An automatic electrolyte replenishment device for nickel plating of circuit boards

Abstract

This utility model discloses an automatic liquid replenishment device for nickel plating of circuit boards, including a nickel plating tank and a storage tank. The storage tank is equipped with an inlet pipe with a valve and a first outlet pipe. A liquid replenishment assembly includes a liquid replenishment pump, a liquid replenishment pipe, a collection pipe, and a distribution pipe. One end of the liquid replenishment pipe is connected to the outlet of the liquid replenishment pump, and the other end is connected to the distribution pipe via the collection pipe. Multiple evenly distributed second outlet pipes are provided on the side wall of the distribution pipe. The distribution pipe and the second outlet pipes are parallel to the bottom of the nickel plating tank, and the length of the distribution pipe matches that of the nickel plating tank. A liquid replenishment control assembly is fixedly installed in the nickel plating tank by a fixing bracket. This utility model achieves precise sensing and automatic liquid replenishment control of the plating solution level by setting a liquid replenishment control assembly that links a float ball with a micro switch. When the liquid level drops to a set position, the float ball drives the pressing block to rise, triggering the micro switch, which in turn starts the liquid replenishment pump to add liquid. The liquid replenishment pump automatically stops after the liquid level recovers.

Description

Technical Field

[0001] This utility model relates to the field of nickel plating technology, and in particular to an automatic liquid replenishing device for nickel plating of circuit boards. Background Technology

[0002] In the circuit board manufacturing process, electroless nickel plating is often used to ensure the uniformity and quality stability of the metal plating layer. During this process, the concentration of nickel ions in the plating solution gradually decreases over time, requiring timely replenishment to maintain a constant liquid composition. Currently, some production lines use manual replenishment or time-controlled pumps for automatic replenishment. However, when there are large fluctuations in the liquid level or when operating at multiple stations, untimely or excessive replenishment can easily occur, affecting product consistency and resource utilization.

[0003] In traditional nickel plating processes, replenishing the plating bath mainly relies on manual operation or simple timed and quantitative replenishment methods. While this method meets production needs to some extent, there is still room for improvement in terms of automation and replenishment accuracy. Manual replenishment suffers from problems such as untimely operation and inaccurate replenishment volume control, easily leading to unstable plating bath levels and affecting the uniformity and consistency of nickel plating quality. Simple timed and quantitative replenishment methods cannot flexibly adjust the replenishment volume according to the actual consumption of plating bath during the nickel plating process, potentially resulting in plating bath waste or insufficient replenishment, increasing production costs and reducing production efficiency. Therefore, there is an urgent need for a device that can achieve automatic and precise replenishment. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automatic liquid replenishment device for nickel plating of circuit boards.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An automatic replenishing device for nickel plating of circuit boards includes a nickel plating tank and a storage tank. The storage tank is equipped with an inlet pipe with a valve and a first outlet pipe. A replenishing assembly includes a replenishing pump, a replenishing pipe, a collecting pipe, and a diverting pipe. One end of the replenishing pipe is connected to the outlet of the replenishing pump, and the other end is connected to the diverting pipe via the collecting pipe. Multiple evenly distributed second outlet pipes are provided on the side wall of the diverting pipe. Both the diverting pipe and the second outlet pipes are parallel to the bottom of the nickel plating tank, and the length of the diverting pipe matches that of the nickel plating tank. The device is fixed by a mounting bracket. The replenishment control assembly installed in the nickel plating tank includes a housing, a micro switch, and a float. The housing is open and facing downwards and is fitted with a lid. The lid has a movable hole in the center. The micro switch is electrically connected to the replenishment pump. The micro switch is fixedly installed in the housing with its button facing downwards and directly opposite the movable hole. A pressing block is fixedly connected to the top of the float via a telescopic rod assembly. The pressing block is located directly below the button of the micro switch, and its top can extend into the housing through the movable hole. Both the telescopic rod assembly and the pressing block are perpendicular to the bottom of the nickel plating tank.

[0006] Preferably, a number of second outlet pipes are located on the side of the diversion pipe away from the side wall of the nickel plating tank and each end is fixedly connected to a nozzle. The end of the nozzle has a duckbill-shaped structure, and both the diversion pipe and the second outlet pipes are located in the nickel plating tank near the designated liquid surface.

