Thin-film transistor circuit cutting device

Abstract

This utility model discloses a thin-film transistor circuit cutting device, relating to the field of glass substrate processing technology. It includes a machine base and a laser head. The machine base has a mounting frame connected to its top. A dust-collecting mechanism is wrapped around the outer surface of the laser head and extends to the back of the mounting frame. A placement plate is connected to the back of the mounting frame. A first filter mechanism and a second filter mechanism are respectively installed on the top of the placement plate. Through the dust-collecting mechanism, the first filter mechanism, and the second filter mechanism, not only can glass shavings and harmful gases generated during glass substrate cutting be sucked up and collected, but the collected gases and glass shavings can also be separated and processed. Simultaneously, the gases are filtered before being discharged again, preventing harmful gases from polluting the air. This not only ensures the physical and mental health of the workers but also guarantees the cleanliness of the production environment, thereby improving the safety of the device during use.

Description

Technical Field

[0001] This utility model relates to the field of glass substrate processing technology, and in particular to a thin film transistor circuit cutting device. Background Technology

[0002] TFT is an abbreviation for Thin Film Transistor. A thin film transistor can be viewed as a layer of liquid crystal sandwiched between two glass substrates. The upper glass substrate contains a color filter, while the lower glass substrate has transistors embedded on it. Because the upper glass is bonded to the color filter, each pixel contains three colors: red, blue, and green. These pixels emitting red, blue, and green colors constitute the image on the skin. The technology of microelectronic precision processing on single crystals is transferred to the processing of thin film transistor arrays on large-area glass. Then, this array substrate is attached to another substrate with a color filter to obtain a thin film transistor. In the process of processing thin film transistors, the glass substrate is one of the most important raw materials, so laser cutting is required to cut the glass substrate.

[0003] Current cutting equipment generates glass shavings and harmful gases during the laser cutting process on glass substrates. Since the glass shavings and gases are not collected, the harmful gases can harm the physical and mental health of workers. At the same time, the glass shavings accumulate on the glass substrates, contaminating the welding process. To address this, we propose a thin-film transistor circuit cutting device. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a thin-film transistor circuit cutting device. Its advantages include the ability to collect glass shards and harmful gases, preventing pollution of the production environment and protecting the physical and mental health of workers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A thin-film transistor circuit cutting device includes a machine base and a laser head. The machine base has a mounting frame connected to its top. A dust-collecting mechanism is wound around the outer surface of the laser head and extends to the back of the mounting frame. A placement plate is connected to the back of the mounting frame. A first filter mechanism and a second filter mechanism are respectively disposed on the top of the placement plate. A suction fan is connected between the first and second filter mechanisms. A blocking mechanism is disposed on the back of the placement plate. Both the first and second filter mechanisms have placement slots, and both placement slots have ejection mechanisms inside.

[0007] The above technical solution involves: starting the suction fan to generate suction that draws in glass shards and harmful gases; then separating and filtering the glass shards and harmful gases through the first and second filtration mechanisms, respectively; and finally, expelling the filtered gas to avoid environmental pollution. By pulling the blocking mechanism to remove the obstruction of the first and second filtration mechanisms, the two ejection mechanisms will reset, ejecting the first and second filtration mechanisms for easy maintenance and cleaning.

[0008] The present invention is further configured such that the dust collection mechanism includes a winding tube, a connecting tube, a suction head, and a flexible hose. The winding tube is wound around the outer surface of the laser head, the connecting tube is connected to the outer surface of the winding tube, the suction head is connected to one end of the connecting tube, and the flexible hose is connected to the outer surface of the winding tube, with one end of the flexible hose extending to the back of the mounting frame.

[0009] The above technical solution allows harmful gases and glass shards to be transported through connecting pipes, spiral pipes, and hoses to the interiors of the first and second filtration units for filtration by generating suction from the suction head.

