Screens, ultrasonic fingerprint modules and electronic devices

Abstract

This application provides a screen, an ultrasonic fingerprint module, and an electronic device. The screen includes a screen body and a metal base film layer; the metal base film layer is attached to the underside of the screen body, the acoustic impedance of the metal base film layer is in the range of 3Mrayl to 20Mrayl, and the thickness of the metal base film layer is in the range of 20um to 80um; the lower surface of the metal base film layer away from the screen body can be attached to the ultrasonic fingerprint module, so that the screen can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module.

Description

Technical Field

[0001] This application relates to the field of ultrasonic technology, and more particularly to a screen, an ultrasonic fingerprint module, and an electronic device. Background Technology

[0002] Currently, the trend in smartphones and other electronic devices is towards larger batteries. While maintaining or even further reducing the overall thickness, the screen thickness needs to be further reduced without compromising reliability standards (i.e., not damaged by external forces). Existing screen base film (BP) layers can be made of PET (Polyethylene Terephthalate), which serves as the substrate for the screen's panel layer. Currently, under-display ultrasonic fingerprint detection using ultrasonic fingerprint modules is becoming increasingly widespread. However, because the PET base film layer is relatively soft, when the ultrasonic fingerprint module adheres to the underside of the PET base film, it can easily cause localized film marks on the screen, affecting the display effect. Furthermore, the screen's layered structure needs to be adapted as much as possible to the ultrasonic fingerprint scenario to ensure the effectiveness of ultrasonic fingerprint detection.

[0003] Therefore, providing a new technical solution to better adapt to the requirements of thin and light screens, display effects, and under-display ultrasonic fingerprint detection performance in the context of under-display ultrasonic fingerprint detection has become a technical problem that needs to be solved. Utility Model Content

[0004] This application provides a screen, an ultrasonic fingerprint module, and an electronic device.

[0005] According to a first aspect of the embodiments of this application, a screen is provided, comprising: a screen body; a metal base film layer attached to the underside of the screen body, wherein the acoustic impedance of the metal base film layer is in the range of 3Mrayl to 20Mrayl, and the thickness of the metal base film layer is in the range of 20um to 80um; the lower surface of the metal base film layer away from the screen body can be attached to an ultrasonic fingerprint module, so that the screen can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module.

[0006] In some alternative embodiments, the screen satisfies one or more of the following conditions:

[0007] The acoustic impedance range of the metal-based film layer is 8 Mrayl to 20 Mrayl;

[0008] The thickness of the metal base film layer is less than or equal to λa / 8, where λa is the equivalent wavelength of the ultrasonic signal in the metal base film layer;

[0009] The metal-based film layer includes an aluminum metal-based film layer or an aluminum alloy metal-based film layer;

[0010] The screen body includes a polarizer, or the screen body is a screen body without a polarizer;

[0011] The thickness of the silicon substrate of the ultrasonic fingerprint module is less than or equal to 75 μm.

[0012] In some optional embodiments, the metal base film layer is adhered to a first adhesive layer to adhere to the underside of the screen body, wherein the first adhesive layer satisfies one or more of the following conditions:

[0013] The thickness of the first adhesive layer ranges from 10µm to 80µm;

[0014] The thickness of the first adhesive layer is less than or equal to λb / 2, where λb is the equivalent wavelength of the ultrasonic signal in the first adhesive layer.

[0015] In some optional embodiments, the first adhesive layer is a black adhesive layer; and / or, the upper surface of the metal base film layer that adheres to the first adhesive layer is provided with a black film layer.

[0016] In some optional embodiments, the screen further includes a first protective layer disposed on the lower surface of the metal base film layer; the first protective layer is provided with a first window that exposes a portion of the lower surface of the metal base film layer so that the lower surface of the metal base film layer can adhere to the ultrasonic fingerprint module.

[0017] In some alternative embodiments, the first protective layer satisfies one or more of the following conditions:

[0018] The first protective layer includes a first metal protective layer and a fourth adhesive layer, and the first metal protective layer is attached to the lower surface of the metal base film layer through the fourth adhesive layer;

[0019] The first protective layer includes a stainless steel protective layer.

[0020] According to a second aspect of the embodiments of this application, an ultrasonic fingerprint module is provided, wherein the ultrasonic fingerprint module is attached to the lower surface of the screen, away from the screen body, of the metal base film layer as described in any one of the first aspects, for realizing under-screen ultrasonic fingerprint detection; wherein the ultrasonic fingerprint module includes a silicon substrate, and the thickness of the silicon substrate is less than or equal to 75um.

[0021] In some optional embodiments, the ultrasonic fingerprint module is attached to the lower surface of the metal base film layer via a screen adhesive layer, wherein the screen adhesive layer is a copper foil adhesive layer, or the screen adhesive layer is a pure adhesive layer with a thickness ranging from 10um to 80um.

[0022] According to a third aspect of the embodiments of this application, a screen is provided, comprising: a screen body; a PET base film layer attached to the underside of the screen body; and a second protective layer including an adhesive layer and a second metal protective layer, wherein the second metal protective layer is attached to the lower surface of the PET base film layer away from the screen body through the adhesive layer, and the thickness of the adhesive layer is in the range of 100um to 150um; wherein the second metal protective layer is provided with a second opening, the second opening exposing the adhesive layer, and the exposed adhesive layer can be attached to an ultrasonic fingerprint module, so that the screen can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module.

[0023] In some alternative embodiments, the screen satisfies one or more of the following conditions:

[0024] The thickness of the adhesive layer ranges from 115µm to 135µm;

[0025] The screen body includes a polarizer, or the screen body is a screen body without a polarizer;

[0026] The thickness of the silicon substrate of the ultrasonic fingerprint module is less than or equal to 75 μm.

[0027] According to a fourth aspect of the embodiments of this application, an ultrasonic fingerprint module is provided, which is attached to an adhesive layer of a screen as described in any one of the third aspects, for the purpose of realizing under-screen ultrasonic fingerprint detection.

[0028] According to a fifth aspect of the embodiments of this application, an electronic device is provided, comprising: a screen as described in any one of the first aspects; and an ultrasonic fingerprint module as described in the second aspect, for implementing under-display ultrasonic fingerprint detection.

[0029] According to a sixth aspect of the embodiments of this application, an electronic device is provided, comprising: a screen as described in any one of the second aspects; and an ultrasonic fingerprint module as described in the fourth aspect, for implementing under-display ultrasonic fingerprint detection.

[0030] The screen in this embodiment includes a screen body and a metal base film layer. The metal base film layer is attached to the bottom of the screen body. The acoustic impedance of the metal base film layer is in the range of 3Mrayl to 20Mrayl, and the thickness is in the range of 20um to 80um. The lower surface of the metal base film layer away from the screen body can be attached to the ultrasonic fingerprint module so that the screen can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module. Therefore, the screen in this embodiment, by setting a metal base film layer, can have good hardness and can support and protect the screen body. Thus, it eliminates the need for a relatively thick foam buffer structure, which helps reduce the screen thickness and better meets the demand for a thinner screen. Furthermore, since the screen uses a metal base film layer with a thickness range of 20µm to 80µm, when the ultrasonic fingerprint module is attached to the lower surface of the metal base film layer, it is less likely to cause localized film marks on the screen, thereby reducing adverse effects on the screen display effect and improving screen display performance. Moreover, since the acoustic impedance range of the metal base film layer is 3Mrayl to 20Mrayl and the thickness range is 20µm to 80µm, the metal base film layer can achieve good acoustic impedance matching with the ultrasonic fingerprint module. Therefore, the screen can be well adapted to ultrasonic fingerprint scenarios, which helps ensure the effectiveness of ultrasonic fingerprint detection. Therefore, the embodiments of this application can be well adapted to the requirements of thin and light screens, display effects, and under-display ultrasonic fingerprint detection performance in the scenario of under-display ultrasonic fingerprint detection, which is conducive to realizing the possibility of large-scale application of under-display ultrasonic fingerprint detection in electronic devices. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0032] Figure 1 A schematic diagram showing an example screen of an embodiment of this application and attached to an ultrasonic fingerprint module is shown.

