A wafer grinding apparatus and wafer grinding equipment

Abstract

This utility model discloses a wafer grinding apparatus and a wafer grinding device. The wafer grinding apparatus includes a grinding disc and a grinding head moving mechanism, which are spaced apart. The grinding disc is used to grind wafers. The grinding head moving mechanism includes a rotatable driving component and opposing grinding heads. The opposing grinding heads are located at both ends of the driving component and are used to adsorb or place wafers. The rotation of the driving component drives the opposing grinding heads to rotate synchronously. One grinding head transfers the wafer to the grinding disc for grinding, while the other grinding head transfers the ground wafer to the outside of the grinding disc. The wafer grinding device includes a wafer grinding apparatus, which has at least one wafer grinding apparatus, and there is a gap between adjacent wafer grinding apparatuses to prevent interference between the rotation of adjacent driving components. This utility model can improve wafer grinding efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer grinding device and wafer grinding equipment. Background Technology

[0002] Wafer grinding is one of the key processes in wafer manufacturing, which can remove and planarize excess material on the wafer surface.

[0003] In the existing technology, the grinding head and the grinding pad are in one-to-one correspondence. During the wafer grinding process, the grinding head needs to first pick up the wafer and then transfer it to the grinding head for grinding. When the grinding head picks up the wafer, the grinding pad does not perform wafer grinding, which results in the grinding pad not being fully utilized and the wafer grinding efficiency being reduced.

[0004] Therefore, it is necessary to provide a new type of wafer grinding apparatus and wafer grinding equipment to solve the above-mentioned problems existing in the prior art. Utility Model Content

[0005] The technical problem to be solved by this application is to provide a wafer grinding apparatus and wafer grinding equipment that can improve wafer grinding efficiency.

[0006] To solve the above-mentioned technical problems, according to an embodiment of this application, a wafer grinding apparatus is provided, including a grinding disc and a grinding head moving mechanism, wherein the grinding disc and the grinding head moving mechanism are spaced apart; the grinding disc is used for grinding wafers. The grinding head moving mechanism includes a rotatable driving component and grinding heads arranged opposite each other; the grinding heads arranged opposite each other are all located at both ends of the driving component, and the grinding heads are used to adsorb or place the wafer; The rotating component drives the oppositely arranged grinding heads to rotate synchronously. One of the grinding heads transfers the wafer to the grinding disk for grinding, while the other grinding head transfers the ground wafer to the outside of the grinding disk.

[0007] A wafer polishing apparatus includes a wafer polishing device, wherein at least one of the wafer polishing devices is provided in the wafer polishing apparatus, and there is a gap between two adjacent wafer polishing devices so that the rotation of adjacent driving components is not interfered with.

[0008] By adopting the above technical solution, grinding heads are set at both ends of the drive component. One grinding head drives the wafer to the grinding disk and grinds the wafer in cooperation with the grinding disk. The other grinding head can hold the un-grinded wafer. After the wafer at the grinding disk is ground, the grinding head drives the un-grinded wafer to the grinding disk for grinding. By setting two grinding heads, one grinding head can hold the wafer while the other grinding head is grinding, which improves the problem that a single grinding head cannot hold the wafer during grinding in the prior art. This allows the grinding disk to be fully utilized and improves the grinding efficiency of the wafer.

[0009] According to an embodiment of this application, it further includes an upper and lower plate mechanism, wherein one of the grinding heads corresponds to the position of the grinding disk, and the other grinding head corresponds to the position of the upper and lower plate mechanism; The rotating drive is used to drive the oppositely arranged grinding heads to rotate synchronously; the grinding head corresponding to the position of the grinding disk transfers the ground wafer to the loading and unloading mechanism; the grinding head corresponding to the position of the loading and unloading mechanism is used to transfer the unground wafer to the grinding disk for grinding.

[0010] According to an embodiment of this application, the direction of the line connecting the relatively disposed grinding heads is defined as a first direction; the grinding head moving mechanism further includes: A movable component is movably disposed on the driving component along a first direction. The movable component is connected to the grinding head and is used to drive the grinding head to move. A first driving member is disposed on the driving member and connected to the moving member to drive the moving member to move along the first direction.

[0011] According to an embodiment of this application, the driving member is provided with a driving groove, and the inner wall of the driving groove is provided with a limiting member along the first direction; The side wall of the movable component has a limiting groove, which is used to pass through the limiting component so that the movable component is movably disposed in the driving groove along the first direction.