[0007] Preferably, both the collecting pipe and the diverting pipe are fixedly installed on the inner wall of the nickel plating tank by several clamps.

[0008] Preferably, a limiting tube is movably sleeved on the outside of the telescopic rod assembly, and the inner diameter of the limiting tube is smaller than the outer diameter of the extrusion block.

[0009] Preferably, a support rod is fixedly connected to one side of the limiting tube, and the end of the support rod is welded to or fixed to the inner wall of the nickel plating tank by bolts.

[0010] Preferably, a limiting sleeve is movably fitted around the extrusion block, and the top of the limiting sleeve is fixedly connected to the box cover.

[0011] Preferably, the telescopic rod assembly includes a threaded rod with a threaded sleeve threadedly connected to it, and the top of the threaded sleeve is fixedly connected to the extrusion block.

[0012] Preferably, a threaded tube matching the threaded sleeve is fixedly connected to the top of the float, and the threaded tube is threadedly connected to the lower end of the threaded rod.

[0013] This utility model has the following beneficial effects: 1. This utility model achieves precise sensing and automatic replenishment control of the plating solution level by setting a replenishment control component that links a float ball with a micro switch. When the liquid level drops to the set position, the float ball drives the extrusion block to rise, triggering the micro switch, which in turn starts the replenishment pump to add liquid. After the liquid level recovers, the replenishment pump automatically stops, achieving the purpose of real-time replenishment and precise control, and improving the level of automation and liquid level stability.

[0014] 2. By setting up a liquid collection pipe, a distribution pipe, and multiple evenly arranged liquid outlet pipes and duckbill-shaped nozzles, this utility model enables the replenishing liquid to be evenly distributed inside the nickel plating tank, thereby improving the liquid mixing efficiency and replenishing uniformity, avoiding the problem of excessively high or low concentration of plating solution in some areas, and helping to improve the plating quality and product consistency.

[0015] 3. This utility model features an adjustable telescopic rod assembly, consisting of a threaded rod, a threaded sleeve, and a threaded tube. By rotating the threaded sleeve, the relative position of the float and the extrusion block can be adjusted, allowing for flexible adjustment of the overall length of the telescopic rod assembly. In different circuit board nickel plating processes, parameters such as the nickel plating tank level setting and plating solution consumption rate vary. By adjusting the telescopic rod assembly, the liquid level threshold for the float to trigger the microswitch can be precisely set. This adjustability allows the device to adapt to various nickel plating process scenarios, meeting the personalized needs of plating solution level control under different production conditions, improving the device's versatility and process adaptability. Furthermore, the float's threaded connection to the lower part of the threaded rod facilitates replacement. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 For the present utility model Figure 1 Enlarged schematic diagram of the structure at point A in the middle; Figure 3 For the present utility model Figure 1 Enlarged schematic diagram of the structure at point B; Figure 4 This is a schematic diagram of the connection structure of the liquid collecting pipe, the diversion pipe, the liquid storage tank, and the nozzle of this utility model; Figure 5 This is a schematic diagram of the overall structure of the fluid replenishment control component in this utility model; Figure 6 This is a schematic diagram of the exploded structure of the liquid replenishment control component in this utility model.

[0017] In the diagram: 1. Nickel plating tank; 2. Storage tank; 201. Inlet pipe; 202. First outlet pipe; 3. Replenishment pump; 4. Replenishment pipe; 5. Diverter pipe; 501. Collector pipe; 6. Second outlet pipe; 7. Nozzle; 8. Fixed bracket; 9. Replenishment control assembly; 901. Box body; 901a. Box cover; 901b. Movable hole; 901c. Limiting sleeve; 902. Micro switch; 903. Float; 903a. Threaded pipe; 904. Telescopic rod assembly; 904a. Threaded rod; 904b. Threaded sleeve; 905. Extrusion block; 10. Limiting pipe; 11. Support rod; 12. Clamp. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Reference Figures 1-6An automatic replenishment device for nickel plating of circuit boards includes a nickel plating tank 1 and a storage tank 2. The storage tank 2 is equipped with an inlet pipe 201 with a valve and a first outlet pipe 202. A replenishment assembly includes a replenishment pump 3, a replenishment pipe 4, a collection pipe 501, and a diversion pipe 5. One end of the replenishment pipe 4 is connected to the outlet of the replenishment pump 3, and the other end is connected to the diversion pipe 5 via the collection pipe 501. Multiple evenly distributed second outlet pipes 6 are provided on the side wall of the diversion pipe 5. The diversion pipe 5 and the second outlet pipes 6 are parallel to the bottom of the nickel plating tank 1, and the length of the diversion pipe 5 matches that of the nickel plating tank 1. A replenishment control assembly 9 is fixedly installed in the nickel plating tank 1 by a fixing bracket 8. Component 9 includes a housing 901, a micro switch 902, and a float 903. The housing 901 is open and downward and is fitted with a cover 901a. The cover 901a has a movable hole 901b at its center. The micro switch 902 is electrically connected to the replenishment pump 3. The micro switch 902 is fixedly installed inside the housing 901 with its button facing downward and directly opposite the movable hole 901b. The top of the float 903 is fixedly connected to a pressing block 905 via a telescopic rod assembly 904. The pressing block 905 is located directly below the button of the micro switch 902, and its top can extend into the housing 901 through the movable hole 901b. Both the telescopic rod assembly 904 and the pressing block 905 are perpendicular to the bottom of the nickel plating tank 1.

