A dual-head laser soldering device

Abstract

A dual-head laser soldering device includes a machine platform with a conveying mechanism arranged on it. The conveying mechanism has a conveying channel extending in a predetermined direction. A soldering mechanism is also arranged on the machine platform, comprising two soldering assemblies arranged side-by-side along the conveying direction for soldering workpieces. Each soldering assembly includes a three-axis drive assembly and a soldering unit mounted on the three-axis drive assembly. Each soldering unit includes a hollow solder wire needle and a laser generating assembly for irradiating the tip of the solder wire needle with a laser beam to melt the solder wire extending from the tip of the solder wire needle. This technical solution employs non-contact laser welding, resulting in a high degree of cleanliness of the solder joints after welding. Excessive oxidation and reduced lifespan due to contact heating on the laser generating assembly are avoided, thus ensuring the overall service life of the equipment.

Description

Technical Field

[0001] This utility model relates to the field of soldering equipment technology, specifically to a dual-head laser soldering device. Background Technology

[0002] Soldering is a common welding method in the manufacturing process of electronic products. It involves heating and melting solder wire, which then penetrates and fills the gaps between metal parts, thereby ensuring the reliability of the weld and its electrical conductivity.

[0003] The current welding method is contact welding, which involves the soldering iron and solder coming into contact to heat and melt the solder wire to weld the metal parts. However, because the soldering iron needs to be in contact with the metal parts and the solder wire, when the soldering iron is removed from the welding position after welding, it will carry away a piece of solder, which can easily cause a tail at the solder joint. At the same time, during frequent welding operations, the soldering iron is prone to oxidation or the generation of impurities, which affects the lifespan of the soldering iron.

[0004] Therefore, there is an urgent need for a technology to solve the above-mentioned technical problems. Utility Model Content

[0005] One objective of this invention is to provide a dual-head laser soldering device to solve the aforementioned technical problems. The invention adopts the following technical solution: A dual-head laser soldering device includes a machine platform with a conveying mechanism arranged on the platform. The conveying mechanism has a conveying channel extending in a predetermined direction to convey workpieces in the predetermined direction. A soldering mechanism is arranged on the machine platform, including two soldering assemblies arranged side by side along the conveying direction for soldering workpieces. Each soldering assembly includes a three-axis drive assembly and a soldering unit mounted on the three-axis drive assembly. The soldering unit is driven by the three-axis drive assembly to reciprocate along the X, Y, and Z axes. Each soldering unit includes a hollow solder wire needle and a laser generating assembly for irradiating the tip of the solder wire needle with a laser beam to melt the solder wire extending from the tip of the solder wire needle.

[0006] Furthermore, the soldering unit also includes a mounting plate, which is mounted on the three-axis drive assembly, and the solder wire needle and the laser generating assembly are mounted on the mounting plate.

[0007] Furthermore, a support structure for supporting the solder wire needle is provided on the mounting plate. The support structure includes a connecting block rotatably connected to the mounting plate and a connecting rod rotatably connected to the connecting block. The solder wire needle is movably mounted on the end of the connecting rod, and the rotation axes of the connecting block and the connecting rod are not the same.

[0008] Furthermore, a solder breaker and solder feeder are also provided on the mounting plate, which is used to provide solder wire to the solder wire needle.

[0009] Furthermore, the machine tool is also equipped with a positioning mechanism that is used opposite to the two solder assemblies to clamp and fix the workpiece to be processed. The positioning mechanism includes: The top plate is provided with clearance holes for the workpiece to be processed to pass through from bottom to top; The lifting assembly is located below the conveying channel and includes two stop plates located on both sides of the conveying channel and a lifting drive device that is simultaneously connected to the two stop plates and drives them to reciprocate in the vertical direction.

[0010] Furthermore, the positioning mechanism also includes a clamping cylinder mounted on the top plate. Two clamping arms, located on both sides of the clearance hole, are driven to the clamping cylinder. The two clamping arms move towards each other under the drive of the clamping cylinder to clamp or release the workpiece to be processed.

[0011] Furthermore, the lifting drive device includes: A primary drive unit includes a base plate fixedly mounted on the lower surface of the machine tool via several guide rods, a first drive cylinder fixedly mounted on the base plate, and an intermediate plate slidably connected to the guide rods and drivenly connected to the first drive cylinder. The two-stage drive unit includes a second drive cylinder fixedly mounted on the intermediate plate, and an upper plate pulsably connected to the guide rod and pulsarily connected to the second drive cylinder. The stop plate is fixedly mounted on the upper plate.