[0012] According to an embodiment of this application, the movable component includes: The movable part is arranged opposite to each other, and the end face of the movable part is divided into a connecting area and a limiting area from the inside to the outside; A connecting protrusion is provided at one end in one of the connecting areas and at the other end in the other connecting area, so that the limiting area and the sidewall of the connecting protrusion, which are arranged opposite to each other, form the limiting groove.

[0013] According to an embodiment of this application, the axial direction of the grinding disc is a second direction; one end of the grinding head is movably disposed on the driving member along the second direction; the other end of the grinding head is provided with an adsorption member, which is used to adsorb the wafer.

[0014] According to an embodiment of this application, the movable component has a movable opening; the movable component is provided with a driving component, a portion of the driving component is movably disposed in the movable opening along the second direction and connected to the grinding head to drive the grinding head to rotate; the remaining portion of the driving component is disposed on the movable component to drive the grinding head to move along the second direction.

[0015] According to an embodiment of this application, the driving component includes: A sliding part is provided on the inner wall of the moving opening, which is movable along the second direction, and a mounting groove is provided on the sliding part; The second driving component is disposed in the mounting groove and connected to the grinding head to drive the grinding head to rotate; A third driving member is disposed on the moving member and connected to the sliding part to drive the sliding part, the second driving member, and the grinding head to move along the second direction.

[0016] According to an embodiment of this application, a plurality of adsorption elements are provided, and the plurality of adsorption elements are spaced apart at the end of the grinding head. Attached Figure Description

[0017] Figure 1 This is a schematic diagram showing the positional relationship between the drive component, the grinding disc, and the upper and lower wafer mechanism of a wafer grinding apparatus according to an embodiment of the present utility model. Figure 2 This is a schematic diagram illustrating a connection method of a movable component on a driving component according to an embodiment of the present utility model; Figure 3 This is a schematic diagram showing the installation position of a drive component according to an embodiment of the present utility model; Figure 4 This is a schematic diagram of the structure of a movable component according to an embodiment of the present utility model; Figure 5 This is a schematic diagram of the structure of a movable part according to an embodiment of the present utility model; Figure 6 This is a schematic diagram showing the positional relationship between two wafer grinding devices in a wafer grinding equipment according to an embodiment of the present invention. Figure 7 This is a schematic diagram showing the positional relationship of multiple wafer grinding devices in a wafer grinding equipment according to an embodiment of the present invention.

[0018] Figure label: 100. Grinding disc; 210. Driving component; 211. Driving groove; 212. Limiting component; 220. Grinding head; 221. Adsorption component; 230. Moving component; 231. Limiting groove; 232. Moving part; 233. Connecting area; 234. Limiting area; 235. Connecting protrusion; 236. Moving port; 240. First driving component; 300. Upper and lower plate mechanism; 400. Driving assembly; 410. Sliding part; 420. Second driving component; 430. Third driving component. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0020] The following is in conjunction with the appendix Figure 1-7 The specific embodiments of this utility model will be further described in detail below.

[0021] An embodiment of this utility model provides a wafer grinding apparatus for grinding wafers. The wafer grinding apparatus includes a grinding disc 100 and a grinding head moving mechanism, which are spaced apart. The grinding disc 100 is used to grind the wafer. The grinding head moving mechanism includes a rotatable driving member 210 and grinding heads 220 arranged opposite each other; the grinding heads 220 are all located at both ends of the driving member 210, and the grinding heads 220 are used to adsorb or place wafers. The drive component 210 rotates to drive the oppositely arranged grinding heads 220 to rotate synchronously. One grinding head 220 transfers the wafer to the grinding disk 100 for grinding, while the other grinding head 220 transfers the ground wafer to the outside of the grinding disk 100.

[0022] In some embodiments, the wafer includes a grinding disk 100 and a grinding head moving mechanism, wherein the grinding disk 100 is used to grind the wafer; and the grinding head moving mechanism is used to transfer the wafer. Specifically, the grinding head moving mechanism can clamp or adsorb the wafer, thereby changing the position of the wafer; in this embodiment, the grinding head moving mechanism adsorbs the wafer and transfers it to the grinding disk 100 for grinding. More specifically, the diameter of the grinding disk 100 is larger than the diameter of the wafer, and during the wafer grinding process, the wafer comes into contact with a portion of the grinding disk 100.

