A polishing pad, polishing head and polishing machine

Abstract

This utility model provides a polishing head pad, a polishing head, and a polishing machine, relating to the technical field of silicon wafer processing equipment. The polishing head pad includes a polishing head pad body, which has a first surface and a second surface arranged opposite to each other. A first groove structure is formed at the center of the first surface, and a plurality of second groove structures are formed extending from the first groove structure to the outer periphery of the polishing head pad body. The plurality of second groove structures are evenly distributed on the polishing head pad body, and the second groove structures are connected to the first groove structures. The second surface is provided with an adhesive for pasting the polishing head pad body to the polishing head pressure plate, and the second surface is provided with a plurality of vent holes penetrating to the first surface. The vent holes are used to expel air between the adhesive and the polishing head pressure plate during the pasting process. The beneficial effect of this utility model is that it solves the problem of poor silicon wafer processing caused by uneven force. The overall structure takes into account both the venting function and the fixing effect, improving the processing accuracy and efficiency of polishing.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing equipment technology, and in particular to a polishing head pad, a polishing head, and a polishing machine. Background Technology

[0002] During the silicon wafer polishing process, the polishing head applies pressure to the ceramic disc. The silicon wafer on the ceramic disc is then ground on the rotating polishing pad to achieve a smooth surface.

[0003] Traditionally, a pyramid pad is attached to the pressure plate of the sling head, and the pressure applied by the sling head is transmitted to the ceramic disc through the pyramid pad.

[0004] However, because the surface of the pyramid pad is hard and consists of many pyramid-shaped protrusions, the force it exerts on the ceramic disk is easily unevenly distributed, which in turn causes poor silicon wafer morphology on the ceramic disk, affects the geometric parameters of the product, and leads to product defects.

[0005] Therefore, there is an urgent need for a polishing head pad, polishing head, and polishing machine to solve the above-mentioned technical problems. Utility Model Content

[0006] The purpose of this invention is to provide a polishing head pad, polishing head, and polishing machine to solve the technical problem in the prior art where the hard surface of the pyramidal pad, composed of many pyramid-shaped protrusions, leads to uneven force distribution on the ceramic disk, resulting in poor silicon wafer morphology on the ceramic disk, affecting the geometric parameters of the product, and causing product defects. The various technical effects of the preferred solutions provided by this invention are detailed below.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] This utility model provides a throwing head pad, including a throwing head pad body, wherein the throwing head pad body has a first surface and a second surface disposed opposite to each other, wherein:

[0009] A first groove structure is formed at the center of the first surface, and a plurality of second groove structures are formed extending from the first groove structure to the outer periphery of the throwing head pad body. The plurality of second groove structures are evenly distributed on the throwing head pad body, and the second groove structures are connected to the first groove structure.

[0010] The second surface is provided with adhesive for attaching the head pad body to the head pressure plate, and the second surface is provided with a plurality of vent holes extending through the first surface. The vent holes are used to release air between the adhesive and the head pressure plate during the attachment process.

[0011] Preferably, the cross-section of the throwing head pad body is circular, the first groove structure is a circular groove, and the second groove structure is a rectangular groove.

[0012] Preferably, the exhaust holes are pinhole-shaped fine exhaust holes with a diameter of 0.1mm-0.3mm, and the exhaust holes are uniformly distributed on the second surface at a density of 80-120 per square centimeter.

[0013] Preferably, the backing adhesive includes a pressure-sensitive adhesive layer that completely covers the second surface, and the thickness of the pressure-sensitive adhesive layer is 0.05-0.1 mm; the pressure-sensitive adhesive layer has a through hole of the same diameter corresponding to the position of the pinhole-shaped fine venting hole, and the through hole is coaxially connected with the pinhole-shaped fine venting hole.

[0014] Preferably, the throwing head pad body is provided with a plurality of connecting holes, the connecting holes penetrating the throwing head pad body, and the connecting holes allow connecting parts to pass through, so as to connect the throwing head pad to the throwing head pressure plate.