[0010] The present invention is further configured such that the first filtration mechanism includes a first filter box, a filter screen and a hinge plate, the first filter box is connected to the top of the placement plate, and grooves are provided on the top and bottom of the inner wall of the first filter box, the filter screen is placed between the two grooves, and the hinge plate is hinged to the bottom of the first filter box.

[0011] The above technical solution allows glass shards to be trapped inside the first filter box via a filter screen, and finally, the glass shards can be discharged by opening the hinge plate.

[0012] The present invention is further configured such that the second filtration mechanism includes a second filter box and an activated carbon mesh, the second filter box is connected to the top of the placement plate, and the top and bottom of the second filter box are provided with grooves, the activated carbon mesh is placed inside the two grooves, and the input end and output end of the suction fan are respectively connected to one side of the first filter box and one side of the second filter box.

[0013] The above technical solution involves filtering harmful gases through an activated carbon mesh and then discharging the gases through a discharge pipe on one side of the second filter box.

[0014] The present invention is further configured such that the blocking mechanism includes an L-shaped plate, a sliding plate, a handle, a main magnet, and a secondary magnet. The L-shaped plate is connected to the back of the placement plate, the sliding plate is slidably connected to the back of the L-shaped plate, and one end of the sliding plate extends to the front of the L-shaped plate. The bottom of the sliding plate is in contact with the top of the first filter box and the second filter box. The handle is connected to the other end of the sliding plate, the main magnet is connected to the back of the L-shaped plate, and the secondary magnet is connected to one end of the handle. The main magnet and the secondary magnet are in an attractive state.

[0015] With the above technical solution: after the auxiliary magnet and the main magnet are separated by pulling the handle, the slide plate can slide on the L-shaped plate, no longer obstructing the top of the first filter box and the top of the second filter box, which facilitates the subsequent removal of the filter screen and activated carbon screen.

[0016] The present invention is further configured such that the ejection mechanism includes two spring telescopic rods and a mounting plate, the two spring telescopic rods are connected to the bottom of the inner wall of one of the grooves, the mounting plate is connected between the top ends of the two spring telescopic rods, and the top of the mounting plate is in contact with the bottom of the filter screen.

[0017] The above technical solution allows the mounting plate to rise after the two spring telescopic rods are reset, thereby pushing out the filter screen and the second filter box.

[0018] The present invention is further provided that a discharge trough is provided at the bottom of the placement trough.

[0019] The above technical solution allows glass shards inside the first filter box to be discharged by opening the hinge plate through the setting of the discharge chute.

[0020] The present invention is further configured such that a placement platform is connected to the top of the machine tool, clamping components are connected to the front and both sides of the machine tool, a horizontal moving component and a vertical moving component are provided inside the mounting frame, and the laser head is connected to the horizontal moving component.

[0021] The above technical solution involves placing the glass substrate on a stage, positioning it around its perimeter using four clamping components, and then moving the laser head via horizontal and vertical moving components to cut the glass substrate.

[0022] The beneficial effects of this utility model are as follows:

[0023] 1. The thin-film transistor circuit cutting device, through its dust suction mechanism, first filter mechanism, and second filter mechanism, can not only suck up and collect glass shavings and harmful gases generated during the cutting of glass substrates, but also separate the collected gases and glass shavings, and filter the gases before discharging them again, thus preventing harmful gases from polluting the air. This not only ensures the physical and mental health of the workers, but also guarantees the cleanliness of the production environment, thereby improving the safety of the device during use.

[0024] 2. Thin-film transistor circuit cutting device: With the setting of blocking mechanism and two ejection mechanism, it is easy for staff to remove the filter screen and activated carbon screen from the inside of the first filter box and the second filter box, so as to facilitate the maintenance and cleaning of the filter box and improve the efficiency and convenience of the maintenance of the first filter box and the second filter box. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the thin-film transistor circuit cutting device proposed in this utility model.

[0026] Figure 2 This is a schematic diagram of the back structure of the thin-film transistor circuit cutting device proposed in this utility model;

[0027] Figure 3 This is a schematic diagram of the horizontal and vertical movement components;

[0028] Figure 4 This is a schematic diagram of the dust collection mechanism of the thin-film transistor circuit cutting device proposed in this utility model.