[0033] Figure 2 A schematic diagram showing another example of a screen and an ultrasonic fingerprint module in an embodiment of this application is illustrated.

[0034] Figure 3 A schematic diagram showing another example of a screen and an ultrasonic fingerprint module in accordance with an embodiment of this application is illustrated.

[0035] Figure 4 A schematic diagram of an example ultrasonic fingerprint module according to an embodiment of this application is shown.

[0036] Figure 5 A schematic diagram of a multi-media stack is shown.

[0037] Figure 6 A schematic diagram showing another example of a screen and an ultrasonic fingerprint module in accordance with an embodiment of this application is illustrated.

[0038] Figure 7 A schematic diagram showing another example of a screen and an ultrasonic fingerprint module in accordance with an embodiment of this application is illustrated.

[0039] Figure 8 A schematic diagram of an example electronic device according to an embodiment of this application is shown.

[0040] Figure 9 A schematic diagram of another example of an electronic device in an embodiment of this application is shown.

[0041] Explanation of reference numerals in the attached figures:

[0042] 100. Screen; 110. Screen body; 1101. First adhesive layer; 1102. Panel layer; 1103. Second adhesive layer; 1104. POL layer or PET layer; 1105. Third adhesive layer; 1106. Screen cover layer; 120. Metal base film layer; 130. First protective layer; 131. First window; 132. First metal protective layer; 133. Fourth adhesive layer; 140. PET base film layer; 150. Second protective layer; 151. Adhesive layer; 152. Second metal protective layer; 153. Second window; 200. Ultrasonic fingerprint module; 210. Silicon substrate; 211. First electrode; 212. Second electrode; 213. Acoustic layer; 220. Screen adhesive layer; 300. Electronic device. Detailed Implementation

[0043] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0044] Currently, the trend in smartphones and other electronic devices is towards larger batteries. While maintaining or even further reducing the overall thickness, the thickness of screens (such as OLED (Organic Light-Emitting Diode) screens) needs to be further reduced without compromising reliability standards (i.e., not being damaged by external forces). Existing screen base film (BP) layers can be made of PET material, which can serve as the base for the screen's panel layer. However, because PET is relatively soft, it cannot effectively protect the panel layer from impacts. Typically, a foam cushioning structure needs to be added to the underside of the PET base film layer to protect the screen. This foam cushioning structure tends to make the overall screen too thick, making it difficult to meet current demands for thinner and lighter designs. For example, in some practical examples, setting a foam cushioning structure in the PET base film layer requires additional cushioning foam, adhesive layers, and metal protective layers, increasing the overall screen thickness by at least 230µm.

[0045] Currently, under-display ultrasonic fingerprint detection using ultrasonic fingerprint modules is becoming increasingly widespread. However, due to the relatively soft texture of the PET base film layer on the screen, the ultrasonic fingerprint module, when attached to the lower surface of the PET base film layer, can easily cause localized film marks on the screen, affecting the display effect. For example, this is especially true for Polless screens (screens without polarizers). Polless screens replace the original polarizer (POL) with a PET layer to meet the need for saving battery power and achieve the same screen brightness with lower current. Lacking the support of the polarizer (POL), Polless screens are also softer. Compared to screens with a polarizer (POL), Polless screens using a PET base film layer are more prone to causing localized film marks on the screen when the ultrasonic fingerprint module is attached to the lower surface of the PET base film layer, thus affecting the display effect.

[0046] Furthermore, the screen's layered structure needs to be adapted to the ultrasonic fingerprint scenario as much as possible to ensure the effectiveness of ultrasonic fingerprint detection. Therefore, providing a new technical solution that better adapts to the screen's thinness requirements, display effect, and ultrasonic fingerprint detection performance in under-display ultrasonic fingerprint detection scenarios has become a technical problem that needs to be solved.

[0047] In view of the above, according to a first aspect of the embodiments of this application, referring to Figure 1 , Figure 2 , Figure 3As shown, this application embodiment provides a screen 100, which includes: a screen body 110 and a metal base film layer 120; the metal base film layer 120 is attached to the underside of the screen body 110, the acoustic impedance of the metal base film layer 120 is in the range of 3Mrayl to 20Mrayl, and the thickness of the metal base film layer 120 is in the range of 20um to 80um; the lower surface of the metal base film layer 120 away from the screen body 110 can be attached to the ultrasonic fingerprint module 200, so that the screen 100 can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module 200.

[0048] Based on this, in the first aspect of the embodiments of this application, the screen 100, by setting a metal base film layer 120, allows the base film layer of the screen 100 to have good hardness and can support and protect the screen body 110. Therefore, it is not necessary to set a relatively thick foam buffer structure, which helps to reduce the thickness of the screen 100 and better meets the requirement of screen 100 being thinner and lighter. In addition, since the screen 100 uses a metal base film layer 120 with a thickness range of 20um to 80um, the ultrasonic fingerprint module 200 adheres to the metal base film of the screen 100. When the film layer 120 is applied to the lower surface, it is less likely to cause localized film marks on the screen 100, thereby reducing the adverse effects on the display effect of the screen 100 and improving the screen display performance. Furthermore, since the acoustic impedance range of the metal base film layer 120 is 3Mrayl to 20Mrayl and the thickness range is 20um to 80um, the metal base film layer 120 can achieve good acoustic impedance matching with the ultrasonic fingerprint module 200. Therefore, the screen 100 can be well adapted to ultrasonic fingerprint scenarios, which helps ensure the effectiveness of ultrasonic fingerprint detection. Thus, the embodiments of this application can better adapt to the requirements of thinness, display effect, and ultrasonic fingerprint detection performance of the screen 100 in under-display ultrasonic fingerprint detection scenarios, which is conducive to realizing the possibility of large-scale application of under-display ultrasonic fingerprint detection in electronic devices.

[0049] Optionally, the screen 100 in this embodiment may be, but is not limited to, an OLED screen, an LED screen, an LCD screen, etc. The screen 100 may be a screen with a polarizer or a Polless screen (screen without a polarizer). That is, the screen body 110 in this embodiment may include a polarizer, or the screen body 110 may be a screen body without a polarizer.

[0050] Therefore, in this embodiment, by setting the metal base film layer 120, the base film layer of the screen 100 can have good hardness and can support and protect the screen body 110 with or without a polarizer. Thus, it is not necessary to set a relatively thick foam buffer structure, which helps to reduce the thickness of the screen 100 and better meets the requirements for thinner and lighter screens 100 with or without polarizers. Furthermore, since the screen 100 uses a metal base film layer 120 with a thickness ranging from 20µm to 80µm, the ultrasonic fingerprint module 200 is attached to the screen 100 with or without a polarizer. When the metal base film layer 120 is applied to the lower surface, it is less likely to cause localized film marks on the screen 100, thereby reducing the adverse effects on the screen display effect and improving screen display performance. Furthermore, since the acoustic impedance range of the metal base film layer 120 is 3Mrayl to 20Mrayl and the thickness range is 20um to 80um, the metal base film layer 120 can achieve good acoustic impedance matching with the ultrasonic fingerprint module 200. Therefore, the screen 100, whether with or without a polarizer, can be well adapted to ultrasonic fingerprint scenarios, which helps ensure the effectiveness of ultrasonic fingerprint detection. Thus, the embodiments of this application can better adapt to the thinness requirements, display effect, and ultrasonic fingerprint detection performance of screens 100, whether with or without polarizers, in under-display ultrasonic fingerprint detection scenarios, facilitating the large-scale application of under-display ultrasonic fingerprint detection in electronic devices.