[0023] In some specific embodiments, a polishing slurry delivery pipe is also provided on the polishing disk 100; the polishing slurry delivery pipe delivers polishing slurry to assist in polishing the surface of the wafer, which is in the prior art and will not be described in detail here.

[0024] In some embodiments, the grinding head moving mechanism includes a drive member 210 and a grinding head 220, wherein the grinding head 220 is used to adsorb or place the wafer, and the drive member 210 is used to drive the grinding head 220 to rotate. Specifically, the drive member 210 can be circular, rectangular, or other irregularly shaped, primarily to drive the grinding head 220 to rotate; here, a rectangular drive member 210 is described. The drive member 210 can rotate to change the position of the grinding head 220. Specifically, a motor can be installed on the machine base on which the drive member 210 is mounted, and the motor shaft is keyed to the drive member 210 to drive the drive member 210 to rotate around the axis of the motor shaft. Two grinding heads 220 are provided, and the two grinding heads 220 are arranged opposite each other on the drive member 210. More specifically, two grinding heads 220 are respectively located at both ends of the drive member 210 along its length. When the drive member 210 rotates, it can drive the two grinding heads 220 to rotate synchronously, so that the two grinding heads 220 can rotate to the grinding disk 100 in turn. After the wafer adsorbed by one grinding head 220 is ground, the other grinding head 220 can drive the wafer to the grinding disk 100 for grinding, thereby improving the grinding efficiency of the wafer. That is, one grinding head 220 transfers the wafer to the grinding disk 100 for grinding, and the other grinding head 220 transfers the ground wafer to the outside of the grinding disk 100.

[0025] In some embodiments, the system further includes an upper and lower plate mechanism 300, wherein one grinding head 220 corresponds to the position of the grinding disk 100, and the other grinding head 220 corresponds to the position of the upper and lower plate mechanism 300. The drive component 210 rotates to drive the grinding head 220, which is arranged opposite to it, to rotate synchronously; the grinding head 220, which is positioned corresponding to the grinding disk 100, transfers the ground wafer to the loading and unloading mechanism 300; the grinding head 220, which is positioned corresponding to the loading and unloading mechanism 300, is used to transfer the unground wafer to the grinding disk 100 for grinding.

[0026] In some specific embodiments, in order to facilitate the adsorption or placement of wafers by the grinding head 220, the wafer grinding apparatus is also provided with a wafer loading and unloading mechanism 300. The wafer loading and unloading mechanism 300 can provide un-grinded wafers and receive grinded wafers. That is, the grinding head 220 adsorbs un-grinded wafers from the wafer loading and unloading mechanism 300 and transfers the wafers to the grinding disk 100 for grinding, while the grinded wafers at the grinding disk 100 are transferred to the wafer loading and unloading mechanism 300.

[0027] In some specific embodiments, the wafer loading / unloading mechanism 300 has a bearing position. For ease of understanding, when the transport device is not in operation, the grinding head 220 corresponding to the wafer loading / unloading mechanism 300 is defined as the first piece, and the grinding head 220 corresponding to the grinding disk 100 is defined as the second piece. In actual operation, the first piece clamps the wafer of the wafer loading / unloading mechanism 300 and transfers it to the grinding disk 100 for grinding. At this time, the second piece moves to the wafer loading / unloading mechanism 300 and clamps the wafer of the wafer loading / unloading mechanism 300. When the wafer at the grinding disk 100 is ground, the first piece drives the ground wafer to the wafer loading / unloading mechanism 300 and places the ground wafer in the bearing position. The robotic arm or a person manually removes the wafer from the bearing position and places the unground wafer in the bearing position. The first piece clamps the unground wafer; the second piece drives the wafer to the grinding disk 100 for grinding. This grinding process is repeated in a cycle.

[0028] In some embodiments, to facilitate the driving member 210 to drive the two grinding heads 220 to move sequentially to the grinding disk 100 or the wafer loading / unloading mechanism 300, one grinding head 220 is positioned corresponding to the grinding disk 100, and the other grinding head 220 is positioned corresponding to the wafer loading / unloading mechanism 300. That is, in the initial state, one grinding head 220 is positioned corresponding to the grinding disk 100, and the other grinding head 220 is positioned corresponding to the wafer loading / unloading mechanism 300, so that the grinding head 220 corresponding to the wafer loading / unloading mechanism 300 can pick up the unpolished wafer. Specifically, the motor controlling the rotation of the drive component 210 is a stepper motor, which precisely controls the rotation angle of the drive component 210 so that the positions of the two grinding heads 220 can move with the rotation of the drive component 210, so that the grinding head 220 at the grinding disk 100 moves to the upper and lower wafer mechanism 300 and transfers the ground wafer to the upper and lower wafer mechanism 300; the grinding head 220 at the upper and lower wafer mechanism 300 moves to the grinding disk 100 and transfers the unground wafer from the upper and lower wafer mechanism 300 to the grinding disk 100 for grinding.

