A solder shielding mesh for a selective wave soldering fixture

Abstract

This utility model discloses a solder stencil for selective wave soldering, comprising a soldering station and a receiving cavity disposed below the processing surface of the soldering station. The processing surface of the soldering station is provided with several titanium alloy solder stencils, each of which is connected to the receiving cavity below. Aluminum alloy solder stencils possess excellent non-soldering properties; their surface has extremely low affinity for molten solder, effectively blocking solder diffusion. During soldering, the solder stencil precisely covers the pins and pads of the component being soldered, forming a physical isolation barrier to prevent solder bridging or spatter, thereby significantly reducing the failure rate of soldering short circuits. Compared to traditional aluminum alloys or other metal materials, titanium alloys, while ensuring mechanical strength, also possess more stable corrosion resistance and a longer service life, making them particularly suitable for high-density, high-precision selective wave soldering processes.

Description

Technical Field

[0001] This utility model relates to the field of tin separators, and in particular to a tin separator for a selective wave soldering fixture. Background Technology

[0002] In the design and application of selective wave soldering fixtures, preventing solder bridging in high-density components such as rectangular connectors and pin headers is a key challenge. Currently, a common solution is to use embedded tinplate as a solder drag strip. By placing a metal strip of a specific shape at the end of the soldering area, its good thermal conductivity and solderability guide the molten solder to flow in a predetermined direction, thereby effectively "stealing" excess solder accumulated between the pins at the end of the component and avoiding the formation of short circuit defects.

[0003] In practical production applications, parameters such as the installation position, tilt angle, and immersion depth of the solder drag have a decisive impact on the soldering quality. Fixture design engineers need to determine the optimal installation coordinates of the solder drag through precise calculations based on different component layouts and PCB board thicknesses. During the equipment debugging phase, process engineers need to repeatedly adjust the contact angle between the solder drag and the solder joint and precisely control the immersion depth. These fine adjustments often require a significant amount of time to achieve the ideal solder dragging effect.

[0004] However, traditional tinplate soldering sheets have obvious drawbacks: because their surface is prone to tin adhesion, they often stick to the solder joints during the soldering process, making it difficult to separate the PCBA board from the fixture; long-term exposure to high-temperature solder and flux environments will gradually corrode the material and change its surface properties, which will not only reduce soldering efficiency but also affect the consistency of soldering. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a solder stencil for a selective wave soldering fixture, which solves the aforementioned problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a solder stencil for a selective wave soldering fixture, comprising a soldering station and a receiving cavity disposed below the processing surface of the soldering station, wherein the processing surface of the soldering station is provided with a plurality of titanium alloy solder stencils, and the lower part of each titanium alloy solder stencil is connected to the receiving cavity.

[0007] Furthermore, the titanium alloy tin-insulating mesh includes a frame and a machining opening on the frame, with several reinforcing ribs inside the machining opening.

[0008] Furthermore, the thickness of the reinforcing ribs is 0.4mm-0.8mm.

[0009] Furthermore, the width of the reinforcing rib is at least 0.3 mm.

[0010] Furthermore, the reinforcing ribs are arranged in a cross shape.

[0011] Furthermore, the reinforcing ribs are multiple transverse plates that are equidistantly distributed.

[0012] Furthermore, at least one of the multiple transverse plates is a double-layer plate, and there is a gap between the two plates of the double-layer plate.

[0013] Furthermore, the reinforcing ribs are arranged in a grid pattern.

[0014] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, the aluminum alloy tin-shielding mesh has excellent non-tinning characteristics. Its surface has extremely low affinity with molten solder, which can effectively block the diffusion of solder. During the welding process, the tin-shielding mesh precisely covers the pins and pads of the component being welded, forming a physical isolation barrier to prevent solder bridging or splashing, thereby significantly reducing the failure rate of short circuits in welding. Compared with traditional aluminum alloys or other metal materials, titanium alloys, while ensuring mechanical strength, also have more stable corrosion resistance and a longer service life, making them particularly suitable for high-density, high-precision selective wave soldering processes.

[0015] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a plan view of Embodiment 1 of this utility model.