[0012] The beneficial effects of this utility model are as follows: This embodiment provides a dual-head laser soldering device. During soldering, the workpiece is conveyed by a conveying mechanism along a predetermined direction. After moving to the position corresponding to the soldering assembly, the soldering unit moves under the drive of a three-axis drive assembly, aligning the solder wire needle with the solder point position of the workpiece. Solder wire extends from the end of the solder wire needle. At this time, the laser generating assembly emits a laser beam and irradiates the solder wire at the end of the solder wire needle, heating it to melt so that the molten solder can flow to the solder point position on the workpiece and fill the gaps between the metal parts. By setting two parallel soldering assemblies, simultaneous soldering can be performed on different positions on the workpiece, thereby improving the efficiency of soldering.

[0013] This technical solution employs non-contact laser welding, which results in a high degree of cleanliness of the weld joints after welding, eliminating the appearance of weld tails. Furthermore, because it is non-contact welding, the laser generating components are not subject to excessive oxidation or reduced lifespan due to contact heating, thus ensuring the cleanliness of the weld joints and the overall service life of the equipment. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the welding assembly in this utility model.

[0016] Figure 3 This is a schematic diagram of the conveying mechanism and the positioning mechanism in this utility model.

[0017] Figure 4 This is a schematic diagram of the positioning mechanism in this utility model.

[0018] Figure 5 This is a schematic diagram of the lifting component in this utility model.

[0019] In the diagram: 100-Machine base; 200-Conveying mechanism; 201-Conveying channel; 300-Welding mechanism; 310-Welding assembly; 320-Three-axis drive assembly; 330-Soldering unit; 331-Solder wire needle; 332-Laser generator assembly; 333-Mounting plate; 334-Connecting block; 335-Connecting rod; 336-Solder breaking and feeding device; 400-Positioning mechanism; 410-Top plate; 411-Allowing hole; 420-Lifting assembly; 421-Stop plate; 430-Lifting drive device; 412-Clamping cylinder; 413-Clamping arm; 431-First-stage drive unit; 4311-Guide rod; 4312-Base plate; 4313-First drive cylinder; 4314-Intermediate plate; 432-Second-stage drive unit; 4321-Second drive cylinder; 4322-Upper plate. Detailed Implementation

[0020] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0021] This utility model embodiment provides a dual-head laser soldering device. Two soldering components 310 are arranged side-by-side along the conveying direction of the conveying mechanism 200 to perform soldering on the products to be processed conveyed by the conveying mechanism 200. Specifically, a soldering needle 331 for conveying solder wire and a laser generating component 332 for emitting laser beams are arranged on the three-axis drive component 320. During the soldering process, the end of the soldering needle 331 is pre-positioned to correspond to the soldering point. When the product to be processed flows through the soldering needle 331... At the corresponding position, the laser generating component 332 emits a laser beam to heat and melt the solder wire at the end of the soldering needle 331. This allows the molten solder to flow onto the welding position of the workpiece. The non-contact welding method using laser beams avoids the formation of solder tails at the solder joint. Furthermore, since the heating and melting of the solder wire is done using non-contact laser heating, excessive oxidation of the laser generating component 332 due to solder will not occur, thus preventing a reduction in its lifespan. This ensures the cleanliness of the solder joint and extends the service life of the equipment.

[0022] Specifically, such as Figure 1-5As shown, a dual-head laser soldering device provided in this embodiment includes a machine platform 100, a conveying mechanism 200 arranged on the machine platform 100, a conveying channel 201 extending in a predetermined direction to convey workpieces in the predetermined direction, a soldering mechanism arranged on the machine platform 100, the soldering mechanism including two soldering components 310 arranged side by side along the conveying direction for soldering workpieces, the soldering components 310 including a three-axis drive component 320 and a soldering unit 330 mounted on the three-axis drive component 320, and the soldering unit 330 is driven by the three-axis drive component 320 to reciprocate along the X, Y, and Z axes, the soldering unit 330 including a hollow solder wire needle 331 and a laser generating component 332 for irradiating the end of the solder wire needle 331 with a laser beam to melt the solder wire extending from the end of the solder needle 331.

[0023] During the soldering process, the workpiece to be processed is conveyed by the conveying mechanism 200 along a predetermined direction. After moving to the position corresponding to the soldering assembly 310, the soldering unit 330 moves under the drive of the three-axis drive assembly 320, so that the solder wire needle 331 corresponds to the soldering point position of the workpiece to be processed, and the solder wire extends from the end of the solder wire needle 331. At this time, the laser generating assembly 332 emits a laser beam and irradiates the solder wire located at the end of the solder wire needle 331, heating it to melt so that the molten solder can flow to the soldering point position of the workpiece to be processed and fill the gaps between the metal parts. By setting two soldering assemblies 310 side by side, synchronous soldering processing can be performed on different positions on the workpiece to be processed, thereby improving the efficiency of soldering processing.