[0020] In this embodiment, the device provides liquid to the replenishment pump 3 through the storage tank 2. The replenishment pump 3 delivers the liquid to the diversion pipe 5 via the replenishment pipe 4 and the collection pipe 501, and then injects the liquid evenly into the nickel plating tank 1 through the second outlet pipe 6 evenly distributed on its side wall, thereby achieving continuous replenishment of the electroplating solution. The replenishment control component 9 senses the change in liquid level through the float 903. A pressing block 905 is provided above the float 903, which is connected to the float 903 through the telescopic rod assembly 904 and guided in the vertical direction. When the liquid level rises, the float 903 floats up and drives the pressing block 905 to rise. The pressing block 905 pushes the micro switch 902 button inside the box 901 through the movable hole 901b on the cover 901a, thereby triggering the replenishment pump 3 to start replenishment. Conversely, when the liquid level drops, the float 903 descends with the liquid surface, the squeezing block 905 stops applying pressure, the micro switch 902 disconnects, and the replenishment pump 3 stops operating, achieving the effect of automatic liquid level control. At the same time, the replenishment can be evenly distributed through multiple second liquid outlet pipes 6 arranged parallel to the bottom of the nickel plating tank 1, improving the uniformity of the plating solution concentration and ensuring the stability of the nickel plating process. The float 903 is usually a hollow sphere or a closed shell structure with an internal cavity to ensure that it can float stably in the liquid. The float 903 is usually made of corrosion-resistant materials with a density lower than that of the nickel plating solution, such as polypropylene (PP), polyvinylidene fluoride (PVDF), or stainless steel, to ensure that it will not be corroded after long-term immersion in the nickel plating solution and can stably perform its liquid level monitoring function.

[0021] In this utility model, several second liquid outlet pipes 6 are located on the side of the diversion pipe 5 away from the side wall of the nickel plating tank 1 and each end is fixedly connected to a nozzle 7. The end of the nozzle 7 is a duckbill-shaped structure, and both the diversion pipe 5 and the second liquid outlet pipes 6 are located in the nickel plating tank 1 near the designated liquid surface.

[0022] In this embodiment, the diversion pipe 5 and the second outlet pipe 6 are located inside the nickel plating tank 1 near the designated liquid surface, allowing the replenished nickel plating solution to flow in close to the actual usage liquid surface, reducing the flow distance of the plating solution and minimizing disturbance to the original plating solution surface in the tank. Several duckbill-shaped nozzles 7, fixedly connected to the ends of the second outlet pipes 6, increase the outlet area of ​​the nickel plating solution, enabling the nickel plating solution to be sprayed out evenly in a flat shape, expanding the coverage area of ​​the nickel plating solution, and preventing the nickel plating solution from concentrating in one place and flowing into the nickel plating tank 1. This ensures that the nickel plating solution is more evenly distributed in the nickel plating tank 1, allowing the circuit board to come into contact with the nickel plating solution of consistent concentration during the nickel plating process, effectively improving the uniformity and quality stability of the nickel plating of the circuit board, and ensuring the consistency and reliability of the nickel plating process.