[0051] It is understandable that when the screen body is a non-polarized screen and the screen is a polless screen, it becomes more flexible due to the lack of polarizer (POL) support. Compared to screens with polarizer (POL), when the ultrasonic fingerprint module is attached to the lower surface of the PET base film layer, it is more likely to cause localized film marks on the screen, affecting the screen display effect. Therefore, when the screen 100 in this embodiment is a polless screen and adopts the stacked structure of the screen 100 in this embodiment, when the ultrasonic fingerprint module 200 is attached to the lower surface of the metal base film layer 120 of the screen 100, the risk of localized film marks on the screen 100 can be better reduced, the adverse effects on the screen display effect can be better reduced, and the screen display performance can be significantly improved.

[0052] Alternatively, the screen 110 can be understood as a combination of other layers located above the base film layer in the screen 100. The specific structure of the screen 110 is not specifically limited in this embodiment. For example... Figure 2 , Figure 3 As shown, it illustrates the structure of some examples of the screen 110. For example... Figure 2 , Figure 3As shown, from the direction closest to to the metal base film layer 120, the screen body 110 may include a first adhesive layer 1101, a panel layer 1102 (mainly used for display functions), a second adhesive layer 1103, a POL layer or a PET layer 1104, a third adhesive layer 1105, and a screen cover layer 1106. Optionally, the metal base film layer 120 may be attached to the first adhesive layer 1101 to be attached to the underside of the screen body 110. Wherein, if 1104 is a POL layer, then the screen body 110 is a screen body with a polarizer; if 1104 is a PET layer, then the screen body 110 is a screen body without a polarizer. Optionally, the first adhesive layer 1101, the second adhesive layer 1103, and the third adhesive layer 1105 may all be implemented using suitable adhesive materials as needed. For example, adhesive layers including but not limited to PSA (Pressure Sensitive Adhesive) and OCA (Optically Clear Adhesive) can be used. In some examples, the first adhesive layer 1101 can be a PSA adhesive layer, the second adhesive layer 1103 can be a PSA adhesive layer, and the third adhesive layer 1105 can be an OCA adhesive layer.

[0053] In the embodiments of this application, the base film (BP) layer of the screen 100 in the first aspect can be a metal base film layer 120, with an acoustic impedance ranging from 3Mrayl to 20Mrayl and a thickness ranging from 20um to 80um. The metal base film layer 120 can effectively support and protect the screen 110.

[0054] Optionally, within the acoustic impedance range (3Mrayl to 20Mrayl) of the aforementioned metal substrate film layer 120, any acoustic impedance can be selected as needed. For example, including but not limited to 3Mrayl, 4Mrayl, 5Mrayl, 6Mrayl, 7Mrayl, 8Mrayl, 9Mrayl, 10Mrayl, 11Mrayl, 12Mrayl, 13Mrayl, 14Mrayl, 15Mrayl, 16Mrayl, 17Mrayl, 18Mrayl, 19Mrayl, 20Mrayl, etc.

[0055] Within the aforementioned acoustic impedance range, preferably, the acoustic impedance range of the metal substrate layer 120 can be 8Mrayl to 20Mrayl. Since the acoustic impedance of the silicon substrate of the ultrasonic fingerprint module 200 is approximately 14Mrayl, within the aforementioned preferred acoustic impedance range, the metal substrate layer 120 can achieve good acoustic impedance matching with the ultrasonic fingerprint module 200. Therefore, the screen 100 is well adapted to the ultrasonic fingerprint scenario, which is beneficial to ensuring the effectiveness of ultrasonic fingerprint detection.

[0056] Within the aforementioned preferred acoustic impedance range, impedances including, but not limited to, 8Mrayl, 8.5Mrayl, 9Mrayl, 9.5Mrayl, 10Mrayl, 10.5Mrayl, 11Mrayl, 11.5Mrayl, 12Mrayl, 12.5Mrayl, 13Mrayl, 13.5Mrayl, 14Mrayl, 14.5Mrayl, 15Mrayl, 15.5Mrayl, 16Mrayl, 16.5Mrayl, 17Mrayl, 17.5Mrayl, 18Mrayl, 18.5Mrayl, 19Mrayl, 19.5Mrayl, 20Mrayl, etc., can be used.

[0057] The metal base film layer 120 can be implemented using any metal that meets the requirements. For example, in some optional embodiments, the metal base film layer 120 can be an aluminum metal base film layer or an aluminum alloy metal base film layer. The acoustic impedance of aluminum and aluminum alloys is approximately 17 Mrayl, which can effectively meet the acoustic impedance range requirements and achieve good acoustic impedance matching with the ultrasonic fingerprint module 200. Therefore, the screen 100 can be well adapted to ultrasonic fingerprint scenarios, which is beneficial to ensuring the effect of ultrasonic fingerprint detection. Furthermore, aluminum and aluminum alloys are relatively light and inexpensive, making them more suitable for widespread application.

[0058] In some alternative embodiments, the metal base film 120 may also be a magnesium metal base film or a magnesium alloy metal base film, or may be made of other materials, without limitation.

[0059] Within the thickness range of the aforementioned metal base film 120 (20µm to 80µm), a specific thickness can be selected as needed, such as including but not limited to 20µm, 25µm, 30µm, 35µm, 40µm, 45µm, 50µm, 55µm, 60µm, 65µm, 70µm, 75µm, 80µm, etc. Alternatively, other thicknesses can be used. For example, in some examples, the metal base film is an aluminum metal base film or an aluminum alloy metal base film, and a thickness of 66µm can be used.

[0060] Optionally, the thickness of the metal substrate layer 120 can be less than or equal to λa / 8, where λa is the equivalent wavelength of the ultrasonic signal in the metal substrate layer 120. This thickness of the metal substrate layer 120 improves the penetration effect of the ultrasonic signal, allowing the screen 100 to better adapt to ultrasonic fingerprint scenarios, thus ensuring the effectiveness of ultrasonic fingerprint detection and improving the accuracy of under-display ultrasonic fingerprint detection by the ultrasonic fingerprint module.

[0061] The equivalent wavelength λ = sound speed / frequency, where the sound speed is the speed of the ultrasonic signal in the transmission medium (such as the metal base film layer 120, the first adhesive layer 1101 in the following text), and the frequency can be the frequency of the ultrasonic signal.

[0062] In some optional embodiments, the metal base film layer 120 can be adhered to the first adhesive layer 1101 to be attached to the underside of the screen body 110. In some optional embodiments, the thickness of the first adhesive layer 1101 ranges from 10µm to 80µm. This thickness range of the first adhesive layer 1101 is neither too thin nor too thick, which can better ensure the structural stability and adhesion of the first adhesive layer 1101, and can optimize acoustic impedance matching, enabling the screen 100 to be better adapted to ultrasonic fingerprint scenarios, which is beneficial to ensuring the effect of ultrasonic fingerprint detection.

[0063] Within the thickness range (10µm to 80µm) of the first adhesive layer 1101 described above, a specific thickness can be selected as needed, such as including but not limited to 10µm, 15µm, 20µm, 25µm, 30µm, 35µm, 40µm, 45µm, 50µm, 55µm, 60µm, 65µm, 70µm, 75µm, 80µm, etc. For example, in some applications, the first adhesive layer 1101 can have a thickness of 45µm or 15µm.

[0064] Optionally, the thickness of the first adhesive layer 1101 can be less than or equal to λb / 2, where λb is the equivalent wavelength of the ultrasonic signal in the first adhesive layer 1101. This thickness of the first adhesive layer 1101 improves the penetration effect of the ultrasonic signal, allowing the screen 100 to better adapt to ultrasonic fingerprint scenarios, thus ensuring the effectiveness of ultrasonic fingerprint detection and improving the accuracy of under-display ultrasonic fingerprint detection by the ultrasonic fingerprint module.