[0029] Figure 5 This is a schematic diagram of the blocking mechanism of the thin-film transistor circuit cutting device proposed in this utility model.

[0030] Figure 6 This is a schematic diagram of the ejection mechanism of the thin-film transistor circuit cutting device proposed in this utility model.

[0031] In the diagram: 1. Machine base; 2. Mounting frame; 3. Laser head; 4. Dust collection mechanism; 401. Winding tube; 402. Connecting tube; 403. Suction head; 404. Flexible hose; 5. First filtration mechanism; 501. First filter box; 502. Filter screen; 503. Hinge plate; 6. Second filtration mechanism; 601. Second filter box; 602. Activated carbon screen; 7. Blocking mechanism; 701. L-shaped plate; 702. Slide plate; 703. Handle; 704. Main magnet; 705. Secondary magnet; 8. Ejection mechanism; 801. Spring telescopic rod; 802. Mounting plate. Detailed Implementation

[0032] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0033] The embodiments of this patent are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this patent, and should not be construed as limiting this patent.

[0034] In the description of this patent, it should be understood that the terms “center,” “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this patent and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this patent.

[0035] In the description of this patent, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this patent according to the specific circumstances.

[0036] Example 1

[0037] Reference Figures 1-6 A thin-film transistor circuit cutting device includes a machine base 1 and a laser head 3. A mounting frame 2 is connected to the top of the machine base 1. A dust suction mechanism 4 is wrapped around the outer surface of the laser head 3 and extends to the back of the mounting frame 2. A placement plate is connected to the back of the mounting frame 2. A first filter mechanism 5 and a second filter mechanism 6 are respectively provided on the top of the placement plate. A suction fan is connected between the first filter mechanism 5 and the second filter mechanism 6. A blocking mechanism 7 is provided on the back of the placement plate. Both the first filter mechanism 5 and the second filter mechanism 6 have placement slots, and both placement slots have an ejection mechanism 8 inside.

[0038] Specifically, by activating the suction fan, the dust collection mechanism 4 generates suction to draw in the glass shards and harmful gases generated by the laser head 3 during cutting. The glass shards and harmful gases are then separated and filtered by the first filter mechanism 5 and the second filter mechanism 6, respectively. The filtered gases are then discharged again to avoid environmental pollution. By pulling the blocking mechanism 7 to release the obstruction of the first filter mechanism 5 and the second filter mechanism 6, the two ejection mechanisms 8 will reset and eject the first filter mechanism 5 and the second filter mechanism 6, thus facilitating subsequent maintenance and cleaning of the first filter mechanism 5 and the second filter mechanism 6.

[0039] Reference Figures 4-5 The thin-film transistor circuit cutting device, specifically, includes a dust extraction mechanism 4 comprising a winding tube 401, a connecting tube 402, a suction head 403, and a flexible hose 404. The winding tube 401 is wound around the outer surface of the laser head 3, the connecting tube 402 is connected to the outer surface of the winding tube 401, the suction head 403 is connected to one end of the connecting tube 402, and the flexible hose 404 is connected to the outer surface of the winding tube 401, with one end of the flexible hose 404 extending to the back of the mounting frame 2. The first filtering mechanism 5 includes a first filter box 501, a filter screen 502, and a hinge plate 503. The first filter box 501 is connected to the mounting frame 2. The top of the plate, and the top and bottom of the inner wall of the first filter box 501 are both provided with grooves. The filter screen 502 is placed between the two grooves. The hinge plate 503 is hinged to the bottom of the first filter box 501. The second filter mechanism 6 includes a second filter box 601 and an activated carbon screen 602. The second filter box 601 is connected to the top of the plate, and the top and bottom of the second filter box 601 are both provided with grooves. The activated carbon screen 602 is placed inside the two grooves. The input end and output end of the suction fan are respectively connected to one side of the first filter box 501 and one side of the second filter box 601.