[0023] In this utility model, the liquid collecting pipe 501 and the diversion pipe 5 are both fixedly installed on the inner wall of the nickel plating tank 1 by several clamps 12.

[0024] In this embodiment, the collecting pipe 501 and the second outlet pipe 6 are fixedly installed on the inner wall of the nickel plating tank 1 by several clamps 12. The clamps 12 can provide a stable and reliable fastening force, firmly fixing the collecting pipe 501 and the second outlet pipe 6 in a predetermined position. This effectively avoids displacement, loosening, or even detachment of the collecting pipe 501 and the second outlet pipe 6 due to the impact force generated by the flow of the nickel plating solution and the vibration during equipment operation during the nickel plating process. The stable pipeline installation ensures that the nickel plating solution can be smoothly transported along the predetermined path, ensuring the normal operation of the replenishment component, thereby maintaining the stability and uniformity of the nickel plating solution replenishment in the nickel plating tank 1, and improving the quality and production efficiency of circuit board nickel plating.

[0025] In this utility model, a limiting tube 10 is movably sleeved on the outside of the telescopic rod assembly 904. The inner diameter of the limiting tube 10 is smaller than the outer diameter of the extrusion block 905. A support rod 11 is fixedly connected to one side of the limiting tube 10. The end of the support rod 11 is welded to or fixedly connected to the inner wall of the nickel plating tank 1 by bolts to the fixed bracket 8.

[0026] In this embodiment, the limiting tube 10 movably sleeved on the telescopic rod assembly 904, together with the support rod 11 fixedly connected to one side, and the support rod 11 and the fixed bracket 8 are fixedly connected to the inner wall of the nickel plating tank 1 by welding or bolts, together forming a stable support structure; the inner diameter of the limiting tube 10 is smaller than the outer diameter of the extrusion block 905. This design can effectively limit the movement range of the extrusion block 905 and the telescopic rod assembly 904, preventing the telescopic rod assembly 904 from coming out of the limiting tube 10. At the same time, the limiting tube 10 can constrain the movement direction of the telescopic rod assembly 904, preventing it from shifting or shaking under the influence of plating solution fluctuations or equipment vibrations in the nickel plating tank 1, ensuring that the float 903 and the extrusion block 905 can move stably in a direction perpendicular to the bottom of the nickel plating tank 1, thereby accurately triggering the micro switch 902, ensuring the accuracy and stability of the liquid replenishment control component 9, effectively avoiding liquid replenishment abnormalities caused by changes in the position of the telescopic rod assembly 904, and providing a reliable guarantee for the accurate and automatic replenishment of plating solution during the nickel plating process of the circuit board.

[0027] In this utility model, a limiting sleeve 901c is movably sleeved on the outside of the extrusion block 905, and the top of the limiting sleeve 901c is fixedly connected to the box cover 901a.

[0028] In this embodiment, the limiting sleeve 901c, which is movably sleeved on the outside of the extrusion block 905, is fixedly connected to the top of the cover 901a. This structure can accurately limit the movement trajectory of the extrusion block 905. When the float 903 moves the extrusion block 905 up and down with the change of liquid level in the nickel plating tank 1, the limiting sleeve 901c can effectively prevent the extrusion block 905 from shifting laterally or shaking, ensuring that the extrusion block 905 always moves stably in the vertical direction. This allows for accurate triggering or resetting of the micro switch 902, avoiding the problem of false triggering or failure of the micro switch 902 due to the deviation of the extrusion block 905's position. This ensures the accuracy and reliability of the liquid replenishment control component 9 in controlling the liquid replenishment pump 3, and further improves the stability and accuracy of the automatic liquid replenishment device for nickel plating of circuit boards.

[0029] In this utility model, the telescopic rod assembly 904 includes a threaded rod 904a, a threaded sleeve 904b is threadedly connected to the threaded rod 904a, the top of the threaded sleeve 904b is fixedly connected to the extrusion block 905, and a threaded tube 903a matching the threaded sleeve 904b is fixedly connected to the top of the float 903, and the threaded tube 903a is threadedly connected to the lower end of the threaded rod 904a.