[0065] Optionally, the first adhesive layer 1101 can be a black adhesive layer. Therefore, the black first adhesive layer 1101 can absorb light leakage and sunlight, ensuring the display effect of the screen 100.

[0066] Optionally, a black film layer is provided on the upper surface of the metal base film layer 120 that is bonded to the first adhesive layer 1101. This allows the black film layer on the upper surface of the metal base film layer 120 to absorb light leakage and sunlight, thus ensuring the display effect of the screen 100. Optionally, the black film layer can be a plating layer or a thin black film laid on the upper surface of the metal base film layer 120.

[0067] It should be understood that, in order to absorb light leakage and sunlight, the first adhesive layer 1101 can be set as a black adhesive layer as needed, or a black film layer can be set on the upper surface of the metal base film layer 120, or both methods can be used at the same time. No specific limitation is made in the embodiments of this application.

[0068] In some alternative embodiments, refer to Figure 3 As shown, the screen 100 in this embodiment of the application further includes a first protective layer 130, which is disposed on the lower surface of the metal base film layer 120. The first protective layer 130 is provided with a first window 131, which exposes a portion of the lower surface of the metal base film layer 120 so that the lower surface of the metal base film layer 120 can be attached to the ultrasonic fingerprint module 200.

[0069] Based on this, the metal base film layer 120 is protected by the first protective layer 130, which can improve the reliability of the metal base film layer 120 and thus improve the reliability of the screen 100. In addition, the first protective layer 130 can effectively bond the lower surface of the metal base film layer 120 to the ultrasonic fingerprint module 200 through the first opening 131, and can facilitate precise alignment and bonding, reduce bonding position deviation, and adapt to the module installation requirements in the under-display ultrasonic fingerprint detection scenario.

[0070] Understandably, referring to Figure 1 , Figure 2 In the embodiment shown, the screen 100 may also omit the first protective layer 130. The stacked structure of the screen 100 is specially designed based on the ultrasonic fingerprint module 200. The ultrasonic fingerprint module 200 can be directly bonded to the metal base film layer 120. The advantage of this structure is that the screen 100 is thinner and lighter, and the cost is lower. There is no need to open the window in the first protective layer 130, which simplifies the manufacturing process of the screen 100. The ultrasonic fingerprint module 200 can also be bonded and installed more flexibly as needed.

[0071] In this embodiment, the first protective layer 130 may include a first metal protective layer 132 and a fourth adhesive layer 133, and the first metal protective layer 132 is adhered to the lower surface of the metal base film layer 120 through the fourth adhesive layer 133. It should be understood that in this embodiment, the first metal protective layer 132 can be made relatively thin, which improves thinness while maintaining a protective effect. Furthermore, compared to a foam cushioning structure, the adhesion of the first metal protective layer 132 to the lower surface of the metal base film layer 120 through the fourth adhesive layer 133 can reduce film marks on the screen 100 and lower the risk of film marks.

[0072] The first metal protective layer 132 can be implemented using any suitable metal. For example, it may include, but is not limited to, copper, aluminum, titanium, etc., or it may also include, but is not limited to, copper alloys, aluminum alloys, titanium alloys, etc. Optionally, the first protective layer 130 includes a stainless steel protective layer. The stainless steel protective layer can be made relatively thin, improving thinness while maintaining protective effect. Compared to foam cushioning structures, the stainless steel protective layer, adhered to the lower surface of the metal base film layer 120, can reduce film marks on the screen 100, lowering the risk of film marks. Furthermore, the stainless steel protective layer is not easily corroded, has a long lifespan, good reliability, and is relatively low in cost.

[0073] The fourth adhesive layer 133 can be implemented using any suitable adhesive layer, such as, but not limited to, PSA adhesive layer, OCA adhesive layer, silicone layer, PMMA adhesive layer, black adhesive layer, etc. The fourth adhesive layer 133 can also be a composite adhesive layer. For example, a composite adhesive layer can include a laminate of at least two adhesive layers, or a double-sided adhesive layer with a substrate (the substrate can serve a supporting function). When the composite adhesive layer is a double-sided adhesive layer, the adhesive layers on both sides can be the same type of adhesive layer or different types of adhesive layers. For example, any adhesive layer in the composite adhesive layer can be, but is not limited to, a PSA adhesive layer, OCA adhesive layer, silicone layer, PMMA adhesive layer, black adhesive, etc.

[0074] In the embodiments of this application, reference is made to Figure 1 , Figure 2 , Figure 3 As shown, the lower surface of the metal base film layer 120 away from the screen body 110 can be attached to the ultrasonic fingerprint module 200 so that the screen 100 can realize under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module 200.

[0075] The ultrasonic fingerprint module 200 can be of any type and structure. For example, the ultrasonic fingerprint module 200 can be a CMOS (Complementary Metal Oxide Semiconductor) ultrasonic fingerprint module. For example, in some optional embodiments, the ultrasonic fingerprint module 200 may include a silicon substrate 210, which may also be referred to as a silicon base layer. Optionally, the thickness of the silicon substrate 210 may be less than or equal to 75 μm.

[0076] It should be understood that since the ultrasonic fingerprint module 200 is applied to the screen 100 of the optional structure in the embodiments of this application to realize under-display ultrasonic fingerprint detection, the stacked structure of the screen 100 is specially designed based on the ultrasonic fingerprint module 200. This allows the silicon substrate 210 of the ultrasonic fingerprint module 200 to be thinned to a certain extent, for example, the thickness can be reduced to less than or equal to 75um. This can provide stronger adaptability while ensuring performance, better meet the thinning requirements of the ultrasonic fingerprint module 200, and meet the thinning requirements of electronic devices using the screen 100 and the ultrasonic fingerprint module 200.

[0077] For example, an optional structure of an ultrasonic fingerprint module 200 can be described below. Optionally, refer to... Figure 4 As shown, the ultrasonic fingerprint module 200 may include a silicon substrate 210, a first electrode 211, an acoustic layer 213, and a second electrode 212. The first electrode 211 is located on the silicon substrate 210, and the acoustic layer 213 is located between the first electrode 211 and the second electrode 212. The second electrode 212 is used to be excited by an excitation signal to induce the acoustic layer 213 to emit ultrasonic signals. The first electrode 211 is used to receive the ultrasonic detection signal generated between the second electrode 212 and the first electrode 211 when the returned ultrasonic signal acts on the acoustic layer 213.

[0078] Based on this, the structure of the optional ultrasonic fingerprint module 200 in this embodiment of the application enables the ultrasonic fingerprint module 200 to effectively realize the function of under-screen ultrasonic fingerprint detection when it is attached to the underside of the screen 100.

[0079] Optionally, one of the first electrode 211 and the second electrode 212 can be a bottom electrode and the other a top electrode. For example, the first electrode 211 can be a bottom electrode and the second electrode 212 can be a top electrode. The first electrode 211 and the second electrode 212 can be made of any material, such as metal, without limitation. For example, the first electrode 211 can be an aluminum electrode or a copper electrode (but is not limited to these), and can include multiple sub-electrodes arranged in an array on the silicon substrate 210, each sub-electrode being considered as a "pixel". For example, the second electrode 212 can be a silver electrode.

[0080] Optionally, the acoustic layer 213 may be a piezoelectric material layer, which generates ultrasonic signal transmission and reception based on the piezoelectric effect (the piezoelectric material layer may include, but is not limited to, at least one of PVDF (polyvinylidene difluoride), lead zirconate titanate, and lithium niobate; the PVDF material may include PVDF, PVDF copolymer, etc.).