[0029] In some embodiments, the direction of the line connecting the relatively disposed grinding heads 220 is defined as a first direction; the grinding head moving mechanism further includes: The movable component 230 is movably disposed on the driving component 210 along the first direction. The movable component 230 is connected to the grinding head 220 and is used to drive the grinding head 220 to move. The first driving member 240 is disposed on the driving member 210 and connected to the moving member 230 to drive the moving member 230 to move along the first direction.

[0030] In some specific embodiments, the direction of the line connecting the relatively arranged grinding heads 220 is defined as the first direction. Simultaneously, any one grinding head 220 can move closer to or further away from another grinding head 220 along the first direction. Specifically, since the diameter of the grinding disk 100 is larger than the diameter of the wafer, and the grinding head 220 adsorbs the wafer and contacts the grinding disk 100, the wafer can only contact a portion of the grinding disk 100. During the grinding process, the grinding capability of the portion of the grinding disk 100 in contact with the wafer weakens with increasing usage time. Therefore, by adjusting the movement of the grinding head 220 in the first direction, the contact position between the wafer on the grinding head 220 and the grinding disk 100 can be adjusted, thereby ensuring grinding efficiency.

[0031] In some specific embodiments, in order to facilitate the adjustment of the position of the grinding head 220 in the first direction, the grinding head moving mechanism also includes a moving member 230, wherein the moving member 230 is movably disposed on the driving member 210 along the first direction, and the grinding head 220 is connected to the moving member 230. When the moving member 230 moves along the first direction, it can drive the grinding head 220 to move synchronously along the first direction, thereby driving the wafer to move along the first direction and adjusting the contact position between the wafer and the grinding disk 100.

[0032] In some more specific embodiments, the grinding head moving mechanism further includes a first driving member 240, which is an electric cylinder. The first driving member 240 is fixedly mounted on the driving member 210, and its fixing method can be adhesive, snap-fit, or bolted, etc., without limitation, as long as the position of the first driving member 240 on the driving member 210 does not move. More specifically, the piston rod of the first driving member 240 is connected to the moving member 230. When the first driving member 240 is activated, the piston rod of the first driving member 240 moves, thereby driving the moving member 230 to move along the first direction.

[0033] In some embodiments, both the movable member 230 and the first driving member 240 are movably disposed at the bottom of the driving member 210.

[0034] In some embodiments, the drive member 210 has a groove, the movable member 230 is movably disposed in the groove, and the first drive member 240 can be disposed at the bottom of the drive member 210 or at the top of the drive member 210; this will be described in detail later.

[0035] In some embodiments, the drive member 210 is provided with a drive groove 211, and the inner wall of the drive groove 211 is provided with a limiting member 212 along the first direction. The side wall of the movable member 230 is provided with a limiting groove 231, which is used to pass through the limiting member 212 so that the movable member 230 is movable in the driving groove 211 along the first direction.

[0036] In some specific embodiments, the driving member 210 has a driving groove 211 that extends through the driving member 210 along its thickness direction. A limiting member 212 is provided within the driving groove 211, positioned along a first direction to limit the movement of the moving member 230. More specifically, two limiting members 212 are provided, fixedly disposed on two opposing inner walls of the driving groove 211. The fixing method can be bonding, snap-fitting, or integral molding, etc., without limitation, with the primary goal of preventing movement of the limiting members 212 within the inner walls of the driving groove 211.

[0037] In some specific embodiments, a limiting groove 231 is formed on the side wall of the movable member 230. The limiting groove 231 is used for the limiting member 212 to pass through. In this case, the limiting member 212 serves both as support and limiting. More specifically, the first driving member 240 is disposed on the top of the driving member 210. The first driving member 240 drives the movable member 230 to move in the first direction within the driving groove 211, thereby adjusting the position of the grinding head 220.