[0040] Specifically, the suction fan is activated to generate suction, creating negative pressure in the suction head 403. Glass shards and gas are drawn in through the suction head 403. The gas flows into the first filter box 501 through the connecting pipe 402, the spiral tube 401, and the flexible hose 404. The gas is then filtered through the filter screen 502, which intercepts the glass shards. The separated gas then re-enters the second filter box 601 through the suction fan. After being filtered through the activated carbon screen 602, the gas is discharged through the exhaust pipe, thus preventing gas pollution of the environment.

[0041] Reference Figures 1-6The thin-film transistor circuit cutting device includes a blocking mechanism 7 comprising an L-shaped plate 701, a sliding plate 702, a handle 703, a main magnet 704, and a secondary magnet 705. The L-shaped plate 701 is connected to the back of a placement plate. The sliding plate 702 is slidably connected to the back of the L-shaped plate 701, with one end of the sliding plate 702 extending to the front of the L-shaped plate 701. The bottom of the sliding plate 702 is in contact with the top of the first filter box 501 and the second filter box 601. The handle 703 is connected to the other end of the sliding plate 702. The main magnet 704 is connected to the back of the L-shaped plate 701, and the secondary magnet 705 is connected to one end of the handle 703. Magnet 704 and auxiliary magnet 705 are attracted to each other. The ejection mechanism 8 includes two spring telescopic rods 801 and a mounting plate 802. The two spring telescopic rods 801 are connected to the bottom of the inner wall of one of the tanks. The mounting plate 802 is connected between the tops of the two spring telescopic rods 801, and the top of the mounting plate 802 is in contact with the bottom of the filter screen 502. The bottom of the placement tank is provided with a discharge chute. The top of the machine base 1 is connected to a placement platform. Clamping components are connected to the front and both sides of the machine base 1. The interior of the mounting frame 2 is provided with a horizontal movement component and a vertical movement component, and the laser head 3 is connected to the horizontal movement component.

[0042] Specifically, pulling the handle 703 forces the auxiliary magnet 705 and the main magnet 704 to separate. At this time, the sliding plate 702 can slide on the L-shaped plate 701, thus no longer obstructing the top of the activated carbon mesh 602 and the filter screen 502. At this time, the two mounting plates 802 will reset, causing the spring telescopic rod 801 to rise, pushing the filter screen 502 and the activated carbon mesh 602 out of the groove respectively, so that the filter screen 502 and the activated carbon mesh 602 can be popped out from the inside of the first filter box 501 and the activated carbon mesh 602, which is convenient for subsequent cleaning and maintenance. By opening the hinge plate 503, the glass shards inside the first filter box 501 can be discharged through the discharge chute. The four clamping components can be used to clamp the glass substrate on the top of the placement platform. The horizontal and vertical moving components can be used to drive the laser head 3 to perform horizontal and vertical moving operations.

[0043] Working principle: First, the glass substrate is placed on top of the placement table and fixed by four clamping components. Then, the horizontal and vertical moving components drive the laser head 3 to move and cut the glass substrate. At this time, the operator starts the suction fan. The suction fan's input end generates suction, which creates negative pressure in the suction head 403, sucking in glass shards and gas generated from the glass substrate. The gas flows into the first filter box 501 through the connecting pipe 402, the winding pipe 401, and the flexible hose 404. Then, the gas is filtered through the filter screen 502, thus intercepting the glass shards. The gas then re-enters the second filter box 601 through the suction fan. After being filtered through the activated carbon screen 602, the gas can enter through the exhaust pipe. To prevent gas pollution, the filter screen 502 and activated carbon screen 602 can be maintained by simply pulling the handle 703. This separates the auxiliary magnet 705 from the main magnet 704, allowing the sliding plate 702 to slide on the L-shaped plate 701. This removes the obstruction to the top of the activated carbon screen 602 and the filter screen 502. The two mounting plates 802 then reset, causing the spring telescopic rod 801 to rise and push the filter screen 502 and activated carbon screen 602 out of the grooves. This allows the filter screen 502 and activated carbon screen 602 to be easily removed from the first filter box 501 and the activated carbon screen 602 for maintenance and cleaning.