[0030] In this embodiment, the telescopic rod assembly 904 adopts a combined structure of threaded rod 904a and threaded sleeve 904b connected by threads, and threaded tube 903a connected to the lower end of threaded rod 904a by threads, forming a precisely adjustable length control mechanism. By rotating the threaded sleeve 904b, its position on the threaded rod 904a can be changed, thereby adjusting the relative distance between float 903 and pressing block 905, realizing stepless adjustment of the overall length of the telescopic rod assembly 904. This threaded drive method is not only easy to operate, but also provides high-precision length control. The liquid level threshold triggered by the float 903 to the microswitch 902 can be precisely set according to different nickel plating process requirements. For processes with high requirements for liquid level stability, precise adjustment can bring the replenishment trigger point closer to the ideal liquid level. Furthermore, the self-locking characteristic of the threaded connection ensures that the length of the telescopic rod assembly 904 remains stable after adjustment, and will not change due to fluctuations in the plating solution in the nickel plating tank 1 or equipment vibration. This provides reliable liquid level control for the circuit board nickel plating process, significantly improving the device's adaptability to different nickel plating processes and the accuracy of replenishment control. The float 903 is connected to the threaded rod 904a via a threaded tube 903a, facilitating replacement and disassembly. The above description is only a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. An automatic electrolyte replenishment device for nickel plating of circuit boards, characterized in that, include: Nickel plating tank (1) and storage tank (2), wherein the storage tank (2) is provided with an inlet pipe (201) with a valve and a first outlet pipe (202); The replenishment assembly includes a replenishment pump (3), a replenishment pipe (4), a collection pipe (501), and a diversion pipe (5). One end of the replenishment pipe (4) is connected to the outlet of the replenishment pump (3), and the other end is connected to the diversion pipe (5) via the collection pipe (501). The side wall of the diversion pipe (5) is provided with multiple evenly distributed second outlet pipes (6). The diversion pipe (5) and the second outlet pipes (6) are parallel to the bottom of the nickel plating tank (1), and the length of the diversion pipe (5) matches that of the nickel plating tank (1). A replenishment control assembly (9) is fixedly installed in the nickel plating tank (1) by a fixing bracket (8). The replenishment control assembly (9) includes a housing (901), a micro switch (902), and a float (903). The housing (901) is open downwards and fitted with a cover (901a). The cover (901a) has a movable hole (901b) at the center. The micro switch (902) is electrically connected to the replenishment pump (3). The float (903) is fixedly installed inside the box (901) with the button facing down and directly opposite the movable hole (901b). The top of the float (903) is fixedly connected to the pressing block (905) via the telescopic rod assembly (904). The pressing block (905) is located directly below the button of the micro switch (902), and its top can extend into the box (901) through the movable hole (901b). Both the telescopic rod assembly (904) and the pressing block (905) are perpendicular to the bottom of the nickel plating tank (1).

2. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 1, wherein Several second outlet pipes (6) are located on the side of the diversion pipe (5) away from the side wall of the nickel plating tank (1) and each end is fixedly connected to a nozzle (7). The end of the nozzle (7) is a duckbill-shaped structure, and the diversion pipe (5) and the second outlet pipe (6) are both located in the nickel plating tank (1) near the designated liquid surface.

3. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 1, wherein The liquid collection pipe (501) and the diversion pipe (5) are both fixedly installed on the inner wall of the nickel plating tank (1) by several clamps (12).

4. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 1, wherein The telescopic rod assembly (904) is movably fitted with a limiting tube (10), the inner diameter of which is smaller than the outer diameter of the extrusion block (905).

5. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 4, wherein A support rod (11) is fixedly connected to one side of the limiting tube (10). The end of the support rod (11) is welded to or fixed to the inner wall of the nickel plating tank (1) by bolts, along with the fixed bracket (8).

6. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 1, wherein The compression block (905) is movably fitted with a limiting sleeve (901c), and the top of the limiting sleeve (901c) is fixedly connected to the box cover (901a).

7. An automatic electrolyte replenishment device for nickel plating of circuit boards according to claim 1, characterized in that, The telescopic rod assembly (904) includes a threaded rod (904a) with a threaded sleeve (904b) threadedly connected to it, and the top of the threaded sleeve (904b) is fixedly connected to the compression block (905).

8. The automatic liquid supplementing device for nickel plating of a circuit board according to claim 7, wherein The top of the floating ball (903) is fixedly connected with a threaded pipe (903a) matched with a threaded sleeve (904b), and the threaded pipe (903a) is threadedly connected with the lower end of a threaded rod (904a).

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