A leveling device

Abstract

This utility model relates to the field of leveling device technology, and more particularly to a leveling device, comprising a processing box and a load-bearing plate; symmetrically installed positioning plates for support are mounted on the inner wall of the processing box, and several sets of brackets are fixed to the inner wall of the positioning plates. Each set of brackets has a load-bearing plate fixed to its upper end for placing the PCB board to be leveled. A pressure plate for flattening the PCB board is installed above the load-bearing plate. This utility model achieves the ability to process multiple PCB boards simultaneously by longitudinally installing multiple sets of pressure plates in the processing box, allowing a large number of PCB boards to be placed in at once for leveling, thus increasing the processing quantity per batch and improving overall production efficiency. Furthermore, it can be flexibly adjusted according to production needs to adapt to different batch production tasks and different specifications of PCB boards. The multiple sets of pressure plates can simultaneously and evenly apply pressure, ensuring that each PCB board achieves a consistent leveling effect and improving leveling quality.

Description

Technical Field

[0001] This utility model relates to the field of leveling device technology, and in particular to a leveling device. Background Technology

[0002] A leveling device is a piece of equipment that uses mechanical, hydraulic, vibration, or laser technologies to flatten the surface of an object. It can be used for surface treatment of various materials such as metal sheets, concrete pavements, and printed circuit boards. After the PCB board is shaped, its warpage needs to be checked. The leveling device is used to eliminate unevenness such as bending and twisting that may occur during the production, transportation, or storage of the PCB board, so as to ensure that subsequent welding, assembly and other processes can be carried out smoothly.

[0003] Existing leveling devices typically place warped PCBs into the device and use clamping plates to compact and correct them. Since the area of ​​the clamping plates is usually small, they cannot accommodate a large number of PCBs for leveling at the same time, which limits the number of PCBs processed in a single batch and reduces the overall processing efficiency. Utility Model Content

[0004] To overcome the problem that existing leveling devices, due to the typically small area of ​​the clamping plate, cannot accommodate a large number of PCB boards for leveling at the same time, thus limiting the processing quantity per batch and reducing overall processing efficiency, this utility model provides a leveling device.

[0005] The technical solution is as follows: A leveling device includes a processing box and a load-bearing plate; the inner wall of the processing box is symmetrically equipped with positioning plates for support, the inner wall of the positioning plate is fixed with several sets of brackets, the upper end of each set of brackets is fixed with a load-bearing plate for placing the PCB board to be leveled, and a pressure plate for flattening the PCB board is installed above the load-bearing plate.

[0006] Furthermore, columns are installed at the inner corners of the two sets of load-bearing plates, and sliding sleeves are installed at the upper corners of the pressure plates. Multiple sets of screws are provided around the outer wall of the sliding sleeves, and the sliding sleeves are fixed to the pressure plates by the screw threads.

[0007] Furthermore, the sliding sleeve and the pressure plate have movable holes for accommodating the column. The pressure plate slides along the outer end of the column through the sliding sleeve. A connecting plate is fixed to the upper end of the pressure plate. A connecting plate is fixed inside the connecting plate. A drive rod is installed inside the processing box on one side of the pressure plate. The connecting plate and the drive rod are installed and fixed.

[0008] Furthermore, the positioning plate has multiple sets of heating tubes installed inside to provide heat, and the outer wall of the positioning plate has several sets of transmission holes on one side of the heating tubes. The processing box has a connector installed at the outer end, and the processing box is electrically connected to the heating tubes.

[0009] Furthermore, two sets of exhaust pipes are installed at the top of the processing box to draw oil fumes outside and prevent the panel surface from being contaminated. One end of each set of exhaust pipes is fixed with a docking ring, and the two sets of exhaust pipes are connected to the processing box through the docking ring.

[0010] Furthermore, a drive module is installed at the rear end of the processing box, and a hydraulic device is installed inside the drive module. The hydraulic device is installed with the drive rod.

[0011] Furthermore, a control panel is installed on the outer end of the cover plate, and two sets of limit buckles are installed on the outer end of the processing box. The cover plate is fastened and fixed to the processing box by the two sets of limit buckles, and a pull rod is fixed on the outer end of the cover plate on one side of the control panel.

[0012] Furthermore, the lower end of the processing box is provided with several sets of anti-slip pads for supporting the equipment. These anti-slip pads are fitted into the processing box. The rear end of the processing box, located below the drive module, has multiple sets of heat dissipation slots.

