A film cutting machine for semiconductor thin films

Abstract

This utility model discloses a film cutting machine for semiconductor thin films in the field of film cutting machine technology. It includes a worktable, an operating table, a loading trolley, a unloading trolley, a guardrail, and an equipment control panel. The operating table is located on the right rear side of the worktable, the loading trolley is located on the rear side of the worktable, and the unloading trolley is located on the right side of the worktable. The guardrail is placed on the outside of the worktable, operating table, loading trolley, and unloading trolley. The equipment control panel is fixedly connected to the top left front side of the worktable. A robotic arm is fixedly connected to the top of the operating table, and a connector is fixedly connected to the end of the robotic arm. A machine connecting wrist is fixedly connected to the outside of the connector, and a connecting plate is fixedly connected to the bottom of the connector and the machine connecting wrist. This film cutting machine for semiconductor thin films has a reasonable structural design and (benefits).

Description

Technical Field

[0001] This utility model relates to the field of film cutting machine technology, specifically a film cutting machine for semiconductor thin films. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. In today's intelligent era, the development of communications, computers, and the Internet of Things is closely related to the use of semiconductors, which are increasingly influencing human technological progress and economic development. Market demand for semiconductors is experiencing explosive growth. Due to the limitations of their structure, semiconductors are easily damaged by scratches or other means, rendering them unusable. Therefore, in daily protection, semiconductors need to be coated with protective films.

[0003] Existing semiconductor thin film cutting methods are generally semi-automatic, requiring manual loading and unloading. After loading, the semiconductor thin film is cut by a film cutting machine. Semi-automatic film cutting equipment has low efficiency and requires manual operation, which increases labor intensity. Therefore, we propose a film cutting machine for semiconductor thin films. Utility Model Content

[0004] The purpose of this invention is to provide a film cutting machine for semiconductor thin films, in order to solve the problems mentioned in the background art, such as the low efficiency of semi-automatic film cutting equipment and the need for manual operation, which increases labor intensity while maintaining low efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a film cutting machine for semiconductor thin films, comprising a worktable, an operating table, a loading trolley, a unloading trolley, a guardrail, and an equipment control panel. The operating table is located on the right rear side of the worktable, the loading trolley is located on the rear side of the worktable, and the unloading trolley is located on the right side of the worktable. The guardrail is placed on the outside of the worktable, the operating table, the loading trolley, and the unloading trolley. The equipment control panel is fixedly connected to the top left front side of the worktable. A robotic arm is fixedly connected to the top of the operating table, and a connector is fixedly connected to the end of the robotic arm. A machine connecting wrist is fixedly connected to the outside of the connector. A connecting plate is fixedly connected to the bottom of the connector and the machine connecting wrist. A mounting rod is fixedly connected to the top of the connecting plate, and a suction cup assembly is fixedly connected to the bottom of the mounting rod. Vacuum generators are fixedly connected to both sides of the top of the connecting plate.

[0006] Preferably, an X-axis module is fixedly connected to the top front side of the workbench, and a half-cutting host is provided on the top of the X-axis module.

[0007] Preferably, a pre-pressing device is fixedly connected to the top of the worktable and to the rear side of the X-axis module, and a half-cut surface is fixedly connected to the top of the worktable and to the rear side of the pre-pressing device.

[0008] Preferably, the operating console has a control cabinet inside, and the control cabinet is electrically connected to the equipment control panel.

[0009] Preferably, an emergency stop button is fixedly connected to the rear side of the guardrail, and an operation button is fixedly connected to the right side of the guardrail.