[0081] Optionally, the excitation signal applied to the second electrode 212 can be a pulse excitation signal, such as a pulse voltage signal. The excitation signal can be input from an external circuit. By applying the excitation signal to the second electrode 212, a voltage difference is formed between the second electrode 212 and the first electrode 211, thereby exciting the acoustic layer 213 to emit an ultrasonic signal upwards toward the screen 100. The first electrode 211 can receive the ultrasonic detection signal generated between the second electrode 212 and the first electrode 211 when the returned ultrasonic signal acts on the acoustic layer 213. The ultrasonic detection signal can be an electrical signal generated by the returned ultrasonic signal acting on the acoustic layer 213. Optionally, the ultrasonic detection signal received by the first electrode 211 can be used to realize ultrasonic fingerprint feature detection. Optionally, taking ultrasonic fingerprint feature detection as an example, the ultrasonic detection signal can be used to generate an ultrasonic fingerprint image, and fingerprint detection can be performed based on the ultrasonic fingerprint image.

[0082] Optionally, the process of generating an ultrasonic fingerprint image and performing fingerprint detection based on the ultrasonic fingerprint image can be implemented by a controller in an electronic device on which the ultrasonic fingerprint module 200 is installed (which can be electrically connected to the ultrasonic fingerprint module 200); or, in other optional embodiments, the process of generating an ultrasonic fingerprint image can also be implemented by a processing unit in the ultrasonic fingerprint module 200, which sends the generated ultrasonic fingerprint image to the controller in the electronic device, and the controller then performs fingerprint detection based on the ultrasonic fingerprint image.

[0083] It should be understood that the ultrasonic fingerprint module can also be understood by referring to related technologies, and there is no unique limitation in the embodiments of this application.

[0084] In some optional embodiments, the ultrasonic fingerprint module 200 can be attached to the lower surface of the metal base film layer 120 via a screen adhesive layer 220, wherein the screen adhesive layer 220 is a copper foil adhesive layer, or the screen adhesive layer 220 is a pure adhesive layer with a thickness ranging from 10um to 80um.

[0085] It should be understood that the screen adhesive layer 220 uses a copper foil adhesive layer or a pure adhesive layer with a thickness ranging from 10um to 80um, which can effectively bond the ultrasonic fingerprint module 200 to the lower surface of the metal base film layer 120, ensuring a stable adhesive structure and bonding, and optimizing acoustic impedance matching, which is beneficial to ensuring the effect of ultrasonic fingerprint detection and improving the accuracy of under-screen ultrasonic fingerprint detection of the ultrasonic fingerprint module 200.

[0086] The copper foil adhesive layer can be selected with appropriate thickness as needed. For example, in some cases, the copper foil adhesive layer is a stack of 6um PMMA (Poly(methyl methacrylate), also known as acrylic, plexiglass) adhesive layer, 6um copper foil layer, and 3um PMMA adhesive layer.

[0087] The pure adhesive layer can be any suitable adhesive layer, such as, but not limited to, silicone layers and OCA adhesive layers. Within the aforementioned thickness range of 10um to 80um, any suitable thickness can be selected, such as, but not limited to, 10um, 15um, 20um, 25um, 30um, 35um, 40um, 45um, 50um, 55um, 60um, 65um, 70um, 75um, 80um, etc., or other thicknesses can also be used. For example, in some applications where the screen adhesive layer 220 is a pure adhesive layer, a 45um silicone layer or a 62.5um OCA adhesive layer can be used.

[0088] Optionally, when the ultrasonic fingerprint module 200 is attached to the lower surface of the metal base film layer 120, the silicon substrate 210 may be attached to the lower surface of the metal base film layer 120. Alternatively, the side of the ultrasonic fingerprint module 200 away from the silicon substrate 210 may be attached to the lower surface of the metal base film layer 120.

[0089] The following section will further explain the principle of ultrasonic wave transmission in multiple media layers, along with some examples, to further illustrate the technical solutions of the embodiments of this application.

[0090] When an ultrasonic wave is transmitted to the interface between two different media, its sound intensity reflection coefficient and transmission coefficient can be obtained by the following formula:

[0091] Sound intensity reflection coefficient:

[0092] Sound intensity transmission coefficient:

[0093] Where z1 and z2 are the acoustic impedances of the two media, respectively.

[0094] For multi-media stacks (such as...) Figure 5 A schematic diagram of multiple media stacks is shown. As the number of interfaces increases, the reflection paths between different media also increase. For ease of calculation, a transmission line model can be used for equivalent acoustic impedance conversion. Figure 5 As shown, multiple dielectric materials 1-N are stacked, with material 1 as the first input material. The equivalent input acoustic impedance seen at the interface between material N and N+1 is denoted as Z. Ne Then we have the following formula:

[0095]

[0096] Among them, Z N-1 Z represents the acoustic impedance of the (N-1)th layer of material. N-2,e denoted by , w represents the equivalent acoustic impedance from the first layer to the (N-2)th layer, w represents the angular frequency, v represents the sound velocity of the (N-1)th layer, and t represents the thickness of the (N-1)th layer.

[0097] By calculating the equivalent acoustic impedance, the reflection and transmission of ultrasonic waves in multi-layered media can be greatly simplified. Taking ultrasonic fingerprinting as an example, ultrasonic waves are emitted from the under-display ultrasonic fingerprint module, transmitted to the screen surface, and reflected back to the receiver after being reflected by the fingerprint. Since the ridges of a fingerprint are generally filled with air, the acoustic impedance of air is very small, approximately 0 Mrayl, and can be considered to be almost 100% reflected at this interface. Therefore, if the equivalent acoustic impedance of the screen surface can be made close to that of human tissue (approximately 1.5 Mrayl), the ultrasonic waves can have a larger penetration coefficient at the ridges, thereby improving the contrast of the fingerprint image.

[0098] For example, referring to Table 1 below, the performance of screen stacking in some examples of embodiments of this application is compared:

[0099] Table 1

[0100]

[0101] ① As shown in Table 1 above, for Polloss screens without polarizers, screen number 1 can be compared with screens numbered 2, 4, and 5. Polloss screen number 1 has a 75µm PET base film layer, and the thickness of the silicon substrate of the ultrasonic fingerprint module is 110µm. The adhesive layer of the ultrasonic fingerprint module uses a 6-6-3 copper foil layer (i.e., a stack of 6µm PMMA adhesive layer, 6µm copper foil layer, and 3µm PMMA adhesive layer). Polloss screens numbered 2, 4, and 5 are Polloss screens with aluminum alloy metal base film layers of thicknesses of 20µm, 40µm, and 50µm, respectively. The thickness of the silicon substrate of the fingerprint module is 110um, and the ultrasonic fingerprint module uses a 6-6-3 copper foil adhesive layer. As can be seen from Table 1, under the same conditions, the ultrasonic signal of the Polloss screen with an aluminum alloy metal base film layer thickness of 20um, 40um, and 50um in this embodiment is close to or better than that of the Polloss screen with a 75um thick PET base film layer. Therefore, the performance of the Polloss screen with an aluminum alloy metal base film layer in this embodiment is close to or better than that of the Polloss screen with a PET base film layer, and both can meet the performance requirements. Moreover, the aluminum alloy metal base film layer can be made thinner than the PET base film layer.

[0102] ② As shown in Table 1 above, for the Polloss screen without a polarizer, screen number 4 can be compared with screen number 3. Screen number 4 has a 40µm aluminum alloy metal base film layer, and the thickness of the silicon substrate of the ultrasonic fingerprint module is 75µm. The screen adhesive layer of the ultrasonic fingerprint module uses a 6-6-3 copper foil adhesive layer. Polloss screen number 4 has a 40µm aluminum alloy metal base film layer, and the thickness of the silicon substrate of the ultrasonic fingerprint module is 110µm. The screen adhesive layer of the ultrasonic fingerprint module uses a 6-6-3 copper foil adhesive layer. As can be seen from Table 1, in the Polloss screen of this application embodiment, when the thickness of the metal base film layer and other conditions are the same, the ultrasonic signal quantity of the ultrasonic fingerprint module with a silicon substrate thickness of 75µm is close to that of the ultrasonic fingerprint module with a silicon substrate thickness of 110µm. Therefore, their performance is similar and both can meet the performance requirements. Using 75µm allows the ultrasonic fingerprint module to be thinner and lighter.