[0015] Preferably, the second groove structure is distributed at a 30° angle along the central axis of the throwing head pad body, and the connecting holes are distributed at a 60° angle along the central axis of the throwing head pad body.

[0016] Preferably, the depth of the first groove structure is 3mm, and the width and depth of the second groove structure are both set to 3mm.

[0017] Preferably, the throwing head pad body includes an SBR rubber material layer.

[0018] A sling head includes a sling head pressure plate and the aforementioned sling head pad, wherein the sling head pad is connected to the sling head pressure plate.

[0019] A blasting head machine includes a blasting head body and the aforementioned blasting head, wherein the blasting head is mounted on the blasting head body.

[0020] The present invention provides a polishing head pad, polishing head, and polishing machine. By setting a first groove structure at the center of the first surface and multiple equally distributed second groove structures connected to the first groove structure, a complete exhaust channel is formed from the center to the outer periphery. This effectively removes air between the polishing head pad and the ceramic disc, avoiding the problem of vacuum formation after pressurization causing the ceramic disc to be sucked up when the polishing head rises, thus ensuring the continuity and stability of the processing. At the same time, the adhesive on the second surface ensures reliable adhesion to the polishing head pressure plate, and the multiple exhaust holes penetrating to the first surface can remove air between the adhesive and the polishing head pressure plate during the adhesion process, eliminating air bubble residue and ensuring that the polishing head pressure is evenly transmitted to the ceramic disc through the polishing head pad body. This solves the problem of poor silicon wafer processing caused by uneven force. The overall structure takes into account both exhaust function and fixing effect, improving the processing accuracy and efficiency of polishing. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural schematic diagram of an embodiment of the present invention's head-throwing pad;

[0023] Figure 2 yes Figure 1 A schematic diagram of the left-side view structure;

[0024] Figure 3 yes Figure 1 Front view structural diagram;

[0025] Figure 4 yes Figure 3 Enlarged structural diagram at point B;

[0026] Figure 5 yes Figure 2 A magnified structural diagram of point A in the middle.

[0027] In the figure: 10, the body of the sling pad; 101, the first surface; 102, the second surface; 11, the first groove structure; 12, the second groove structure; 13, the adhesive backing; 14, the connecting hole. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] Example 1

[0030] Figure 1 This is a structural schematic diagram of this embodiment. Figure 2 yes Figure 1 A schematic diagram of the left-side view structure, as shown below. Figure 1 and Figure 2As shown, this embodiment provides a sling pad, including a sling pad body 10, which has a first surface 101 and a second surface 102 disposed opposite to each other. In this embodiment, the first surface 101 is the working surface facing the ceramic disc, and the second surface 102 is the mounting surface facing the sling pad pressure plate.

[0031] In this embodiment, the polishing head pad body 10 includes an SBR (styrene-butadiene rubber) material layer, or the polishing head pad body 10 is made of SBR rubber. SBR rubber is soft and uniform, which can buffer and homogenize the pressure from the polishing head before transferring it to the ceramic disc, solving the problem of uneven force distribution caused by traditional hard materials, such as pyramid pads. Furthermore, SBR rubber has good elasticity and wear resistance, extending the service life of the polishing head pad. Its good chemical stability also allows it to withstand the corrosion of polishing fluids, ensuring stable performance after long-term use.

[0032] in, Figure 3 yes Figure 1 A schematic diagram of the main structure. Figure 4 yes Figure 3 An enlarged structural diagram at point B is shown below. Figure 3 and Figure 4 As shown, a first groove structure 11 is formed at the center of the first surface 101. Multiple second groove structures 12 extend from the first groove structure 11 towards the outer periphery of the polishing head pad body 10. These second groove structures 12 are evenly distributed on the polishing head pad body 10 and are connected to the first groove structure 11. By providing the first groove structure 11 and the second groove structure 12 on the first surface 101, and ensuring the second groove structure 12 is connected to the first groove structure 11, a complete exhaust channel is formed. This allows for the rapid discharge of air between the polishing head pad and the ceramic disc, preventing the formation of a vacuum after pressurization that could cause the ceramic disc to be sucked up when the polishing head rises, thus ensuring stability during silicon wafer processing.