[0010] Preferably, the equipment control panel is electrically connected to the X-axis module, the half-cutting host, and the pre-pressing device via wires.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: The film cutting machine for semiconductor thin films is made by placing a loading trolley and a unloading trolley on both sides of the worktable. The robotic arm is connected to the machine wrist via a connector and a connecting plate. A cross-shaped mounting rod is set at the bottom of the connecting plate, and suction cup assemblies are evenly installed at the bottom of the mounting rod. The vacuum generator controls the suction cup assemblies to pick up the material on the loading trolley and place it on the semi-cutting table for film cutting. After the processing is completed, the material is picked up again by the suction cup assemblies and placed on the unloading trolley. This enables fully automated loading, cutting and unloading of semiconductor thin films, improving efficiency while reducing labor intensity. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of a film cutting machine for semiconductor thin films proposed in this utility model; Figure 2 This is a rear view schematic diagram of a film cutting machine for semiconductor thin films proposed in this utility model; Figure 3 This is a schematic diagram of the suction cup assembly structure for a semiconductor thin film cutting machine proposed in this utility model; Figure 4 This is a schematic diagram of the semi-cutting main unit structure of a film cutting machine for semiconductor thin films proposed in this utility model.

[0013] In the diagram: 100, workbench; 110, X-axis module; 111, semi-cutting main unit; 112, pre-compression device; 120, semi-cutting table surface; 200, operating table; 201, control cabinet; 210, robotic arm; 211, connector; 212, machine connecting wrist; 220, connecting plate; 221, mounting rod; 222, suction cup assembly; 230, vacuum generator; 300, loading trolley; 400, unloading trolley; 500, guardrail; 510, emergency stop button; 600, equipment control panel. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0016] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0017] Example: Figures 1-4 As shown, this utility model provides a film cutting machine for semiconductor thin films, which can realize the full automation of loading, cutting and unloading of semiconductor thin films, improving efficiency while reducing labor intensity. It includes a workbench 100, an operating table 200, a loading trolley 300, an unloading trolley 400, a guardrail 500 and an equipment control panel 600. Please refer to it again. Figure 1-4The operating table 200 is located on the right rear side of the workbench 100, the loading trolley 300 is located on the rear side of the workbench 100, and the unloading trolley 400 is located on the right side of the workbench 100. The guardrail 500 is placed on the outside of the workbench 100, the operating table 200, the loading trolley 300 and the unloading trolley 400. The equipment control panel 600 is fixedly connected to the top left front side of the workbench 100. The top of the operating table 200 is fixedly connected to the robotic arm 210. The end of the robotic arm 210 is fixedly connected to the connector 211. The outside of the connector 211 is fixedly connected to the machine connecting wrist 212. The bottom of the connector 211 and the machine connecting wrist 212 is fixedly connected to the connecting plate 220. The top of the connecting plate 220 is fixedly connected to the mounting rod 221. The bottom of the mounting rod 221 is fixedly connected to the suction cup assembly 222. The top two sides of the connecting plate 220 are fixedly connected to the vacuum generator 230.

[0018] The loading trolley 300 and unloading trolley 400 are placed on both sides of the workbench 100. The robotic arm 210 is connected to the machine wrist 212 via the connector 211 and the connecting plate 220 is installed. A cross-shaped mounting rod 221 is set at the bottom of the connecting plate 220. Suction cup assemblies 222 are evenly installed at the bottom of the mounting rod 221. The vacuum generator 230 controls the suction cup assembly 222 to pick up the material on the loading trolley 300 and place it on the semi-cutting table 120 for film cutting. After the processing is completed, the material is picked up by the suction cup assembly 222 and placed on the unloading trolley 400.

[0019] In summary, this method enables fully automated feeding and unloading of semiconductor thin film cutting, improving efficiency while reducing labor intensity.

[0020] Please refer to it again. Figure 1-4 An X-axis module 110 is fixedly connected to the top front side of the worktable 100. A half-cutting host 111 is provided on the top of the X-axis module 110. A pre-pressing device 112 is fixedly connected to the top of the worktable 100 and to the rear side of the X-axis module 110. A half-cutting table surface 120 is fixedly connected to the top of the worktable 100 and to the rear side of the pre-pressing device 112. The semiconductor film is pressed by the pre-pressing device 112, and the X-axis module 110 supports the half-cutting host 111 to move. The semiconductor film is cut by the half-cutting host 111.