[0038] The movable component 230 includes: a movable part 232 disposed opposite to each other, the end face of the movable part 232 being divided into a connecting area 233 and a limiting area 234 from the inside out; The connecting protrusion 235 has one end located in one of the connecting areas 233 and the other end located in another connecting area 233, so that the limiting area 234 and the side wall of the connecting protrusion 235, which are respectively arranged oppositely, form a limiting groove 231.

[0039] In some embodiments, since the movable member 230 is disposed in the drive groove 211 and is limited by the limiting member 212, the installation of the movable member 230 needs to be considered when it is placed in the drive groove 211. Therefore, the movable member 230 is designed to be detachable.

[0040] In some specific embodiments, the movable member 230 includes a movable portion 232 disposed opposite to each other and a connecting protrusion 235 disposed between the movable portions 232; wherein, the movable portion 232 is plate-shaped; the end face of the movable portion 232 is divided into a connecting area 233 and a limiting area 234 from the inside out, such that the limiting area 234 surrounds the connecting area 233. Both ends of the connecting protrusion 235 are respectively connected to the two connecting areas 233. Specifically, one end of the connecting protrusion 235 is connected to one of the connecting areas 233, and the other end of the connecting protrusion 235 is connected to the other connecting area 233. More specifically, the connection method can be snap-fit ​​or bolt fixing, etc., without limitation, but the movable portion 232 and the connecting protrusion 235 are primarily detachable.

[0041] In some more specific embodiments, the limiting area 234 on the oppositely arranged moving part 232 and the sidewall of the connecting protrusion 235 together form a limiting groove 231. During the process of installing the moving part 230 into the drive groove 211, the connecting protrusion 235 is first installed into the connecting area 233 of one of the moving parts 232. Then, the installed moving part 232 and the connecting protrusion 235 are placed in the drive groove 211. Finally, the remaining moving part 232 is connected to the connecting protrusion 235, thereby installing the moving part 232 in the drive groove 211.

[0042] The axial direction of the grinding disc 100 is defined as the second direction; one end of the grinding head 220 is movably disposed on the drive member 210 along the second direction; the other end of the grinding head 220 is provided with an adsorption member 221, which is used to adsorb the wafer.

[0043] In some embodiments, the axial direction of the grinding disk 100 is defined as the second direction, that is, the second direction is the vertical direction; during the grinding process, the grinding head 220 needs to be able to rise or fall in the second direction to press the wafer onto the grinding disk 100, or while one grinding head 220 is grinding the wafer with the grinding disk 100, the other grinding head 220 can grip or place the wafer at the wafer loading and unloading mechanism 300.

[0044] In some specific embodiments, one end of the grinding head 220 is movably disposed on the drive member 210 along the second direction so that the grinding head 220 as a whole can move along the second direction; the other end of the grinding head 220 is provided with an adsorption member 221, which is used to adsorb the wafer, thereby driving the wafer and the grinding head 220 to move synchronously.

[0045] In some more specific embodiments, the adsorption element 221 is a vacuum chuck, and the device on which the movable element 230 is mounted is also equipped with a vacuum pump. The vacuum pump is connected to the vacuum chuck through a pipe to evacuate the vacuum chuck, thereby fixing the wafer.

[0046] In some more specific embodiments, the adsorption element 221 is an electrostatic chuck for adsorbing the wafer; the use of an electrostatic chuck for adsorption is a conventional setup in the art and will not be described in detail here.

[0047] In some embodiments, the movable member 230 has a movable opening 236; the movable member 230 is provided with a driving component 400, a portion of the driving component 400 is movably disposed in the movable opening 236 along the second direction and connected to the grinding head 220 to drive the grinding head 220 to rotate; the remaining portion of the driving component 400 is disposed on the movable member 230 to drive the grinding head 220 to move along the second direction.

[0048] In some specific embodiments, since the grinding head 220 is disposed on the moving member 230, in order to facilitate the movement of the grinding head 220 along the second direction, a moving opening 236 is provided on the moving member 230, and the moving opening 236 passes through the moving member 230 along the second direction.

[0049] In some more specific embodiments, the movable member 230 is further provided with a driving component 400, wherein a portion of the driving component 400 is located inside the movable opening 236, and the remaining portion is located outside the movable opening 236. The driving component 400 located inside the movable opening 236 can rise or fall in the second direction within the movable opening 236, and is connected to the grinding head 220, and can drive the grinding head 220 to rotate, as described in detail later. The driving component 400 located outside the movable opening 236 is connected to the movable component located inside the movable opening, and can drive the movable component located inside the movable opening 236 to move, thereby driving the grinding head 220 to move in the second direction. In addition, since both the driving component 400 and the grinding head 220 are located on the movable member 230, when the movable member 230 moves, it can drive the grinding head 220 and the driving component 400 to move synchronously, that is, the movement of the grinding head 220 in the first direction and the second direction will not interfere with each other.

