Evaporation crucible

Abstract

This utility model discloses a vapor deposition crucible, including a pot body with an inner cavity and an outer cavity spaced apart from each other. An organic material is placed inside the inner cavity, and a vapor deposition nozzle is located at the top of the inner cavity. A heating wire is placed inside the outer cavity, surrounding the outer wall of the inner cavity. One end of the heating wire along the height of the pot body is adjacent to the bottom of the pot body, and the other end is adjacent to a cover plate at the top of the pot body. The cover plate has clearance holes corresponding to the vapor deposition nozzle. A heat spreader is placed between the cover plate and the heating wire, abutting against both the heating wire and the cover plate. The horizontal projections of the heating wire and the heat spreader are both within the horizontal projection range of the cover plate. This utility model's vapor deposition crucible has a simple structure, effectively preventing heat from the heating wire from being directly transferred to the panel, while maintaining a uniform temperature throughout the entire vapor deposition crucible, which is beneficial for ensuring the quality of the vapor deposition on the panel.

Description

Technical Field

[0001] This utility model relates to the field of panel production equipment technology, and in particular to a vapor deposition crucible. Background Technology

[0002] Reference Figure 1 As shown, existing vapor deposition crucibles 1' typically employ a heating wire 2' positioned near the bottom. This design aims to fully heat the organic material within the crucible, ensuring its smooth vaporization. The vaporized material is then evenly ejected through the vapor deposition nozzle 11' at the top of the crucible 1', achieving efficient vapor deposition of the panel 3'. In existing designs, to ensure consistent temperatures across the top and bottom of the crucible 1' and prevent uneven deposition due to temperature differences, an additional heating wire 2' is usually added to the top of the crucible 1', covering its outer surface. This partially exposed heating wire 2' serves two purposes: heating the organic material within the crucible 1' and maintaining a consistent temperature within the vapor deposition chamber to ensure the quality of the panel 3''s vapor deposition.

[0003] The existing technology has the following drawbacks in practical applications: After adding heating wires 2' to the top of the vapor deposition crucible 1', because these heating wires 2' are relatively close to the panel 3', the heat generated by the heating wires 2' at the top of the vapor deposition crucible 1' is directly transferred to the top panel 3'. This direct heat transfer will cause the temperature of the panel 3' to rise significantly, thereby causing poor vapor deposition on the panel 3' and affecting the vapor deposition quality. Utility Model Content

[0004] The purpose of this invention is to provide a vapor deposition crucible with a simple structure that can effectively prevent the heat from the heating wire from being directly transferred to the panel, while maintaining a uniform temperature throughout the vapor deposition crucible, which is beneficial to ensuring the vapor deposition quality of the panel.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A vapor deposition crucible is provided, comprising a pot body, the pot body including an inner cavity and an outer cavity spaced apart from each other, an organic material being disposed in the inner cavity, a vapor deposition nozzle being disposed at the top of the inner cavity, a heating wire being disposed in the outer cavity, the heating wire being disposed around the outer side wall of the inner cavity, one end of the heating wire being adjacent to the bottom of the pot body along the height direction of the pot body, and the other end of the heating wire being adjacent to a cover plate at the top of the pot body, the cover plate being provided with a clearance hole corresponding to the position of the vapor deposition nozzle, a heat spreader being disposed between the cover plate and the heating wire, the heat spreader abutting against the heating wire and the cover plate respectively, and the horizontal projections of the heating wire and the heat spreader being located within the horizontal projection range of the cover plate.

[0007] In one embodiment of the vapor deposition crucible, the heat spreader portion is located inside the outer cavity and abuts against the heating wire, and the heat spreader portion extends to the outside of the crucible to form a heat-conducting part.

[0008] In one embodiment of the vapor deposition crucible, the cover plate includes an extension extending to the outside of the crucible body, the extension having a length D along its extending direction, and the heat-conducting part having a length d along its extending direction, where d ≥ 1 / 2D.

[0009] In one embodiment of the vapor deposition crucible, 1 / 2D ≤ d ≤ 2 / 3D.