[0103] ③ Similarly, for POL screens with polarizers, screen number 6 can be compared with screens numbered 7 and 8. Screen number 1 has a 75µm PET base film layer, and the thickness of the silicon substrate of the ultrasonic fingerprint module is 110µm; the adhesive layer of the ultrasonic fingerprint module uses 6-6-3 copper foil. Screens numbered 7 and 8, on the other hand, have aluminum alloy metal base film layers with thicknesses of 30µm and 50µm respectively, and the thickness of the silicon substrate of the ultrasonic fingerprint module is 110µm in both cases. The acoustic fingerprint module uses a 6-6-3 copper foil adhesive layer. As shown in Table 1, under the same conditions, the ultrasonic signal of the POL screen with an aluminum alloy metal base film layer of 30um and 50um thickness in this embodiment is close to that of the POL screen with a 75um thick PET base film layer. Therefore, the performance of the POL screen with an aluminum alloy metal base film layer and the POL screen with a PET base film layer in this embodiment is similar and can meet the performance requirements. Moreover, the aluminum alloy metal base film layer can be made thinner than the PET base film layer.

[0104] It should be understood that Table 1 above is only used to illustrate the embodiments of this application and is not intended to limit the embodiments of this application in any way.

[0105] According to a second aspect of the embodiments of this application, an ultrasonic fingerprint module 200 is provided, with reference to... Figure 1 , Figure 2 , Figure 3As shown, the ultrasonic fingerprint module 200 is attached to the lower surface of the screen 100 of any of the first aspects, away from the screen body 110, of the metal base film layer 120, to achieve under-display ultrasonic fingerprint detection. Using the ultrasonic fingerprint module 200 of this second aspect to achieve under-display ultrasonic fingerprint detection provides better detection performance.

[0106] In some alternative embodiments, the ultrasonic fingerprint module 200 includes a silicon substrate 210 with a thickness of less than or equal to 75 μm.

[0107] In some alternative embodiments, refer to Figure 4 As shown, the ultrasonic fingerprint module 200 may include a silicon substrate 210, a first electrode 211, an acoustic layer 213, and a second electrode 212. The first electrode 211 is located on the silicon substrate 210, and the acoustic layer 213 is located between the first electrode 211 and the second electrode 212. The second electrode 212 is used to be excited by an excitation signal to induce the acoustic layer 213 to emit ultrasonic signals. The first electrode 211 is used to receive the ultrasonic detection signal generated between the second electrode 212 and the first electrode 211 when the returned ultrasonic signal acts on the acoustic layer 213.

[0108] In some alternative embodiments, refer to Figure 1 , Figure 2 , Figure 3 As shown, the ultrasonic fingerprint module 200 can be attached to the lower surface of the metal base film layer 120 via the screen adhesive layer 220. The screen adhesive layer 220 is either a copper foil adhesive layer or a pure adhesive layer with a thickness ranging from 10µm to 80µm.

[0109] It should be understood that the relevant content and beneficial effects of the ultrasonic fingerprint module 200 and its optional embodiments in the third aspect above have been described in the screen 100 embodiment in the first aspect above, and can be understood in conjunction with the foregoing, and will not be repeated here.

[0110] According to a third aspect of the embodiments of this application, a screen 100 is provided, with reference to... Figure 6 , Figure 7As shown, the screen 100 may include: a screen body 110 and a PET base film layer 140; the PET base film layer 140 is attached to the underside of the screen body 110; a second protective layer 150 includes an adhesive layer 151 and a second metal protective layer 152, the second metal protective layer 152 being attached to the lower surface of the PET base film layer 140 away from the screen body 110 via the adhesive layer 151, the thickness of the adhesive layer 151 being in the range of 100um to 150um; wherein, the second metal protective layer 152 is provided with a second window 153, the second window 153 exposing the adhesive layer 151, the exposed adhesive layer 151 being able to adhere to the ultrasonic fingerprint module 200, so that the screen 100 can achieve under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module 200.

[0111] Based on this, in the second aspect of this application embodiment, the screen 100, by setting a second protective layer 150, and optimizing the thickness range of the adhesive layer 151 in the second protective layer 150 to 100um~150um, ensures that the adhesive layer 151 is neither too thick nor too thin, thus better meeting the thinness requirement of the screen 100. Furthermore, the second metal protective layer 152 of the second protective layer 150 can be adhered to the lower surface of the PET base film layer 140 away from the screen body 110 through the optimized thickness adhesive layer 151, providing support and protection for the relatively soft PET base film layer 140 and the screen body 110 above it. The presence of the optimized thickness adhesive layer 151 also reduces the risk of film imprints forming on the screen when the second metal protective layer 152 is adhered to the lower surface of the PET base film layer, thereby helping to ensure the screen display effect. In addition, the second metal protective layer 152 is provided with a second window 153, which can... The adhesive layer 151 is exposed, allowing it to be reused as the screen-mounted structure for the second metal protective layer 152 and the ultrasonic fingerprint module 200. This enables the lower surface of the PET base film layer 140 to be effectively bonded to the ultrasonic fingerprint module 200 via the adhesive layer 151, facilitating precise alignment and reducing bonding position deviation. This adapts to the module installation requirements in under-display ultrasonic fingerprint detection scenarios. When the ultrasonic fingerprint module 200 is bonded to the adhesive layer 151, the optimized thickness of the adhesive layer 151 simultaneously improves the problem of localized film marks on the screen when the second metal protective layer 152 and the ultrasonic fingerprint module 200 are bonded to the lower surface of the PET base film layer, thereby further ensuring the screen display effect. Furthermore, the optimized thickness range of the adhesive layer 151 has minimal impact on ultrasonic signal transmission, making the screen more adaptable to ultrasonic fingerprint scenarios and helping to ensure the effectiveness of ultrasonic fingerprint detection. Therefore, the embodiments of this application can be well adapted to the requirements of thin and light screens, display effects, and under-display ultrasonic fingerprint detection performance in the scenario of under-display ultrasonic fingerprint detection, which is conducive to realizing the possibility of large-scale application of under-display ultrasonic fingerprint detection in electronic devices.

[0112] Optionally, the screen 100 in this embodiment may be, but is not limited to, an OLED screen, an LED screen, an LCD screen, etc. The screen 100 may be a screen with a polarizer or a Polless screen (screen without a polarizer). That is, the screen body 110 in this embodiment may include a polarizer, or the screen body 110 may be a screen body without a polarizer.

