A stamping die for hardware processing

CN224629772UActive Publication Date: 2026-08-14SHENZHEN FUSHENG PRECISION HARDWARE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0003]在五金件加工过程中,冲压模具是常用的加工工具,传统的冲压模具在冲压作业时,上模具与下模具之间会产生巨大的刚性碰撞,这种刚性碰撞不仅会产生较大的噪音,影响工作环境,还会加速模具的磨损和损坏,缩短模具的使用寿命,增加模具更换成本,同时,由于冲压过程中产生的冲击力较大,模具和设备容易受到损坏,影响加工精度和产品质量,此外,现有的冲压模具大多缺乏有效的缓冲调节机制,难以适应不同材质、不同厚度以及不同冲压工艺要求的五金件加工,通用性和适应性较差

Benefits of technology

[0022]First, this utility model uses a gas inlet to inject gas at a suitable pressure into the sealing frame to adjust the buffering performance of the buffer mechanism. The hardware to be processed is placed on the lower mold, ensuring accurate placement and matching with the cavity of the lower mold to guarantee the quality of the stamping process. The stamping device is then activated, and its output drives the upper mold downwards to stamp the hardware placed on the lower mold. When the upper mold contacts the hardware and applies pressure, the lower mold experiences an upward reaction force. The top plate pushes the second support block upwards, compressing the gas medium inside the sealing frame. Simultaneously, the upward movement of the top plate drives the second hinge seat upwards. The second hinge seat pushes the support rod through the second bracket, causing the slider to slide upwards within the groove of the support frame. The slider compresses the hydraulic damper, generating damping force to slow the slider's sliding speed, thus providing a buffering effect. Simultaneously, the first bracket rotates on the first hinge seat, changing the hinge point position with the support rod, further assisting the buffering process and making the entire buffer mechanism... The structure can smoothly absorb and disperse the impact force generated during the stamping process, protecting the mold and equipment. After the stamping device completes the stamping action, it drives the upper mold to move upward and reset. Under the action of the buffer mechanism, the lower mold will also smoothly return to the initial position. At this time, the processed hardware can be taken out, completing one stamping cycle. The buffer mechanism, through the coordinated action of hydraulic dampers, first brackets, second brackets and other components, can effectively absorb and disperse the huge impact force generated during the stamping process, reduce the rigid collision between the upper and lower molds, reduce the wear and damage risk of the mold, extend the service life of the mold, and reduce the mold replacement cost. By connecting the air head, gas or liquid can be injected into the sealing frame to adjust the pressure in the sealing frame, thereby changing the buffer performance of the buffer mechanism. This adjustability allows the stamping mold to adapt to the processing of hardware with different materials, thicknesses and stamping process requirements, improving the versatility and adaptability of the mold, and reducing the time and cost consumption caused by changing the mold or adjusting the equipment parameters.

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Abstract

This utility model relates to the technical field of hardware processing equipment and discloses a stamping die for hardware processing. This stamping die for hardware processing utilizes a buffer mechanism that, through the coordinated action of a hydraulic damper, a first support, a second support, and other components, effectively absorbs and disperses the enormous impact force generated during stamping. This reduces rigid collisions between the upper and lower dies, lowers the risk of die wear and damage, extends the die's service life, and reduces die replacement costs. By connecting an air inlet, gas or liquid can be injected into the sealing frame to adjust the pressure within the sealing frame, thereby altering the buffering performance of the buffer mechanism. This adjustability allows the stamping die to adapt to the processing of hardware parts with different materials, thicknesses, and stamping process requirements, improving the die's versatility and adaptability, and reducing the time and cost associated with die replacement or equipment parameter adjustments.
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Description

Technical Field

[0001] This utility model relates to the technical field of hardware processing equipment, specifically a stamping die for hardware processing. Background Technology

[0002] Stamping dies are special process equipment used in cold stamping to process materials (metal or non-metal) into parts (or semi-finished products). They are called cold stamping dies (commonly known as cold stamping dies). Stamping is a pressure processing method that uses dies mounted on a press to apply pressure to materials at room temperature, causing them to separate or plastically deform, thereby obtaining the desired parts.