[0033] like Figure 2 As shown, the second surface 102 is provided with adhesive 13 for attaching the head pad body 10 to the head pressure plate, and the second surface 102 is provided with a plurality of vent holes that penetrate to the first surface 101. The vent holes are used to release the air between the adhesive 13 and the head pressure plate during the pasting process.

[0034] By setting vent holes on the second surface 102 and using the backing adhesive 13, the problem of air bubbles remaining during the pasting process is solved, ensuring that the polishing head pad and the polishing head pressure plate are tightly bonded, so that the pressure applied by the polishing head can be evenly transmitted to the ceramic disc through the polishing head pad.

[0035] As an optional implementation method, Figure 5 yes Figure 2 An enlarged structural diagram at point A in the middle, as shown below. Figures 1-5As shown, the cross-section of the throwing head pad body 10 is circular, the first groove structure 11 is a circular groove with a depth of 3mm, and the second groove structure 12 is a rectangular groove.

[0036] By setting the cross-section of the polishing head pad body 10 to be circular, it can better adapt to the circular polishing head of the polishing machine. A first groove structure 11 with a circular cross-section is formed at the center of the first surface 101. A central air collection space can be formed within the first groove structure 11 to gather air from all directions. The second groove structure 12 is a rectangular groove that can serve as a linear exhaust channel. Through the structure of central air collection and linear divergent exhaust, the exhaust path is smoother, and the circular and rectangular grooves are relatively easy to process and their dimensional accuracy is easy to control, which can reduce the production cost of the polishing head pad.

[0037] As an optional implementation, the exhaust holes are pinhole-shaped fine exhaust holes with a diameter of 0.1mm-0.3mm, and the exhaust holes are uniformly distributed on the second surface 102 at a density of 80-120 per square centimeter.

[0038] By setting the pinhole-like fine venting holes with a diameter of 0.1mm-0.3mm, air can be effectively expelled without the adhesive overflowing or weakening the bonding force due to excessively large pores. A density of 80-120 vents / square centimeter ensures no dead corners for venting and avoids localized air bubble residue. The venting holes are evenly distributed on the second surface 102, making the venting process more balanced and preventing pressure transmission deviations caused by poor localized venting.

[0039] As an optional implementation, the backing adhesive 13 includes a pressure-sensitive adhesive layer that completely covers the second surface 102, and the thickness of the pressure-sensitive adhesive layer is 0.05-0.1mm; the pressure-sensitive adhesive layer has through holes of the same diameter at the positions corresponding to the pinhole-shaped fine vent holes, and the through holes are coaxially connected with the pinhole-shaped fine vent holes.

[0040] By setting the backing adhesive 13 as a pressure-sensitive adhesive layer with a thickness of 0.05-0.1mm, both adhesive strength and pressure transmission lag caused by excessive thickness are ensured. Coaxial through-holes of the same diameter are provided at the positions of the pinhole-like fine venting holes in the pressure-sensitive adhesive layer, ensuring that the venting holes are not blocked by the backing adhesive. Air can be smoothly discharged through the through-holes in the backing adhesive and the venting holes of the polishing head pad in sequence, solving the problem of traditional backing adhesive covering the venting holes. The pressure-sensitive adhesive layer completely covers the second surface 102, resulting in uniform adhesive force distribution and preventing localized lifting of the polishing head pad.

[0041] As an optional implementation, the head pad body 10 is provided with a plurality of connection holes 14, which penetrate the head pad body 10 and allow connectors to pass through, so as to connect the head pad to the head pressure plate.

[0042] By providing the connecting hole 14, a double fixation is formed with the adhesive backing 13, preventing the polishing head pad from shifting due to centrifugal force when the polishing machine is running at high speed. In use, screws can be used as the connector; the screws pass through the connecting hole 14 to fix the polishing head pad to the polishing head pressure plate. The detachable connection method also facilitates the replacement of the polishing head pad, reducing maintenance costs.

[0043] As an optional implementation, in this embodiment, the second groove structure 12 is evenly distributed at a 30° angle along the central axis of the throwing head pad body 10.

