A tool for interference mounting of semiconductor seals

Abstract

This utility model relates to the field of semiconductor processing technology, specifically to a tool for interference installation of semiconductor seals, including a sealing mechanism and an installation mechanism. The installation mechanism includes a sealing ring, a first mounting plate, a second mounting plate, a positioning component, a pressing component, and an adjusting component. The pressing component and adjusting component can adjust the position of the pressing wheel according to production needs, and adjust the distance and vertical relative position between the pressing wheel and the sealing ring according to the installation requirements of the sealing ring. The sealing ring is slowly installed from the sealing ring. The groove between the pressing wheel and the sealing ring also provides pressing space for the installation of the sealing ring. This design is convenient to use and solves the problems of difficult installation, low accuracy, and inconvenience for rapid installation of sealing rings.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a tool for interference mounting of semiconductor seals. Background Technology

[0002] In the semiconductor manufacturing process, sealing rings need to be installed into the corresponding ESC components. Currently, the width of the selected sealing ring is larger than the width of the ESC groove. This design difference makes it difficult to smoothly install the sealing ring into the designated groove during the assembly process. Multiple attempts have encountered significant resistance, which not only affects the assembly efficiency but also poses a potential risk to the integrity of the sealing ring and the ESC component. Therefore, the existing tooling needs to be able to accurately align the sealing ring, reduce the assembly difficulty, ensure that the sealing ring can be accurately embedded into the groove, and avoid damage to the surrounding area. Utility Model Content

[0003] The purpose of this invention is to provide a tool for interference installation of semiconductor seals, which solves the problems of difficult, inaccurate, and inconvenient quick installation of seals in the prior art.

[0004] To achieve the above objectives, this utility model provides a tool for interference mounting of semiconductor sealing components, including a sealing mechanism and a mounting mechanism. The mounting mechanism includes a sealing ring, a first mounting plate, a second mounting plate, a positioning component, a pressing component, and an adjusting component. The adjusting component is slidably connected to the positioning component and located on one side of the positioning component. The pressing component is rotatably connected to the adjusting component and located on one side of the adjusting component. The positioning component is fixedly connected to the sealing mechanism and located below the sealing mechanism. The second mounting plate is fixedly connected to the first mounting plate and located above the first mounting plate. The first mounting plate is fixedly connected to the sealing ring and located above the sealing ring. The sealing ring is fixedly connected to the sealing mechanism and located inside the sealing mechanism.

[0005] The positioning component includes a positioning plate, a horizontal plate, and a positioning rod. The positioning rod is fixedly connected to the horizontal plate and located inside the horizontal plate. The horizontal plate is fixedly connected to the positioning plate and located below the positioning plate. The positioning plate is fixedly connected to the sealing mechanism and located below the sealing mechanism.

[0006] The extrusion assembly includes an extrusion roller, a disassembly block, and an extrusion wheel. The extrusion wheel is rotatably connected to the disassembly block and is located on one side of the disassembly block. The disassembly block is detachably connected to the extrusion roller and is located at one end of the extrusion roller. The extrusion roller is rotatably connected to the adjustment assembly and is located outside the adjustment assembly.

[0007] The adjustment assembly includes an adjustment frame and an adjustment unit. The adjustment unit is fixedly connected to the adjustment frame and located below the adjustment frame. The adjustment frame is slidably connected to the positioning rod and located beside the positioning rod.

[0008] The adjusting unit includes a threaded cylinder, an adjusting rod, and a threaded rod. The threaded rod is threadedly connected to the threaded cylinder and located inside the threaded cylinder. The adjusting rod is fixedly connected to the threaded rod and located at the lower end of the threaded rod. The threaded cylinder is fixedly connected to the adjusting frame and located below the adjusting frame.

[0009] The adjusting frame has a threaded hole that is compatible with the threaded rod.

[0010] The sealing mechanism includes a sealing plate and a pre-pressure plate. The pre-pressure plate is fixedly connected to the sealing plate and is located below the sealing plate. The sealing plate is fixedly connected to the second mounting plate and is located on the periphery of the second mounting plate.