[0003] In the hardware processing, stamping dies are commonly used processing tools. Traditional stamping dies generate huge rigid collisions between the upper and lower dies during stamping operations. These rigid collisions not only produce a lot of noise, affecting the working environment, but also accelerate the wear and damage of the dies, shorten their service life, and increase the cost of dies replacement. At the same time, due to the large impact force generated during stamping, the dies and equipment are easily damaged, affecting processing accuracy and product quality. In addition, most existing stamping dies lack effective buffering and adjustment mechanisms, making it difficult to adapt to the processing of hardware parts with different materials, thicknesses, and stamping process requirements, resulting in poor versatility and adaptability. Utility Model Content

[0004] The purpose of this utility model is to provide a stamping die for processing hardware parts, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a stamping die for processing hardware parts, including a stamping mechanism, a buffer mechanism provided on the stamping mechanism, and an anti-slip mechanism provided at the bottom of the stamping mechanism;

[0006] The stamping mechanism includes a support platform, a support plate is fixedly connected to the rear of the support platform, a stamping device is installed at the top front end of the support plate, and an upper mold is fixedly connected to the output end of the stamping device.

[0007] The buffer mechanism includes a support base, a first support block fixedly connected to the top of the support base, first hinge seats fixedly connected to the left and right sides of the top of the support base, first brackets hinged to the front and rear ends of the first hinge seats, a sealing frame provided on the top of the first support block, support frames fixedly connected to the left and right sides of the sealing frame, sliding grooves opened on the inner walls of the upper and lower ends of the two support frames, sliders slidably connected to the two support frames through the sliding grooves opened on the inner walls of the upper and lower ends, support rods fixedly connected to the front and rear ends of the two sliders, hydraulic dampers fixedly connected to opposite sides of the inner walls of the two support frames, second brackets hinged to the surfaces of the four support rods, a second support block provided on the top of the sealing frame, a top plate fixedly connected to the top of the second support block, a lower mold fixedly connected to the top of the top plate by bolts, and second hinge seats fixedly connected to the left and right sides of the bottom of the top plate.

[0008] The anti-slip mechanism includes an anti-slip mat.

[0009] Preferably, the support base is fixedly connected to the top of the support platform, and the ends of the four first brackets away from the first hinge base are respectively hinged to the four support rods.

[0010] Furthermore, the support base is fixed to the top of the support platform, providing a stable installation foundation for the entire buffer mechanism. At the same time, the hinge relationship between the first bracket and the support rod is specified. The four first brackets are connected to the four support rods by hinges. This hinge structure allows the first bracket to rotate relative to the support rod, providing a flexible motion mechanism for the subsequent buffering action of the buffer mechanism. It is an important structural connection method to realize the buffering function.

[0011] Preferably, the sealing frame has grooves at both the upper and lower ends that are adapted to the first support block and the second support block, and the second support block and the first support block are respectively inserted into the grooves at the upper and lower ends of the sealing frame.

[0012] Furthermore, grooves that are specially made at the upper and lower ends of the sealing frame to match the shape and size of the first and second support blocks are provided. This design allows the first and second support blocks to be inserted into the grooves at the upper and lower ends of the sealing frame respectively, achieving a tight insertion connection. This connection method not only helps to ensure the relative position stability between the components of the buffer mechanism, but also enhances the integrity and sealing of the structure to a certain extent. It is of great significance for functions such as air pressure or hydraulic pressure adjustment that may exist inside the buffer mechanism.

[0013] Preferably, the ends of the two hydraulic dampers away from the inner walls of the two support frames are fixedly connected to one side of the two sliders, respectively.

[0014] Furthermore, two hydraulic dampers are installed in the two support frames respectively, and their ends away from the inner wall of the support frame are fixedly connected to one side of the slider. A hydraulic damper is a device that uses the principle of liquid damping to consume energy and slow down the movement speed. Through this fixed connection, when the slider slides in the support frame, the hydraulic damper can generate resistance to the movement of the slider, thereby achieving a buffering effect, effectively reducing the impact force generated during the stamping process, and protecting the mold and related equipment.

[0015] Preferably, the ends of the four second brackets away from the support rod are respectively hinged to the front and rear ends of the two second hinge seats.

[0016] Furthermore, the four second supports are respectively hinged to the front and rear ends of the two second hinge seats. This hinge structure allows the second supports to rotate relative to the second hinge seats. Combined with the hinge relationship between the first support and the support rod, the entire buffer mechanism forms a multi-link hinge structure. During the stamping process, the impact force can be dispersed and buffered through the relative rotation and coordinated movement between the links, further enhancing the effect of the buffer mechanism and ensuring the stability and reliability of the mold operation.

