A grinding assembly for semiconductor packaging processing
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2026-08-14
AI Technical Summary
[0004]鉴于上述现有传统打磨方式因砂纸颗粒度均匀性不足且人工操作力度与精度不可控,导致打磨溢料时易划伤塑封体树脂面完好区域、降低产品良率的问题,提出了本实用新型
[0012]1、本实用新型在传统打磨溢料的基础上再利用该设备进行打磨处理,通过羊毛打磨头进行打磨处理,由于羊毛具有柔软的纤维结构,可以用于封装表面复杂的形状表面处理,能够快速去除和修复半导体封装树脂材料表面的划伤,且不损伤其他位置的树脂材料和框架金属材料,使用羊毛打磨头进行打磨的方式,减少了对产品的划伤,满足高标准的半导体封装外观要求,提高了产品良率。
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Figure CN224630448U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging and processing technology, and in particular to a polishing component for semiconductor packaging and processing. Background Technology
[0002] In the manufacturing process of rectangular flat no-lead packages, overflow is a common packaging anomaly. Overflow refers to the excess resin material overflowing from the package during semiconductor packaging, forming irregular edges or burrs in the metal functional areas. This severely affects the appearance and dimensional accuracy of the packaged product and can also interfere with subsequent soldering and board mounting processes. Therefore, removing overflow is a critical step in the packaging process of rectangular flat no-lead packages, playing an important role in ensuring product quality and performance.
[0003] Currently, the traditional polishing method uses sandpaper to polish the resin surface of the encapsulant to remove excess material. The mechanical friction between the sandpaper particles and the excess material removes the excess material. However, this method has obvious drawbacks. Because it is difficult to ensure the uniformity of sandpaper particle size, and the force and precision cannot be effectively controlled during manual operation, sandpaper particles are very likely to accidentally touch the intact areas of the resin surface of the encapsulant during the polishing process, causing irreparable scratches. These scratches are easily identified during product appearance inspection, resulting in a large number of products being judged as defective products with abnormal appearance, which greatly reduces the product yield. Utility Model Content
[0004] In view of the problems that existing traditional sanding methods have, due to insufficient uniformity of sandpaper particles and uncontrollable manual operation force and precision, it is easy to scratch the intact area of the resin surface of the molding compound and reduce the product yield when sanding overflows, so this utility model is proposed.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a polishing assembly for semiconductor packaging processing, including a polishing pen, a drive motor is fixedly installed inside one end of the polishing pen, a metal connecting rod connected to the drive motor is provided at one end of the polishing pen, a wool polishing head is connected to the end of the metal connecting rod away from the polishing pen, and a connecting mechanism connected to the polishing pen and the output end of the drive motor is movably installed at one end of the polishing pen.
[0006] As a preferred embodiment, the connecting mechanism includes a connecting seat located inside the polishing pen barrel, with one end of the connecting seat fixedly connected to the output end of a drive motor. A connecting sleeve is movably fitted inside the polishing pen barrel on the outer side of the connecting seat. A first chamber and a second chamber are respectively formed on the upper and lower inner walls of the connecting sleeve. A spring and a baffle are respectively fitted on the upper and lower outer walls of the connecting seat within the first chamber. Insert rods are symmetrically arranged within the second chamber, with one end of the insert rod penetrating the side wall of the connecting seat. One end of a metal connecting rod is located inside the connecting seat. Slots adapted to the insert rod are symmetrically formed on the outer wall of the metal connecting rod. The insert rod is located away from the metal... The connecting rod has a groove at one end, and a matching extrusion rod is provided in the groove. The upper end of the extrusion rod is fixedly connected to the top wall of the second chamber. A limiting frame is provided on the outside of the insertion rod, and one end of the limiting frame is fixedly connected to the connecting seat. A second spring is provided on the inside of the limiting frame, and both ends of the second spring are fixedly connected to the insertion rod and the limiting frame, respectively. A limiting rod is provided on the outside of the limiting frame, and the limiting rod is hook-shaped. The upper end of the limiting rod is fixedly connected to the top wall of the second chamber. A limiting groove matching the limiting rod is provided on one side of the bottom of the insertion rod. A receiving groove is provided at the bottom of the second chamber, and the lower end of the limiting rod is located in the receiving groove.
[0007] As a preferred embodiment, the insert rod is rectangular, the extrusion groove is a right-angled trapezoid, and the lower end of the extrusion rod is provided with an inclined surface that matches the inclined inner wall surface of the extrusion groove.
[0008] As a preferred embodiment, the baffle is fixedly connected to the connecting seat, the outer wall of the baffle is symmetrically provided with sliders, and the inner wall of the chamber is symmetrically provided with grooves adapted to the sliders.