[0013] The beneficial effects are: This utility model realizes the ability to process a large number of PCB boards at once by vertically installing multiple sets of pressure plates in the processing box, thereby increasing the processing quantity per batch and improving overall production efficiency. Secondly, it can be flexibly adjusted according to production needs to adapt to different batch production tasks and different specifications of PCB boards. Moreover, multiple sets of pressure plates can apply pressure evenly at the same time to ensure that each PCB board can achieve a consistent leveling effect and improve leveling quality. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a leveling device according to the present invention; Figure 2 This is a three-dimensional structural diagram of the load-bearing plate of this utility model; Figure 3 This is a schematic diagram of the three-dimensional structure of the pressure plate of this utility model; Figure 4 This is a three-dimensional structural diagram of the drive module of this utility model; Figure 5 This is a three-dimensional structural diagram of the anti-slip pad of this utility model.

[0015] In the attached diagram, the following are the reference numerals: 1. Processing box; 2. Cover plate; 3. Load-bearing plate; 4. Pressure plate; 5. Column; 6. Connecting plate; 7. Connecting plate; 8. Drive rod; 9. Bracket; 10. Positioning plate; 11. Transmission hole; 12. Connecting joint; 13. Drive module; 14. Exhaust pipe; 15. Connecting ring; 16. Heat dissipation groove; 17. Limit buckle; 18. Control panel; 19. Pull rod; 20. Anti-slip pad. Detailed Implementation

[0016] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0017] A PCB, or Printed Circuit Board, is a support structure for electronic components and a carrier for their electrical connections. In electronic devices, the PCB plays a crucial role in mechanical support and circuit connection. Visually, a PCB is typically a rectangular board with various circuit lines and pads covering its surface. These circuit lines are made of conductive copper foil, etched onto an insulating substrate according to a pre-designed circuit pattern to achieve electrical connections between electronic components. The pads are the metal areas used to solder electronic components; the components are fixed to the pads with solder, thus connecting to the circuit lines. The substrate of a PCB is usually made of insulating materials such as glass fiber reinforced epoxy resin. This material has good mechanical strength, heat resistance, and insulation properties, ensuring stable circuit operation. Depending on the application and performance requirements, PCBs can be classified as single-layer, double-layer, and multi-layer boards. Single-layer boards have circuitry on only one side and are suitable for simple electronic circuits; double-layer boards have circuitry on both sides, with the circuitry on both sides connected by vias, and can accommodate more components and more complex circuits; multilayer boards contain multiple conductive layers, which are interconnected by structures such as vias and blind vias, enabling highly complex circuit designs, and are often used in high-performance electronic devices such as computer motherboards and communication equipment.

[0018] The manufacturing process of PCB boards involves multiple complex steps, including circuit design, photoplotting, etching, drilling, copper plating, and surface treatment. First, engineers design the circuit according to the functional requirements of the electronic product, creating a detailed circuit diagram. This diagram is then converted into photoplotting film for transfer onto the PCB board. Next, chemical etching removes unwanted copper foil, leaving the desired circuit patterns. Drilling is used to create vias and blind vias to connect circuits between different layers. Finally, the PCB surface is treated with processes such as gold or tin plating to improve solderability and oxidation resistance. With the continuous development of electronic technology, PCB boards are constantly evolving. For example, to meet the requirements of miniaturization and high performance, high-density interconnect (HDI) PCB boards have emerged, achieving higher wiring density and smaller size through technologies such as micro-blind vias and buried vias. Furthermore, flexible PCB boards are widely used, functioning normally even when bent or folded, making them suitable for emerging electronic products such as wearable devices and foldable screen phones. In short, PCB boards are an indispensable core component of modern electronic devices, and their design and manufacturing level directly affects the performance, reliability, and cost of these devices.

[0019] Leveling devices effectively correct warping and bending of PCB boards caused by various factors during production. In the PCB manufacturing process, from raw material cutting and lamination to subsequent etching and drilling, various degrees of deformation can occur in the board material. If these deformations are not corrected, they can cause numerous problems during subsequent component soldering and assembly, such as poor solder joint contact and inaccurate component installation, thus affecting the electrical performance and reliability of the circuit. Through the correction of a leveling device, the PCB board can be restored to a near-ideal flat state, providing a good foundation for subsequent processes.

[0020] Secondly, leveling devices help improve soldering quality. In modern electronics manufacturing, surface mount technology (SMT) is widely used, requiring a flat PCB surface to ensure that solder can evenly cover the pads and form good solder joints. If the PCB is uneven, the solder may not be evenly distributed due to factors such as surface tension, leading to soldering defects such as cold solder joints, missing solder joints, or short circuits. By using a leveling device to process the PCB, the probability of these soldering problems can be significantly reduced, thereby improving product soldering quality and production yield.