[0017] Preferably, a connecting air head is fixedly connected to the front end of the sealing frame.

[0018] Furthermore, the connection of the air inlet allows the sealing frame to be connected to an external air source or air pressure control device. By connecting the air inlet, gas can be injected into or discharged into the sealing frame, thereby regulating the air pressure inside the sealing frame. This air pressure regulation function can work in conjunction with other components in the buffer mechanism, such as hydraulic dampers, to further optimize the buffering effect. According to different stamping process requirements, the buffering force and speed can be flexibly adjusted to improve the adaptability of the mold and the processing quality.

[0019] Preferably, the anti-slip pad is adhered to the bottom of the support platform.

[0020] Furthermore, the anti-slip pad is fixed to the bottom of the support platform by adhesive bonding. The function of the anti-slip pad is to increase the friction between the support platform and the placement surface, preventing the support platform from sliding or moving due to the huge impact force generated by the stamping device during the stamping process. This ensures the stability and safety of the entire stamping die during operation, and avoids affecting the processing accuracy or even causing safety accidents due to die movement.

[0021] Compared with the prior art, the beneficial effects achieved by this utility model are:

[0022] First, this utility model uses a gas inlet to inject gas at a suitable pressure into the sealing frame to adjust the buffering performance of the buffer mechanism. The hardware to be processed is placed on the lower mold, ensuring accurate placement and matching with the cavity of the lower mold to guarantee the quality of the stamping process. The stamping device is then activated, and its output drives the upper mold downwards to stamp the hardware placed on the lower mold. When the upper mold contacts the hardware and applies pressure, the lower mold experiences an upward reaction force. The top plate pushes the second support block upwards, compressing the gas medium inside the sealing frame. Simultaneously, the upward movement of the top plate drives the second hinge seat upwards. The second hinge seat pushes the support rod through the second bracket, causing the slider to slide upwards within the groove of the support frame. The slider compresses the hydraulic damper, generating damping force to slow the slider's sliding speed, thus providing a buffering effect. Simultaneously, the first bracket rotates on the first hinge seat, changing the hinge point position with the support rod, further assisting the buffering process and making the entire buffer mechanism... The structure can smoothly absorb and disperse the impact force generated during the stamping process, protecting the mold and equipment. After the stamping device completes the stamping action, it drives the upper mold to move upward and reset. Under the action of the buffer mechanism, the lower mold will also smoothly return to the initial position. At this time, the processed hardware can be taken out, completing one stamping cycle. The buffer mechanism, through the coordinated action of hydraulic dampers, first brackets, second brackets and other components, can effectively absorb and disperse the huge impact force generated during the stamping process, reduce the rigid collision between the upper and lower molds, reduce the wear and damage risk of the mold, extend the service life of the mold, and reduce the mold replacement cost. By connecting the air head, gas or liquid can be injected into the sealing frame to adjust the pressure in the sealing frame, thereby changing the buffer performance of the buffer mechanism. This adjustability allows the stamping mold to adapt to the processing of hardware with different materials, thicknesses and stamping process requirements, improving the versatility and adaptability of the mold, and reducing the time and cost consumption caused by changing the mold or adjusting the equipment parameters.

[0023] Secondly, this utility model places the stamping die as a whole in a suitable working position to ensure that the support platform is placed stably. Since the bottom of the support platform is bonded with an anti-slip pad, the anti-slip pad can increase the friction with the worktable surface, prevent the die from sliding due to the impact force of the stamping device during use, and ensure the stability of the die. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0025] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 3 This is a schematic cross-sectional view of the present invention.

[0027] Figure 4 This is a schematic diagram of the buffer mechanism of this utility model.

[0028] The components include: 1. Stamping mechanism; 101. Support platform; 102. Support plate; 103. Stamping device; 104. Upper die; 2. Buffer mechanism; 201. Support seat; 202. First support block; 203. First hinge seat; 204. First bracket; 205. Sealing frame; 206. Support frame; 207. Slider; 208. Support rod; 209. Hydraulic damper; 210. Second bracket; 211. Second support block; 212. Top plate; 213. Lower die; 214. Second hinge seat; 215. Connecting air head; 3. Anti-slip mechanism; 301. Anti-slip pad. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] This utility model provides the following technical solution:

[0031] Example 1

[0032] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 A stamping die for processing hardware parts, comprising a stamping mechanism 1, a buffer mechanism 2 provided on the stamping mechanism 1, and an anti-slip mechanism 3 provided at the bottom of the stamping mechanism 1.