[0011] The pre-compression plate has multiple pre-compression grooves.

[0012] This utility model discloses a tool for interference installation of semiconductor seals. The extrusion assembly and adjustment assembly can adjust the position of the extrusion wheel according to production needs, and adjust the distance and vertical relative position with the sealing ring according to the installation requirements of the sealing ring. The sealing ring is slowly installed from the sealing ring. The groove between the extrusion wheel and the sealing ring also provides extrusion space for the installation of the sealing ring. This design is convenient to use and solves the problems of difficult, inaccurate and inconvenient quick installation of sealing rings. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0014] Figure 1 This is a schematic diagram of the overall structure of a tool for interference mounting of semiconductor seals according to this utility model.

[0015] Figure 2 This is a front view of a tool for interference mounting of semiconductor seals according to this utility model.

[0016] Figure 3 This is the utility model Figure 2 A sectional view along line AA.

[0017] Figure 4 This is the utility model Figure 3 BB line section view.

[0018] Figure 5 This is the utility model Figure 4 Enlarged view of the local structure at point C.

[0019] Figure 6 This is the utility model Figure 4 Enlarged view of the local structure at point D.

[0020] 101-Sealing mechanism, 102-Installation mechanism, 103-Sealing ring, 104-First mounting plate, 105-Second mounting plate, 106-Positioning assembly, 107-Extrusion assembly, 108-Adjusting assembly, 109-Positioning plate, 110-Horizontal plate, 111-Positioning rod, 112-Extrusion roller, 113-Disassembly block, 114-Extrusion wheel, 115-Adjusting frame, 116-Adjusting unit, 117-Threaded cylinder, 118-Adjusting rod, 119-Threaded rod, 120-Threaded hole, 121-Sealing plate, 122-Pre-pressure plate, 123-Pre-pressure groove. Detailed Implementation

[0021] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0022] Please see Figures 1-6 ,in Figure 1 This is a schematic diagram of the overall structure of a tool for interference mounting of semiconductor seals according to this utility model. Figure 2 This is a front view of a tool for interference mounting of semiconductor seals according to this utility model. Figure 3 This is the utility model Figure 2 AA-line sectional view, Figure 4 This is the utility model Figure 3 BB line section view, Figure 5 This is the utility model Figure 4 Enlarged view of the local structure at point C. Figure 6 This is the utility model Figure 4 Enlarged view of the local structure at point D.

[0023] This utility model provides a tool for interference mounting of semiconductor seals, including a sealing mechanism 101 and a mounting mechanism 102. The mounting mechanism 102 includes a sealing ring 103, a first mounting plate 104, a second mounting plate 105, a positioning component 106, a pressing component 107, and an adjusting component 108. The positioning component 106 includes a positioning plate 109, a horizontal plate 110, and a positioning rod 111. The pressing component 107 includes a pressing roller 112, a disassembly block 113, and a pressing wheel 114. The adjusting component 108 includes an adjusting frame 115 and an adjusting unit 116. The adjusting unit 116 includes a threaded cylinder 117, an adjusting rod 118, and a threaded rod 119. The adjusting frame 115 has a threaded hole 120 that is adapted to the threaded rod 119. The sealing mechanism 101 includes a sealing plate 121 and a pre-pressure plate 122. The pre-pressure plate 122 has a plurality of pre-pressure grooves 123.