[0010] In one embodiment of the vapor deposition crucible, a plurality of supporting heat-conducting rods are also included. One end of the supporting heat-conducting rod abuts against the bottom of the pot body, and the other end of the supporting heat-conducting rod abuts against the heat spreader. The heating wire is spirally and uniformly wrapped around the outside of the supporting heat-conducting rod.

[0011] In one embodiment of the vapor deposition crucible, a plurality of the supporting heat-conducting rods are evenly distributed around the outer side of the inner cavity.

[0012] In one embodiment of the vapor deposition crucible, the outer cavity is provided with a thermally conductive liquid, and the heating wire is immersed in the thermally conductive liquid.

[0013] In one embodiment of the vapor deposition crucible, a first temperature sensor and a second temperature sensor are further included, the first temperature sensor being disposed in the inner cavity and the second temperature sensor being disposed in the outer cavity.

[0014] In one embodiment of the vapor deposition crucible, the cover plate is detachably connected to the vessel body, and / or

[0015] The cover plate is detachably connected to the temperature distribution plate, and / or

[0016] The temperature distribution plate is detachably connected to the pot body.

[0017] In one embodiment of the vapor deposition crucible, the heating wire is connected to an external power supply device via a connecting wire, one end of the cover plate is provided with a first semicircular hole, and the temperature equalization plate is provided with a second semicircular hole corresponding to the first semicircular hole. The first semicircular hole and the second semicircular hole are combined to form a wiring hole for the connecting wire to pass through.

[0018] The beneficial effects of this invention are as follows: By placing the organic material and heating wire in the spaced-apart inner and outer cavities of the pot, the heating wire achieves uniform heat conduction to the organic material through the cavity wall, avoiding localized overheating and effectively eliminating the risk of material deterioration such as carbonization, thus ensuring the quality of the organic material and consequently the quality of the panel vapor deposition. Specifically, one end of the heating wire along the height of the pot is adjacent to the bottom of the pot, and the other end is adjacent to the top cover plate, meaning the heating wire heats the entire pot uniformly from top to bottom, ensuring that the temperature remains as consistent as possible. This guarantees that the organic material remains vaporized when ejected from the vapor deposition nozzle at the top of the pot, thus ensuring the quality of the panel vapor deposition.

[0019] Furthermore, the heating wire is housed within the outer cavity and protected by a cover plate on top of the pot, preventing direct exposure of the heating wire and thus avoiding overheating of the panel. This reduces the probability of panel defects and ensures the quality of the vapor deposition process. Additionally, the cover plate does not directly contact the heating wire; instead, a heat spreader transfers the heat from the heating wire to the cover plate, maintaining a consistent temperature and preventing overheating that could directly transfer heat to the panel. Moreover, the heat spreader ensures a relatively uniform temperature across the cover plate, preventing localized overheating and subsequent heat transfer to the panel. Attached Figure Description

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram of the structure of an existing vapor deposition crucible;

[0022] Figure 2 This is a schematic diagram of the vapor deposition crucible in an embodiment of this utility model;

[0023] Figure 3 This is a side view of the vapor deposition crucible in an embodiment of this utility model;

[0024] Figure 4 This is a top view of the vapor deposition crucible (without the cover plate and the temperature equalization plate) in an embodiment of this utility model;

[0025] Figure 5 This is a partial structural schematic diagram of the cover plate in an embodiment of this utility model.

[0026] Figure 1 middle:

[0027] 1′, Evaporation crucible; 11′, Evaporation nozzle; 2′, Heating wire; 3′, Panel;

[0028] Figures 2 to 5 middle:

[0029] 1. Pot body; 11. Inner cavity; 111. Evaporation nozzle; 12. Outer cavity; 2. Organic material; 31. Heating wire; 32. Supporting heat-conducting rod; 4. Cover plate; 41. Clearance hole; 42. Extension; 43. First semi-circular hole; 5. Heat spreader plate; 51. Heat-conducting part; 52. Second semi-circular hole; 6. Heat-conducting liquid; 7. Connecting wire; 8. Wiring hole; 91. First temperature sensor; 92. Second temperature sensor. Detailed Implementation

[0030] The advantages and features of this invention, as well as methods of implementing them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, this invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided merely to complete the disclosure of this invention and to enable those skilled in the art to fully understand its scope, which is defined only by the scope of the claims. The same reference numerals denote the same constituent elements throughout the specification.