[0044] Specifically, in this embodiment, 12 second groove structures are set, and the width and depth of the second groove structures are both set to 3mm. The 12 second groove structures are equally distributed at a 30° angle along the central axis of the head pad body 10. By setting the 30° equally divided exhaust grooves, the exhaust of each area of ​​the ceramic disk is uniform, avoiding local vacuum. The 3mm depth and width can ensure sufficient exhaust space to avoid air stagnation, and will not cause insufficient strength of the head pad body due to excessive groove depth.

[0045] There are a total of 6 connecting holes 14, which are evenly distributed at a 60° angle along the central axis of the throwing head pad body 10. In this embodiment, the 60° evenly distributed connecting holes 14 make the fixing force evenly distributed along the circumference, preventing the throwing head pad from deforming due to uneven force.

[0046] Example 2

[0047] This embodiment provides a polishing head, which includes a polishing head pressure plate and a polishing head pad as described in Embodiment 1. The polishing head pad is connected to the polishing head pressure plate. This polishing head has the functions of uniform pressure application, stable air exhaust, and firm fixation, which can significantly improve the yield of silicon wafer processing.

[0048] Example 3

[0049] This embodiment provides a polishing head machine, including a polishing head body and a polishing head as described in Embodiment 2, with the polishing head mounted on the polishing head body. By employing the aforementioned polishing head, stable pressure transmission and venting functions reduce the number of downtime adjustments during processing, improve production efficiency, and significantly increase the yield of silicon wafer processing.

[0050] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A throw pillow cushion characterized by, Includes a throwing head pad body, the throwing head pad body having a first surface and a second surface disposed opposite to each other, wherein: A first groove structure is formed at the center of the first surface, and a plurality of second groove structures are formed extending from the first groove structure to the outer periphery of the throwing head pad body. The plurality of second groove structures are evenly distributed on the throwing head pad body, and the second groove structures are connected to the first groove structure. The second surface is provided with adhesive for attaching the head pad body to the head pressure plate, and the second surface is provided with a plurality of vent holes extending through the first surface. The vent holes are used to release air between the adhesive and the head pressure plate during the attachment process.

2. A putter head cover according to claim 1, wherein: The cross-section of the throwing head pad body is circular, the first groove structure is a circular groove, and the second groove structure is a rectangular groove.

3. A putter head cover according to claim 1, wherein: The exhaust holes are pinhole-shaped fine exhaust holes with a diameter of 0.1mm-0.3mm, and the exhaust holes are uniformly distributed on the second surface at a density of 80-120 per square centimeter.

4. A putter head cover according to claim 3, wherein: The backing adhesive includes a pressure-sensitive adhesive layer that completely covers the second surface. The thickness of the pressure-sensitive adhesive layer is 0.05-0.1 mm. The pressure-sensitive adhesive layer has a through hole of the same diameter corresponding to the position of the pinhole-shaped fine vent hole, and the through hole is coaxially connected to the pinhole-shaped fine vent hole.

5. A putter head cover according to any one of claims 1-4, wherein: The throwing head pad body is provided with multiple connecting holes, which penetrate the throwing head pad body and allow connecting parts to pass through, so as to connect the throwing head pad to the throwing head pressure plate.

6. A putter head cover according to claim 5, wherein: The second groove structure is evenly distributed at a 30° angle along the central axis of the throwing head pad body, and the connecting holes are evenly distributed at a 60° angle along the central axis of the throwing head pad body.

7. A putter head cover according to any one of claims 1 to 4, 6, wherein: The depth of the first groove structure is 3mm, and the width and depth of the second groove structure are both set to 3mm.

8. A putter head cover according to any one of claims 1 to 4, 6, wherein: The main body of the throwing head pad includes an SBR rubber material layer.

9. A putter, characterized by: It includes a sling head pressure plate and a sling head pad as described in any one of claims 1-8, wherein the sling head pad is connected to the sling head pressure plate.

10. A pitching machine characterized by: It includes a blasting head body and the blasting head as described in claim 9, wherein the blasting head is mounted on the blasting head body.

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