[0024] In this specific embodiment, the adjusting component 108 is slidably connected to the positioning component 106, the extrusion component 107 is rotatably connected to the adjusting component 108, the positioning component 106 is fixedly connected to the sealing mechanism 101, the second mounting plate 105 is fixedly connected to the first mounting plate 104, the first mounting plate 104 is fixedly connected to the sealing ring 103, the sealing ring 103 is fixedly connected to the sealing mechanism 101, the positioning rod 111 is fixedly connected to the horizontal plate 110, the horizontal plate 110 is fixedly connected to the positioning plate 109, the positioning plate 109 is fixedly connected to the sealing mechanism 101, the extrusion roller 114 is rotatably connected to the disassembly block 113, the disassembly block 113 is detachably connected to the extrusion roller 112, the extrusion roller 112 is rotatably connected to the adjusting component 108, and the adjusting unit 116 is fixedly connected to the adjusting frame 115. The adjustment frame 115 is slidably connected to the positioning rod 111, the threaded rod 119 is threadedly connected to the threaded cylinder 117, the adjustment rod 118 is fixedly connected to the threaded rod 119, the threaded cylinder 117 is fixedly connected to the adjustment frame 115, the pre-pressure plate 122 is fixedly connected to the sealing plate 121, and the sealing plate 121 is fixedly connected to the second mounting plate 105. The extrusion assembly 107 and the adjustment assembly 108 can adjust the position of the extrusion wheel 114 according to production needs, and adjust the distance and vertical relative position with the sealing ring 103 according to the sealing ring installation requirements. The sealing ring is slowly installed from the sealing ring 103. The groove between the extrusion wheel 114 and the sealing ring 103 also provides extrusion space for the installation of the sealing ring. This design is convenient to use and solves the problems of difficult, inaccurate, and inconvenient quick installation of the sealing ring.

[0025] In this configuration, the adjusting component 108 is located to one side of the positioning component 106, the pressing component 107 is located to one side of the adjusting component 108, the positioning component 106 is located below the sealing mechanism 101, the second mounting plate 105 is located above the first mounting plate 104, the first mounting plate 104 is located above the sealing ring 103, the sealing ring 103 is located inside the sealing mechanism 101, the positioning rod 111 is located inside the horizontal plate 110, the horizontal plate 110 is located below the positioning plate 109, and the positioning plate 109 is located below the sealing mechanism 101. The worker... The operator rotates the adjusting rod 118, which drives the threaded rod 119 to rotate. The threaded rod 119 interacts with the thread inside the adjusting frame 115, causing the adjusting frame 115 to move up and down. Since the positioning rod 111 is slidably connected to the adjusting frame 115 and limits its movement, the adjusting frame 115 is prevented from disengaging from the positioning rod 111 on the positioning plate 109. The adjustment of the position of the disassembly block 113 by the extrusion roller 112 can also change the distance between the extrusion roller 114 and the sealing ring 103. Adjustments can be made according to actual production needs to ensure that the sealing ring is stably embedded around the sealing ring 103.

[0026] Secondly, the extrusion roller 114 is located on one side of the disassembly block 113, the disassembly block 113 is located at one end of the extrusion roller 112, the extrusion roller 112 is located outside the adjustment assembly 108, the adjustment unit 116 is located below the adjustment frame 115, the adjustment frame 115 is located beside the positioning rod 111, and the periphery of the sealing ring 103 also has a groove for the extrusion roller 114 to pass through. The setting of the groove ensures that after the sealing ring is fitted onto the sealing ring 103, the extrusion roller 114 gradually presses the sealing ring to complete the installation, so that it can be accurately embedded in the groove, while also avoiding damage to other surrounding components.

[0027] Meanwhile, the threaded rod 119 is located inside the threaded cylinder 117, the adjusting rod 118 is located at the lower end of the threaded rod 119, the threaded cylinder 117 is located below the adjusting frame 115, the pre-pressure plate 122 is located below the sealing plate 121, and the sealing plate 121 is located on the periphery of the second mounting plate 105. Both the pre-pressure plate 122 and the sealing plate 121 are circular structures, which enclose and protect the built-in mounting body composed of the first mounting plate 104, the second mounting plate 105, and the sealing ring 103. The adjusting rod 118 and the extrusion roller 112 can be rotated manually by the operator to adjust the height of the adjusting frame 115 and the position of the disassembly block 113 to accommodate the installation of the sealing ring.