[0033] The stamping mechanism 1 includes a support platform 101, a support plate 102 fixedly connected to the rear of the support platform 101, a stamping device 103 installed at the top front end of the support plate 102, and an upper mold 104 fixedly connected to the output end of the stamping device 103.

[0034] The buffer mechanism 2 includes a support base 201, a first support block 202 fixedly connected to the top of the support base 201, first hinge seats 203 fixedly connected to the left and right sides of the top of the support base 201, first brackets 204 hinged to the front and rear ends of the first hinge seats 203, a sealing frame 205 provided on the top of the first support block 202, and support frames 206 fixedly connected to the left and right sides of the sealing frame 205. Sliding grooves are provided on the inner walls of the upper and lower ends of the two support frames 206, allowing the two support frames 206 to slide through the sliding grooves on their inner walls. The system is connected to sliders 207, with support rods 208 fixedly connected to both ends of the two sliders 207. Hydraulic dampers 209 are fixedly connected to opposite sides of the inner walls of the two support frames 206. Second brackets 210 are hinged to the surfaces of the four support rods 208. A second support block 211 is provided on the top of the sealing frame 205. A top plate 212 is fixedly connected to the top of the second support block 211. A lower mold 213 is fixedly connected to the top of the top plate 212 by bolts. Second hinge seats 214 are fixedly connected to the left and right sides of the bottom of the top plate 212.

[0035] The support base 201 is fixedly connected to the top of the support platform 101, and the ends of the four first brackets 204 away from the first hinge base 203 are respectively hinged to the four support rods 208.

[0036] Specifically, the upper and lower ends of the sealing frame 205 are provided with grooves that are adapted to the first support block 202 and the second support block 211. The second support block 211 and the first support block 202 are respectively inserted into the grooves provided at the upper and lower ends of the sealing frame 205.

[0037] Specifically, the ends of the two hydraulic dampers 209 that are away from the inner walls of the two support frames 206 are fixedly connected to one side of the two sliders 207 respectively.

[0038] Specifically, the ends of the four second brackets 210 that are away from the support rod 208 are respectively hinged to the front and rear ends of the two second hinge seats 214.

[0039] Specifically, the front end of the sealing frame 205 is fixedly connected to a connecting air head 215.

[0040] Through the above technical solution, gas at a suitable pressure is injected into the sealing frame 205 via the connecting air head 215 to adjust the buffering performance of the buffer mechanism 2. The hardware to be processed is placed on the lower mold 213 to ensure accurate placement and matching with the cavity of the lower mold 213, thereby ensuring the quality of the stamping process. The stamping device 103 is started, and the output end of the stamping device 103 drives the upper mold 104 to move downward, performing stamping processing on the hardware placed on the lower mold 213. When the upper mold 104 contacts the hardware and applies pressure, the lower mold 213 receives an upward reaction force, and the top plate 2... 12 pushes the second support block 211 upward, the second support block 211 compresses the medium gas in the sealing frame 205, and at the same time the top plate 212 moves upward, driving the second hinge seat 214 to move upward. The second hinge seat 214 pushes the support rod 208 through the second bracket 210. The support rod 208 drives the slider 207 to slide upward in the groove of the support frame 206. The slider 207 compresses the hydraulic damper 209, the hydraulic damper 209 generates damping force, slowing down the sliding speed of the slider 207, thus playing a buffering role. At the same time, the first bracket 204 rotates on the first hinge seat 203, and the support rod 210 moves upward. The hinge point position of 08 changes, assisting in the buffering process, enabling the entire buffer mechanism 2 to smoothly absorb and disperse the impact force generated during the stamping process, protecting the mold and equipment. After the stamping device 103 completes the stamping action, it drives the upper mold 104 to move upward and reset. Under the action of the buffer mechanism 2, the lower mold 213 will also smoothly return to its initial position. At this time, the processed hardware can be taken out, completing one stamping cycle. The buffer mechanism 2, through the coordinated action of components such as the hydraulic damper 209, the first support 204, and the second support 210, can effectively absorb and disperse the huge impact force generated during the stamping process. The large impact force reduces rigid collisions between the upper mold 104 and the lower mold 213, reduces the risk of mold wear and damage, extends the service life of the mold, and reduces mold replacement costs. By connecting the air head 215, gas or liquid can be injected into the sealing frame 205 to adjust the pressure inside the sealing frame 205, thereby changing the buffering performance of the buffer mechanism 2. This adjustability allows the stamping die to adapt to the processing of hardware parts with different materials, thicknesses, and stamping process requirements, improving the versatility and adaptability of the die and reducing the time and cost consumption caused by changing the die or adjusting equipment parameters.