[0017] Explanation of reference numerals in the attached diagram: Spacing a; Soldering station 10, receiving cavity 11; Titanium alloy tin-insulating mesh 20, frame 21, machining port 22, reinforcing rib 23, horizontal plate 231, double-layer plate 2311. Detailed Implementation

[0018] Please refer to Figure 1As shown, this invention illustrates the specific structure of a preferred first embodiment of the present invention, which is a solder stencil for a selective wave soldering fixture. It includes a soldering station 10 and a receiving cavity 11 located below the processing surface of the soldering station 10. The processing surface of the soldering station 10 is provided with a plurality of titanium alloy solder stencils 20, each of which communicates with the receiving cavity 11 below. The titanium alloy solder stencils 20 have excellent solder-resistant properties; their surface has extremely low affinity for molten solder, effectively blocking solder diffusion. During the soldering process, the solder stencils 20 precisely cover the pins and pads of the component being soldered, forming a physical isolation barrier to prevent solder bridging or splashing, thereby significantly reducing the failure rate of short circuits. Compared to traditional aluminum alloys or other metal materials, titanium alloys, while ensuring mechanical strength, also possess more stable corrosion resistance and a longer service life, making them particularly suitable for high-density, high-precision selective wave soldering processes.

[0019] In addition, the mesh size of the solder barrier 20 can be optimized according to the pin spacing of different components to ensure that it can effectively block solder without affecting the heat conduction and solder joint formation quality, thereby improving the soldering yield and reducing the amount of manual solder joint trimming work, thus improving the overall production efficiency.

[0020] For example, the titanium alloy tin-insulating mesh 20 includes a frame 21 and a processing opening 22 on the frame 21, with a plurality of reinforcing ribs 23 provided in the processing opening 22. The core function of the ribs 23 is to precisely isolate adjacent solder pins. Their width and spacing are strictly calculated to form a physical barrier during the soldering process, effectively preventing molten solder from flowing between adjacent pins, thereby avoiding bridging short circuits.

[0021] In addition, the height of the isolation rib 23 is slightly higher than the component lead, ensuring that the solder wave contact only acts on the target solder joint and does not overflow into adjacent areas.

[0022] The thickness of the reinforcing rib 23 is 0.4mm-0.8mm.

[0023] The width of the reinforcing rib 23 is at least 0.3 mm.

[0024] The reinforcing rib 23 is cross-shaped.

[0025] The reinforcing ribs 23 are multiple transverse plates 231 that are equidistantly distributed.

[0026] The multiple transverse plates 231 include at least one double-layer plate 2311, and the two plates of the double-layer plate 2311 have a spacing a between them.

[0027] The reinforcing rib 23 is in the form of a grid.

[0028] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A solder shield for a selective wave soldering fixture, comprising a soldering station (10) and a receiving cavity (11) disposed below the processing surface of the soldering station (10), characterized in that: The processing surface of the soldering station (10) is provided with several titanium alloy tin-insulating meshes (20), and the bottom of each titanium alloy tin-insulating mesh (20) is connected to the receiving cavity (11).

2. The solder stencil for a selective wave soldering fixture according to claim 1, characterized in that: The titanium alloy tin-insulating mesh (20) includes a frame (21) and a processing opening (22) on the frame (21), and the processing opening (22) is provided with a number of reinforcing ribs (23).

3. The solder stencil for a selective wave soldering fixture according to claim 2, characterized in that: The thickness of the reinforcing rib (23) is 0.4mm-0.8mm.

4. The solder stencil for a selective wave soldering fixture according to claim 2, characterized in that: The width of the reinforcing rib (23) is at least 0.3 mm.

5. The solder stencil for a selective wave soldering fixture according to claim 2, characterized in that: The reinforcing rib (23) is cross-shaped.

6. The solder stencil for a selective wave soldering fixture according to claim 2, characterized in that: The reinforcing rib (23) is a number of horizontally distributed plates (231).

7. The solder stencil for a selective wave soldering fixture according to claim 6, characterized in that: The plurality of transverse plates (231) include at least one double-layer plate (2311), and the two plates of the double-layer plate (2311) have a gap (a) between them.

8. The solder stencil for a selective wave soldering fixture according to claim 2, characterized in that: The reinforcing rib (23) is in the form of a grid.

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