[0028] In this embodiment, the operator rotates the adjusting rod 118, causing the threaded rod 119 to rotate. The threaded rod 119 interacts with the thread inside the adjusting frame 115, causing the adjusting frame 115 to move up and down. Since the positioning rod 111 is slidably connected to the adjusting frame 115 and limits its movement, the adjusting frame 115 is prevented from disengaging from the positioning rod 111 on the positioning plate 109. The adjustment of the position of the disassembly block 113 by the extrusion roller 112 can also change the distance between the extrusion roller 114 and the sealing ring 103. Adjustments can be made according to actual production needs to ensure that the sealing ring is stably embedded in the periphery of the sealing ring 103. The periphery of the sealing ring 103 also has a space for the extrusion... The groove through which the wheel 114 passes ensures that after the sealing ring is fitted onto the sealing ring 103, it is gradually squeezed by the pressing wheel 114 to complete the installation, allowing it to be accurately embedded in the groove while avoiding damage to other surrounding components. The pre-pressing plate 122 and the sealing plate 121 are both circular structures, which enclose and protect the built-in mounting body composed of the first mounting plate 104, the second mounting plate 105, and the sealing ring 103. The adjusting rod 118 and the pressing roller 112 can be rotated manually by the operator to adjust the height of the adjusting frame 115 and the position of the disassembly block 113 to accommodate the installation of the sealing ring.

[0029] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A tool for interference mounting of semiconductor seals, comprising a sealing mechanism, characterized in that, It also includes an installation mechanism, which comprises a sealing ring, a first mounting plate, a second mounting plate, a positioning component, a pressing component, and an adjusting component. The adjusting component is slidably connected to the positioning component and is located on one side of the positioning component. The pressing component is rotatably connected to the adjusting component and is located on one side of the adjusting component. The positioning component is fixedly connected to the sealing mechanism and is located below the sealing mechanism. The second mounting plate is fixedly connected to the first mounting plate and is located above the first mounting plate. The first mounting plate is fixedly connected to the sealing ring and is located above the sealing ring. The sealing ring is fixedly connected to the sealing mechanism and is located inside the sealing mechanism.

2. The tool for interference mounting of semiconductor seals as described in claim 1, characterized in that, The positioning assembly includes a positioning plate, a horizontal plate, and a positioning rod. The positioning rod is fixedly connected to the horizontal plate and located inside the horizontal plate. The horizontal plate is fixedly connected to the positioning plate and located below the positioning plate. The positioning plate is fixedly connected to the sealing mechanism and located below the sealing mechanism.

3. The tool for interference mounting of semiconductor seals as described in claim 2, characterized in that, The extrusion assembly includes an extrusion roller, a disassembly block, and an extrusion wheel. The extrusion wheel is rotatably connected to the disassembly block and is located on one side of the disassembly block. The disassembly block is detachably connected to the extrusion roller and is located at one end of the extrusion roller. The extrusion roller is rotatably connected to the adjustment assembly and is located outside the adjustment assembly.

4. The tool for interference mounting of semiconductor seals as described in claim 3, characterized in that, The adjustment assembly includes an adjustment frame and an adjustment unit. The adjustment unit is fixedly connected to the adjustment frame and located below the adjustment frame. The adjustment frame is slidably connected to the positioning rod and located beside the positioning rod.

5. The tool for interference mounting of semiconductor seals as described in claim 4, characterized in that, The adjustment unit includes a threaded cylinder, an adjustment rod, and a threaded rod. The threaded rod is threadedly connected to the threaded cylinder and located inside the threaded cylinder. The adjustment rod is fixedly connected to the threaded rod and located at the lower end of the threaded rod. The threaded cylinder is fixedly connected to the adjustment frame and located below the adjustment frame.

6. The tool for interference mounting of semiconductor seals as described in claim 5, characterized in that, The adjusting frame has a threaded hole that is compatible with the threaded rod.

7. The tool for interference mounting of semiconductor seals as described in claim 6, characterized in that, The sealing mechanism includes a sealing plate and a pre-pressure plate. The pre-pressure plate is fixedly connected to the sealing plate and is located below the sealing plate. The sealing plate is fixedly connected to the second mounting plate and is located on the periphery of the second mounting plate.

8. The tool for interference mounting of semiconductor seals as described in claim 7, characterized in that, The pre-compression plate has multiple pre-compression grooves.

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