[0050] In some embodiments, the driving component 400 includes: The sliding part 410 is movable along the second direction and is provided on the inner wall of the moving opening 236, and the sliding part 410 is provided with a mounting groove. The second driving component 420 is disposed in the mounting groove and connected to the grinding head 220 to drive the grinding head 220 to rotate; The third driving member 430 is disposed on the moving member 230 and connected to the sliding part 410 to drive the sliding part 410, the second driving member 420 and the grinding head 220 to move along the second direction.

[0051] In some embodiments, the drive assembly 400 includes a sliding portion 410, a second drive member 420, and a third drive member 430. The sliding portion 410 is disposed inside the movable opening 236 and can move within the movable opening 236 along a second direction. Specifically, the sliding portion 410 has a groove on its sidewall, and the movable opening 236 has a protrusion along the second direction inside, the protrusion passing through the groove, thereby limiting the sliding portion 410 and preventing it from rotating within the movable opening 236. The sliding portion 410 has a mounting groove at its bottom, used to mount the second drive member 420. The mounting method can be adhesive, snap-fit, or bolted, etc., without limitation, with the primary consideration being that the second drive member 420 is disposed within the mounting groove and does not move relative to the sliding portion 410. In some specific embodiments, the second drive component 420 is a motor, more specifically, a servo motor. The shaft of the second drive component 420 is keyed to the grinding head 220 to drive the grinding head 220 to rotate. This facilitates the wafer grinding process. The rotational speed of the grinding head 220 and the wafer can be controlled by the second drive component 420, thereby controlling the wafer grinding efficiency.

[0052] In some specific embodiments, the third driving member 430 is fixedly mounted on the moving member 230. The fixing method can be bonding, welding, or bolting, etc., without limitation, as long as there is no relative movement between the third driving member 430 and the moving member 230. More specifically, the third driving member 430 is an electric cylinder. The piston rod of the third driving member 430 is keyed to the sliding part 410. When the third driving member 430 is activated, it drives the sliding part 410 to rise or fall along the second direction within the transfer port, thereby driving the grinding head 220 and the wafer to rise or fall along the second direction. This allows the grinding head 220 to bring the wafer into contact with the grinding disk 100 when it is at the grinding disk 100, cooperating with the grinding disk 100 to grind the wafer. When the grinding head 220 is at the loading / unloading mechanism 300, it rises or falls along the second direction to pick up un-ground wafers on the support stage or place ground wafers on the placement stage.

[0053] In some embodiments, multiple adsorption elements 221 are provided, and the multiple adsorption elements 221 are spaced apart at the end of the grinding head 220.

[0054] In some specific embodiments, multiple adsorption elements 221 are evenly spaced at the end of the polishing head 220. When adsorbing the wafer, the multiple adsorption elements 221 cooperate with each other to adsorb the wafer. When some adsorption elements 221 fail, the remaining adsorption elements 221 can continue to adsorb the wafer, thereby reducing the possibility of the wafer detaching from the polishing head 220 due to the failure of some adsorption elements 221. When only one adsorption element 221 is provided, if the adsorption element 221 fails, the wafer will detach from the polishing head 220, thereby causing damage to the wafer.

[0055] This application also discloses a wafer polishing apparatus, which includes at least one wafer polishing device. Specifically, the wafer polishing apparatus may include two, three, or more wafer polishing devices; there is no limitation on this, and the number of wafer polishing devices is determined according to actual production needs.

[0056] In some embodiments, there is a gap between two adjacent wafer grinding devices so that the adjacent drive members 210 do not interfere with each other when rotating, and each wafer grinding device can perform wafer grinding independently.

[0057] The implementation principle of the wafer grinding apparatus and grinding equipment in this application embodiment is as follows: only grinding heads 220 are arranged opposite each other in the wafer grinding apparatus. The grinding heads 220 can work alternately. That is, when one grinding head 220 leaves the grinding disk 100, the other grinding head 220 adsorbs the un-grinded wafer and transfers it to the grinding disk 100 for grinding, thereby improving the grinding efficiency of the wafer.