[0021] Furthermore, leveling devices are crucial for improving the appearance quality of PCB boards. In applications where high aesthetic standards are required, such as consumer electronics, the flatness of the PCB board directly impacts the overall aesthetics of the product. A flat PCB board is not only more visually appealing but also reflects the manufacturing process and quality control capabilities to a certain extent. Therefore, leveling devices play an irreplaceable role in ensuring the appearance quality of PCB boards.

[0022] Meanwhile, leveling devices can effectively reduce assembly difficulties and failure risks caused by uneven board surfaces. During the assembly of electronic products, PCB boards need to precisely align with other components. If the PCB board is warped or bent, it may lead to uneven gaps in the assembly with other components, or even prevent assembly altogether. This not only increases assembly difficulty and time costs but may also cause malfunctions such as poor contact and short circuits during product use. By leveling the PCB board, a good fit with other components during assembly can be ensured, thereby reducing assembly difficulty and failure risks, and guaranteeing the stable operation and lifespan of electronic products.

[0023] Leveling devices also play a crucial role in improving production efficiency. In large-scale production, any production stoppage or rework caused by unevenness in the PCB board will negatively impact efficiency. By quickly and effectively correcting the PCB board using leveling devices, production interruptions and rework due to board quality issues can be reduced, thereby improving the overall efficiency of the production line and lowering production costs.

[0024] like Figures 1-5 As shown, a leveling device includes a processing box 1 and a load-bearing plate 3. Positioning plates 10 for support are symmetrically installed on the inner wall of the processing box 1. Several sets of brackets 9 are fixed to the inner wall of the positioning plates 10. Each set of brackets 9 has a load-bearing plate 3 fixed to its upper end for placing the PCB board to be leveled. A pressure plate 4 for flattening the PCB board is installed above the load-bearing plate 3. Columns 5 are installed at the inner corners of the two sets of load-bearing plates 3. A sliding sleeve is installed at the upper corner of the pressure plate 4. Multiple sets of screws are circumferentially arranged on the outer wall of the sliding sleeve. The sliding sleeve is threadedly fixed to the pressure plate 4 by the screws. The cooperation between the column 5 and the sliding sleeve allows the pressure plate 4 to slide stably along the column 5, ensuring the verticality and stability of the pressure plate 4 during the pressure application process, further improving the leveling effect.

[0025] Please see Figures 2-4 The sliding sleeve and pressure plate 4 have movable holes for accommodating the column 5. The pressure plate 4 slides along the outer end of the column 5 via the sliding sleeve. A connecting plate 6 is fixed to the upper end of the pressure plate 4, and a connecting plate 7 is fixed inside the connecting plate 6. A drive rod 8 is installed inside the processing box 1 on one side of the pressure plate 4. The connecting plate 7 is fixed to the drive rod 8. The drive rod 8 drives the PCB board to apply uniform pressure, improving the reliability of the equipment. Multiple sets of heating tubes for providing heat are installed inside the positioning plate 10. Several sets of transmission holes 11 are opened on the outer wall of the positioning plate 10 on one side of the heating tubes. The processing box 1 is equipped with a connector 12 at one end, and is electrically connected to the heating tube. The heating tube can preheat the PCB board, so that the PCB board reaches a suitable temperature before leveling, reducing stress concentration caused by temperature differences. The upper end of the processing box 1 is equipped with two sets of exhaust pipes 14 to draw oil fumes out to prevent contamination of the board surface. One end of each set of exhaust pipes 14 is fixed with a docking ring 15. The two sets of exhaust pipes 14 are connected to the processing box 1 through the docking ring 15. The exhaust pipes 14 can discharge the oil fumes generated during the processing in a timely manner, preventing the oil fumes from contaminating the surface of the PCB board and ensuring the surface quality of the PCB board.

[0026] Please see Figures 3-5A drive module 13 is installed at the rear end of the processing box 1. A hydraulic device is installed inside the drive module 13, and it is installed with the drive rod 8. The hydraulic device provides a stable driving force to the pressure plate 4, ensuring that the pressure plate 4 can evenly and stably flatten the PCB board during the pressure application process, adapting to the flattening requirements of PCB boards of different thicknesses and materials. A control panel 18 is installed on the outer end of the cover plate 2, and two sets of limit buckles 17 are installed on the outer end of the processing box 1. The cover plate 2 is fastened and fixed to the processing box 1 by the two sets of limit buckles 17. A pull rod 19 is fixed to one side of the control panel 18 on the outer end of the cover plate 2. The configuration of 8 facilitates centralized control of the equipment by operators, improving the ease of operation and automation of the equipment. The lower end of the processing box 1 is equipped with several sets of anti-slip pads 20 for supporting the equipment. The anti-slip pads 20 are fitted into the processing box 1. The rear end of the processing box 1, located at the lower end of the drive module 13, has multiple sets of heat dissipation grooves 16. The anti-slip pads 20 can effectively prevent the equipment from sliding due to vibration during processing, improving the stability of the equipment. Combined with the timely dissipation of heat generated by the drive module 13 during operation by the heat dissipation grooves 16, the equipment is prevented from malfunctioning due to overheating, thus extending the service life of the equipment.