[0113] Therefore, in this embodiment, by setting a second protective layer 150, and optimizing the thickness range of the adhesive layer 151 in the second protective layer 150 to 100µm-150µm, the adhesive layer 151 is neither too thick nor too thin, which can better meet the thinning requirements of the screen 100 with or without a polarizer. Furthermore, the second metal protective layer 152 of the second protective layer 150 can be adhered to the lower surface of the PET base film layer 140 away from the screen body 110 through the optimized thickness adhesive layer 151, providing support and protection for the relatively soft PET base film layer 140 and the screen body 110 with or without a polarizer above it. The presence of the optimized thickness adhesive layer 151 also reduces the risk of film imprints forming on the screen when the second metal protective layer 152 is adhered to the lower surface of the PET base film layer, thus helping to ensure the screen display effect. In addition, the second metal protective layer 152 is provided with a second window 153, which can conceal the adhesive layer... The exposed adhesive layer 151 allows it to be reused as the screen-mounted structure for the second metal protective layer 152 and the ultrasonic fingerprint module 200. This enables the lower surface of the PET base film layer 140 to be effectively bonded to the ultrasonic fingerprint module 200 via the adhesive layer 151, facilitating precise alignment and reducing bonding position deviation. This adapts to the module installation requirements in under-display ultrasonic fingerprint detection scenarios for screens 100 with or without polarizers. When the ultrasonic fingerprint module 200 is bonded to the adhesive layer 151, the optimized thickness of the adhesive layer 151 simultaneously improves the problem of localized film marks on the screen when the second metal protective layer 152 and the ultrasonic fingerprint module 200 are bonded to the lower surface of the PET base film layer, thereby further ensuring the screen display effect. Furthermore, the optimized thickness range of the adhesive layer 151 has minimal impact on ultrasonic signal transmission, making the screen more adaptable to ultrasonic fingerprint scenarios and helping to ensure the effectiveness of ultrasonic fingerprint detection. Therefore, the embodiments of this application can be well adapted to the thin and light requirements, display effects, and under-display ultrasonic fingerprint detection performance of screens with or without polarizers in the under-display ultrasonic fingerprint detection scenario, which is conducive to realizing the possibility of large-scale application of under-display ultrasonic fingerprint detection in electronic devices.

[0114] It is understandable that when the screen body is a non-polarized screen and the screen is a polless screen, it becomes softer due to the lack of polarizer (POL) support. Compared to screens with polarizer (POL), it is more prone to localized film marks when the ultrasonic fingerprint module is bonded to the lower surface of the PET base film layer, affecting the screen display effect. Therefore, when the screen 100 in this embodiment is a polless screen and adopts the stacked structure of the screen 100 in this embodiment, when the ultrasonic fingerprint module 200 is bonded to the adhesive layer 151 of the second protective layer 150 of the screen 100, the risk of localized film marks on the screen 100 can be better reduced, the adverse effects on the screen display effect can be better reduced, and the screen display performance can be significantly improved.

[0115] Within the thickness range of the adhesive layer 151 (100um to 150um), a specific thickness can be selected as needed, such as including but not limited to 100um, 105um, 110um, 115um, 120um, 125um, 130um, 135um, 140um, 145um, 150um, etc. For example, in some applications, the adhesive layer 151 may have a thickness of 125um.

[0116] Preferably, within the aforementioned thickness range, the thickness of the adhesive layer 151 can be between 115µm and 135µm. This thickness range is well-suited to the requirements of thinness, display effect, and under-display ultrasonic fingerprint detection performance in scenarios involving under-display ultrasonic fingerprint detection, thus facilitating the large-scale application of under-display ultrasonic fingerprint detection in electronic devices.

[0117] Within the aforementioned preferred acoustic impedance range, values ​​including but not limited to 115um, 116um, 117um, 118um, 119um, 120um, 121um, 122um, 123um, 124um, 125um, 126um, 127um, 128um, 129um, 130um, 131um, 132um, 133um, 134um, 135um, etc., can be used.

[0118] The adhesive layer 151 can be implemented using any suitable adhesive layer. For example, in some optional embodiments, the adhesive layer 151 may include a silicone gel layer. As another example, the adhesive layer 151 may also include, but is not limited to, a silicone layer, an OCA adhesive layer, a PMMA adhesive layer, a black adhesive layer, etc. The adhesive layer 151 may also be a composite adhesive layer. For example, a composite adhesive layer may include a laminate of at least two adhesive layers, or a double-sided adhesive layer with a substrate (the substrate can serve a supporting function). When the composite adhesive layer is a double-sided adhesive layer, the adhesive layers on both sides can be the same type of adhesive layer or different types of adhesive layers. For example, any adhesive layer in the composite adhesive layer can be, but is not limited to, a silicone gel layer, a silicone layer, an OCA adhesive layer, a PMMA adhesive layer, a black adhesive layer, etc.

[0119] The second metal protective layer 152 can be implemented using any suitable metal. For example, it may include, but is not limited to, copper, aluminum, titanium, or copper alloys, aluminum alloys, titanium alloys, etc. The second metal protective layer 152 can be selected with an appropriate thickness as needed. For example, in some applications, the second metal protective layer 152 may be a 50µm thick copper layer.

[0120] Alternatively, the screen 110 can be understood as a combination of other layers located above the base film layer in the screen 100. The specific structure of the screen 110 is not specifically limited in this embodiment. For example... Figure 7 As shown, it illustrates the structure of some examples of the screen 110. For example... Figure 7 As shown, from the direction closest to to the PET base film layer 140, the screen body 110 may include a first adhesive layer 1101, a panel layer 1102 (mainly used for display function), a second adhesive layer 1103, a POL layer or a PET layer 1104, a third adhesive layer 1105, and a screen cover layer 1106. Optionally, the PET base film layer 140 may be adhered to the first adhesive layer 1101 to adhere to the underside of the screen body 110. Wherein, if 1104 is a POL layer, then the screen body 110 is a screen body with a polarizer; if 1104 is a PET layer, then the screen body 110 is a screen body without a polarizer. Optionally, the first adhesive layer 1101, the second adhesive layer 1103, and the third adhesive layer 1105 may all be implemented using suitable adhesive materials as needed. For example, adhesive layers including but not limited to PSA (Pressure Sensitive Adhesive) and OCA (Optically Clear Adhesive) can be used. In some examples, the first adhesive layer 1101 can be a PSA adhesive layer, the second adhesive layer 1103 can be a PSA adhesive layer, and the third adhesive layer 1105 can be an OCA adhesive layer.

[0121] In the embodiments of this application, reference is made to Figure 6 , Figure 7As shown, the adhesive layer 151 can adhere to the ultrasonic fingerprint module 200, enabling the screen 100 to perform under-display ultrasonic fingerprint detection via the ultrasonic fingerprint module 200. It is understood that since the adhesive layer 151 in the second protective layer 150 can be reused as the screen-mounting structure for the ultrasonic fingerprint module 200, there is no need to separately install adhesive for the ultrasonic fingerprint module 200, nor is there a need for separate windowing operations on the adhesive layer 151.

[0122] The ultrasonic fingerprint module 200 can be of any type and structure. For example, the ultrasonic fingerprint module 200 can be a CMOS (Complementary Metal Oxide Semiconductor) ultrasonic fingerprint module. For example, in some optional embodiments, the ultrasonic fingerprint module 200 may include a silicon substrate 210, which may also be referred to as a silicon base layer. Optionally, the thickness of the silicon substrate 210 may be less than or equal to 75 μm.

[0123] It should be understood that since the ultrasonic fingerprint module 200 is applied to the screen 100 of the optional structure in the embodiments of this application to realize under-display ultrasonic fingerprint detection, the stacked structure of the screen 100 is specially designed based on the ultrasonic fingerprint module 200. This allows the silicon substrate 210 of the ultrasonic fingerprint module 200 to be thinned to a certain extent, for example, the thickness can be reduced to less than or equal to 75um. This can provide stronger adaptability while ensuring performance, better meet the thinning requirements of the ultrasonic fingerprint module 200, and meet the thinning requirements of electronic devices using the screen 100 and the ultrasonic fingerprint module 200.

[0124] Regarding some optional structures for the ultrasonic fingerprint module 200, please refer to the aforementioned... Figure 4 The description of the ultrasonic fingerprint module 200 shown is for reference only and will not be repeated here.

[0125] Optionally, when the ultrasonic fingerprint module 200 is attached to the adhesive layer 151, the silicon substrate 210 may be attached to the adhesive layer 151. Alternatively, the side of the ultrasonic fingerprint module 200 furthest from the silicon substrate 210 may be attached to the adhesive layer 151.