[0058] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer polishing apparatus characterized by comprising: It includes a grinding disc (100) and a grinding head moving mechanism, the grinding disc (100) and the grinding head moving mechanism being spaced apart: the grinding disc (100) is used for grinding wafers; The grinding head moving mechanism includes a rotatable drive member (210) and grinding heads (220) arranged opposite to each other; the grinding heads (220) arranged opposite to each other are all located at both ends of the drive member (210), and the grinding heads (220) are used to adsorb or place the wafer; The drive member (210) rotates to drive the oppositely arranged grinding heads (220) to rotate synchronously. One of the grinding heads (220) transfers the wafer to the grinding disk (100) for grinding, and the other grinding head (220) transfers the ground wafer to the outside of the grinding disk (100).

2. The wafer polishing apparatus according to claim 1, wherein It also includes an upper and lower plate mechanism (300), wherein one of the grinding heads (220) corresponds to the position of the grinding disk (100), and the other grinding head (220) corresponds to the position of the upper and lower plate mechanism (300); The drive member (210) rotates to drive the grinding head (220) arranged opposite to it to rotate synchronously; the grinding head (220) corresponding to the position of the grinding disk (100) transfers the ground wafer to the loading and unloading mechanism (300); the grinding head (220) corresponding to the position of the loading and unloading mechanism (300) is used to transfer the unground wafer to the grinding disk (100) for grinding.

3. The wafer polishing apparatus according to claim 2, wherein The direction of the line connecting the relatively positioned grinding heads (220) is defined as the first direction; the grinding head moving mechanism further includes: A movable component (230) is movably disposed on the driving component (210) along a first direction. The movable component (230) is connected to the grinding head (220) and is used to drive the grinding head (220) to move. A first driving member (240) is disposed on the driving member (210) and connected to the moving member (230) to drive the moving member (230) to move along the first direction.

4. The wafer polishing apparatus according to claim 3, wherein The drive member (210) is provided with a drive groove (211), and the inner wall of the drive groove (211) is provided with a limiting member (212) along the first direction; The side wall of the movable member (230) is provided with a limiting groove (231), the limiting groove (231) is used to pass through the limiting member (212) so that the movable member (230) is movably disposed in the driving groove (211) along the first direction.

5. The wafer polishing apparatus of claim 4, wherein The movable element (230) includes: The movable part (232) is arranged opposite to each other, and the end face of the movable part (232) is divided into a connecting area (233) and a limiting area (234) from the inside to the outside; A connecting protrusion (235) is provided at one end in one of the connecting areas (233) and at the other end in the other connecting area (233), so that the sidewalls of the oppositely arranged limiting area (234) and the connecting protrusion (235) form the limiting groove (231).

6. The wafer polishing apparatus of claim 3, wherein The axial direction of the grinding disc (100) is defined as the second direction; one end of the grinding head (220) is movably disposed on the drive member (210) along the second direction; the other end of the grinding head (220) is provided with an adsorption member (221), which is used to adsorb the wafer.

7. The wafer polishing apparatus of claim 6, wherein The movable component (230) has a movable opening (236); the movable component (230) is provided with a driving component (400), part of the driving component (400) is movably disposed in the movable opening (236) along the second direction and connected to the grinding head (220) to drive the grinding head (220) to rotate; the remaining part of the driving component (400) is disposed on the movable component (230) to drive the grinding head (220) to move along the second direction.

8. The wafer polishing apparatus of claim 7, wherein The drive component (400) includes: A sliding part (410) is provided on the inner wall of the moving port (236) and is movable along the second direction, and a mounting groove is provided on the sliding part (410); The second driving member (420) is disposed in the mounting groove and connected to the grinding head (220) to drive the grinding head (220) to rotate; A third driving member (430) is disposed on the moving member (230) and connected to the sliding part (410) to drive the sliding part (410), the second driving member (420) and the grinding head (220) to move along the second direction.

9. The wafer polishing apparatus of claim 6, wherein The adsorption element (221) is provided in multiple ways, and the multiple adsorption elements (221) are spaced apart at the end of the grinding head (220).

10. A wafer polishing apparatus characterized by comprising: The wafer polishing apparatus includes any one of the wafer polishing apparatuses according to claims 1-9, wherein the wafer polishing equipment is provided with at least one of the wafer polishing apparatuses and there is a gap between two adjacent wafer polishing apparatuses, so that the rotation of adjacent drive members (210) is not interfered with.

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