[0024] It is worth noting that the laser generating component 332 used in this embodiment can be implemented using existing technical solutions, and is not limited in this embodiment.

[0025] This technical solution employs non-contact laser welding, which results in a high degree of cleanliness of the weld joints after welding, eliminating the appearance of weld tails. Furthermore, because it is a non-contact welding method, the laser generating component 332 is protected from excessive oxidation and reduced lifespan caused by contact heating, thus ensuring the cleanliness of the weld joints and the overall service life of the equipment.

[0026] In this embodiment, to facilitate the installation of the welding unit, such as Figure 2 As shown, the soldering unit 330 also includes a mounting plate 333, which is mounted on the three-axis drive assembly 320, and the soldering needle 331 and the laser generating assembly 332 are mounted on the mounting plate 333.

[0027] During the welding process, the position of the welding wire needle 331 needs to be adjusted. In order to deliver the welding wire to the welding point more accurately, in this embodiment, a support structure for supporting the welding wire needle 331 is also provided on the mounting plate 333. The support structure includes a connecting block 334 rotatably connected to the mounting plate 333 and a connecting rod 335 rotatably connected to the connecting block 334. The welding wire needle 331 is movably mounted on the end of the connecting rod 335. The rotation axes of the connecting block 334 and the connecting rod 335 are not the same.

[0028] By setting a connecting block 334 and a connecting rod 335 that rotate in opposite directions on the mounting plate 333, and by making the axes of rotation of the connecting block 334 and the connecting rod 335 different, the welding wire needle 331 can be universally adjusted, and the welding wire needle 331 can be easily adjusted to any angle to facilitate the alignment of the welding point.

[0029] In this embodiment, in order to perform continuous soldering operations, a solder wire feeder 336 is also provided on the mounting plate 333. The solder wire feeder 336 is used to provide solder wire to the soldering needle 331. By feeding the solder wire through the solder wire feeder 336 and perforating the solder wire, continuous solder feeding can be achieved, and at the same time, the phenomenon of "solder bursting" during the soldering process can be avoided.

[0030] During the welding process, in order to ensure that the workpiece to be welded is welded under certain stable conditions, such as... Figure 3-5 As shown, in this embodiment, the machine base 100 is also equipped with a positioning mechanism 400 that is used opposite to the two soldering components 310 to clamp and fix the workpiece to be processed. The positioning mechanism 400 includes a top plate 410 and a lifting component 420. The lifting component 420 lifts the workpiece to be processed above the conveying channel 201, thereby separating it from the conveying mechanism 200. This ensures that the workpiece to be processed is suspended and remains stable, which facilitates soldering. Specifically, the top plate 410 is provided with a clearance hole 411 for the workpiece to be processed to pass through from bottom to top. The lifting component 420 is located below the conveying channel 201 and includes two stop plates 421 located on both sides of the conveying channel 201 and a lifting drive device 430 that is simultaneously connected to the two stop plates 421 and drives them to move back and forth in the vertical direction.

[0031] During the process of fixing the workpiece to be processed, after the workpiece to be processed is transported to the position corresponding to the positioning mechanism 400, the lifting drive device 430 stops the plate 421 and lifts it, thereby touching both sides of the workpiece to be processed and lifting it up, and passing through the clearance hole 411 of the top plate 410, thereby restricting the workpiece to be processed and keeping it fixed. At the same time, the workpiece to be processed passing through the clearance hole 411 can facilitate the soldering assembly 310 to perform soldering processing.

[0032] In order to further ensure the stability of the workpiece to be processed, the positioning mechanism 400 also includes a clamping cylinder 412 mounted on the top plate 410. Two clamping arms 413 located on both sides of the clearance hole 411 are connected to the clamping cylinder 412. The two clamping arms 413 move towards each other under the drive of the clamping cylinder 412 to clamp or release the workpiece to be processed.

[0033] In other words, after the lifting assembly 420 lifts the workpiece to be processed and it protrudes through the clearance hole 411, the clamping cylinder 412 drives the two clamping arms 413 to clamp the workpiece to be processed, thereby fixing it to the top plate 410, thus ensuring that the workpiece to be processed can be welded stably. At the same time, the lifting assembly 420 can also fall back to its original position.

