A multi-station punching die for a silicon wafer carrier

Abstract

This utility model provides a multi-station punching die for a silicon wafer carrier. It relates to the field of punching die technology. The multi-station punching die for the silicon wafer carrier includes a lower pressing die and a positioning frame die. The positioning frame die is located below the lower pressing die. A bottom groove is formed at the bottom of the lower pressing die. A bidirectional screw is installed on a rotating rod within the bottom groove. One end of the bidirectional screw extends outside the lower pressing die. Two lateral adjusting blocks are threaded onto the bidirectional screw. An open frame is fixedly installed at the bottom of each of the two lateral adjusting blocks. A unidirectional screw is rotatably installed within each of the two open frames. A longitudinal adjusting block is threaded onto each of the two unidirectional screws. A punching head is fixedly installed at the bottom of each of the two longitudinal adjusting blocks. This utility model can reduce the number of clamping operations, achieve simultaneous multi-station punching, and improve punching accuracy.

Description

Technical Field

[0001] This utility model relates to the field of punching die technology, specifically a multi-station punching die for a silicon wafer carrier. Background Technology

[0002] Silicon wafer carriers are key auxiliary components in the production, transportation, and processing of silicon wafers. They typically hold the silicon wafers directly in grooves to provide support. Currently, to meet assembly and weight reduction requirements, silicon wafer carriers usually need to be machined with multiple through holes or positioning holes, and punching is one of the core processes involved.

[0003] Current silicon wafer carrier punching processes mostly use single-station dies, meaning that only one hole can be processed at a time. This processing method has the following problems: First, it is inefficient, requiring multiple clamping and punching for carriers that need to be processed with multiple holes; second, it has poor positioning accuracy, as multiple clampings lead to inconsistent positioning references, large cumulative errors, and easy hole position deviations, affecting the assembly accuracy of the carrier.

[0004] Therefore, it is necessary to provide a new multi-station punching die for silicon wafer carriers to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a multi-station punching die for silicon wafer carriers that can reduce the number of clamping operations, achieve multi-station synchronous punching, and improve punching accuracy.

[0006] To solve the above-mentioned technical problems, the multi-station punching die for a silicon wafer carrier provided by this utility model includes: a lower pressing die and a positioning frame die. The positioning frame die is located below the lower pressing die. A bottom groove is opened at the bottom of the lower pressing die. A bidirectional screw is installed on a rotating rod in the bottom groove. One end of the bidirectional screw extends outside the lower pressing die. Two lateral adjusting blocks are threaded on the bidirectional screw. An open frame is fixedly installed at the bottom of each of the two lateral adjusting blocks. A unidirectional screw is rotatably installed in each of the two open frames. A longitudinal adjusting block is threaded on each of the two unidirectional screws. A punching head is fixedly installed at the bottom of each of the two longitudinal adjusting blocks. A fixing frame is fixedly installed at the top of the lower pressing die. Support arms are fixedly installed on both sides of the fixing frame. Two guide folding rods are slidably installed on each of the two support arms. The bottoms of the four guide folding rods are fixedly connected to the positioning frame die. A buffer unit is provided on each of the four guide folding rods.

[0007] Preferably, each of the buffer units includes a clamping ring plate, which is fixedly sleeved on the guide folding rod. A compression spring is sleeved on the guide folding rod, with its top end fixedly connected to the support arm and its bottom end fixedly connected to the clamping ring plate.

[0008] Preferably, a horizontal scale is fixedly installed inside the fixing frame, and a first guide head is fixedly installed on the top of each of the two horizontal adjusting blocks. The top of each of the two first guide heads extends above the lower pressing mold and is slidably connected to the top of the lower pressing mold. Both of the first guide heads are adapted to the horizontal scale.

[0009] Preferably, two transverse sliding rods are fixedly installed in the bottom groove, and the two transverse sliding rods pass through the two transverse adjusting blocks and are slidably connected to the two transverse adjusting blocks.