[0031] The present invention will now be described in detail with reference to the accompanying drawings.

[0032] like Figures 2 to 5 As shown, the vapor deposition crucible of this utility model embodiment includes a pot body 1, which includes an inner cavity 11 and an outer cavity 12 spaced apart from each other. The inner cavity 11 is filled with organic material 2, and the top of the inner cavity 11 is provided with a vapor deposition nozzle 111. The outer cavity 12 is provided with a heating wire 31, which is arranged around the outer wall of the inner cavity 11. One end of the heating wire 31 along the height direction of the pot body 1 is adjacent to the bottom of the pot body 1, and the other end of the heating wire 31 is adjacent to the cover plate 4 at the top of the pot body 1. The cover plate 4 is provided with a clearance hole 41 corresponding to the position of the vapor deposition nozzle 111. A heat equalization plate 5 is provided between the cover plate 4 and the heating wire 31. The heat equalization plate 5 abuts against the heating wire 31 and the cover plate 4 respectively. The horizontal projection of the heating wire 31 and the heat equalization plate 5 are both located within the horizontal projection range of the cover plate 4. The heat spreader 5 is provided with a clearance through hole (not shown) at the position corresponding to the inner cavity 12, so that the vapor deposition nozzle 111 at the top of the inner cavity 11 can pass through the clearance through hole and the clearance hole 41 in sequence, and spray vaporized organic material 2 toward the panel above to vapor deposit the panel.

[0033] In this embodiment, the organic material 2 and the heating wire 31 are respectively arranged in the inner cavity 11 and the outer cavity 12 spaced apart within the pot body 1. Specifically, the outer cavity 12 surrounds the outer side of the inner cavity 11, and the cavity wall of the inner cavity 11 has thermal conductivity. This allows the heating wire 31 to uniformly conduct heat to the organic material 2 through the cavity wall of the inner cavity 11, avoiding local overheating and effectively eliminating the risk of material deterioration such as carbonization, thus ensuring the quality of the organic material 2 and consequently the quality of the panel vapor deposition. One end of the heating wire 31 along the height direction of the pot body 1 is adjacent to the bottom of the pot body 1, and the other end is adjacent to the cover plate 4 at the top of the pot body 1. This means the heating wire 31 heats the upper and lower parts of the pot body 1 uniformly, ensuring that the temperature of the upper and lower parts of the pot body 1 remains as consistent as possible. This ensures that the organic material 2 remains vaporized when it is ejected from the vapor deposition nozzle 111 at the top of the pot body 1, thereby guaranteeing the quality of the panel vapor deposition.

[0034] Furthermore, the heating wire 31 is disposed within the outer cavity 12 and is blocked by a cover plate 4 on the top of the pot body 1, preventing the heating wire 31 from being directly exposed and heating the panel, thus reducing the probability of panel defects and ensuring the quality of panel vapor deposition. In addition, the cover plate 4 does not directly contact the heating wire 31; instead, the heat from the heating wire 31 is transferred to the cover plate 4 through the heat spreader 5, allowing the cover plate 4 to maintain a certain temperature and prevent overheating, thus reducing the risk of heat being directly transferred to the panel. Moreover, the heat conduction through the heat spreader 5 ensures that the temperature of all parts of the cover plate 4 remains relatively consistent, preventing localized overheating of the cover plate 4 and the direct transfer of heat to the panel.