[0009] As a preferred embodiment, the limiting frame is U-shaped, and the two side walls of the extrusion groove are provided with guide grooves that are adapted to the limiting frame.
[0010] As a preferred embodiment, a guide post is fixedly installed at the bottom of the connecting seat, and a mating groove adapted to the guide post is opened at the bottom of the metal connecting rod.
[0011] Compared with the prior art, the present invention has at least the following beneficial effects:
[0012] 1. This utility model further utilizes this equipment for polishing on the basis of traditional polishing of overflow material. The polishing is carried out by a wool polishing head. Due to the soft fiber structure of wool, it can be used for surface treatment of complex shapes on the packaging surface. It can quickly remove and repair scratches on the surface of semiconductor packaging resin material without damaging the resin material and frame metal material in other locations. The method of polishing with a wool polishing head reduces scratches on the product, meets the high standard of semiconductor packaging appearance requirements, and improves product yield.
[0013] 2. This utility model uses a connecting mechanism that allows the extrusion rod and limiting rod to move downwards by pushing the connecting sleeve, thus releasing the restriction on the insertion rod. Simultaneously, the extrusion rod presses against the inner wall of the extrusion groove, causing the insertion rod to move outwards and out of the slot, releasing the restriction on the metal connecting rod. This allows the metal connecting rod and the wool polishing head to be disassembled for replacement. When installing the metal connecting rod, repeat the above steps. After installing the metal connecting rod into the connecting seat, release the force applied to the connecting sleeve. The elastic force of springs one and two will reset the connecting seat and the insertion rod, allowing one end of the insertion rod to be inserted into the corresponding slot to fix and restrict the metal connecting rod, completing the installation of the metal connecting rod. This allows for convenient and quick assembly and disassembly of the metal connecting rod and the wool polishing head.
[0014] 3. By setting the guide post, this utility model can position and guide the metal connecting rod, and better transmit the power of the drive motor to the metal connecting rod. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0016] Figure 2 This is a partial cross-sectional structural diagram of the grinding pen barrel and the metal connecting rod of this utility model.
[0017] Figure 3 For the present utility model Figure 2 A magnified structural diagram of A in the middle;
[0018] Figure 4 This is a schematic diagram of the structure between the connecting seat, the insert rod, and the guide post of this utility model;
[0019] Figure 5 This is a schematic diagram of the structure of the metal connecting rod of this utility model;
[0020] Figure 6 This is a schematic diagram of the structure between the limiting rod and the insertion rod of this utility model.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1. Grinding pen barrel; 2. Metal connecting rod; 3. Wool grinding head; 4. Drive motor; 5. Connecting seat; 6. Connecting sleeve; 7. Chamber 1; 8. Baffle; 9. Spring 1; 10. Insert rod; 11. Extrusion rod; 12. Extrusion groove; 13. Chamber 2; 14. Limiting frame; 15. Slider; 16. Slide groove; 17. Guide groove; 18. Guide post; 19. Slot; 20. Connecting groove; 21. Spring 2; 22. Limiting rod; 23. Receiving groove; 24. Limiting groove. Detailed Implementation
[0023] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0024] Reference Figures 1-6 As shown, a polishing assembly for semiconductor packaging processing is provided, including a polishing pen 1. A drive motor 4 is fixedly installed inside one end of the polishing pen 1. A metal connecting rod 2 connected to the drive motor 4 is provided at one end of the polishing pen 1. A wool polishing head 3 is connected to the end of the metal connecting rod 2 away from the polishing pen 1. A connecting mechanism connected to the output end of the polishing pen 1 and the drive motor 4 is movably installed at one end of the polishing pen 1. The wool polishing head 3 adopts a soft fiber structure, which can adapt to the complex shape of the packaging surface, quickly repair scratches without damaging the resin and metal frame, reduce the risk of scratches, and improve product yield.