[0041] Example 2

[0042] Please see Figure 1 , Figure 2 , Figure 3 , Figure 4 Furthermore, based on Embodiment 1, the anti-slip mechanism 3 includes an anti-slip pad 301.

[0043] Specifically, the anti-slip pad 301 is adhered to the bottom of the support platform 101.

[0044] Through the above technical solution, the stamping die is placed in a suitable working position to ensure that the support platform 101 is placed stably. Since the bottom of the support platform 101 is bonded with an anti-slip pad 301, the anti-slip pad 301 can increase the friction with the worktable surface, prevent the die from sliding due to the impact force of the stamping device 103 during use, and ensure the stability of the die.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations may be made to these embodiments without departing from the principles and spirit, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A stamping die for machining of a hardware piece, comprising a stamping mechanism (1), characterized in that: The stamping mechanism (1) is provided with a buffer mechanism (2), and the bottom of the stamping mechanism (1) is provided with an anti-slip mechanism (3); The stamping mechanism (1) includes a support platform (101), a support plate (102) is fixedly connected to the rear of the support platform (101), a stamping device (103) is installed at the top front end of the support plate (102), and an upper mold (104) is fixedly connected to the output end of the stamping device (103). The buffer mechanism (2) includes a support base (201), a first support block (202) is fixedly connected to the top of the support base (201), and first hinge seats (203) are fixedly connected to the left and right sides of the top of the support base (201). First brackets (204) are hinged to the front and rear ends of the first hinge seats (203). A sealing frame (205) is provided on the top of the first support block (202), and support frames (206) are fixedly connected to the left and right sides of the sealing frame (205). Sliding grooves are provided on the inner walls of the upper and lower ends of the two support frames (206), and the two support frames (206) slide through the sliding grooves on the inner walls of the upper and lower ends. The two sliders (207) are connected to each other. Support rods (208) are fixedly connected to both ends of the two sliders (207). Hydraulic dampers (209) are fixedly connected to opposite sides of the inner walls of the two support frames (206). Second brackets (210) are hinged to the surfaces of the four support rods (208). A second support block (211) is provided on the top of the sealing frame (205). A top plate (212) is fixedly connected to the top of the second support block (211). A lower mold (213) is fixedly connected to the top of the top plate (212) by bolts. Second hinge seats (214) are fixedly connected to the left and right sides of the bottom of the top plate (212). The anti-slip mechanism (3) includes an anti-slip pad (301).

2. The stamping die for hardware processing according to claim 1, characterized in that: The support base (201) is fixedly connected to the top of the support platform (101), and the ends of the four first brackets (204) away from the first hinge base (203) are respectively hinged to the four support rods (208).

3. The stamping die for machining of hardware according to claim 1, characterized in that: The sealing frame (205) has grooves at both the upper and lower ends that are adapted to the first support block (202) and the second support block (211). The second support block (211) and the first support block (202) are respectively inserted into the grooves at the upper and lower ends of the sealing frame (205).

4. The stamping die for machining of hardware according to claim 1, characterized in that: The ends of the two hydraulic dampers (209) away from the inner walls of the two support frames (206) are respectively fixedly connected to one side of the two sliders (207).

5. The stamping die for machining of hardware according to claim 1, characterized in that: The ends of the four second brackets (210) away from the support rod (208) are respectively hinged to the front and rear ends of the two second hinge seats (214).

6. The stamping die for machining of hardware according to claim 1, characterized in that: The sealing frame (205) is fixedly connected to the front end of the air connector (215).

7. The stamping die for machining of hardware according to claim 1, characterized in that: The anti-slip pad (301) is adhered to the bottom of the support platform (101).