[0035] In one embodiment, a portion of the heat spreader 5 is located within the outer cavity 12 and abuts against the heating wire 31. The heat spreader 5 extends to the outside of the pot body 1, forming a heat-conducting section 51. The heat spreader 5 directly abuts against the heating wire 31 to quickly absorb heat, which is then conducted to the outside of the pot body 1 through the heat-conducting section 51 to heat the vapor deposition chamber. Furthermore, since the vapor deposition chamber is heated indirectly through the heat spreader 5, overheating of the vapor deposition chamber is avoided, thus maintaining the panel within a vapor deposition chamber with a certain temperature for vapor deposition operations, ensuring vapor deposition quality. In actual operation, the heat spreader 5 can be a metal heat spreader, such as a copper heat spreader or an iron heat spreader, to achieve good thermal conductivity. Of course, depending on the actual operating conditions, heat spreaders 5 with different thermal conductivity can be used to ensure that the vapor deposition chamber maintains a certain temperature without overheating.

[0036] In one embodiment, the cover plate 4 includes an extension 42 extending to the outside of the pot body 1. The length of the extension 42 along its extension direction is D, and the length of the heat-conducting part 51 along its extension direction is d, where d ≥ 1 / 2D. This ensures that the heat-conducting part 51 can effectively conduct heat to the extension 42, preventing the extension 42 from moving away from the pot body 1 and causing the temperature of the extension 42 to drop, resulting in uneven temperature of the overall structure and affecting the evaporation quality.

[0037] Furthermore, 1 / 2D≤d≤2 / 3D, while ensuring that the heat-conducting part 51 can effectively conduct heat to the extension part 42, it is also necessary to avoid the heat-conducting part 51 being too long, so that the extension part 42 cannot effectively block the heat dissipated by the heat-conducting part 51. This part of the heat will bypass the extension part 42 and heat the panel upward, causing the panel to overheat.

[0038] In one embodiment, the vapor deposition crucible further includes multiple supporting heat-conducting rods 32. One end of each supporting heat-conducting rod 32 abuts against the bottom of the pot body 1, and the other end abuts against the heat spreader plate 5. Heating wires 31 are spirally and uniformly wound around the outside of the supporting heat-conducting rods 32. On the one hand, by arranging the heating wires 31 in a spiral shape, the effective length of the heating wires 31 is increased, thereby improving the heating efficiency. On the other hand, by having the supporting heat-conducting rods 32 abut against the heat spreader plate 5, the heating efficiency of the heat spreader plate 5 can also be further improved.

[0039] In one embodiment, multiple supporting heat-conducting rods 32 are evenly distributed around the outer side of the inner cavity 11, so that the heating wires 31 surrounding the outer side of the supporting heat-conducting rods 32 can uniformly heat the inner cavity 11, ensuring that the organic material 2 in the inner cavity 11 is heated evenly, which is beneficial to improving the uniformity of panel vapor deposition and improving the panel vapor deposition quality.

[0040] In one embodiment, a heat-conducting liquid 6 is provided inside the outer cavity 12, and a heating wire 31 is immersed in the heat-conducting liquid 6. The heating wire 31 heats the heat-conducting liquid 6, thereby improving the heating efficiency and uniformity of the heating of the inner cavity 11. In actual operation, depending on the actual vapor deposition requirements, the heat-conducting liquid 6 can be water, water-based solutions, synthetic heat-conducting oils, etc. Compared with air, the heat-conducting liquid 6 has high thermal conductivity and strong thermal uniformity.

[0041] In one embodiment of the vapor deposition crucible, a first temperature sensor 91 and a second temperature sensor 92 are also included. The first temperature sensor 91 is disposed in the inner cavity 11 to detect the temperature of the organic material 2 inside the inner cavity 11, preventing the organic material 2 from becoming too hot and deteriorating, and also preventing the organic material 2 from becoming too hot and causing instability in its vapor deposition characteristics on the panel, or preventing the organic material 2 from becoming too cold and having poor vaporization, thus affecting the vapor deposition quality. The second temperature sensor 92 is disposed in the outer cavity 12 to detect the temperature of the heat-conducting liquid 6 inside the outer cavity 12, preventing the outer cavity 12 from becoming too hot or too cold, which would affect the heating effect on the inner cavity 11.

