obtaining the molded product 2 in a single stamping operation. This arrangement allows the stamping force of the punches 20 to be more dispersed during the stamping process, thereby reducing the wear of the die punches 20 during stamping and increasing the service life of the punches 20. Furthermore, by enabling at least one punch 20 to stamp the opposite ends of the molded product 2 along the first direction X in two stamping operations, the number of punches 20 can be reduced, thereby improving the overall economy of the equipment.
[0039] In some embodiments, at least two punches 20 include a first punch 201, a second punch 202, and a third punch 203 arranged at intervals along a first direction X. The first punch 201 is configured to perform two punches to shape the molded product 2 at opposite ends along the first direction X. The second punch 202 is configured to perform two punches to form a separation gap between the molded product 2 at opposite ends along the first direction X and the substrate 1. The third punch 203 is configured to detach the molded product 2 from the substrate 1.
[0040] When the first punch 201 stamps the molded product 2 at its opposite ends along the first direction X, it causes the opposite ends of the molded product 2 along the first direction X to detach from the substrate 1. The second punch 202 causes the opposite ends of the molded product 2 along the first direction X to completely detach from the substrate 1. Alternatively, the third punch 203 can only stamp the opposite ends of the molded product 2 along the third direction Z, so that the molded product 2 detaches from the substrate 1 at its opposite ends along the third direction Z, thereby achieving overall detachment of the molded product 2. Or, the third punch 203 can stamp the entire outer periphery of the molded product 2, and stamp again after the second punch 202 has created a separation gap between the opposite ends of the molded product 2 along the first direction X and the substrate 1. This allows for secondary processing of the opposite ends of the molded product 2 along the second direction Y, thereby reducing burrs on the edges of the opposite ends of the molded product 2 along the second direction Y, and reducing defects in the molded product 2.
[0041] In the first punch 201, the first punch 201 stamps the two opposite ends of the molded product 2 along the first direction X in two stamping processes. Then, the second punch 202 stamps the two opposite ends of the molded product 2 along the first direction X in two stamping processes. Finally, the third punch 203 stamps the molded product 2 once, so that the molded product 2 is separated from the substrate 1. This allows the first punch 201, the second punch 202 and the third punch 203 to stamp the areas that need to be contacted when they come into contact with the molded product 2 multiple times, which can reduce the burrs in this area and thus reduce the defects of the molded product 2.
[0042] In some embodiments, the third punch 203 is configured to create a separation gap between the molded product 2 and the substrate 1 at opposite ends along the third direction Z. With this configuration, the outer periphery of the molded product 2 is punched by the first punch 201, the second punch 202, and the third punch 203 respectively, thereby achieving the purpose of removing the molded product 2 from the substrate 1.
[0043] In some embodiments, the orthographic projection of the third punch 203 along the second direction Y overlaps with the orthographic projection of the molded product 2 along the second direction Y. With this configuration, the third punch 203 can perform overall stamping on the outer periphery of the molded product 2. While ensuring that the molded product 2 can detach from the substrate 1, because other punches 20 have already caused part of the edges of the molded product 2 to detach from the substrate 1, it also supports secondary stamping on at least part of the outer periphery of the molded product 2, achieving an edge-grinding effect, thereby reducing defects in the molded product 2.
[0044] In some embodiments, the multi-stage punching die further includes a pushing mechanism configured to move the substrate 1 along a first direction X, and cause the first punch 201 to preferentially punch the substrate 1.
[0045] The pushing mechanism can be a slide rail, a push rod, a push plate, etc. During the movement of the substrate 1, the first punch 201 prioritizes punching the substrate 1 to shape the molded product 2. As the substrate 1 continues to move, the first punch 201 can perform multiple punching operations, thereby achieving the purpose of obtaining multiple molded products 2 on one substrate 1.
[0046] When the first punch 201, the second punch 202 and the third punch 203 are all connected to a driving mechanism, the substrate 1 can complete the stamping shape in sequence during the movement process, and form a separation gap between the opposite ends of the substrate 1 along the first direction X and make the molded product 2 separate from the substrate 1.
[0047] In some embodiments, the multi-stage punching die further includes a stamping plate 40 connected to the first base 10, and at least two punches 20 are connected to the stamping plate 40. By setting the stamping plate 40, multiple punches 20 can be connected to a single drive mechanism, thereby reducing the use of equipment and energy consumption, and thus improving the overall economy of the equipment.