[0025] In this example, the connecting mechanism includes a connecting seat 5, which is located inside the polishing pen barrel 1. One end of the connecting seat 5 is fixedly connected to the output end of the drive motor 4. A connecting sleeve 6 is movably fitted inside the polishing pen barrel 1 on the outer side of the connecting seat 5. A first chamber 7 and a second chamber 13 are respectively opened on the upper and lower sides of the inner wall of the connecting sleeve 6. A first spring 9 and a baffle 8 are respectively fitted on the upper and lower sides of the outer wall of the connecting seat 5 inside the first chamber 7. Insert rods 10 are symmetrically arranged inside the second chamber 13, and one end of the insert rod 10 penetrates the side wall of the connecting seat 5. One end of the metal connecting rod 2 is located inside the connecting seat 5. A slot 19 adapted to the insert rod 10 is symmetrically opened on the outer wall of the metal connecting rod 2. A groove 12 is opened at the top of the end of the insert rod 10 away from the metal connecting rod 2. A groove 11 adapted to the groove 12 is provided inside the groove 12, and the upper end of the groove 11 is connected to the metal connecting rod 2. The top wall of the inner chamber 13 is fixedly connected. A limiting frame 14 is provided on the outer side of the insertion rod 10, and one end of the limiting frame 14 is fixedly connected to the connecting seat 5. A spring 21 is provided on the inner side of the limiting frame 14, and both ends of the spring 21 are fixedly connected to the insertion rod 10 and the limiting frame 14 respectively. A limiting rod 22 is provided on the outer side of the limiting frame 14, and the limiting rod 22 is hook-shaped. The upper end of the limiting rod 22 is fixedly connected to the top wall of the inner chamber 13. A limiting groove 24 adapted to the limiting rod 22 is opened on one side of the bottom of the insertion rod 10. A receiving groove 23 is opened at the bottom of the inner chamber 13, and the lower end of the limiting rod 22 is located in the receiving groove 23. By pushing the extrusion rod 11 to squeeze the extrusion groove 12 through the connecting sleeve 6, the insertion rod 10 can be quickly installed and disassembled to lock the metal connecting rod 2. The operation is convenient and efficient, and it is convenient to disassemble and replace the wool polishing head 3.
[0026] In this example, the insertion rod 10 is rectangular, the extrusion groove 12 is a right trapezoid, and the lower end of the extrusion rod 11 is provided with an inclined surface that matches the inclined inner wall surface of the extrusion groove 12. The right trapezoidal extrusion groove 12 and the inclined surface at one end of the extrusion rod 11 cooperate to achieve stable lateral movement of the insertion rod 10 through mechanical transmission, ensuring reliable connection.
[0027] In this example, the baffle 8 is fixedly connected to the connecting seat 5. The outer wall of the baffle 8 is symmetrically provided with sliders 15, and the inner wall of the chamber 7 is symmetrically provided with grooves 16 that are adapted to the sliders 15. The sliders 15 and the grooves 16 cooperate to restrict the movement direction of the baffle 8, ensure the stable transmission of the spring force of the spring 9, improve the smoothness of the operation of the connecting mechanism, and enable the connecting sleeve 6 and the connecting seat 5 to rotate synchronously.
[0028] In this example, the limiting frame 14 is U-shaped, and the two side walls of the extrusion groove 12 are provided with guide grooves 17 that are adapted to the limiting frame 14. The U-shaped limiting frame 14 and the guide grooves 17 cooperate to constrain the movement trajectory of the insertion rod 10, avoid deviation, and improve the stability and accuracy of the connection structure.
[0029] In this example, a guide post 18 is fixedly installed at the bottom of the connector 5, and a mating groove 20 adapted to the guide post 18 is opened at the bottom of the metal connecting rod 2. The guide post 18 and the mating groove 20 cooperate to accurately position the metal connecting rod 2, ensure the coaxiality of power transmission, and improve the stability of grinding operations.
[0030] During use, before polishing, place a lint-free cloth on the polishing table to protect the front plastic seal of the product. Replace the cloth according to the prescribed cycle, and replace it immediately if there is a lot of dust. Under normal inspection light, use sandpaper to polish the product pins and heat sink for 20 seconds on areas where the material is not resinous or dark black. After polishing, wipe the back of the product with an alcohol-soaked lint-free cloth. Then, hold the polishing pen 1 and tilt it at 30°-70°. Drive the metal connecting rod 2 and the wool polishing head 3 to rotate through the drive motor 4. Rotate the wool polishing head 3 at a speed of 20,000-25,000 rpm. Then, polish the polishing area with the side of the wool polishing head 3 for 10-15 seconds to remove scratches. Finally, wipe the back of the product again with an alcohol-soaked lint-free cloth to complete the entire polishing process. This ensures that the product meets the packaging process requirements. This method significantly reduces scratches and improves the product yield.