[0126] According to a fourth aspect of the embodiments of this application, an ultrasonic fingerprint module 200 is provided, with reference to... Figure 6 , Figure 7 As shown, the ultrasonic fingerprint module 200 is bonded to the adhesive layer 151 of the screen 100 as described in any of the third aspects to achieve under-display ultrasonic fingerprint detection. The ultrasonic fingerprint module 200 of this fourth aspect provides good detection performance for under-display ultrasonic fingerprint detection.

[0127] In some alternative embodiments, the ultrasonic fingerprint module 200 includes a silicon substrate 210 with a thickness of less than or equal to 75 μm.

[0128] In some alternative embodiments, refer to Figure 4 As shown, the ultrasonic fingerprint module 200 may include a silicon substrate 210, a first electrode 211, an acoustic layer 213, and a second electrode 212. The first electrode 211 is located on the silicon substrate 210, and the acoustic layer 213 is located between the first electrode 211 and the second electrode 212. The second electrode 212 is used to be excited by an excitation signal to induce the acoustic layer 213 to emit ultrasonic signals. The first electrode 211 is used to receive the ultrasonic detection signal generated between the second electrode 212 and the first electrode 211 when the returned ultrasonic signal acts on the acoustic layer 213.

[0129] It should be understood that the relevant content and beneficial effects of the ultrasonic fingerprint module 200 and its optional embodiments in the fourth aspect above have been described in the screen 100 embodiment in the third aspect above, and can be understood in conjunction with the foregoing, and will not be repeated here.

[0130] According to a fifth aspect of the embodiments of this application, an electronic device 300 is provided, with reference to... Figure 8 As shown, the electronic device 300 includes: a screen 100 as in any of the first aspects; and an ultrasonic fingerprint module 200 as in the second aspect, for implementing under-screen ultrasonic fingerprint detection.

[0131] According to a sixth aspect of the embodiments of this application, an electronic device 300 is provided, with reference to... Figure 9 As shown, the electronic device 300 includes: a screen 100 as in any of the third aspects; and an ultrasonic fingerprint module 200 as in the fourth aspect, for implementing under-screen ultrasonic fingerprint detection.

[0132] Optionally, the electronic device 300 in the fifth and sixth aspects can be, but is not limited to, any terminal device or non-terminal device, as long as there is a need for under-screen ultrasonic testing. For example, it includes, but is not limited to, mobile phones, tablets, personal computers, etc.

[0133] It is understood that the above descriptions of various aspects of the embodiments of this application are merely optional exemplary descriptions of the technical solutions of the embodiments of this application, and are not intended to limit the embodiments of this application in any way.

[0134] The optional embodiments of the present application have been described in detail above with reference to the accompanying drawings. However, the embodiments of the present application are not limited thereto. It should be noted that, for the convenience of explaining the embodiments of the present application, the various drawings of the embodiments of the present application are not necessarily drawn to scale, and are only used to facilitate the explanation of the technical solution, and are not intended to limit the embodiments of the present application in any way. Within the scope of the technical concept of the embodiments of the present application, various simple modifications can be made to the technical solutions of the embodiments of the present application. The various technical features included in the different embodiments of the present application can be combined and / or separated in any suitable manner. In order to avoid unnecessary repetition, the embodiments of the present application will not describe the various possible combinations separately. However, these simple modifications and combinations should also be regarded as the content disclosed in the embodiments of the present application, and all fall within the protection scope of the embodiments of the present application.

[0135] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". It should be noted that the concepts of "first", "second", etc., mentioned in the embodiments of this application are only used to distinguish different devices, modules, or units, and are not used to limit the order of functions performed by these devices, modules, or units or their interdependencies. It should be noted that the modifications of "a" and "a plurality" mentioned in the embodiments of this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0136] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A screen, characterized in that, include: Screen body; A metal base film layer is attached to the bottom of the screen body. The acoustic impedance of the metal base film layer is in the range of 3Mrayl to 20Mrayl, and the thickness of the metal base film layer is in the range of 20um to 80um. The lower surface of the metal base film layer, away from the screen body, can be bonded to the ultrasonic fingerprint module, so that the screen can achieve under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module.

2. The screen according to claim 1, characterized in that, The screen satisfies one or more of the following conditions: The acoustic impedance range of the metal-based film layer is 8 Mrayl to 20 Mrayl; The thickness of the metal base film layer is less than or equal to λa / 8, where λa is the equivalent wavelength of the ultrasonic signal in the metal base film layer; The metal-based film layer includes an aluminum metal-based film layer or an aluminum alloy metal-based film layer; The screen body includes a polarizer, or the screen body is a screen body without a polarizer; The thickness of the silicon substrate of the ultrasonic fingerprint module is less than or equal to 75 μm.

3. The screen according to claim 1, characterized in that, The metal base film layer is bonded to the first adhesive layer to adhere to the underside of the screen body, wherein the first adhesive layer satisfies one or more of the following conditions: The thickness of the first adhesive layer ranges from 10µm to 80µm; The thickness of the first adhesive layer is less than or equal to λb / 2, where λb is the equivalent wavelength of the ultrasonic signal in the first adhesive layer.

4. The screen according to claim 3, characterized in that, The first adhesive layer is a black adhesive layer; and / or, the upper surface of the metal base film layer that is adhered to the first adhesive layer is provided with a black film layer.

5. The screen according to any one of claims 1-4, characterized in that, The screen also includes a first protective layer, which is disposed on the lower surface of the metal base film layer; The first protective layer is provided with a first window, which exposes a portion of the lower surface of the metal base film layer so that the lower surface of the metal base film layer can adhere to the ultrasonic fingerprint module.

6. The screen according to claim 5, characterized in that, The first protective layer satisfies one or more of the following conditions: The first protective layer includes a first metal protective layer and a fourth adhesive layer, and the first metal protective layer is attached to the lower surface of the metal base film layer through the fourth adhesive layer; The first protective layer includes a stainless steel protective layer.

7. An ultrasonic fingerprint module, characterized in that, The ultrasonic fingerprint module is attached to the lower surface of the screen, away from the screen body, of the metal base film layer as described in any one of claims 1-6, to enable under-screen ultrasonic fingerprint detection.

8. The ultrasonic fingerprint module according to claim 7, characterized in that, The ultrasonic fingerprint module is attached to the lower surface of the metal base film layer via a screen adhesive layer, wherein... The screen adhesive layer is a copper foil adhesive layer, or the screen adhesive layer is a pure adhesive layer with a thickness ranging from 10um to 80um.

9. A screen, characterized in that, include: Screen body; A PET base film layer is attached to the underside of the screen. The second protective layer includes an adhesive layer and a second metal protective layer. The second metal protective layer is attached to the lower surface of the PET base film layer away from the screen body through the adhesive layer. The thickness of the adhesive layer is 100um to 150um. The second metal protective layer has a second window that exposes the adhesive layer. The exposed adhesive layer can adhere to the ultrasonic fingerprint module, enabling the screen to perform under-screen ultrasonic fingerprint detection through the ultrasonic fingerprint module.

10. The screen according to claim 9, characterized in that, The screen satisfies one or more of the following conditions: The thickness of the adhesive layer ranges from 115µm to 135µm; The screen body includes a polarizer, or the screen body is a screen body without a polarizer; The thickness of the silicon substrate of the ultrasonic fingerprint module is less than or equal to 75 μm.

11. An ultrasonic fingerprint module, characterized in that, The ultrasonic fingerprint module is attached to the adhesive layer of the screen as described in any one of claims 9-10 to enable under-screen ultrasonic fingerprint detection.

12. An electronic device, characterized in that, include: The screen as claimed in any one of claims 1-6; and, The ultrasonic fingerprint module as described in any one of claims 7-8 is used to realize under-display ultrasonic fingerprint detection.

13. An electronic device, characterized in that, include: The screen as described in any one of claims 9-10; and, The ultrasonic fingerprint module as described in any one of claims 11 is used to realize under-display ultrasonic fingerprint detection.

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