[0010] Preferably, a rotating handle is fixedly installed at one end of the bidirectional screw outside the lower die, and a protrusion is fixedly installed on the side of the lower die near the rotating handle. A second set screw is threaded onto the protrusion, and the end of the second set screw abuts against the bidirectional screw.

[0011] Preferably, a longitudinal scale is fixedly installed inside each of the two open frames, and a second guide head is fixedly installed on the top of each of the two longitudinal adjusting blocks, with the two second guide heads respectively adapted to the two longitudinal scales.

[0012] Preferably, each of the two open frames is fixedly installed with a limiting bar, the two limiting bars pass through the two longitudinal adjusting blocks respectively and are slidably connected to the corresponding longitudinal adjusting blocks, and the two longitudinal adjusting blocks are threaded with a first set screw on the side away from each other, and the ends of the two first set screws respectively abut against the two limiting bars.

[0013] Compared with related technologies, the multi-station punching die for silicon wafer carriers provided by this utility model has the following beneficial effects: This invention enables a dual-station synchronous punching operation by using two independent punching heads, thereby improving punching efficiency. Furthermore, the lateral and longitudinal positions of the two punching heads are adjustable, allowing for punching within a defined range within the positioning mold, thus offering strong applicability. In addition, when used in conjunction with a lateral and longitudinal scale, and without the need for multiple clamping and positioning of the carrier component, punching accuracy can be significantly improved. Attached Figure Description

[0014] Figure 1 A schematic diagram of the structure of the multi-station punching die for the silicon wafer carrier provided by this utility model; Figure 2 This is a cross-sectional view of the lower die in this utility model; Figure 3 This is a schematic diagram of the oblique upward view structure of this utility model; Figure 4 This is a schematic diagram of the connection structure between the single screw and the longitudinal adjusting block in this utility model.

[0015] The following are the labels in the diagram: 1. Lower pressing mold; 2. Positioning frame mold; 3. Fixing frame; 4. Bottom groove; 5. Two-way screw; 6. Lateral adjusting block; 7. Open frame; 8. One-way screw; 9. Longitudinal adjusting block; 10. Punching head; 11. Support arm; 12. Guide folding rod; 13. Pressing ring; 14. Compression spring; 15. Lateral scale; 16. First guide head; 17. Longitudinal scale; 18. Second guide head; 19. Limiting bar; 20. First set screw. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Please refer to the following: Figures 1-4 ,in, Figure 1 A schematic diagram of the structure of the multi-station punching die for the silicon wafer carrier provided by this utility model; Figure 2 This is a cross-sectional view of the lower die in this utility model; Figure 3 This is a schematic diagram of the oblique upward view structure of this utility model; Figure 4 This is a schematic diagram of the connection structure between the single-axis screw and the longitudinal adjusting block in this utility model. The multi-station punching die for the silicon wafer carrier includes: a lower pressing die 1 and a positioning frame die 2. The positioning frame die 2 is located below the lower pressing die 1, and a bottom groove 4 is formed at the bottom of the lower pressing die 1. A bidirectional screw 5 is installed in the rotating rod inside the bidirectional screw 5. One end of the bidirectional screw 5 extends to the outside of the lower pressing die 1 and is fixed with a handle for easy rotation. Two transverse adjusting blocks 6 are threaded onto the bidirectional screw 5. In order to ensure the stability of the linear movement of the transverse adjusting blocks 6, two transverse sliding rods are fixedly installed in the bottom groove 4. The two transverse sliding rods pass through the two transverse adjusting blocks 6 and are slidably connected to the two transverse adjusting blocks 6. The bottom of each of the two transverse adjusting blocks 6 is fixedly installed with... An open frame 7 is provided, with its opening facing downwards. Two one-way screws 8 are rotatably installed inside the two open frames 7. Each of the two one-way screws 8 is threaded with a longitudinal adjusting block 9. A punch head 10 is fixedly installed at the bottom of each of the two longitudinal adjusting blocks 9. A fixing frame 3 is fixedly installed on the top of the lower die 1. Support arms 11 are fixedly installed on both sides of the fixing frame 3. Two guide folding rods 12 are slidably installed on each of the two support arms 11. The bottom of each of the four guide folding rods 12 is fixedly connected to the positioning frame die 2. Each of the four guide folding rods 12 is equipped with a buffer unit, so that the positioning frame die 2 can be used to press and position the carrier component to be punched.