[0042] In one embodiment, the cover plate 4 is detachably connected to the pot body 1, and / or the cover plate 4 is detachably connected to the heat spreader plate 5, and / or the heat spreader plate 5 is detachably connected to the pot body 1. In actual operation, the pot body 1, cover plate 4, and heat spreader plate 5 can be connected to each other in a detachable manner to facilitate disassembly and maintenance. The appropriate cover plate 4 and heat spreader plate 5 can be selected according to the specific size of the pot body 1, and the cover plate 4 and heat spreader plate 5 can be replaced and selected according to the actual operating conditions.

[0043] In one embodiment, the heating wire 31 is connected to an external power supply device (not shown) via a connecting wire 7. One end of the cover plate 4 is provided with a first semi-circular hole 43, and the heat spreader 5 is provided with a second semi-circular hole 52 corresponding to the first semi-circular hole 43. The first semi-circular hole 43 and the second semi-circular hole 52 are combined to form a wiring hole 8 for the connecting wire 7 to pass through, so as to connect the heating wire 31. At the same time, the cover plate 4 can reduce the corrosion of the connecting wire 7 by the organic material 2, which is beneficial to improving the service life of the connecting wire 7.

[0044] Although embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but can be made in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential characteristics of the present invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A vapor deposition crucible, characterized in that, The device includes a pot body comprising an inner cavity and an outer cavity spaced apart from each other. The inner cavity contains an organic material, and a vapor deposition nozzle is located at the top of the inner cavity. A heating wire is located in the outer cavity, surrounding the outer wall of the inner cavity. One end of the heating wire along the height direction of the pot body is adjacent to the bottom of the pot body, and the other end of the heating wire is adjacent to a cover plate at the top of the pot body. The cover plate has a clearance hole corresponding to the position of the vapor deposition nozzle. A heat spreader is disposed between the cover plate and the heating wire, and the heat spreader abuts against both the heating wire and the cover plate. The horizontal projections of the heating wire and the heat spreader are both located within the horizontal projection range of the cover plate.

2. The vapor deposition crucible according to claim 1, characterized in that, The heat spreader is located inside the outer cavity and abuts against the heating wire, and the heat spreader extends to the outside of the pot body to form a heat-conducting part.

3. The vapor deposition crucible according to claim 2, characterized in that, The cover plate includes an extension extending to the outside of the pot body, the extension having a length of D along its extending direction, and the heat-conducting part having a length of d along its extending direction, where d ≥ 1 / 2D.

4. The vapor deposition crucible according to claim 3, characterized in that, 1 / 2D≤d≤2 / 3D.

5. The vapor deposition crucible according to any one of claims 1 to 4, characterized in that, It also includes multiple supporting heat-conducting rods, which are disposed inside the outer cavity. One end of the supporting heat-conducting rod abuts against the bottom of the pot body, and the other end of the supporting heat-conducting rod abuts against the heat spreader plate. The heating wire is spiral and evenly wrapped around the outside of the supporting heat-conducting rod.

6. The vapor deposition crucible according to claim 5, characterized in that, Multiple of the aforementioned supporting heat-conducting rods are evenly distributed around the outer side of the inner cavity.

7. The vapor deposition crucible according to any one of claims 1 to 4, characterized in that, The outer cavity is filled with a heat-conducting liquid, and the heating wire is immersed in the heat-conducting liquid.

8. The vapor deposition crucible according to any one of claims 1 to 4, characterized in that, It also includes a first temperature sensor and a second temperature sensor, the first temperature sensor being disposed inside the inner cavity and the second temperature sensor being disposed inside the outer cavity.

9. The vapor deposition crucible according to any one of claims 1 to 4, characterized in that, The cover plate is detachably connected to the pot body, and / or The cover plate is detachably connected to the temperature distribution plate, and / or The temperature distribution plate is detachably connected to the pot body.

10. The vapor deposition crucible according to any one of claims 1 to 4, characterized in that, The heating wire is connected to an external power supply device via a connecting wire. One end of the cover plate is provided with a first semicircular hole, and the heat equalizing plate is provided with a second semicircular hole corresponding to the first semicircular hole. The first semicircular hole and the second semicircular hole are combined to form a wiring hole for the connecting wire to pass through.

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