[0021] Please see Figure 2 The control panel 200 is equipped with a control cabinet 201 inside. The control cabinet 201 is electrically connected to the equipment control panel 600. The equipment can be started and stopped through the equipment control panel 600.

[0022] Please refer to it again. Figure 1-2An emergency stop button 510 is fixedly connected to the rear side of the guardrail 500, and an operation button is fixedly connected to the right side of the guardrail 500. The guardrail 500 can be used to protect the film cutting equipment.

[0023] Please see Figure 1-2 The equipment control panel 600 is electrically connected to the X-axis module 110, the half-cutting host 111, and the pre-pressing device 112 via wires. The equipment control panel 600 can control the start and stop of the X-axis module 110, the half-cutting host 111, and the pre-pressing device 112.

[0024] In practical use, when performing film cutting on semiconductor thin films, the semiconductor thin film is placed on the loading trolley 300, the loading trolley 300 is pushed to the rear of the worktable 100, and the film cutting equipment and robotic arm 210 are started through the equipment control panel 600. The robotic arm 210 is connected to the machine wrist 212 via connector 211 and mounting plate 220. A star-shaped mounting rod 221 is provided at the bottom of the mounting plate 220, and suction cup assemblies 2 are evenly mounted on the bottom of the mounting rod 221. 22. The robotic arm 210 moves the suction cup assembly 222 to above the loading trolley 300. The vacuum generator 230 controls the suction cup assembly 222 to pick up the material on the loading trolley 300 and move it to the half-cutting table 120. The semiconductor film is placed on the half-cutting table 120 for film cutting. After the processing is completed, it is adsorbed by the suction cup assembly 222. The robotic arm 210 picks up the processed semiconductor film and puts it on the unloading trolley 400. The automated continuous film cutting of semiconductor films is carried out in this way.

[0025] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0026] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A film slitter for semiconductor films, characterized by: The system includes a workbench (100), an operating table (200), a loading trolley (300), a unloading trolley (400), a guardrail (500), and an equipment control panel (600). The operating table (200) is located on the right rear side of the workbench (100), the loading trolley (300) is located on the rear side of the workbench (100), the unloading trolley (400) is located on the right side of the workbench (100), and the guardrail (500) is placed on the outside of the system including the workbench (100), the operating table (200), the loading trolley (300), and the unloading trolley (400). The equipment control panel (600) is fixedly connected to the system. On the top left front side of the workbench (100), a robotic arm (210) is fixedly connected to the top of the operating table (200). A connector (211) is fixedly connected to the end of the robotic arm (210). A machine connecting wrist (212) is fixedly connected to the outside of the connector (211). A connecting plate (220) is fixedly connected to the bottom of the connector (211) and the machine connecting wrist (212). A mounting rod (221) is fixedly connected to the top of the connecting plate (220). A suction cup assembly (222) is fixedly connected to the bottom of the mounting rod (221). Vacuum generators (230) are fixedly connected to both sides of the top of the connecting plate (220).

2. A film slitter for semiconductor films as defined in claim 1, wherein: An X-axis module (110) is fixedly connected to the top front side of the workbench (100), and a half-cutting host (111) is provided on the top of the X-axis module (110).

3. A film slitter for semiconductor wafers as defined in claim 2 wherein: A pre-pressing device (112) is fixedly connected to the top of the worktable (100) and to the rear side of the X-axis module (110), and a half-cut table surface (120) is fixedly connected to the top of the worktable (100) and to the rear side of the pre-pressing device (112).

4. The film slitter as claimed in claim 1, wherein: The control cabinet (201) is provided inside the control console (200), and the control cabinet (201) is electrically connected to the equipment control panel (600).

5. The film slitter as claimed in claim 1, wherein: An emergency stop button (510) is fixedly connected to the rear side of the guardrail (500), and an operation button is fixedly connected to the right side of the guardrail (500).

6. The film slitter as claimed in claim 3, wherein: The equipment control panel (600) is electrically connected to the X-axis module (110), the half-cutting host (111), and the pre-pressing device (112) via wires.

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