[0048] In some embodiments, the multi-stage punching die further includes a stripper plate 50, which is movably connected to the first base 10 along a second direction Y relative to the first base 10. The stripper plate 50 is located on the side of the stamping plate 40 opposite to the first base 10, and has through holes for at least two punches 20 to move along the first direction X. This arrangement allows the substrate 1 to be detached entirely after stamping.
[0049] In some embodiments, the multi-stage punching die further includes a pad 60, which is located between the stamping plate 40 and the first base 10 and connected to the stamping plate 40 and the first base 10. By setting the pad 60, buffering can be achieved between the stamping plate 40 and the first base 10, thereby reducing the probability of damage to the overall equipment and improving the overall economy.
[0050] This application provides a multi-stage punching die. Please refer to [link / reference]. Figures 2-6 The specific workflow is as follows:
[0051] For ease of explanation, the direction in which substrate 1 moves is from left to right. First, the substrate 1 moves from left to right. The substrate 1 first contacts the first punch 201. During the first punch, the first punch 201 first punches the right side of the first molded product 2 formed on the substrate 1. Then, the substrate 1 continues to move to the right. During the second punch, the first punch 201 and the second punch 202 contact the substrate 1 respectively. The first punch 201 punches the left side of the first molded product 2 and the right side of the second molded product 2 (the next one after the first molded product 2). The second punch 202 punches the right side of the first molded product 2 to form a separation gap. Next, the substrate 1 continues to move to the right. During the third punch, the first punch 201, the second punch 202, and the third punch 203 all contact the substrate 1. The first punch 201 punches the left side of the second molded product 2 and the right side of the third molded product 2. The second punch 202 punches the right side of the second molded product 2 to form a separation gap. The third punch 203 punches the entire molded product 2, causing the molded product 2 to detach from the substrate 1. Repeat the above steps to obtain multiple molded products 2 on a substrate 1.
[0052] During the stamping process, the left and right edges of the formed product 2 undergo multiple stamping contacts, which enables the finishing of the formed product 2, thereby reducing the burrs on the left and right edges of the formed product 2, reducing defects in the corresponding positions of the formed product 2, and improving the overall quality of the formed product 2.
[0053] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A multi-stage punching die for punching substrates to obtain shaped products, characterized in that, include: First base; At least two punches are provided, spaced apart along a first direction, and movably connected to the first base along a second direction relative to the first base; one of the punches is configured to perform two punches to punch the molded product at opposite ends along the first direction, and the other punch is configured to detach the molded product from the substrate, wherein the second direction is perpendicular to the first direction; The second base is disposed opposite to the first base along the second direction, and the second base is provided with cavities corresponding to at least two of the punches.
2. The multi-stage punching die as described in claim 1, characterized in that, The at least two punches include a first punch, a second punch, and a third punch that are spaced apart and arranged sequentially along the first direction. The first punch is configured to perform two punches to shape the molded product at opposite ends along the first direction. The second punch is configured to perform two punches to create a separation gap between the molded product and the substrate at opposite ends along the first direction. The third punch is configured to detach the molded product from the substrate.
3. The multi-stage punching die as described in claim 2, characterized in that, The third punch is configured to create a separation gap between the molded product and the substrate at opposite ends along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.
4. The multi-stage punching die as described in claim 3, characterized in that, The orthographic projection of the third punch along the second direction overlaps with the orthographic projection of the molded product along the second direction.
5. The multi-stage punching die as described in claim 2, characterized in that, The multi-stage punching die also includes a pushing mechanism, which is configured to drive the substrate to move along the first direction and cause the first punch to preferentially punch the substrate.
6. The multi-stage punching die as described in claim 1, characterized in that, The multi-stage punching die also includes a stamping plate, which is connected to the first base, and at least two of the punches are connected to the stamping plate.
7. The multi-stage punching die as described in claim 6, characterized in that, The multi-stage punching die also includes a stripper plate, which is movably connected to the first base along the second direction relative to the first base. The stripper plate is located on the side of the stamping plate away from the first base, and the stripper plate is provided with through holes for at least two punches to move along the first direction.
8. The multi-stage punching die as described in claim 6, characterized in that, The multi-stage punching die also includes a pad, which is located between the stamping plate and the first base and is connected to the stamping plate and the first base.