[0018] Each of the buffer units described above includes a clamping ring 13, which is fixedly sleeved on the guide folding rod 12. A compression spring 14 is sleeved on the guide folding rod 12. The top end of the compression spring 14 is fixedly connected to the support arm 11, and its bottom end is fixedly connected to the clamping ring 13.

[0019] In this method, in order to improve the accuracy of adjusting the position of the punch head 10, a horizontal scale 15 is fixedly installed in the fixed frame 3. A first guide head 16 is fixedly installed on the top of each of the two horizontal adjustment blocks 6. The top of each of the two first guide heads 16 extends above the lower die 1 and slides to connect with the top of the lower die 1. Both first guide heads 16 are adapted to the horizontal scale 15. A vertical scale 17 is fixedly installed in each of the two open frames 7. A second guide head 18 is fixedly installed on the top of each of the two vertical adjustment blocks 9. The two second guide heads 18 are adapted to the two vertical scales 17 respectively. The horizontal scale 15 and the vertical scale 17 are both gradually increased from the center line as the zero mark to both sides, which makes it convenient for the operator to find the correct position.

[0020] In this method, in order to prevent the bidirectional screw 5 from rotating naturally, a protrusion is fixedly installed on the side of the lower die 1 near the handle. A second set screw is threaded on the protrusion, and its end abuts against the bidirectional screw 5, thereby achieving a fixing effect.

[0021] In this method, in order to ensure that the longitudinal adjusting block 9 can form a stable linear motion, a limiting bar 19 is fixedly installed in both open frames 7. The two limiting bars 19 pass through the two longitudinal adjusting blocks 9 respectively and are slidably connected to the corresponding longitudinal adjusting blocks 9. The two longitudinal adjusting blocks 9 are threaded with a first set screw 20 on the side that is far away from each other. The ends of the two first set screws 20 abut against the two limiting bars 19 respectively.

[0022] The working principle of the multi-station punching die for the silicon wafer carrier provided by this utility model is as follows: In this utility model, the fixed frame 3 is connected to the hydraulic cylinder output shaft above it. By extending the hydraulic cylinder output shaft, the punch head 10 can be lowered to form a punching operation. When punching holes in the silicon wafer carrier, first adjust the horizontal spacing of the two punching heads 10 according to the hole spacing. During adjustment, first reverse the second set screw to separate it from the bidirectional screw 5, and then rotate the bidirectional screw 5. The two horizontal adjustment blocks 6 will move closer to each other. At this time, observe the pointing position of the first guide head 16 on the vertical scale 17. After the two first guide heads 16 move to the specified scale line position, rotate the second set screw to fix the bidirectional screw 5. Then, adjust the vertical horizontal position of the two punching heads 10 according to the hole position. During adjustment, first reverse the two first set screws 20 to separate them from the corresponding limit bar 19. Then, move one of the vertical adjustment blocks 9 and observe the positional relationship between the second guide head 18 and the vertical scale 17. After moving it to the specified position, retighten the corresponding first set screw 20. Then adjust the vertical horizontal position of the other punching head 10 in the same way. Finally, all adjustments are completed. Then, the original carrier component to be punched is positioned below the positioning frame mold 2. Then, the extension of the hydraulic cylinder output shaft is started, and the lower pressing mold 1 descends with the positioning frame mold 2. When the positioning frame mold 2 contacts the original carrier component, it is subjected to the action of the compression spring 14. The lower pressing mold 1 continues to descend with the two punching heads 10 until the punching heads 10 contact the original carrier component, and the punching work begins. After the punching is completed, the hydraulic cylinder output shaft is started to retract.