[0027] When leveling a large number of PCBs, the PCBs are first stacked in the same quantity and placed on the load-bearing plates 3 inside the processing box 1. The multiple load-bearing plates 3 installed inside the processing box 1 allow for the simultaneous leveling of a large number of PCBs in a single process, increasing the processing capacity per batch. Furthermore, the system can be flexibly adjusted according to production needs to accommodate different batch sizes and PCB specifications. After multiple sets of PCBs are stably placed, the cover plate 2 is closed, and the leveling time is controlled by the control module, typically set to 1-2 hours. The stress relief time is also typically set to 1-2 hours, and the leveling pressure parameter is 0.5-5 kg / cm². Next, each layer of pressure plate 4... All leveling processes are controlled by pressure and can be adjusted in batches. After the leveling parameters are adjusted, the heating tube is turned on to preheat the PCB board, so that the PCB board reaches a suitable temperature before leveling, reducing stress concentration caused by temperature differences. At the same time, the hydraulic equipment inside the drive module 13 is activated to provide power to the drive rod 8. The drive rod 8 is connected to the pressure plate 4 and presses down, ensuring that the pressure plate 4 can level the PCB board evenly and stably during the pressure application process. Multiple pressure plates 4 can apply pressure evenly at the same time, ensuring that each PCB board can get a consistent leveling effect. During the leveling process, the exhaust pipe 14 is controlled to discharge the oil fumes generated during the processing in a timely manner, preventing the oil fumes from contaminating the surface of the PCB board and ensuring the leveling quality of the PCB board.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A screeding device, characterized in that, It includes a processing box (1) and a load-bearing plate (3); the inner wall of the processing box (1) is symmetrically equipped with a positioning plate (10) for support, and the inner wall of the positioning plate (10) is fixed with several sets of brackets (9). The upper end of each set of brackets (9) is fixed with a load-bearing plate (3) for placing the PCB board to be flattened. A pressure plate (4) for flattening the PCB board is installed above the load-bearing plate (3).

2. A screeding device according to claim 1, wherein A column (5) is installed at the inner corner of the two sets of load-bearing plates (3), and a sliding sleeve is installed at the upper corner of the pressure plate (4). Multiple sets of screws are provided on the outer wall of the sliding sleeve, and the sliding sleeve is threadedly fixed to the pressure plate (4) by the screws.

3. A screeding device according to claim 2, wherein, The sliding sleeve and the pressure plate (4) have an opening for a movable hole to accommodate the column (5). The pressure plate (4) slides along the outer end of the column (5) through the sliding sleeve. A connecting plate (6) is fixed at the upper end of the pressure plate (4). A connecting plate (7) is fixed inside the connecting plate (6). A drive rod (8) is installed inside the processing box (1) on one side of the pressure plate (4). The connecting plate (7) and the drive rod (8) are installed and fixed.

4. A screeding device according to claim 1, wherein The positioning plate (10) has multiple sets of heating tubes installed inside to provide heat. The outer wall of the positioning plate (10) has several sets of transmission holes (11) on one side of the heating tubes. The processing box (1) has a connector (12) installed at the outer end. The processing box (1) is electrically connected to the heating tubes.

5. A screeding device according to claim 1, wherein The upper end of the processing box (1) is equipped with two sets of exhaust pipes (14) for drawing oil fumes outside to prevent contamination of the panel surface. One end of each set of exhaust pipes (14) is fixed with a docking ring (15), and the two sets of exhaust pipes (14) are connected to the processing box (1) through the docking ring (15).

6. A screeding device according to claim 3, wherein The rear end of the processing box (1) is equipped with a drive module (13), and the drive module (13) is equipped with a hydraulic device. The hydraulic device is installed with the drive rod (8).

7. A screeding device according to claim 6, wherein A control panel (18) is installed on the outer end of the cover plate (2), and two sets of limit buckles (17) are installed on the outer end of the processing box (1). The cover plate (2) is fastened and fixed to the processing box (1) by the two sets of limit buckles (17). A pull rod (19) is fixed on the outer end of the cover plate (2) on one side of the control panel (18).

8. A screeding device according to claim 7, wherein The lower end of the processing box (1) is provided with several sets of anti-slip pads (20) for supporting the equipment. The several sets of anti-slip pads (20) are fitted to the processing box (1). The rear end of the processing box (1) is located at the lower end of the drive module (13) and has multiple sets of heat dissipation slots (16).

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