[0034] In this embodiment, the lifting assembly 420 is used to lift the workpiece to be processed located above the conveying mechanism 200, thereby separating it from the conveying mechanism 200 and transferring it above the top plate 410 where it is clamped and fixed by the clamping cylinder 412. To ensure that the workpiece to be processed is stably lifted and clamped by the clamping cylinder 412 during the lifting process, the lifting drive device 430 in this embodiment is configured as a two-stage lifting structure. The first stage can quickly lift the workpiece to be processed, and the second stage is used for slow and precise lifting and conveying with a small stroke. In this embodiment, as... Figure 5 As shown, the lifting drive device 430 includes a primary drive unit 431 and a secondary drive unit 432. The primary drive unit 431 includes a base plate 4312 fixedly mounted on the lower surface of the machine base 100 via several guide rods 4311. A first drive cylinder 4313 is fixedly mounted on the base plate 4312. The secondary drive unit includes an intermediate plate 4314 slidably connected to the guide rods 4311 and driven by the first drive cylinder 4313. The secondary drive unit includes a second drive cylinder 4321 fixedly mounted on the intermediate plate 4314. The secondary drive unit includes an upper plate 4322 slidably connected to the guide rods 4311 and driven by the second drive cylinder 4321. A stop plate 421 is fixedly mounted on the upper plate 4322.

[0035] During the lifting action, the first drive cylinder 4313 pushes the upper intermediate plate 4314 and the headphone drive unit mounted on the intermediate plate 4314 upward, so that the stop plate 421 can quickly rise to the position corresponding to the workpiece to be processed. At this time, the second drive cylinder 4321 drives the top plate 410 to slowly lift the stop plate 421, so that the stop plate 421 and the two ends of the workpiece to be processed come into contact with each other and then move upward, so that the workpiece to be processed extends out along the clearance hole 411 and is clamped and fixed by the clamping arm 413.

[0036] The two-stage lifting method can improve the lifting efficiency and ensure the stability of the lifting of the workpiece to be processed.

[0037] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the present utility model without departing from the scope of the present utility model shall fall within the scope of the present utility model.

Claims

1. A dual-head laser soldering device, comprising a machine table, a conveying mechanism arranged on the machine table, the conveying mechanism being provided with a conveying channel extending in a predetermined direction to convey workpieces in the predetermined direction, characterized in that, A soldering mechanism is arranged on the machine base. The soldering mechanism includes two soldering assemblies arranged side by side along the conveying direction for soldering workpieces. Each soldering assembly includes a three-axis drive assembly and a soldering unit mounted on the three-axis drive assembly. The soldering unit is driven by the three-axis drive assembly to reciprocate along the X, Y, and Z axes. The soldering unit includes a hollow solder wire needle and a laser generating assembly for irradiating the tip of the solder wire needle with a laser beam to melt the solder wire extending from the tip of the solder wire needle.

2. The double-head laser soldering apparatus of claim 1, wherein, The soldering unit also includes a mounting plate, which is mounted on the three-axis drive assembly, and the solder wire needle and the laser generating assembly are mounted on the mounting plate.

3. The dual-head laser soldering apparatus of claim 2, wherein, The mounting plate is further provided with a support structure for supporting the solder wire needle. The support structure includes a connecting block rotatably connected to the mounting plate and a connecting rod rotatably connected to the connecting block. The solder wire needle is movably mounted on the end of the connecting rod. The rotation axes of the connecting block and the connecting rod are not the same.

4. The dual-head laser soldering apparatus of claim 3, wherein, A solder breaker and solder feeder is also provided on the mounting plate, which is used to provide solder wire to the solder wire needle.

5. The dual-head laser soldering apparatus of claim 1, wherein, The machine tool is also equipped with a positioning mechanism that is used opposite to the two solder assemblies to clamp and fix the workpiece to be processed. The positioning mechanism includes: The top plate is provided with clearance holes for the workpiece to be processed to pass through from bottom to top; The lifting assembly is located below the conveying channel and includes two stop plates located on both sides of the conveying channel and a lifting drive device that is simultaneously connected to the two stop plates and drives them to reciprocate in the vertical direction.

6. A double-head laser soldering apparatus according to claim 5, wherein The positioning mechanism also includes a clamping cylinder mounted on the top plate. Two clamping arms are drivenly connected to the clamping cylinder and are located on both sides of the clearance hole. The two clamping arms move towards each other under the drive of the clamping cylinder to clamp or release the workpiece to be processed.

7. The dual-head laser soldering apparatus of claim 5, wherein, The lifting drive device includes: A primary drive unit includes a base plate fixedly mounted on the lower surface of the machine tool via several guide rods, a first drive cylinder fixedly mounted on the base plate, and an intermediate plate slidably connected to the guide rods and drivenly connected to the first drive cylinder. The two-stage drive unit includes a second drive cylinder fixedly mounted on the intermediate plate, and an upper plate pulsably connected to the guide rod and pulsarily connected to the second drive cylinder. The stop plate is fixedly mounted on the upper plate.

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