[0031] When it is necessary to disassemble the metal connecting rod 2 and the wool polishing head 3 for replacement of the wool polishing head 3, the connecting sleeve 6 can be pushed, causing it to move under the guidance of the connecting seat 5 and the slider 15. Simultaneously, the connecting sleeve 6, in conjunction with the baffle 8, will compress the spring 9. The connecting sleeve 6 will also cause the extrusion rod 11 and the limiting rod 22 to move downwards synchronously, causing one end of the limiting rod 22 to move out of the limiting groove 24, releasing the restriction on the insertion rod 10. Then, the inclined surface at the lower end of the extrusion rod 11, in conjunction with the extrusion groove 12, can compress and push the insertion rod 10 away from the connecting seat 5 under the limiting guidance of the limiting frame 14, compressing the spring 21. This causes one end of the insertion rod 10 inserted into the slot 19 to move out, releasing the restriction on the metal connecting rod 2, thus allowing the metal connecting rod 2 and the wool polishing head 3 to be disassembled. The wool polishing head 3 can then be installed. When grinding head 3, the above steps can be repeated. Then, insert the lower end of the metal connecting rod 2 into the connecting seat 5, and insert the guide post 18 into the mating groove 20 at the bottom of the metal connecting rod 2. By using the cooperation of the mating groove 20 and the guide post 18, the metal connecting rod 2 is guided and positioned. Then, release the thrust applied to the connecting sleeve 6. Under the elastic force of spring 1 9 and spring 2 21, the connecting sleeve 6 and the insert rod 10 will be reset and moved, so that one end of the insert rod 10 is inserted into the slot 19 opened on the outer wall of the metal connecting rod 2, which restricts and fixes it. At the same time, one end of the limiting rod 22 is inserted into the limiting groove 24 opened on the insert rod 10 to limit it, so as to prevent the insert rod 10 from moving out of the slot 19 due to centrifugal force, which would affect the fixing effect. Through the connecting mechanism, the wool grinding head 3 can be easily and quickly disassembled and replaced, which is highly practical.
[0032] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.
Claims
1. A polishing assembly for semiconductor package processing comprising a polishing pen shaft (1), characterized in that: A drive motor (4) is fixedly installed inside one end of the polishing pen (1). A metal connecting rod (2) connected to the drive motor (4) is provided at one end of the polishing pen (1). A wool polishing head (3) is connected to the end of the metal connecting rod (2) away from the polishing pen (1). A connecting mechanism connected to the output end of the polishing pen (1) and the drive motor (4) is movably installed at one end of the polishing pen (1).
2. The polishing assembly for semiconductor package processing according to claim 1, wherein: The connecting mechanism includes a connecting seat (5), which is located inside the polishing pen barrel (1). One end of the connecting seat (5) is fixedly connected to the output end of the drive motor (4). A connecting sleeve (6) is movably fitted inside the polishing pen barrel (1) on the outside of the connecting seat (5). A first chamber (7) and a second chamber (13) are respectively opened on the upper and lower walls of the inner wall of the connecting sleeve (6). A spring (9) and a baffle (8) are respectively fitted on the upper and lower walls of the outer wall of the connecting seat (5) inside the first chamber (7). Insert rods (10) are symmetrically arranged inside the second chamber (13). One end of the insert rod (10) penetrates the side wall of the connecting seat (5). One end of the metal connecting rod (2) is located inside the connecting seat (5). A slot (19) adapted to the insert rod (10) is symmetrically opened on the outer wall of the metal connecting rod (2). A groove (12) is opened on the top of the end of the insert rod (10) away from the metal connecting rod (2). The extrusion groove (12) is provided with an extrusion rod (11) adapted to the extrusion groove (12), and the upper end of the extrusion rod (11) is fixedly connected to the top wall of the inner chamber (13). The outer side of the insertion rod (10) is provided with a limiting frame (14), and one end of the limiting frame (14) is fixedly connected to the connecting seat (5). The inner side of the limiting frame (14) is provided with a spring (21), and the two ends of the spring (21) are respectively connected to the insertion rod (10) and the limiting frame (14). The limiting frame (14) is fixedly connected to the limiting rod (22) on the outside, and the limiting rod (22) is hook-shaped. The upper end of the limiting rod (22) is fixedly connected to the top wall of the second chamber (13). The bottom side of the insertion rod (10) is provided with a limiting groove (24) that is compatible with the limiting rod (22). The bottom of the second chamber (13) is provided with a receiving groove (23). The lower end of the limiting rod (22) is located in the receiving groove (23).
3. The polishing assembly for semiconductor package processing according to claim 2, wherein: The insertion rod (10) is rectangular, the extrusion groove (12) is a right trapezoid, and the lower end of the extrusion rod (11) is provided with an inclined surface that matches the inclined inner wall surface of the extrusion groove (12).
4. The polishing assembly for semiconductor package processing according to claim 3, wherein: The baffle (8) is fixedly connected to the connecting seat (5). The outer wall of the baffle (8) is symmetrically provided with sliders (15), and the inner wall of the first chamber (7) is symmetrically provided with grooves (16) that are adapted to the sliders (15).
5. The polishing assembly for semiconductor package processing of claim 4, wherein: The limiting frame (14) is U-shaped, and the two side walls of the extrusion groove (12) are provided with guide grooves (17) that are adapted to the limiting frame (14).
6. The polishing assembly for semiconductor package processing of claim 5, wherein: A guide post (18) is fixedly installed at the bottom of the connecting seat (5), and a mating groove (20) adapted to the guide post (18) is opened at the bottom of the metal connecting rod (2).