[0023] Compared with related technologies, the multi-station punching die for silicon wafer carriers provided by this utility model has the following beneficial effects: This utility model provides a multi-station punching die for a silicon wafer carrier. By setting two independent punching heads 10, a dual-station synchronous punching operation can be formed, thereby improving punching efficiency. Furthermore, the lateral and longitudinal positions of the two punching heads 10 can be adjusted to meet the punching work within a fixed range of the positioning frame die 2, making it highly applicable. In addition, when used in conjunction with the lateral scale 15 and the longitudinal scale 17, and without the need for multiple clamping and positioning of the carrier component, the punching accuracy can be greatly improved.

[0024] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A multi-station punching die for a silicon wafer carrier comprising a lower die and a positioning frame die, the positioning frame die being located below the lower die, characterized in that, The bottom of the lower die has a bottom groove. A bidirectional screw is installed in the bottom groove. One end of the bidirectional screw extends to the outside of the lower die. Two lateral adjustment blocks are threaded on the bidirectional screw. An open frame is fixedly installed at the bottom of each of the two lateral adjustment blocks. A unidirectional screw is rotatably installed in each of the two open frames. A longitudinal adjustment block is threaded on each of the two unidirectional screws. A punch head is fixedly installed at the bottom of each of the two longitudinal adjustment blocks. A fixed frame is fixedly installed on the top of the lower pressing mold, and support arms are fixedly installed on both sides of the fixed frame. Two guide folding rods are slidably installed on each of the two support arms. The bottom of each of the four guide folding rods is fixedly connected to the positioning frame mold, and a buffer unit is provided on each of the four guide folding rods.

2. The multi-station wafer carrier piercing die of claim 1 wherein, Each of the buffer units includes a clamping ring plate, which is fixedly sleeved on the guide folding rod. A compression spring is sleeved on the guide folding rod, with its top end fixedly connected to the support arm and its bottom end fixedly connected to the clamping ring plate.

3. The multi-station punch die for silicon wafer carriers of claim 1 wherein, A horizontal scale is fixedly installed inside the fixing frame. A first guide head is fixedly installed on the top of each of the two horizontal adjustment blocks. The top of each of the two first guide heads extends above the lower pressing mold and is slidably connected to the top of the lower pressing mold. Both of the first guide heads are adapted to the horizontal scale.

4. The multi-station wafer carrier piercing die of claim 3, wherein, Two transverse sliding rods are fixedly installed in the bottom groove. The two transverse sliding rods pass through the two transverse adjusting blocks and are slidably connected to the two transverse adjusting blocks.

5. The multi-station punch die for silicon wafer carriers of claim 1 wherein, A rotating handle is fixedly installed at one end of the bidirectional screw outside the lower die. A protrusion is fixedly installed on the side of the lower die near the rotating handle. A second set screw is threaded onto the protrusion, and the end of the second set screw abuts against the bidirectional screw.

6. The multi-station wafer carrier piercing die of claim 1 wherein, Both of the open frames are fixedly installed with longitudinal scales, and the tops of the two longitudinal adjustment blocks are fixedly installed with second guide heads, which are respectively adapted to the two longitudinal scales.

7. The multi-station wafer carrier piercing die of claim 1 wherein, Each of the two open frames is fixedly installed with a limit bar. The two limit bars pass through the two longitudinal adjustment blocks and are slidably connected to the corresponding longitudinal adjustment blocks. The two longitudinal adjustment blocks are threaded with a first set screw on the side that is far away from each other. The ends of the two first set screws abut against the two limit bars respectively.

Images