[0044] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A thin film transistor line cutting apparatus comprising a machine table (1) and a laser head (3), characterized in that, The top of the machine base (1) is connected to a mounting frame (2), the outer surface of the laser head (3) is wrapped with a dust suction mechanism (4), and the dust suction mechanism (4) extends to the back of the mounting frame (2). The back of the mounting frame (2) is connected to a placement plate. The top of the placement plate is respectively provided with a first filter mechanism (5) and a second filter mechanism (6). A suction fan is connected between the first filter mechanism (5) and the second filter mechanism (6). The back of the placement plate is provided with a blocking mechanism (7). The first filter mechanism (5) and the second filter mechanism (6) are both provided with placement slots, and the interior of the two placement slots is provided with an ejection mechanism (8).

2. The thin film transistor line cutting apparatus according to claim 1, wherein The vacuuming mechanism (4) includes a winding tube (401), a connecting tube (402), a suction head (403), and a flexible tube (404). The winding tube (401) is wound around the outer surface of the laser head (3). The connecting tube (402) is connected to the outer surface of the winding tube (401). The suction head (403) is connected to one end of the connecting tube (402). The flexible tube (404) is connected to the outer surface of the winding tube (401), and one end of the flexible tube (404) extends to the back of the mounting frame (2).

3. The thin film transistor line cutting apparatus according to claim 1, wherein The first filtration mechanism (5) includes a first filter box (501), a filter screen (502), and a hinge plate (503). The first filter box (501) is connected to the top of the placement plate, and grooves are provided on the top and bottom of the inner wall of the first filter box (501). The filter screen (502) is placed between the two grooves, and the hinge plate (503) is hinged to the bottom of the first filter box (501).

4. The thin film transistor line cutting apparatus according to claim 1, wherein The second filtration mechanism (6) includes a second filter box (601) and an activated carbon mesh (602). The second filter box (601) is connected to the top of the placement plate, and the top and bottom of the second filter box (601) are provided with grooves. The activated carbon mesh (602) is placed inside the two grooves. The input end and output end of the suction fan are respectively connected to one side of the first filter box (501) and one side of the second filter box (601).

5. The thin film transistor line cutting apparatus according to claim 1, wherein The blocking mechanism (7) includes an L-shaped plate (701), a sliding plate (702), a handle (703), a main magnet (704), and a secondary magnet (705). The L-shaped plate (701) is connected to the back of the placement plate. The sliding plate (702) is slidably connected to the back of the L-shaped plate (701), and one end of the sliding plate (702) extends to the front of the L-shaped plate (701). The bottom of the sliding plate (702) is in contact with the top of the first filter box (501) and the second filter box (601). The handle (703) is connected to the other end of the sliding plate (702). The main magnet (704) is connected to the back of the L-shaped plate (701). The secondary magnet (705) is connected to one end of the handle (703), and the main magnet (704) and the secondary magnet (705) are attracted to each other.

6. The thin film transistor line cutting apparatus according to claim 3, wherein The ejection mechanism (8) includes two spring telescopic rods (801) and a mounting plate (802). The two spring telescopic rods (801) are connected to the bottom of the inner wall of one of the tanks. The mounting plate (802) is connected between the tops of the two spring telescopic rods (801), and the top of the mounting plate (802) is in contact with the bottom of the filter screen (502).

7. The thin film transistor line cutting apparatus according to claim 1, wherein The bottom of the placement trough is provided with a discharge trough.

8. The thin film transistor line cutting apparatus according to claim 1, wherein The top of the machine base (1) is connected to a placement platform. Clamping components are connected to the front and both sides of the machine base (1). The interior of the mounting frame (2) is provided with a horizontal moving component and a vertical moving component, and the laser head (3) is connected to the horizontal moving component.

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